JP2008264893A - Cutting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting apparatus promoting the cooling of an abutting part between a cutting tool and a workpiece. <P>SOLUTION: The cutting apparatus 100 to cut a workpiece 2 using the cutting tool 1 is equipped with: a first conductor part 21 connected electrically with near the abutting part 12 of the tool 1 with the workpiece 2; second conductor parts 22 and 23 connected electrically with the tool 1 in a position farther from the abutting part 12 than the position the first conductor part 21, is connected with the tool 1; and a first voltage impressing means 50A to impress a voltage between the first conductor part 21 and the second conductor parts 22 and 23 so that electrons move from the first conductor part 21 to the second conductor parts 22 and 23 through the tool 1. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a cutting apparatus for cutting a work material with a cutting tool.

  2. Description of the Related Art Conventionally, a processing machine described in Patent Document 1 is known as a cutting device that performs cutting while adjusting the temperature of a workpiece during cutting. This processing machine cuts a work material while absorbing heat generated during cutting, and includes a cooling means for cooling a workpiece. The cooling means is constituted by, for example, a heat absorption circuit including a Peltier element built in the work holding means. As a result, a direct current is passed through the Peltier element to cause a decrease in heat absorption, and the workpiece can be cooled.

JP 2006-95618 A

  However, in the processing machine described in Patent Document 1, the work is cooled from the periphery, and the heat generated at the contact point between the cutting tool and the work material is dispersed toward the periphery cooled by the heat conduction of the work, Although it is possible to absorb heat, for example, when cutting a work having low thermal conductivity, the heat generated at the contact is difficult to disperse, and there is a possibility that the temperature locally rises. Therefore, the temperature of the contact portion of the cutting tool with the work material is likely to increase, and the tool life may be significantly shortened. In particular, when a titanium alloy or the like having a material characteristic of low thermal conductivity and high chemical activity is used as a work material, the influence of heat generation at the contact portion of the cutting tool becomes large.

  An object of this invention is to provide the cutting device which can accelerate | stimulate cooling of the contact part of a cutting tool and a cut material in view of the said situation.

Means and effects for solving the problems

  The present invention relates to a cutting apparatus for cutting a work material with a cutting tool. The cutting device according to the present invention has the following features in order to achieve the above object. That is, the cutting apparatus of the present invention includes the following features alone or in combination as appropriate.

  In order to achieve the above object, a first feature of the cutting device according to the present invention is a cutting device for cutting a work material with a cutting tool, wherein the cutting device is used with the work material in the cutting tool. A first conductor portion that is electrically connected in the vicinity of the contact portion, and is electrically connected to the cutting tool at a position that is farther from the contact portion than a position at which the first conductor portion is connected to the cutting tool. A voltage is applied between the second conductor portion and the second conductor portion so that electrons move from the first conductor portion to the second conductor portion through the cutting tool. First voltage applying means.

  According to this configuration, when cutting, by applying a voltage by the first voltage applying means, electrons are applied to the cutting tool from the side of the contact portion with the work material in a direction away from the contact portion. An electric current can flow to move. By flowing the current in this way, it becomes possible to move more heat from the contact portion side in the direction away from the contact portion than when no current is flowed due to the Thomson effect. . Thereby, the heat generated at the abutting portion between the cutting tool and the work material is easily radiated, and the cooling of the abutting portion can be promoted.

  The second feature of the cutting device according to the present invention is that temperature measuring means for measuring the temperature of the cutting tool in the vicinity of the abutting portion and voltage applied from the first voltage applying means are controlled. First voltage control means, wherein the first voltage control means controls the voltage applied from the first voltage application means based on the measurement result of the temperature measurement means.

  According to this structure, the electric current sent through a cutting tool can be adjusted based on the temperature of the contact part vicinity with the work material in a cutting tool. For example, it is possible to control the current to flow through the cutting tool only when the temperature of the cutting tool rises above a predetermined temperature to promote the heat dissipation of the heat generated at the contact portion. Accordingly, it is possible to perform more appropriate voltage control corresponding to the temperature change of the cutting tool during cutting, and it is possible to efficiently control the cutting apparatus while suppressing power consumption.

  The third feature of the cutting device according to the present invention is that a work material conductor part electrically connected to the work material, a second conductor part, and the work material conductor part are provided. A potential difference measuring means, a changeover switch capable of opening and closing an electric circuit connecting the second conductor portion and the first voltage applying means, and a first voltage for controlling a voltage applied from the first voltage applying means. Voltage control means, wherein the first voltage control means is configured to measure the potential difference when the electric circuit connecting the second conductor portion and the first voltage application means is interrupted by the changeover switch. The voltage applied from the first voltage applying means is controlled based on the measured voltage.

  According to this configuration, the potential difference between the cutting tool and the work material can be measured by the potential difference measuring means. Here, when two different materials are in contact with each other at two points to form a loop circuit, if there is a temperature difference between one contact and the other contact, the loop circuit is heated by the Seebeck effect. An electromotive force is generated. Since the cutting tool and the work material are usually made of different materials, according to the above principle, one contact point (a contact portion that becomes a cutting point) between the cutting tool and the work material and the second conductor portion in the cutting tool If there is a temperature difference between the contact point and the contact point between the contact point that is the cutting point and the work material conductor part, a thermoelectromotive force is generated corresponding to the temperature difference. As a result, a voltage is generated between the contact point of the cutting tool with the second conductor part and the contact point of the work material conductor part. As a result, voltage data corresponding to the temperature at the contact portion of the cutting tool can be acquired, and the voltage applied by the first voltage applying unit can be adjusted based on the voltage data. Further, the voltage between the work material and the cutting tool can be measured by the potential difference measuring means in a state where the electric circuit is cut off so that the voltage of the first voltage applying means is not applied to the cutting tool by the changeover switch. It is possible to easily measure only the thermoelectromotive force of the work material and the cutting tool without being affected by the voltage applied by the first voltage applying means.

