JP2008251774A5 - - Google Patents
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- Publication number
- JP2008251774A5 JP2008251774A5 JP2007090327A JP2007090327A JP2008251774A5 JP 2008251774 A5 JP2008251774 A5 JP 2008251774A5 JP 2007090327 A JP2007090327 A JP 2007090327A JP 2007090327 A JP2007090327 A JP 2007090327A JP 2008251774 A5 JP2008251774 A5 JP 2008251774A5
- Authority
- JP
- Japan
- Prior art keywords
- porous silica
- silica film
- group
- alkyl group
- film according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 40
- 239000000377 silicon dioxide Substances 0.000 claims description 20
- 125000000217 alkyl group Chemical group 0.000 claims description 11
- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- 150000003961 organosilicon compounds Chemical class 0.000 claims description 5
- 229910018557 Si O Inorganic materials 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 125000003545 alkoxy group Chemical group 0.000 claims description 2
- 125000002947 alkylene group Chemical group 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 claims description 2
- 125000005843 halogen group Chemical group 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 2
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 claims 5
- 239000004065 semiconductor Substances 0.000 claims 3
- 239000011229 interlayer Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 229910020175 SiOH Inorganic materials 0.000 claims 1
- 238000000862 absorption spectrum Methods 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 230000007062 hydrolysis Effects 0.000 claims 1
- 238000006460 hydrolysis reaction Methods 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 description 2
- 239000007859 condensation product Substances 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007090327A JP5165914B2 (ja) | 2007-03-30 | 2007-03-30 | 多孔質シリカフィルム及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007090327A JP5165914B2 (ja) | 2007-03-30 | 2007-03-30 | 多孔質シリカフィルム及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008251774A JP2008251774A (ja) | 2008-10-16 |
| JP2008251774A5 true JP2008251774A5 (enExample) | 2010-04-30 |
| JP5165914B2 JP5165914B2 (ja) | 2013-03-21 |
Family
ID=39976383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007090327A Active JP5165914B2 (ja) | 2007-03-30 | 2007-03-30 | 多孔質シリカフィルム及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5165914B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5603586B2 (ja) * | 2009-11-06 | 2014-10-08 | 旭化成イーマテリアルズ株式会社 | トレンチ埋め込み用絶縁膜の形成方法 |
| JP5999593B2 (ja) * | 2012-05-22 | 2016-09-28 | 国立大学法人広島大学 | シリカゼオライト絶縁膜の製造方法 |
| JP6849083B2 (ja) * | 2017-09-11 | 2021-03-24 | 東京エレクトロン株式会社 | 絶縁膜の成膜方法、基板処理装置及び基板処理システム |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08236518A (ja) * | 1995-02-28 | 1996-09-13 | Hitachi Ltd | シリコン酸化膜の形成方法 |
| JP4028032B2 (ja) * | 1997-07-25 | 2007-12-26 | 日本テキサス・インスツルメンツ株式会社 | 半導体装置及びその製造方法 |
| CN1219700C (zh) * | 1998-12-23 | 2005-09-21 | 贝特勒纪念学院 | 由含表面活性剂的溶液制备的中孔二氧化硅膜及其制备方法 |
| US6768200B2 (en) * | 2000-10-25 | 2004-07-27 | International Business Machines Corporation | Ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device |
| WO2002043119A2 (en) * | 2000-10-25 | 2002-05-30 | International Business Machines Corporation | An ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device, a method for fabricating the same, and an electronic device containing the same |
| TWI240959B (en) * | 2003-03-04 | 2005-10-01 | Air Prod & Chem | Mechanical enhancement of dense and porous organosilicate materials by UV exposure |
| JP2005133060A (ja) * | 2003-10-29 | 2005-05-26 | Rohm & Haas Electronic Materials Llc | 多孔性材料 |
| US7202564B2 (en) * | 2005-02-16 | 2007-04-10 | International Business Machines Corporation | Advanced low dielectric constant organosilicon plasma chemical vapor deposition films |
| WO2007020878A1 (ja) * | 2005-08-12 | 2007-02-22 | Mitsui Chemicals, Inc. | 多孔質シリカの製造方法および製造装置 |
-
2007
- 2007-03-30 JP JP2007090327A patent/JP5165914B2/ja active Active
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