WO2019189040A1 - Contact and method of manufacturing same - Google Patents

Contact and method of manufacturing same Download PDF

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Publication number
WO2019189040A1
WO2019189040A1 PCT/JP2019/012622 JP2019012622W WO2019189040A1 WO 2019189040 A1 WO2019189040 A1 WO 2019189040A1 JP 2019012622 W JP2019012622 W JP 2019012622W WO 2019189040 A1 WO2019189040 A1 WO 2019189040A1
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WO
WIPO (PCT)
Prior art keywords
contact
range
end surface
thin plate
closer
Prior art date
Application number
PCT/JP2019/012622
Other languages
French (fr)
Japanese (ja)
Inventor
中村　達哉
允昌 石黒
Original Assignee
北川工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 北川工業株式会社 filed Critical 北川工業株式会社
Publication of WO2019189040A1 publication Critical patent/WO2019189040A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending

Definitions

  • the present disclosure relates to a contact and a manufacturing method thereof.
  • a contact used for EMC (electromagnetic compatibility) countermeasures of an electronic circuit board is known (for example, see Patent Document 1).
  • the contact described in Patent Document 1 has an elastic contact portion that is shaped to protrude in a direction parallel to the component mounting surface of the electronic circuit board.
  • the elastic contact portion is configured to be able to advance and retract in a direction parallel to the component mounting surface of the electronic circuit board as it elastically deforms.
  • the elastic contact portion is a contact portion at the tip in the protruding direction, and is in pressure contact with a non-contact surface (for example, a panel surface of the casing) arranged perpendicular to the component mounting surface of the electronic circuit board.
  • a non-contact surface for example, a panel surface of the casing
  • the DC resistance value of the contact may increase. If the DC resistance value of the contact increases, there is a possibility that the EMC countermeasure effect is reduced. Therefore, when it is assumed that the device is used in a high temperature environment as described above, it is preferable to take measures that can suppress a decrease in contact performance.
  • the contact includes a base portion and an elastic contact portion.
  • the base has a joint surface that is soldered to the first surface.
  • the elastic contact portion is elastically deformed and press-contacts with the second surface.
  • the elastic contact portion has an outer surface, an inner surface, a first end surface, and a second end surface.
  • the outer surface is constituted by one surface of a thin metal plate.
  • the inner surface is constituted by the other surface of the thin plate.
  • a 1st end surface and a 2nd end surface are comprised by the end surface of a thin plate.
  • At least the outer surface is constituted by a plating film provided on the surface of the thin plate.
  • the outer side surface has a first range adjacent to the first end surface, a second range adjacent to the second end surface, and a third range between the first range and the second range.
  • the outer surface has a surface that is in contact with the third range as a reference surface, and the shape where the first range is closer to the first end surface is away from the reference surface, and the portion where the second range is closer to the second end surface is away from the reference surface It is said that.
  • the contact configured in this way, it is possible to suppress an increase in the DC resistance value of the contact even when used for a long period of time in a high temperature environment exceeding normal temperature.
  • the contact includes a base portion and an elastic contact portion.
  • the base has a joint surface that is soldered to the first surface.
  • the elastic contact portion is elastically deformed and press-contacts with the second surface.
  • the elastic contact portion has an outer surface, an inner surface, a first end surface, and a second end surface.
  • the outer surface is constituted by one surface of a thin metal plate.
  • the inner surface is constituted by the other surface of the thin plate.
  • a 1st end surface and a 2nd end surface are comprised by the end surface of a thin plate.
  • At least the outer surface is constituted by a plating film provided on the surface of the thin plate.
  • the outer side surface has a first range adjacent to the first end surface, a second range adjacent to the second end surface, and a third range between the first range and the second range.
  • the outer surface has a surface that is in contact with the third range as a reference surface, and the shape where the first range is closer to the first end surface is away from the reference surface, and the portion where the second range is closer to the second end surface is away from the reference surface It is said that.
  • the metal thin plate Tapping is applied.
  • a contact capable of suppressing an increase in DC resistance value even when used for a long period of time in a high temperature environment exceeding normal temperature is manufactured. be able to.
  • FIG. 1A is a perspective view of a contact according to the first embodiment.
  • FIG. 1B is an enlarged view of the IB section shown in FIG. 1A.
  • FIG. 2A is a plan view of the contact of the first embodiment.
  • FIG. 2B is a front view of the contact according to the first embodiment.
  • FIG. 2C is a right side view of the contact according to the first embodiment.
