JP2008210890A - Chip type electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip type electronic component that can improve solder deposition strength. <P>SOLUTION: Two lead wires 3 of a chip type electronic component are laid including a couple of peak portions of a meandering shape and a couple of channels 4 are formed at the bottom surface of a resin plate 2 on which the chip type electronic component is fixed. Before accommodation of the lead wires 3 in the channel 4, width of the meandering shape part (formed in the horizontal direction of the resin plate) of the lead wires 3 in the width direction of the channel 4 is a little larger than the width A of the channel 4. After the lead wires 3 are stored within the channel 4, the couple of peak portions of the meandering shape respectively press the internal wall of the channel 4 because of elastic deformation generated by accommodation thereof within the channel and a pressing force of these peak portions suppresses the force of the lead wires 3 to move upward from the channel 4, resulting in stable fixing of the substrate. Moreover, since the lead wires 3 include the meandering shape part in the channel 4, a soldering area of the internal part within the channel of the lead wires 3 and a metal pattern of a printed circuit board becomes large thereby improving solder deposition strength. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a chip-type electronic component, and more particularly to a chip-type electrolytic capacitor.

In order to surface-mount an electronic component main body, in which a plurality of lead wires are led out from the lower end surface like an electrolytic capacitor, on a printed circuit board, the lead wires led out from the electronic component main body are pressed.
Then, each lead wire is passed to the back of the slit of the resin plate so that the resin plate in which the groove extending from the inner side toward the outer peripheral side is formed on the lower end surface overlaps the lower end portion of the electronic component main body.
Thereafter, the pressed lead wire is bent along the groove of the resin plate and fixed to the resin plate, thereby forming an electronic component such as a chip-type electrolytic capacitor.
The electronic component subjected to the above processing is surface-mounted by soldering a pressed lead wire positioned in a groove of a resin plate and a metal pattern of a printed board (see, for example, Patent Document 1).
Since the weight of the product body is relatively large, the electrolytic capacitor having the above-described configuration may break the soldered portion and cause the capacitor to fall off if excessive vibration is applied.
For this reason, proposals have been made to increase the solder strength by welding the capacitor lead wires to the terminals provided on the resin plate or by providing auxiliary electrodes.

Japanese Patent Publication No. 4-19695

As shown in FIG. 4, when the lead wire 103 in the groove 104 provided in the resin plate 102 is linear, the soldering area between the lead wire 103 and the metal pattern of the printed circuit board is not sufficient, so that a large capacitor body May not be enough to support the solder.
For this reason, there is a proposal to provide a terminal on the resin plate, but the cost of the resin plate increases, and when an auxiliary terminal is provided, it is necessary to design a land pattern for the auxiliary terminal, which is troublesome.

Further, when the lead wire is bent, a force that the lead wire tries to return to the original position acts, and so-called spring back is generated. On the other hand, the target angle may be obtained by bending at an angle smaller than the desired angle. However, when bending along the resin plate, the resin plate is bent to an angle smaller than the desired angle. Therefore, it is impossible in practice and springback is inevitable.
Therefore, as shown in FIG. 5, the two lead wires 103 led out from the capacitor main body 101 are in a floating state with respect to the resin plate 102, and the substrate and the chip-type electronic component are not in close contact with each other, so that the strength against vibration is reduced. To do. In particular, in the case of a large chip-type electronic component, the strength against vibration is significantly reduced.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a chip-type electronic component that can improve the solder fixing strength.

  Another object of the present invention is to provide a chip-type electronic component capable of suppressing spring back.

  The chip-type electronic component of the present invention includes an electronic component body having a lower end surface from which a plurality of lead wires formed by pressing are led out, and a resin plate for fixing the electronic component body. The resin plate has a plurality of grooves formed on a surface opposite to the fixing surface of the electronic component main body, and the lead wire is bent halfway so as to extend along the groove. And has a non-linear portion in the horizontal direction of the resin plate in the groove.

As the non-linear portion, a wave shape (triangular wave shape, rectangular wave shape, sine wave shape, etc.), arc shape, spiral shape, hairpin shape, or the like can be adopted in addition to the meandering shape described later.
A preferred example of the chip-type electronic component is a chip-type aluminum electrolytic capacitor.