  The fourth feature of the cutting device according to the present invention is that the work material conductor and the second conductor are arranged between the work material conductor and the second conductor. And a second voltage applying means for applying a predetermined voltage so as to generate a potential difference between the cutting tool and the work material.

  According to this configuration, it is possible to apply a voltage between the cutting tool and the work material by the second voltage applying means during cutting. Since the cutting tool and the work material are in contact with each other during the cutting process, a current is applied to the contact point between the cutting tool and the work material by applying a voltage between the cutting tool and the work material. It becomes possible. Since the cutting tool and the work material are usually formed of different types of materials, when a current flows through the contact portion between the cutting tool and the work material, heat generation or heat absorption due to the Peltier effect occurs at the contact portion. Happens. Therefore, it is possible to directly cool the contact portion between the cutting tool and the work material by flowing a current in a direction in which heat absorption due to the Peltier effect occurs, and to control the voltage applied by the second voltage applying means. Thus, the temperature of the contact portion can be adjusted. In this case, since the contact portion is directly cooled, the temperature responsiveness is enhanced and the amount of heat absorbed by the Peltier effect can be easily controlled by controlling the voltage.

  Further, a fifth feature of the cutting apparatus according to the present invention is that the work material conductor and the second conductor are arranged between the work material conductor and the second conductor. A second voltage applying means for applying a predetermined voltage so as to generate a potential difference between the cutting tool and the work material, and a second voltage for controlling the voltage applied by the second voltage applying means. Control means, wherein the second voltage control means controls the voltage applied by the second voltage application means based on the measurement value of the temperature measurement means.

  According to this configuration, the amount of heat absorbed by the Peltier effect can be controlled by controlling the voltage applied by the second voltage applying unit based on the measured value of the temperature of the cutting tool by the temperature measuring unit. Thereby, it becomes possible to adjust the temperature of the contact part in a cutting tool to the temperature suitable for cutting with higher precision.

Further, a sixth feature of the cutting device according to the present invention is arranged between the workpiece conductor portion and the second conductor portion, and the workpiece conductor portion and the second conductor portion are arranged. A second voltage applying means for applying a predetermined voltage so as to generate a potential difference between the cutting tool and the work material, and a second voltage for controlling the voltage applied by the second voltage applying means. Control means, wherein the change-over switch can open and close an electric circuit connecting the second conductor portion and the second voltage applying means, and (1) the second conductor portion and the first voltage application A first state in which an electric circuit connecting the second electric circuit and the second voltage applying unit is cut off, and (2) the second electric conductor and the first voltage applying unit. The electric circuit connecting the two and the second conductor portion and the front A second state in which an electric circuit connecting the second voltage applying means is connected; and (3) shutting off the electric circuit connecting the second conductor portion and the first voltage applying means, and the second conductor portion and the second state. A third state in which the electric circuit connecting the two voltage applying means is cut off;
The second voltage control means is configured to switch the first voltage applying means and the second voltage control means based on a measured value by the potential difference measuring means when the changeover switch is switched to the third state. The voltage applied by the voltage applying means is controlled.

  According to this configuration, when the changeover switch is switched to the first state, the first voltage applying means can cause the current to flow through the cutting tool and promote heat dissipation of the contact portion by the Thomson effect. It is. In addition, when the changeover switch is switched to the second state, the second voltage application means allows a current to flow between the cutting tool and the work material, and the contact portion can be cooled by the Peltier effect. . In addition, when the changeover switch is switched to the third state, the potential difference is maintained while the electric circuit is cut off so that the voltages of the first voltage applying means and the second voltage applying means are not applied to the cutting tool and the work material. Since the voltage between the work material and the cutting tool can be measured by the measuring means, the work material and the cutting tool are not affected by the voltage applied by the first voltage applying means and the second voltage applying means. It is possible to easily measure only the thermoelectromotive force. This makes it possible to acquire voltage data corresponding to the temperature at the contact portion of the cutting tool, and to adjust the voltage applied by the first voltage application unit and the second voltage application unit based on the voltage data. Become.

  Hereinafter, the best mode for carrying out the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is an overall schematic diagram of a cutting apparatus 100 according to a first embodiment of the present invention. The cutting apparatus 100 is an apparatus used for performing fine processing, and can be used for applications such as cutting of microparts, surface finishing processing of metal or the like, processing for forming a fine pattern on the surface, and the like. . In the present embodiment, a case where a titanium alloy is cut as the work material 2 will be described as an example.

  The cutting apparatus 100 includes a chip 1 (cutting tool) that is a cemented carbide tool for contacting and cutting the work material 2, a chip holder 3 that is a holding member for holding the chip 1, A workpiece holding unit 4 for holding and rotating the workpiece 2; a controller unit 5 (see FIG. 7) including a first power supply device 50A and a computer 53 for applying a voltage to the chip 1; It is equipped with.

  The work material holding portion 4 is rotatably supported with respect to the apparatus main body, and includes a main shaft 41 rotated by a driving device (not shown), and a chuck portion 42 fixed to an end portion of the main shaft 41. It is equipped with. The chuck portion 42 includes a base member 42a fixed to the end portion of the main shaft 41, and a plurality of chuck claws 42b and 42b that are slidable with respect to the base member 42a and can adjust the distance between them. Composed. The work material 2 is sandwiched between a plurality of chuck claws 42b and 42b via an insulating member 43 such as ceramic and a guide seat 44 formed of a conductive metal such as copper. The workpiece holding unit 4 holds the workpiece.