  • FIG. 2D is a rear view of the contact of the first embodiment.
  • FIG. 2E is a bottom view of the contact according to the first embodiment.
  • FIG. 3A is an enlarged view of the IIIA portion shown in FIG. 2A.
  • FIG. 3B is an enlarged view of the IIIB portion shown in FIG. 2A.
  • FIG. 3C is a horizontal sectional view of the portion shown in FIG. 3A.
  • FIG. 3D is a horizontal sectional view of the portion shown in FIG. 3B.
  • FIG. 4 is an explanatory view showing a contact arranging method according to the first embodiment.
  • FIG. 5A is an explanatory diagram illustrating a state in which a ⁇ shift occurs in the contact according to the first embodiment.
  • FIG. 5B is an enlarged cross-sectional view showing an enlarged cross section of the VB portion shown in FIG. 5A.
  • FIG. 4 is a graph showing changes with time in the resistance value of the contact according to the first embodiment.
  • FIG. FIG. 7A is a perspective view of a contact according to the second embodiment.
  • FIG. 7B is an enlarged view of the VIIB section shown in FIG. 7A.
  • FIG. 8A is a plan view of a contact according to the second embodiment.
  • FIG. 8B is a front view of the contact of the second embodiment.
  • FIG. 8C is a right side view of the contact according to the second embodiment.
  • FIG. 8D is a rear view of the contact according to the second embodiment.
  • FIG. 8E is a bottom view of the contact of the second embodiment.
  • FIG. 9 is a cross-sectional view taken along the line IX-IX in FIG. 8B.
  • FIG. 10A is an explanatory view showing a contact arranging method (No. 1) according to the second embodiment.
  • FIG. 10B is an explanatory view showing a contact arranging method (No. 2) according to the second embodiment.
  • a contact 1 shown in FIGS. 1A, 1B, 2A, 2B, 2C, 2D, and 2E has a first surface (for example, a component mounting surface of an electronic circuit board) and is perpendicular to the first surface.
  • 2 is a conductive component that can be electrically connected to a second surface (for example, a surface of a metal panel disposed in the vicinity of the electronic circuit board).
  • a first surface for example, a component mounting surface of an electronic circuit board
  • 2 is a conductive component that can be electrically connected to a second surface (for example, a surface of a metal panel disposed in the vicinity of the electronic circuit board).
  • each of these directions is only a direction defined in order to briefly explain the relative positional relationship between the respective parts constituting the contact 1. Therefore, for example, the direction in which the contact 1 is directed when the contact 1 is shipped or used is undefined.
  • the contact 1 includes a base portion 3 and an elastic contact portion 5.
  • the base portion 3 and the elastic contact portion 5 are integrally formed by a thin metal plate (in the case of the first embodiment, a thin plate of tin-plated spring beryllium copper subjected to reflow treatment, thickness 0.08 mm). ing.
  • the base portion 3 is a portion that is secured to such a degree that it does not deform even when an external force assumed when the contact 1 is used.
  • the base 3 has a joint surface 3A that is soldered to the first surface.
  • the elastic contact portion 5 is a portion that elastically deforms when an external force assumed when the contact 1 is used acts.
  • the elastic contact portion 5 is elastically deformed along with the contact with the second surface, and an elastic force generated at that time is applied to the second surface to make pressure contact with the second surface.
  • the base portion 3 includes a top plate portion 11 constituting the upper surface of the base portion 3, a first hanging wall 12 ⁇ / b> A that curves from the left end of the top plate portion 11 and extends downward, and the top plate portion 11.
  • a second hanging wall 12B that curves from the right end of the first hanging wall and extends downward, a first hook receiver 13A that curves from the front end of the first hanging wall 12A and extends to the right, and a front end of the second hanging wall 12B From the lower end of the second hanging wall 12B, the second bottom plate portion 14A that curves from the lower end of the first hanging wall 12A, and that curves from the lower end of the first hanging wall 12B.
  • a second bottom plate portion 14B extending leftward.
  • the lower surfaces of the first bottom plate portion 14A and the second bottom plate portion 14B are the above-described bonding surface 3A.
  • the elastic contact portion 5 includes a drooping portion 21 that curves from the rear end of the top plate portion 11 and extends downward, and a first stopper 22A that protrudes leftward from the left end of the drooping portion 21.