  In the chip-type electronic component of the present invention, the width direction dimension of the non-linear portion of the lead wire is equal to or greater than the width dimension of the groove, and the non-linear portion is accommodated in the groove. It may be elastically deformed and fitted and fixed in the groove by pressing the inner wall of the groove.

  In the chip-type electronic component according to the present invention, a locking portion with which the leading end of the lead wire comes into contact with the outer edge portion of the groove is provided, and the non-linear portion of the lead wire housed in the groove and elastically deformed is elastic. The locking portion may lock the lead wire so that the lead wire does not come out along the groove by returning.

The non-linear portion may have a meandering shape. Further, the non-linear portion may be in contact with the inner wall of the groove at each of the meandering top portions.
In addition to the meandering shape, the non-linear portion may have a wave shape (triangular wave shape, rectangular wave shape, sine wave shape, etc.) or an arc shape. Further, each of the top portions of the shape may be in contact with the inner wall of the groove.

As described above, according to the electronic component of the present invention, the lead wire is bent in the middle so as to extend along the groove, and the non-linear portion (meandering shape, wave Shape, arc shape, spiral shape, hairpin shape, etc.) Compared to the case of having only a straight portion, the soldering area between the lead wire groove portion and the metal pattern of the printed circuit board As a result, the solder fixing strength can be improved.
The non-linear portion may be formed by forming in advance before bending the lead wire.
By adopting the above configuration, it is not necessary to provide terminals or auxiliary terminals in advance on the resin plate, which is advantageous in terms of cost.

The non-linear part of the lead wire is housed in the groove and elastically deforms, and the inner surface of the groove is pressed to fix the lead wire in the groove, and the lead wire floats from the groove. The non-linear portion can be suppressed by the force pushing the inner wall of the groove, and the spring back can be suppressed.
This is because the width when the lead wire is formed is set to the same width as the width of the groove for accommodating the lead wire of the resin plate or slightly larger, and the lead wire is fitted into the groove of the resin plate. This is realized by assembling.

When the elastically deforming non-linear portion is about to return elastically, the lead wire is accommodated in the groove along the groove by providing a locking portion with which the leading end of the lead wire comes into contact with the outer edge portion of the groove. And can be locked so as not to go outside.
This is because the width when forming is made slightly smaller than the width of the groove for storing the lead wire of the resin plate, and after the lead wire is accommodated in the groove, the forming width is widened in the groove portion of the lead wire. This is also realized by pushing along the groove from the outside and generating a force with which the lead wire pushes the inner wall of the groove.

FIG. 1 is a side view of a chip-type aluminum electrolytic capacitor that is a chip-type electronic component according to the first embodiment of the present invention.
In FIG. 1, the capacitor body 1 is fixed to a resin plate 2. Two lead wires 3 are led out from the lower end surface of the capacitor body 1.

FIG. 2 is a bottom view of the chip-type aluminum electrolytic capacitor depicted in FIG. As shown in FIG. 2, the two lead wires 3 are formed in advance so as to have a meandering shape having two meandering tops, and then the forming is subjected to pressing.
The two lead wires 3 extend from the bottom surface of the capacitor body 1 in a direction orthogonal to the capacitor body 1 before the capacitor body 1 is fixed to the resin plate 2.

  The resin plate 2 is formed with two slits 5 penetrating between the upper and lower surfaces. Further, two grooves 4 are formed on the bottom surface of the resin plate 2. The extending direction of the slit 5 and the groove 4 is orthogonal.

  In order to fix the capacitor body 1 having the two lead wires 3 formed in advance to the resin plate 2, the capacitor body 1 is placed on the bottom surface of the resin plate 2 until the two lead wires 3 reach the tips of the slits 5. Slide in the direction along. Thereafter, the two lead wires 3 are bent so as to be accommodated in the groove 4.

