JP2008217776A - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP2008217776A
JP2008217776A JP2008026598A JP2008026598A JP2008217776A JP 2008217776 A JP2008217776 A JP 2008217776A JP 2008026598 A JP2008026598 A JP 2008026598A JP 2008026598 A JP2008026598 A JP 2008026598A JP 2008217776 A JP2008217776 A JP 2008217776A
Authority
JP
Japan
Prior art keywords
antenna
integrated circuit
substrate
circuit portion
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008026598A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008217776A5 (https=
Inventor
Jun Koyama
潤 小山
Shunpei Yamazaki
舜平 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2008026598A priority Critical patent/JP2008217776A/ja
Publication of JP2008217776A publication Critical patent/JP2008217776A/ja
Publication of JP2008217776A5 publication Critical patent/JP2008217776A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thin Film Transistor (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Credit Cards Or The Like (AREA)
  • Electroluminescent Light Sources (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2008026598A 2007-02-09 2008-02-06 半導体装置 Withdrawn JP2008217776A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008026598A JP2008217776A (ja) 2007-02-09 2008-02-06 半導体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007030858 2007-02-09
JP2008026598A JP2008217776A (ja) 2007-02-09 2008-02-06 半導体装置

Publications (2)

Publication Number Publication Date
JP2008217776A true JP2008217776A (ja) 2008-09-18
JP2008217776A5 JP2008217776A5 (https=) 2011-03-17

Family

ID=39685402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008026598A Withdrawn JP2008217776A (ja) 2007-02-09 2008-02-06 半導体装置

Country Status (2)

Country Link
US (1) US7683838B2 (https=)
JP (1) JP2008217776A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8435870B2 (en) 2009-04-27 2013-05-07 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
WO2017010449A1 (ja) * 2015-07-13 2017-01-19 トッパン・フォームズ株式会社 電子機器
CN110335553A (zh) * 2019-01-10 2019-10-15 友达光电股份有限公司 显示装置以及无线传输装置
JP2023100804A (ja) * 2018-03-15 2023-07-19 大日本印刷株式会社 インターポーザ

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1978472A3 (en) * 2007-04-06 2015-04-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8154456B2 (en) 2008-05-22 2012-04-10 Philtech Inc. RF powder-containing base
US8188924B2 (en) * 2008-05-22 2012-05-29 Philtech Inc. RF powder and method for manufacturing the same
WO2011093151A1 (en) * 2010-01-29 2011-08-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device including the same
US10052848B2 (en) 2012-03-06 2018-08-21 Apple Inc. Sapphire laminates
CN102749771B (zh) * 2012-04-06 2015-02-04 信利工业(汕尾)有限公司 一种集成nfc天线的薄膜晶体管显示器
US9221289B2 (en) 2012-07-27 2015-12-29 Apple Inc. Sapphire window
DE102012023064A1 (de) * 2012-11-20 2014-05-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. RFID-Transponder, der passiv betreibbar ist
US9232672B2 (en) 2013-01-10 2016-01-05 Apple Inc. Ceramic insert control mechanism
US9678540B2 (en) 2013-09-23 2017-06-13 Apple Inc. Electronic component embedded in ceramic material
US9632537B2 (en) 2013-09-23 2017-04-25 Apple Inc. Electronic component embedded in ceramic material
JP6220239B2 (ja) * 2013-11-13 2017-10-25 キヤノン株式会社 電磁波検出・発生装置
US9154678B2 (en) 2013-12-11 2015-10-06 Apple Inc. Cover glass arrangement for an electronic device
US9225056B2 (en) 2014-02-12 2015-12-29 Apple Inc. Antenna on sapphire structure
US9443872B2 (en) 2014-03-07 2016-09-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US10406634B2 (en) 2015-07-01 2019-09-10 Apple Inc. Enhancing strength in laser cutting of ceramic components
US9787368B2 (en) * 2015-11-06 2017-10-10 Mediatek Inc. Antenna having passive booster for near field communication
JP6917700B2 (ja) 2015-12-02 2021-08-11 株式会社半導体エネルギー研究所 半導体装置
CN106057662A (zh) * 2016-06-03 2016-10-26 杭州潮盛科技有限公司 射频标签及其制作工艺
DE212017000171U1 (de) * 2016-06-30 2019-01-31 Murata Manufacturing Co., Ltd. Anbringbare Verstärkerantenne und dieselbe verwendender Leser/Schreiber
US10249456B2 (en) * 2017-03-21 2019-04-02 Illinois Tool Works Inc. Apparatus with membrane panel having close-proximity communication antenna
CN110556404A (zh) * 2019-08-09 2019-12-10 武汉华星光电半导体显示技术有限公司 显示面板及其制备方法、显示装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003006592A (ja) * 2001-06-21 2003-01-10 Matsushita Electric Ind Co Ltd 情報送受信装置
JP2005311331A (ja) * 2004-03-26 2005-11-04 Semiconductor Energy Lab Co Ltd 半導体装置
JP2006121060A (ja) * 2004-09-24 2006-05-11 Semiconductor Energy Lab Co Ltd 半導体装置及びその作製方法、並びに電子機器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW484101B (en) 1998-12-17 2002-04-21 Hitachi Ltd Semiconductor device and its manufacturing method
JP2004078991A (ja) 1998-12-17 2004-03-11 Hitachi Ltd 半導体装置およびその製造方法
JP4718677B2 (ja) * 2000-12-06 2011-07-06 株式会社半導体エネルギー研究所 半導体装置及びその作製方法
JP2005252853A (ja) 2004-03-05 2005-09-15 Fec Inc Ｒｆ−ｉｄ用アンテナ
WO2005093900A1 (en) * 2004-03-26 2005-10-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP4071253B2 (ja) * 2005-08-25 2008-04-02 東芝テック株式会社 複合アンテナ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003006592A (ja) * 2001-06-21 2003-01-10 Matsushita Electric Ind Co Ltd 情報送受信装置
JP2005311331A (ja) * 2004-03-26 2005-11-04 Semiconductor Energy Lab Co Ltd 半導体装置
JP2006121060A (ja) * 2004-09-24 2006-05-11 Semiconductor Energy Lab Co Ltd 半導体装置及びその作製方法、並びに電子機器

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8435870B2 (en) 2009-04-27 2013-05-07 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
WO2017010449A1 (ja) * 2015-07-13 2017-01-19 トッパン・フォームズ株式会社 電子機器
JP2017021640A (ja) * 2015-07-13 2017-01-26 トッパン・フォームズ株式会社 電子機器
JP2023100804A (ja) * 2018-03-15 2023-07-19 大日本印刷株式会社 インターポーザ
JP7622772B2 (ja) 2018-03-15 2025-01-28 大日本印刷株式会社 インターポーザ
CN110335553A (zh) * 2019-01-10 2019-10-15 友达光电股份有限公司 显示装置以及无线传输装置

Also Published As

Publication number Publication date
US7683838B2 (en) 2010-03-23
US20080191959A1 (en) 2008-08-14

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