  • a second stopper 22B protruding rightward from the right end of the hanging part 21, a lower extending part 23 curved from the lower end of the hanging part 21 and extending forward, and an upper side from the front end of the lower extending part 23
  • the lower extension 23 extends from the hanging portion 21 at the rear of the first hook receiver 13A and the second hook receiver 13B, and passes below the first hook receiver 13A and the second hook receiver 13B. 13A and the second hook receiver 13B extend forward.
  • the upper extending portion 25 passes from above the first hook receiver 13A and the second hook receiver 13B from the folded portion 24 in front of the first hook receiver 13A and the second hook receiver 13B, and passes through the first hook receiver 13A. And it extends rearward rather than the second hook receiver 13B.
  • the hook portion 26 enters the back side of the first hook receiver 13A and the second hook receiver 13B.
  • the first stopper 22A and the second stopper 22B are displaced forward together with the hanging portion 21 when the hanging portion 21 is elastically deformed and displaced forward, and the first and second hanging walls 12A and 12B are moved to the front.
  • the contact portion is displaced to a position where it comes into contact, the drooping portion 21 is restricted from being displaced further forward.
  • the hook part 26 restricts the upper extension part 25 from being displaced forward by being hooked on the back surfaces of the first hook receiver 13A and the second hook receiver 13B.
  • the lower extending portion 23 has a movable range defined upward by the first hook receiver 13A and the second hook receiver 13B, and a movable range defined downward by the first bottom plate portion 14A and the second bottom plate portion 14B. Yes.
  • the lower extending portion 23 has a movable range in the left-right direction defined by the first hanging wall 12A and the second hanging wall 12B.
  • the upper extending portion 25 has a downward movable range defined by the first hook receiver 13A and the second hook receiver 13B.
  • the elastic contact portion 5 has an outer surface 31, an inner surface 32, a first end surface 33A, and a second end surface 33B.
  • the outer side surface 31 is constituted by one surface of a thin plate.
  • the inner side surface 32 is constituted by the other surface of the thin plate.
  • 33 A of 1st end surfaces and the 2nd end surface 33B are comprised by the end surface of a thin plate.
  • the outer side surface 31 includes a first range 31A adjacent to the first end surface 33A, a second range 31B adjacent to the second end surface 33B, and a third range 31C between the first range 31A and the second range 31B.
  • the outer side surface 31 assumes a reference surface 41 in contact with the third range 31 ⁇ / b> C, and a shape in which the first range 31 ⁇ / b> A is closer to the first end surface 33 ⁇ / b> A is separated from the reference surface 41.
  • the second range 31 ⁇ / b> B has a shape that is separated from the reference surface 41 as the position is closer to the second end surface 33 ⁇ / b> B.
  • the outer side surface 31 and the inner side surface 32 are comprised by the plating film 43 provided in the surface of a thin plate so that it may appear in FIG. 3C and FIG. 3D. On the outer surface 31, the plating film 43 is provided so as to continue from the first range 31A to the second range 31B through the third range 31C.
  • the thin base metal 45 is exposed at the first end surface 33A and the second end surface 33B.
  • the first range 31 ⁇ / b> A and the second range 31 ⁇ / b> B are a part from the lower extending part 23 to the upper extending part 25 through the folded part 24 after punching out the processed product from the metal thin plate on which the plating film 43 is formed.
  • the shape is processed as described above.
  • the portions corresponding to the first range 31A and the second range 31B are processed into a shape in which the plate thickness of the thin plate becomes thinner as the position is closer to the first end surface 33A and the second end surface 33B. Thereafter, the bend is applied to the portion subjected to the tapping, and the folded portion 24 and the like are configured.
  • the contact 1 configured as described above is surface-mounted on the component mounting surface of the electronic circuit board 51 and is disposed at a predetermined location together with the electronic circuit board 51.
  • the elastic contact part 5 of the contact 1 contacts the surface of the metal panel 53 arrange
  • either the electronic circuit board 51 or the metal panel 53 is moved relative to the other so that the surface of the metal panel 53 slides in the vertical direction with respect to the component mounting surface of the electronic circuit board 51.
  • the contact 1 can be arranged at an intended position.
  • the mounting position of the contact 1 is shifted in the rotation direction about the axis perpendicular to the component mounting surface.
  • a shift is also referred to as a ⁇ shift.
  • the elastic contact portion 5 of the contact 1 easily comes into contact with the surface of the metal panel 53 at either the left end or the right end.
  • FIG. 5A the case where the elastic contact part 5 contacts the surface of the metal panel 53 in the edge part of a right end is illustrated.