In the present embodiment, before the lead wire 3 is accommodated in the groove 4 (at the time of forming), the width dimension of the meandering portion of the lead wire 3 along the width direction of the groove 4 is the width dimension of the groove 4. Slightly larger than A.
Therefore, after the lead wire 3 is accommodated in the groove 4, both of them have substantially the same size, but the meandering portion of the lead wire 3 is forcibly accommodated in the groove 4 and is elastically deformed. Each of the two meandering tops presses the inner wall of the groove 4.

Furthermore, in this embodiment, since the lead wire 3 has a meandering portion in the groove 4, the soldering area between the in-groove portion of the lead wire 3 and the metal pattern of the printed circuit board increases, and the meandering Since it becomes longer by the amount of soldering, the solder fixing strength can be improved.
Further, it is not necessary to provide terminals or auxiliary terminals in advance on the resin plate 2, which is advantageous in terms of cost.

  Further, the force of the lead wire 3 floating from the groove 4 can be suppressed by the force of pressing the inner wall of the groove 4 generated by elastic deformation of the meandering portion of the lead wire 3 housed in the groove. And spring back can be suppressed.

Next, a second embodiment of the present invention will be described.
FIG. 3 is a bottom view of the chip-type aluminum electrolytic capacitor according to the present embodiment.

As shown in FIG. 3, the two lead wires 3 are formed in advance so as to have a meandering shape having two meandering tops, and are then pressed.
The two lead wires 3 extend from the bottom surface of the capacitor body 1 in a direction orthogonal to the capacitor body 1 before the capacitor body 1 is fixed to the resin plate 2.

The resin plate 2 is formed with two slits 5 penetrating between the upper and lower surfaces. Further, two grooves 4 are formed on the bottom surface of the resin plate 2. The extending direction of the slit 5 and the groove 4 is orthogonal.
Further, the inner wall of the groove 4 is a lead wire latching in which the vicinity of the outlet in the extending direction is a tapered surface that is inclined with respect to the extending direction of the groove 4 and the width of the groove 4 is gradually narrowed toward the outlet. It is part 4a.

  As described above, the capacitor body 1 having the two lead wires 3 formed in advance is slid into the slits 5 so that the two lead wires 3 are accommodated in the grooves 4 as described above. Bend it.

In the present embodiment, before the lead wire 3 is accommodated in the groove 4 (that is, during forming), the length of the meandering portion of the lead wire 3 along the width direction of the groove 4 is the width A of the groove 4. Slightly smaller than. Therefore, even after the lead wire 3 is accommodated in the groove 4, each of the two meandering tops is separated from the inner wall of the groove 4.
Therefore, the leading end portion of the lead wire 3 along the extending direction of the groove 4 is pushed by pressing the lead wire 3 from the outside toward the inside along the extending direction of the groove 4. As a result, the meandering portion of the lead wire 3 is elastically deformed, and the width dimension of the meandering portion of the lead wire 3 along the width direction of the groove 4 becomes substantially the same as the width A of the groove 4. At this time, each of the two meandering tops presses the inner wall of the groove 4.
Next, after the tip of the lead wire 3 is locked to the tapered surface 4a, the force that presses the lead wire 3 from the outside toward the inside along the extending direction of the groove 4 is released. After that, even if the lead wire 3 tries to return elastically, the lead wire 3 cannot be elastically returned because the tip of the lead wire 3 is locked by the lead wire locking portion 4a having a tapered surface. Stay and never go outside.

Thus, in this embodiment, since the lead wire 3 has a meandering portion in the groove 4, the soldering area between the in-groove portion of the lead wire 3 and the metal pattern of the printed board increases. .
Therefore, the solder fixing strength can be improved. Further, it is not necessary to provide terminals or auxiliary terminals in advance on the resin plate 2, which is advantageous in terms of cost.

  Further, a tapered surface in which the tip of the lead wire 3 is a part of the inner wall of the groove 4 so that the lead wire 3 does not come out of the groove 4 by elastically returning the meandering portion that is elastically deformed; That is, by pressing the lead wire locking portion 4a, it is possible to suppress the force with which the lead wire 3 tries to float from the groove 4, and to suppress spring back.

[Example 1]
A chip-type aluminum electrolytic capacitor described in the first embodiment shown in FIG. 2 was manufactured using an aluminum electrolytic capacitor of 470 μF / 35 V and φ16 × 16.5 mm.