  The work material holding part 4 has a rod-shaped conductive rod 6 penetrating from one end to the other end on the chuck claw 42b side in the rotation axis direction. The conductive rod 6 is also configured to rotate. The conductive rod 6 is made of a conductive material such as copper and extends from one end to the other end on the chuck portion 42 side, and the conductive portion 61 is in electrical contact with the main shaft 41 and the chuck portion 42. And an insulating portion 62 formed of an insulator such as rubber or plastic that covers the periphery of the conductive portion 61.

  One end located on the chuck portion 42 side of the conductive portion 61 of the conductive rod 6 is electrically connected to the conductive seat 44 via a conductive wire 63. Further, the other end of the conductive portion 61 is connected to the connector portion 7 for rotational connection, and the electrical connection in the connector portion 7 is possible even when the conductive portion 61 is rotating as the main shaft 41 rotates. Will not be blocked. For example, the rotary connecting connector 7 is formed by immersing a part of a disk formed at the end of the conductive portion 61 so as to form a surface perpendicular to the axial direction of the conductive portion 61 in mercury in a mercury tank. By setting it as the state which was made, what was comprised so that an electrical connection might be maintained also at the time of rotation can be used. In addition, a conductive wire 71 is connected to the connector portion 7 for rotational connection, and the controller unit 5 is electrically connected via the conductive wire 71.

  In this way, the conductor portion 20 for the work material, which includes the conductor 71, the connector portion 7 for rotation connection, the conductive portion 61 of the conductive rod 6, the lead wire 63, and the conductor seat 44, from the controller portion 5 to the work material 2. (See FIG. 7).

  FIG. 2 is a schematic diagram for explaining a state in which the chip 1 is attached to the chip holder 3. 3 is a plan view showing the chip 1 in an enlarged manner, and FIG. 4 is a cross-sectional view taken along the line S1-S1 in FIG. 3 and shows a state when a lead wire is electrically connected to the chip 1. It is.

  As shown in FIGS. 2 and 3, the chip 1 is formed in an equilateral triangular plate shape, for example, and three through holes 1 a, 1 b, 1 c are formed in the vicinity of the three corners that are the apexes of the triangle. Has been. As shown in FIGS. 3 and 4, the through holes 1 a, 1 b, and 1 c are formed symmetrically with respect to the center of the equilateral triangle, and one end is opened near the apex of the equilateral triangle of the chip 1. Also, the other end is opened at a position approaching the center of the equilateral triangle. Further, the through holes 1a, 1b, and 1c are formed on the opening side near the apex of the chip 1 so as to have a reduced diameter portion 1s. In the present embodiment, a case will be described in which cutting is performed by bringing the corner portion of the tip 1 adjacent to the through hole 1a into contact with the work material 2. In addition, since the shape of the chip 1 is formed symmetrically, it is possible to perform the cutting in the same manner even if corner portions adjacent to the through holes 1b and 1c are used.

  As shown in FIG. 4 for the through hole 1a, the lead wire 21 (first conductor portion) formed of copper or the like connected to the chip 1 has an end portion from the opening opposite to the reduced diameter portion 1s and the reduced diameter portion 1s. And is brazed and connected by, for example, silver brazing 90 or the like at the reduced diameter portion 1s. After the brazing connection, the plug 91 made of the same material as the chip 1 is inserted from the opening to close the reduced diameter portion, and the portion of the plug 91 protruding from the reduced diameter portion 1s to the outside of the through hole 1a is cut, polished, or the like. Removed. In addition, an insulating sleeve 92 is inserted around the conducting wire 21 in the through hole 1a so that the conducting wire 21 does not come into contact with the chip 1 except for the brazed portion. Similarly, the other through holes 1b and 1c formed in the chip 1 are connected to the conductive wires 22 and 23 (second conductor portions), respectively.

  As shown in FIG. 2, a substantially V-shaped chip holding groove 31 for installing the chip 1 is formed near the end in the longitudinal direction of the chip holder 3. The chip holding groove 31 includes a bottom surface 31a formed as a surface substantially parallel to the top surface of the chip holder 3, and a side surface 31b and a side surface 31c that are perpendicular to the bottom surface 31a. Further, a screw hole 32 penetrating the chip holder 3 is formed at a position close to the chip holding groove 31 in the chip holder 3 in a direction perpendicular to the bottom surface 31a.

  FIG. 5 is a view showing a cross section passing through the screw hole 32 and the through hole 33 of the chip holder 3 with the chip 1 in FIG. 2 attached. As shown in FIG. 5, the chip holder 3 is formed with a through hole 33 that is bent so as to penetrate from the bottom surface 31 a of the chip holding groove 31 to the screw hole 32. A lock screw 34 is screwed into the screw hole 32 so as to be positioned at a predetermined depth. The lock screw 34 is formed with a recess 34 a having a smaller diameter than the screw top at a part in the axial direction, and the recess 34 a is positioned at the opening to the screw hole 32 in the through hole 33. ing.

  A ceramic rod 35 is inserted into the through hole 33 of the chip holding groove 31. The ceramic rod 35 is formed in a substantially L shape using, for example, zirconia, and the one end 35a side extends in a plate shape, and the other end 35b side is formed as a substantially cylindrical shaft. The ceramic rod 35 is installed so that one end 35a formed in a plate shape passes through the through hole 33 from the bottom surface 31a side and is inserted into the recess 34a of the lock screw 34 installed in the screw hole 32. . In the state where the ceramic rod 35 is inserted into the through hole 33 of the chip holding groove 31, the ceramic rod 35 is disposed so that the shaft on the other end 35 b side protrudes from the through hole 33 of the bottom surface 31 a.