  • the description will be continued assuming a case where a ⁇ shift occurs in the direction illustrated in FIG. 5A.
  • the first range 31A and the second range 31B are subjected to the tapping process described above. Therefore, even if the above-described ⁇ deviation occurs, as shown in FIG. 5B, the outermost end portion of the plating film 43 does not contact the surface of the metal panel 53, and either the first range 31A or the second range 31B. (FIG. 5B illustrates the case of the second range 31B) and the vicinity of the boundary between the third range 31C and the surface of the metal panel 53. Therefore, even if the ⁇ shift occurs, the load associated with the contact with the metal panel 53 is hardly applied to the outermost end portion of the plating film 43 (the rightmost end in the example shown in FIG. 5B).
  • the endmost portion of the plating film 43 from being chipped, scraped, or peeled off in contact with the metal panel 53 (hereinafter also collectively referred to as “missing”). Therefore, it is possible to suppress the state where the thin plate base material 45 and the metal panel 53 are in direct contact with each other as much as the end portion of the plating film 43 is less likely to be lost. Thereby, it can suppress that the surface of the base material 45 which is easier to oxidize than the plating film 43 will be in the state which contact
  • the contact 1 is surface-mounted on the printed wiring board.
  • a gold-plated copper plate is disposed at a position perpendicular to the printed wiring board, and the contact 1 is disposed so as to be in pressure contact with the gold-plated copper plate.
  • the relative position between the contact 1 and the gold-plated copper plate is set so that the elastic contact portion 5 of the contact 1 is compressed by 10%.
  • the printed wiring board and the gold-plated copper plate are positioned via a spacer or the like, and necessary portions are fixed by a fixing tool such as a screw so that the relative positions of each other are not shifted.
  • the test object configured as described above is installed in a tank of an environmental tester (model name: SH-242, manufactured by ESPEC Corporation).
  • the temperature in the bath is periodically changed between ⁇ 40 ° C. and 125 ° C. More specifically, after raising the temperature in the tank to 125 ° C., the temperature is maintained at 125 ° C. for 2 hours. Thereafter, the temperature in the tank is lowered to ⁇ 40 ° C. over 1 hour, and then kept at ⁇ 40 ° C. for 2 hours. Thereafter, the temperature in the tank is increased to 125 ° C. over 1 hour, and thereafter, the temperature in the tank is changed at the above-described cycle.
  • the resistance value of the contact 1 is measured by a resistance meter (milliohm high tester) at a timing when the processing time becomes 0 hour, 100 hours, 250 hours, and 500 hours.
  • Such an increase in resistance value is caused by, for example, the contact of the contact 1 with the metal panel 53 at a location where the plating film 43 is missing (ie, the location where the base material 45 is exposed), and the base material 45 serving as a contact location. It is assumed that there is a cause for the formation of an oxide film on the surface. Moreover, in the case of a comparative example, it turns out that not only resistance value rises but resistance value rises or falls, and the fluctuation range is large. The reason why such a variation in the resistance value occurs is that, for example, the resistance value increases as the oxide film is formed at the contact portion of the comparative example, and then the resistance value decreases when the oxide film is scraped. It is guessed that this is due to a phenomenon. Therefore, in the case of the comparative example, it is difficult to suppress an increase in the DC resistance value over a long period of time, and it is difficult to obtain a stable EMC countermeasure effect.
  • the contact 61 shown in FIGS. 7A, 7B, 8A, 8B, 8C, 8D, and 8E is perpendicular to the first surface (for example, the component mounting surface of the electronic circuit board) and the first surface. 2 is a conductive component that can be electrically connected to a second surface (for example, a surface of a metal panel disposed in the vicinity of the electronic circuit board).
  • first surface for example, the component mounting surface of the electronic circuit board
  • 2 is a conductive component that can be electrically connected to a second surface (for example, a surface of a metal panel disposed in the vicinity of the electronic circuit board).
  • the respective directions of the left, right, front, rear, top and bottom are defined as in the first embodiment.
  • the contact 61 includes a base portion 3 and an elastic contact portion 5.
  • the base portion 3 and the elastic contact portion 5 are integrally formed by a thin metal plate (in the case of the second embodiment, a thin plate of tin-plated spring beryllium copper with a reflow treatment, thickness 0.08 mm). ing.
  • the base 3 is a portion that is secured to such a degree that it does not deform even when an external force assumed when the contact 61 is used.
  • the base 3 has a joint surface 3A that is soldered to the first surface.