[Example 2]
Using a product having the same rating and size as in Example 1, the chip-type aluminum electrolytic capacitor described in the second embodiment shown in FIG. 3 was produced.

(Comparative Example 1)
Using a product having the same rating and size as in Example 1, a chip-type aluminum electrolytic capacitor shown in FIG.

With respect to Examples 1 and 2 and Comparative Example 1, a vibration test and a fixing strength confirmation test were performed. The vibration test was performed under the conditions described later, and the presence or absence of lead wire breakage was confirmed. The test result indicates the number of products in which the lead wire is broken with respect to the number of tests (number of failures / number of tests).
In the adhesion strength test, by applying force from the side to the soldered product under the conditions described later, it was confirmed which part was peeled off when the product was peeled off the substrate. When the land was peeled off, it was judged that the solder had sufficient solder bonding strength. Shows the number of cases where the test was broken outside the land with respect to the number of tests (number of failures / number of tests).

[Vibration test conditions]
Sinusoidal vibration: f = 5 to 2000 Hz, maximum amplitude: 0.42 mm, maximum acceleration: 20G
Sweep speed: 1 oct / min (logarithmic sweep), vibration direction: 3 axes of X, Y and Z, 24 hours each [sticking strength test]
Tensile speed: 20 mm / min, force is applied until the product peels off the substrate.

  From the above vibration test and adhesion strength test results, it can be seen that Examples 1 and 2 according to the present invention have an excellent effect as compared with Comparative Example 1.

  In the above embodiment, only the case where the non-linear portion meanders is described, but the non-linear portion has a triangular wave shape, a rectangular wave shape, a sine wave shape, an arc shape, a spiral shape, or a hairpin shape. The same effect can be obtained also in the case of being.

1 is a side view of a chip-type aluminum electrolytic capacitor according to a first embodiment of the present invention. It is a bottom view of the chip-type aluminum electrolytic capacitor of FIG. It is a bottom view of the chip-type aluminum electrolytic capacitor by the 2nd Embodiment of this invention. It is a bottom view of the conventional chip-type aluminum electrolytic capacitor. It is a side view of the conventional chip-type aluminum electrolytic capacitor.

Explanation of symbols

1, 101 Capacitor body 2, 102 Resin plate 3, 103 Lead wire 4, 104 Groove 4a Lead wire locking portion (taper surface)
5 Slit

Claims (7)

An electronic component main body having a lower end surface from which a plurality of lead wires formed by pressing are derived, and a resin plate for fixing the electronic component main body,
In the resin plate, a plurality of grooves are formed on the surface opposite to the fixed surface of the electronic component body,
A chip characterized in that the lead wire is bent in the middle so as to extend along the groove, and has a non-linear portion in the horizontal direction of the resin plate in the groove. Electronic components. The width direction dimension of the groove of the non-linear portion of the lead wire is substantially the same as the width dimension of the groove,
2. The chip-type electronic component according to claim 1, wherein the non-linear portion is accommodated in the groove and elastically deformed, and the inner wall of the groove is pressed and fixed in the groove. . Provided with a locking portion that a lead wire tip abuts on the outer edge of the groove, the width direction dimension of the groove of the non-linear portion of the lead wire is substantially the same as the width dimension of the groove,
The locking portion prevents the lead wire from coming out along the groove so that the non-linear portion of the lead wire housed in the groove is elastically deformed and elastically returns. The chip-type electronic component according to claim 1, wherein the chip-type electronic component is locked.   The chip-type electronic component according to claim 1, wherein the non-linear portion has a meandering shape.   The chip-type electronic component according to claim 4, wherein the non-linear portion is in contact with the inner wall of the groove at each of the meandering top portions.   3. The chip-type electronic component according to claim 1, wherein the non-linear portion has a triangular wave shape, a rectangular wave shape, a sine wave shape, an arc shape, a spiral shape, or a hairpin shape.   The non-linear portion has a triangular wave shape, a rectangular wave shape, a sine wave shape, or an arc shape, and is in contact with the inner wall of the groove at each of the top portions of the shape. The chip-type electronic component according to claim 1.

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