  The insulating plate 36 and the chip 1 are formed with a through hole 36d and a through hole 1d at the center, respectively, and after inserting the ceramic rod 35 into the through hole 33 of the chip holder 3, the through hole 36d of the insulating plate 36 and the chip 1 are inserted. The end portion 35b of the ceramic rod 35 is inserted into one through hole 1d and stacked on the bottom surface 31a of the chip holding groove 31 (see FIG. 2). The insulating plate 36 is formed as a triangular plate member, and on two sides facing the side surfaces 31 b and 31 c of the chip holder 3, wall surfaces standing in the stacking direction are formed. By disposing the insulating plate 36 between the chip 1 and the chip holder 3, the chip 1 and the chip holder 3 are electrically insulated.

  Further, as schematically shown in a perspective view of the chip 1 in the state of being installed in the chip holder 3 in FIG. 6, the insulating plate 36 is formed with through holes 36a, 36b, 36c. The holder 3 is formed with through holes 3a, 3b, 3c. The through holes 36 a, 36 b, 36 c and the through holes 3 a, 3 b, 3 c are located at positions where they communicate with the through holes 1 a, 1 b, 1 c of the chip 1, and lead wires 21 extending from the bottom surface of the chip 1. , 22 and 23 extend below the chip holder 3 through the through holes 36a to 36c and 3a to 3c.

  As shown in FIG. 5, a stepped portion 33 a that can be in contact with and supported by the bent portion 35 c of the ceramic rod 35 is formed in the through hole 33 that penetrates from the bottom surface 31 a to the screw hole 32. The ceramic rod 35 is biased by the lock screw 34 with the end portion 35a facing away from the tip 1 side while the bent portion 35c is supported by the stepped portion in the stacking direction of the tip 1 and the like. As a result, a rotational force is received with the bent portion 35c as a fulcrum, and the other end 35b moves so as to approach the axial direction of the screw hole 32. As a result, the chip 1 is biased toward the corner formed by the side surface 31b and the side surface 31c of the chip holding groove 31 by the end portion 35b of the ceramic rod 35, and between the side surfaces 31b and 31c of the chip holding groove 31. It is fixed with the insulating plate 36 sandwiched therebetween. Further, the chip 1 is held by receiving a force from the end portion 35b of the ceramic rod 35 toward the bottom surface 31a.

  In this manner, the controller unit 5 to the chip 1 are electrically connected via the conductive wires 21, 22, and 23.

  Next, the configuration of the controller unit 5 will be described. FIG. 7 is a diagram schematically showing a control circuit of the cutting apparatus 100 according to the present embodiment. As shown in FIG. 7, the conductive wires 22 and 23 connected at positions away from the contact portion 12 with the work material 2 in the chip 1 are branched from the conductive wire 24 extending from the controller portion 5 at the contact 24 a. It is configured. The controller unit 5 includes a conductive wire 21 connected in the vicinity of the contact portion 12 of the chip 1, a conductive wire 24 connected to the conductive wires 22 and 23 connected at positions away from the contact portion 12 in the chip 1, The first power supply device 50A (first voltage applying means) capable of applying a predetermined voltage to the chip 1 via the lead, the work material 2 via the lead wire 24 (lead wires 22, 23) and the work material conductor 20 Based on the voltage measurement value measured by the voltmeter 52, the voltage generated by the first power supply device 50A can be controlled. And a computer 53 (first voltage control means) and a change-over switch 54 that can cut off a circuit that electrically connects the first power supply device 50A and the conductor 24.

  The changeover switch 54 is connected to an electric circuit that connects the first power supply device 50A and the conductive wire 24 and is also connected to a power supply state (connected to a1 in FIG. 7) that interrupts the electric circuit that connects the voltmeter 52 and the conductive wire 24. Switching to the voltmeter connection state (the state connected to a2 in FIG. 7) in which the electrical circuit connecting the first power supply device 50A and the conductor 24 is cut off and the electrical circuit connecting the voltmeter 52 and the conductor 24 is connected. It is installed as possible. Thus, when the changeover switch 54 is in the power supply connection state, it is possible to apply a predetermined voltage to the chip 1 from the first power supply device 50 </ b> A and to pass a current through the chip 1. On the other hand, when the changeover switch 54 is in the voltmeter connection state, the voltage (thermoelectromotive force) between the chip 1 and the work material 2 in a state where no voltage is applied to the chip 1 by the first power supply device 50A. Can be measured. The changeover control of the changeover switch 54 is performed by the computer 53.

  Next, the control operation of the cutting apparatus 100 during cutting will be described.

  Cutting is performed by bringing the tip 1 into contact with the work material 2 fixed to the chuck portion 42 of the work material holding part 4 in a state where the work material holding part 4 is rotated at a predetermined speed. (See FIG. 1). When cutting is performed, the changeover switch 54 is switched between a power supply connection state and a voltmeter connection state at predetermined time intervals. Specifically, for example, the changeover switch 54 is controlled to repeat the operation of maintaining the power supply connection state for 5 seconds and then maintaining the voltmeter connection state for 0.5 seconds. The computer 53 is set in advance to perform the control. In the voltmeter connection state, it is desirable that the voltmeter connection state be a short time, for example, a time that is approximately 1 to 5 times the sampling period of the voltmeter 52. As a result, the time during which the first power supply device 50A cannot apply a voltage to the chip 1 can be reduced.

  When the voltage measurement value becomes larger than a predetermined voltage value based on the voltage measurement value of the voltmeter 52 in the voltmeter connection state, the computer 53 is in contact with the work material 2 and the tip 1. When the thermoelectromotive force generated in the work material 2 and the chip 1 becomes larger than a predetermined value due to the temperature of 12 exceeding the predetermined temperature, the first power supply device 50A is controlled to conduct the conductor A voltage is applied to 21 and the conductor 24. At this time, the applied voltage of the first power supply device 50A is such that electrons move from the contact point with the lead wire 21 toward the contact points with the lead wires 22 and 23 in the chip 1, that is, the potential of the lead wire 24 is higher than that of the lead wire 21. Controlled to be higher. Thereby, in the chip 1, electrons move in the direction away from the contact portion 12 from the vicinity of the contact portion 12 with the work material 2, so that the direction away from the contact portion 12 is caused by the Thomson effect. Heat transfer can be promoted. Therefore, heat dissipation of the heat generated at the contact portion 12 during cutting is promoted.