  • the elastic contact portion 5 is a portion that is elastically deformed as an external force assumed when the contact 61 is used acts.
  • the elastic contact portion 5 is elastically deformed along with the contact with the second surface, and an elastic force generated at that time is applied to the second surface to make pressure contact with the second surface.
  • the base portion 3 includes a top plate portion 11 constituting the upper surface of the base portion 3, a first hanging wall 12A that curves from the left end of the top plate portion 11 and extends downward, and the top plate portion 11.
  • a second hanging wall 12B that curves from the right end of the first hanging wall and extends downward, a first bottom plate portion 14A that curves from the lower end of the first hanging wall 12A and extends to the right, and a lower end of the second hanging wall 12B
  • a second bottom plate portion 14B that curves to the left and extends to the left.
  • the lower surfaces of the first bottom plate portion 14A and the second bottom plate portion 14B are the above-described bonding surface 3A.
  • the first hanging wall 12A is provided with a first opening 71A
  • the second hanging wall 12B is provided with a second opening 71B.
  • the elastic contact portion 5 includes a drooping portion 21 that curves from the rear end of the top plate portion 11 and extends downward, and a first stopper 22A that protrudes leftward from the left end of the drooping portion 21.
  • the second stopper 22B protrudes rightward from the right end of the hanging part 21.
  • the elastic contact portion 5 is curved from the lower end of the drooping portion 21 and extends forward, and is curved from the front end of the first horizontal portion 81 and obliquely rearward and upward.
  • An inclined part 82 that extends from the upper end of the inclined part 82 and extends forward, and a folded part 24 that curves downward from the front end of the second horizontal part 83 and folds backward. It has a rising portion 84 that curves from the rear end of the folded portion 24 and extends upward, and a third horizontal portion 85 that curves from the upper end of the rising portion 84 and extends backward.
  • the elastic contact portion 5 includes a first protrusion 86A that protrudes from the left end of the third horizontal portion 85 to the left, and a right end of the third horizontal portion 85. And a second projecting portion 86B projecting to the right.
  • the first protrusion 86A enters the inner peripheral side of the first opening 71A.
  • the movable range of the first protrusion 86A is defined by the inner peripheral surface of the first opening 71A.
  • the second protrusion 86B enters the inner peripheral side of the second opening 71B.
  • the movable range of the 2nd protrusion part 86B is demarcated by the internal peripheral surface of the 2nd opening part 71B.
  • the first stopper 22A and the second stopper 22B are displaced forward together with the hanging portion 21 when the hanging portion 21 is elastically deformed and displaced forward, and the first and second hanging walls 12A and 12B are moved to the front.
  • the contact portion is displaced to a position where it comes into contact, the drooping portion 21 is restricted from being displaced further forward.
  • the elastic contact portion 5 has an outer surface 31, an inner surface 32, a first end surface 33A, and a second end surface 33B.
  • the outer side surface 31 is constituted by one surface of a thin plate.
  • the inner side surface 32 is constituted by the other surface of the thin plate.
  • 33 A of 1st end surfaces and the 2nd end surface 33B are comprised by the end surface of a thin plate.
  • the outer side surface 31 includes a first range 31A adjacent to the first end surface 33A, a second range 31B adjacent to the second end surface 33B, and a third range 31C between the first range 31A and the second range 31B.
  • the first range 31A and the second range 31B are subjected to the same tapping process as the first embodiment, thereby the first range 31A and the second range 31B.
  • the range 31B is processed into the same shape as the first embodiment. Therefore, even the contact 61 of the second embodiment can exhibit the same operations and effects as the contact 1 of the first embodiment, and can suppress an increase in the DC resistance value.
  • the metal panel rises in the relative sliding direction between the electronic circuit board and the metal panel. Either the direction (see FIG. 10A) and the direction in which the metal panel is processed (see FIG. 10B) can be used. Therefore, the degree of freedom regarding the mounting direction when contacting the metal panel is higher than that of the contact 61 of the first embodiment, and workability can be improved.
  • the first range 31A and the second range 31B are subjected to a tapping process so that the shape of the first range 31A and the second range 31B is processed so that the plate thickness decreases toward the end.
  • the processing method is not limited to tapping as long as it can be processed into the same shape.
  • the material of the plating film 43 and the base material 45 can be changed arbitrarily.
  • achieved by the one component in each said embodiment may be implement
  • achieved by the some component may be implement
  • at least a part of the configuration of each of the above embodiments may be added to or replaced with the configuration of the other above embodiments.