  As described above, the cutting apparatus 100 according to the present embodiment cuts the workpiece 2 with the tip 1, and is in the vicinity of the contact portion 12 with the workpiece 2 in the tip 1. The electrically conductive wire 21, the electrically conductive wires 22 and 23 electrically connected to the chip 1 at a position farther from the contact portion 12 than the position where the electrically conductive wire 21 is connected to the chip 1, and the chip 1 from the electrically conductive wire 21 pass through the chip 1. Thus, the first power supply device 50 </ b> A that applies a voltage between the conductive wire 21 and the conductive wires 22 and 23 is provided so that electrons move to the conductive wires 22 and 23.

  According to this configuration, during cutting, a voltage is applied by the first power supply device 50 </ b> A so that the tip 1 is directed away from the contact portion 12 from the contact portion 12 side with the workpiece 2. Thus, current can flow so that electrons move. By flowing current in this way, it is possible to move more heat from the side of the abutting portion 12 toward the direction away from the abutting portion 12 by the Thomson effect than when no current is passed. It becomes. Thereby, the heat generated at the contact portion 12 between the tip 1 and the work material 2 is easily radiated, and the cooling of the contact portion 12 can be promoted.

  Further, a work material conductor 20 electrically connected to the work material 2, a voltmeter 52 installed between the work wire 24 connected to the conductive wires 22 and 23 and the work material conductor 20, A change-over switch 54 that can open and close an electric circuit that connects the conductive wire 24 and the first power supply device 50A is further provided. Then, the computer 53 is applied from the first power supply device 50 </ b> A based on the measured voltage of the voltmeter 52 when the electrical circuit connecting the conductor 24 and the first power supply device 50 </ b> A is interrupted by the changeover switch 54. Control the voltage.

  According to this configuration, the potential difference between the tip 1 and the work material 2 can be measured by the voltmeter 52. Here, when two different materials are in contact with each other at two points to form a loop circuit, if there is a temperature difference between one contact and the other contact, the loop circuit is heated by the Seebeck effect. An electromotive force is generated. Since the tip 1 and the work material 2 are usually made of different materials, one contact point (the contact portion 12 serving as a cutting point) between the tip 1 and the work material 2 and the lead wire 22 in the chip 1 according to the above principle. , 23, or when there is a temperature difference between the contact portion 12 serving as the cutting point and the contact point between the work material conductor 20 in the work material 2, the temperature A thermoelectromotive force is generated corresponding to the difference, and as a result, a voltage is generated between a contact point between the conductors 22 and 23 of the chip 1 and a contact point of the work material conductor 20 on the work material 2. become. Thus, voltage data corresponding to the temperature at the contact portion 12 of the chip 1 can be acquired, and the voltage applied by the first power supply device 50A can be adjusted based on the voltage data. Further, the voltage between the workpiece 2 and the chip 1 can be measured by the voltmeter 52 in a state where the electric circuit is cut off so that the voltage of the first power supply device 50A is not applied to the chip 1 by the changeover switch 54. Therefore, it is possible to easily measure only the thermoelectromotive force of the work material 2 and the chip 1 without being affected by the voltage applied by the first power supply device 50A.

  Further, the cutting apparatus 100 is provided with a chuck portion 42 that is rotatably provided to the apparatus main body and can be fixed by sandwiching the work material 2, and the work material 2 is sandwiched by the chuck portion 42. The workpiece 1 can be cut by bringing the tip 1 into contact with the workpiece 2 in a rotated state. The work material conductor portion 20 is electrically connected to the guide seat 44 interposed between the chuck portion 42 and the work material 2, and to the guide seat 44 via a lead wire 63. A conductive portion 61 of the conductive rod 6 and a connector portion 7 for rotational connection. The connector portion 7 is installed so as to be relatively rotatable with respect to the conductive portion 61 in the same direction as the chuck portion 42, and the connector portion 7 and the controller portion 5 including the first power supply device 50 </ b> A are provided. It is electrically connected via a conducting wire 71.

  According to this configuration, since the work material 2 is fixed by the chuck portion 42 and at the same time, the work material conductor 20 and the work material 2 can be electrically connected, so that the work material 2 can be easily installed. It becomes possible. Therefore, installation of the work material 2 for cutting and connection with the voltmeter 52 can be easily performed without taking time. Further, since the guide seats 44 and the like and the connector portion 7 are installed so as to be relatively rotatable while maintaining an electrical connection state, the voltmeter is also maintained while the guide seats 44 and the like are rotating together with the work material 2. The voltage between the chip 1 and the work material 2 can be measured by 52.

  As shown in this embodiment, the temperature in the vicinity of the contact portion 12 in the tip 1 is not limited to the case where the thermoelectromotive force generated in the tip 1 and the work material 2 is measured. It can also be set as the structure measured using non-contact thermometers (temperature measurement means), such as. That is, temperature measuring means for measuring the temperature of the chip 1 in the vicinity of the contact portion 12 is provided, and the computer 53 controls the voltage applied from the first power supply device 50A based on the measurement result of the temperature measuring means. Good. As a method for controlling the applied voltage of the first power supply device 50A, for example, when the temperature in the vicinity of the contact portion 12 detected by the temperature measuring means is higher than a predetermined temperature, a voltage is applied to the chip 1 to supply current. When the temperature is below a predetermined temperature, the application of voltage can be controlled to stop.

(Second Embodiment)
FIG. 8 shows a control circuit of the cutting apparatus according to the second embodiment. The cutting apparatus according to the second embodiment is different from the cutting apparatus according to the first embodiment in that it further includes a second power supply device 50B (second voltage applying means) and the configuration of the changeover switch 56 is different. The same members as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  The second power supply device 50B is a power supply device that is disposed between the workpiece conductor 20 and the conductive wire 24 and applies a predetermined voltage so as to generate a potential difference between the chip 1 and the workpiece 2. is there. The second power supply device 50B is connected to a computer 53 (first voltage control means, second voltage control means), and the applied voltage is automatically controlled by the computer 53.

  The changeover switch 56 (1) connects an electrical circuit that connects the conductor 24 and the first power supply device 50A, and interrupts the electrical circuit that connects the conductor 24, the second power supply device 50B, and the voltmeter 52. The first power supply connection state (the first state, the state connected to b1 in FIG. 8) and (2) the electrical circuit connecting the conductor 24 and the second power supply device 50B are connected, the conductor 24 and the first power supply A second power supply connection state (second state, a state connected to b2 in FIG. 8) that cuts off the electric circuit connecting the device 50A and the voltmeter 52; and (3) electricity connecting the lead 24 and the voltmeter 52. A voltmeter connection state (a third state, a state connected to b3 in FIG. 8) that connects the circuit and cuts off an electric circuit that connects the conductive wire 24 to the first power supply device 50A and the second power supply device 50B. , Cut into A possible switch.

  When cutting is being performed, the changeover switch 56 is automatically switched by the computer 53 so that the voltmeter is connected at predetermined time intervals. Specifically, for example, the first power supply connection state or the second power supply connection state is maintained for 5 seconds, and then the operation of maintaining the voltmeter connection state for 0.5 seconds is repeated.

  Based on the voltage measurement value of the voltmeter 52 in the voltmeter connection state, the computer 53 determines that the voltage measurement value is larger than a predetermined first voltage value, that is, the temperature of the contact portion 12 in the chip 1. When the temperature becomes higher than the predetermined first temperature, the changeover switch 56 is controlled to be switched to the first power supply connection state. At this time, the applied voltage of the first power supply device 50A is such that electrons move from the contact point with the lead wire 21 toward the contact points with the lead wires 22 and 23 in the chip 1, that is, the potential of the lead wire 24 is higher than that of the lead wire 21. Controlled to be higher. Thereby, in the chip 1, electrons move in the direction away from the contact portion 12 from the vicinity of the contact portion 12 with the work material 2, so that the direction away from the contact portion 12 is caused by the Thomson effect. Heat transfer can be promoted. Therefore, it is possible to efficiently dissipate heat generated in the contact portion 12.

  Further, the computer 53 switches the changeover switch 56 to the second power supply connection state when the voltage measurement value measured by the voltmeter 52 becomes equal to or greater than a predetermined second voltage value that is larger than the predetermined first voltage value. To control. In this case, a current is applied to the contact portion 12 between the work material 2 and the chip 1. Note that the direction of the current flowing through the contact portion 12 is controlled so that heat is absorbed by the Peltier effect. Thereby, in the contact part 12, since the heat absorption effect | action by the Peltier effect arises, it becomes possible to cool the said contact part 12 directly. Thus, for example, when the work material 2 is rotated at a high speed to perform cutting, the temperature of the contact portion 12 is high even when the amount of heat generated at the contact portion 12 between the tip 1 and the work material 2 is large. It becomes possible to suppress an excessive rise.

  As described above, the cutting apparatus according to the second embodiment is disposed between the work material conductor 20 and the conductor 24, and the chip 1 is interposed via the work material conductor 20 and the conductor 24. And a work material 2 are provided with a second power supply device 50B for applying a predetermined voltage so as to generate a potential difference.

  According to this configuration, it is possible to apply a voltage between the tip 1 and the work material 2 by the second power supply device 50B during the cutting process. Since the tip 1 and the work material 2 are in contact with each other at the time of cutting, a contact portion between the tip 1 and the work material 2 is applied by applying a voltage between the tip 1 and the work material 2. 12 can be made to pass a current. Since the tip 1 and the work material 2 are usually formed of different types of materials, a current flows through the contact portion 12 between the tip 1 and the work material 2, thereby causing a Peltier effect at the contact portion 12. Exothermic or endothermic due to Therefore, it is possible to directly cool the contact portion 12 between the chip 1 and the work material 2 by flowing a current in a direction in which heat absorption due to the Peltier effect occurs, and control the voltage applied by the second power supply device 50B. This makes it possible to adjust the temperature of the contact portion 12. In this case, since the contact portion 12 is directly cooled, the temperature responsiveness is improved, and the amount of heat absorbed by the Peltier effect can be easily controlled by controlling the voltage.

  The changeover switch 56 can open and close an electric circuit that connects the conductive wire 24 and the second power supply device 50B. (1) The electrical switch that connects the conductive wire 24 and the first power supply device 50A is connected to the conductive switch 24. A first power connection state in which an electric circuit connecting the second power supply device 50B is cut off; and (2) an electric circuit connecting the conductive wire 24 and the first power supply device 50A is cut off and the conductive wire 24 and the second power supply device 50B are connected. A second power supply connection state for connecting the electric circuit to be connected; and (3) a voltage for cutting off the electric circuit for connecting the conductive wire 24 and the second power supply device 50B while cutting off the electric circuit for connecting the conductive wire 24 and the first power supply device 50A. It can be switched to the meter connection state. Then, the computer 53 controls the voltage applied by the first power supply device 50A and the second power supply device 50B based on the measured value by the voltmeter 52 when the changeover switch 56 is switched to the voltmeter connection state. .

  According to this configuration, when the changeover switch 56 is switched to the first power supply connection state, the first power supply device 50A causes the current to flow through the chip 1 and promotes heat dissipation of the contact portion 12 by the Thomson effect. It is possible to make it. When the changeover switch 56 is switched to the second power supply connection state, the second power supply device 50B causes a current to flow between the tip 1 and the work material 2 and causes the contact portion 12 to be Cooling is possible. In addition, when the changeover switch 56 is switched to the voltmeter connection state, the electric circuit is cut off so that the voltages of the first power supply device 50A and the second power supply device 50B are not applied to the chip 1 and the work material 2. Thus, since the voltage between the workpiece 2 and the chip 1 can be measured by the voltmeter 52, the workpiece can be cut without being affected by the voltages applied by the first power supply device 50A and the second power supply device 50B. Only the thermoelectromotive force of the material 2 and the chip 1 can be easily measured. Thereby, voltage data corresponding to the temperature at the contact portion 12 of the chip 1 can be acquired, and the voltage applied by the first power supply device 50A and the second power supply device 50B can be adjusted based on the voltage data. It becomes.

  In addition, it can also be set as the structure which measures the temperature of the contact part 12 vicinity in the chip | tip 1 using temperature measuring means, such as a non-contact thermometer. That is, the computer 53 may control the voltage applied from the second power supply device 50B based on the measurement result of the temperature measuring unit.

(Third embodiment)
FIG. 9 shows a control circuit of the cutting apparatus according to the third embodiment. In the cutting apparatus according to the third embodiment, one end of a conducting wire 80 made of, for example, constantan is electrically connected to a contact 80A between the chip 1 and the conducting wire 22. In addition, a voltmeter 82 is installed so that the voltage between the other end 80 </ b> B of the conductor 80 and the conductor 22 can be measured.

  Further, an ammeter 55 is interposed in the work material conductor portion 20 between the work material 2 and the second power supply device 50B, and the contact portion 12 between the work material 2 and the chip 1 is provided. The flowing current value can be measured. The measurement data of the voltmeter 82 and the ammeter 55 is transmitted to the computer 53, and the computer 53 controls the applied voltage of the second power supply device 50B based on the data. In addition, the other part is the same as that of the cutting apparatus which concerns on 2nd Embodiment, attaches | subjects the same code | symbol to the same member, and abbreviate | omits description.

  In this way, since the conductor 80 made of constantan and the conductor 22 made of copper are connected, the conductor 80 and the conductor 22 can be used as a thermocouple for measuring the temperature at the contact 80 </ b> A with the chip 1. . That is, the temperature θa of the contact 80A between the conducting wire 80 and the conducting wire 22 is measured by measuring the voltage between the end 80B of the conducting wire 80 opposite to the contact 80A and the conducting wire 22 by the voltmeter 82. It becomes possible to do.

  Specifically, when the temperature θb of the end portion 80B of the conducting wire 80 is kept constant, for example, by keeping it at room temperature, the thermoelectromotive force generated in the conducting wire 80 and the conducting wire 22 is measured, whereby constantan (conducting wire 80). Based on the physical property value (Seebeck coefficient) of copper (conductive wire 22), the temperature of the contact 80A between the conductive wire 80 and the conductive wire 22 can be calculated. It is also possible to keep the temperature of the end portion constant (substantially 0 degrees) by immersing the end portion 80B of the conducting wire 80 in ice water or the like.

  Using the temperature θa of the contact 80A calculated as described above as a reference temperature, the temperature of the contact portion 12 between the tip 1 and the work material 2 can be calculated from the thermoelectromotive force generated in the tip 1. Become. The computer 53 controls the voltage applied by the first power supply device 50A or the second power supply device 50B based on the calculated temperature of the contact portion 12.

  In addition, when a voltage is applied to the work material 2 and the chip 1 from the second power supply device 50B, the applied voltage is set to a computer so that the current value flowing through the work material 2 and the chip 1 is constant. 53. Specifically, based on the measured current value of the ammeter 55, when the current measured value by the ammeter 55 becomes smaller than a predetermined current value, the voltage applied by the second power supply device 50B is increased. Be controlled. Further, when the current measured value by the ammeter 55 becomes larger than a predetermined current value, the voltage applied by the second power supply device 50B is controlled to be decreased.

  As described above, the cutting apparatus according to the third embodiment further includes an ammeter 55 capable of measuring the current flowing through the contact portion 12 between the tip 1 and the workpiece 2, and the computer 53. Controls the voltage applied by the second power supply device 50B based on the current value measured by the ammeter 55 during cutting.

  According to this configuration, the voltage applied from the second power supply device 50B is controlled by the computer 53 based on the current flowing through the contact portion 12 between the tip 1 and the work material 2 during cutting. Here, the amount of heat absorbed by the Peltier effect is the amount of heat corresponding to the current flowing through the contact portion 12. On the other hand, even when a constant voltage is applied between the tip 1 and the work material 2, the flowing current value may fluctuate due to the influence of a change in the thermoelectromotive force and the resistance value due to a temperature change. In this case, the amount of heat absorbed by the Peltier effect also changes as the current value changes. Therefore, by directly measuring the current value and controlling the voltage applied from the second power supply device 50B by the computer 53 so that the current value becomes a predetermined value, without being affected by the temperature change or the like, It is possible to reliably perform temperature adjustment using predetermined heat absorption or heat generation by the Peltier effect.

  Further, in the third embodiment, the temperature of the contact 80A is measured by a thermocouple composed of a conducting wire 80 made of constantan, and the temperature of the contact portion 12 is calculated from the thermoelectromotive force of the chip 1 based on the temperature. However, it is not limited to this configuration. For example, it is also possible to measure the temperature of the contact point between the chip 1 and the conducting wire 21 with a thermocouple, and to control the voltage applied to the first power supply device 50A and the second power supply device 50B based on the measured temperature.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made as long as they are described in the claims.

(1) As shown in FIG. 10, the space between the through hole 1a of the chip 1 and the conductive wire 21 is sealed with an insulating resin 93 or the like, and the conductive wire 21 extends downward from the through hole 1a while having a predetermined rigidity. In the through hole 3a of the chip holder 3, a conductor 25 having a connector portion 25a fitted to the extended end of the conductor 21 at the tip and covered with an insulating sleeve 26 is installed in the through hole 3a of the chip holder 3. When the chip 1 is attached to the chip holder 3, the end portion of the conducting wire 21 connected to the chip 1 may be fitted into the connector portion 25a and electrically connected to the conducting wire 25. In this case, since the extension length from the chip 1 of the conducting wire 21 connected in advance to the chip 1 can be shortened, the chip 1 can be easily handled. Further, if the conducting wire 25 is connected to the controller unit 5 in advance, the electrical connection of the chip 1 can be easily performed.

(2) The present invention is not limited to cutting by rotating the work material, but can also be applied to cutting by rotating and sliding a cutting tool.

1 is an overall schematic diagram showing a cutting apparatus according to a first embodiment of the present invention. It is the schematic for demonstrating the attachment state of the chip | tip in FIG. It is a top view which expands and shows the chip | tip 1 in FIG. FIG. 4 is a cross-sectional view taken along line S1-S1 in FIG. 3 and shows a state when a lead wire is electrically connected to a chip 1; It is sectional drawing which passes along the screw hole 32 and the through-hole 33 of a chip holder in FIG. 4 is a perspective view of the chip 1 installed in the chip holder 3. FIG. It is a figure which shows typically the control circuit of the cutting apparatus 100 which concerns on this embodiment. It is a figure which shows typically the control circuit of the cutting apparatus which concerns on 2nd Embodiment. It is a figure which shows typically the control circuit of the cutting processing apparatus which concerns on 3rd Embodiment. It is a figure which shows the modification of the cutting apparatus in this embodiment.

Explanation of symbols

1 Tip (cutting tool)
2 Work material 20 Conductor portion 21 for work material Conductive wire (first conductor portion)
22, 23 Conductor (second conductor)
50A 1st power supply device (1st voltage application means)
50B Second power supply device (second voltage applying means)
52 Voltmeter (potential difference measuring means)
53 Computer (first voltage control means, second voltage control means)
54, 56 changeover switch 100 cutting device

Claims (6)

A cutting device for cutting a work material with a cutting tool,
A first conductor portion electrically connected in the vicinity of a contact portion with the work material in the cutting tool;
A second conductor portion that is electrically connected to the cutting tool at a position farther from the contact portion than a position at which the first conductor portion is connected to the cutting tool;
First voltage applying means for applying a voltage between the first conductor portion and the second conductor portion so that electrons move from the first conductor portion to the second conductor portion through the cutting tool. When,
A cutting apparatus comprising: Temperature measuring means for measuring the temperature of the cutting tool in the vicinity of the contact portion;
First voltage control means for controlling a voltage applied from the first voltage application means;
Further comprising
The cutting apparatus according to claim 1, wherein the first voltage control unit controls a voltage applied from the first voltage application unit based on a measurement result of the temperature measurement unit. A conductor for work material electrically connected to the work material;
A potential difference measuring means installed between the second conductor portion and the workpiece conductor portion;
A change-over switch capable of opening and closing an electric circuit connecting the second conductor portion and the first voltage applying means;
First voltage control means for controlling a voltage applied from the first voltage application means;
With
The first voltage control means is based on a measured voltage of the potential difference measuring means when an electric circuit connecting the second conductor portion and the first voltage applying means is interrupted by the changeover switch. The cutting apparatus according to claim 1 or 2, wherein a voltage applied from one voltage applying means is controlled.   It is arranged between the conductor part for work material and the second conductor part, and a potential difference is established between the cutting tool and the work material via the conductor part for work material and the second conductor part. The cutting apparatus according to claim 1, further comprising a second voltage applying unit that applies a predetermined voltage so as to be generated. It is arranged between the conductor part for work material and the second conductor part, and a potential difference is established between the cutting tool and the work material via the conductor part for work material and the second conductor part. Second voltage applying means for applying a predetermined voltage so as to generate;
Second voltage control means for controlling the voltage applied by the second voltage application means;
With
The cutting apparatus according to claim 2, wherein the second voltage control unit controls a voltage applied by the second voltage application unit based on a measurement value of the temperature measurement unit. It is arranged between the conductor part for work material and the second conductor part, and a potential difference is established between the cutting tool and the work material via the conductor part for work material and the second conductor part. Second voltage applying means for applying a predetermined voltage so as to generate;
Second voltage control means for controlling the voltage applied by the second voltage application means;
With
The change-over switch can open and close an electric circuit connecting the second conductor portion and the second voltage applying means,
(1) a first state in which an electric circuit connecting the second conductor part and the first voltage applying unit is connected and an electric circuit connecting the second conductor part and the second voltage applying unit is cut off;
(2) a second state in which an electrical circuit connecting the second conductor part and the first voltage application unit is cut off and an electrical circuit connecting the second conductor part and the second voltage application unit is connected;
(3) a third state in which an electric circuit connecting the second conductor part and the first voltage applying unit is cut off and an electric circuit connecting the second conductor part and the second voltage applying unit is cut off;
Can be switched to,
The second voltage control means is applied by the first voltage application means and the second voltage application means based on a measured value by the potential difference measurement means when the changeover switch is switched to the third state. The cutting apparatus according to claim 3, wherein the voltage is controlled.

Images