  • a component supply body for example, a carrier tape or a storage tray
  • Disclosure can also be realized.
  • the contact and the manufacturing method thereof of the present disclosure may further include the following configurations.
  • the first range may have a shape in which the thickness of the thin plate becomes thinner as the position is closer to the first end surface.
  • the second range may be a shape in which the plate thickness of the thin plate decreases as the position is closer to the second end surface.
  • the contact manufacturing method of the present disclosure may bend the portion subjected to the tapping process by performing the bending process after the tapping process is performed.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

The present invention provides a contact such that an increase in DC resistance value can be suppressed for a long period, and a method of manufacturing the contact. The contact comprises an elastic contact portion (5). The elastic contact portion (5) includes an outside surface (31) configured of one surface of a metal thin plate, and a first end surface (33A) and a second end surface (33B) which are configured of end surfaces of the thin plate. The outside surface (31) is configured of a plated film (43). The outside surface (31) includes a first area (31A) adjacent to the first end surface (33A), a second area (31B) adjacent to the second end surface (33B), and a third area (31C) between the first area (31A) and the second area (31B). With a plane contacting the third area (31C) being considered a reference plane, the first area (31A) is shaped so as to be increasingly spaced apart from the reference plane with decreasing distance to the first end surface (33A), and the second area (31B) is shaped so as to be increasingly spaced apart from the reference plane with decreasing distance to the second end surface (33B).

Description

コンタクト及びその製造方法Contact and manufacturing method thereof
　本開示は、コンタクト及びその製造方法に関する。 The present disclosure relates to a contact and a manufacturing method thereof.
　電子回路基板のＥＭＣ（electromagnetic compatibility）対策に用いられるコンタクトが知られている（例えば、特許文献１参照。）。特許文献１に記載のコンタクトは、電子回路基板の部品実装面と平行な方向に向かって突出する形状とされた弾性接触部を有する。弾性接触部は、弾性変形するのに伴って電子回路基板の部品実装面と平行な方向へ進退可能に構成されている。 A contact used for EMC (electromagnetic compatibility) countermeasures of an electronic circuit board is known (for example, see Patent Document 1). The contact described in Patent Document 1 has an elastic contact portion that is shaped to protrude in a direction parallel to the component mounting surface of the electronic circuit board. The elastic contact portion is configured to be able to advance and retract in a direction parallel to the component mounting surface of the electronic circuit board as it elastically deforms.
　弾性接触部は、突出方向先端にある接触部で、電子回路基板の部品実装面に対して垂直に配置される非接触面（例えば筐体のパネル面。）に加圧接触する。これにより、電子回路基板と上述の非接触面は、コンタクトを介して電気的に接続される。 The elastic contact portion is a contact portion at the tip in the protruding direction, and is in pressure contact with a non-contact surface (for example, a panel surface of the casing) arranged perpendicular to the component mounting surface of the electronic circuit board. As a result, the electronic circuit board and the non-contact surface are electrically connected via the contact.
特開２０１４－７２３１７号公報JP 2014-72317 A
　しかし、上述のようなコンタクトが、常温を上回るような高温環境下（例えば自動車のエンジンルーム等。）で長期間にわたって使用された場合には、コンタクトの直流抵抗値が上昇することがある。コンタクトの直流抵抗値が上昇すると、ＥＭＣ対策効果の低下を招く可能性がある。したがって、上述のような高温環境下での使用が想定される場合には、コンタクトの性能低下を抑制できるような対策を講ずることが好ましい。 However, when the above-described contact is used for a long period of time in a high-temperature environment (for example, an automobile engine room) exceeding normal temperature, the DC resistance value of the contact may increase. If the DC resistance value of the contact increases, there is a possibility that the EMC countermeasure effect is reduced. Therefore, when it is assumed that the device is used in a high temperature environment as described above, it is preferable to take measures that can suppress a decrease in contact performance.
　本開示の一局面においては、長期にわたって直流抵抗値の上昇を抑制可能なコンタクトと、そのようなコンタクトの製造方法を提供することが望ましい。 In one aspect of the present disclosure, it is desirable to provide a contact that can suppress an increase in DC resistance over a long period of time and a method for manufacturing such a contact.
　本開示の一態様は、第一面と、第一面に対して垂直に配置される第二面とを電気的に接続可能なコンタクトである。当該コンタクトは、基部と、弾性接触部と、を備える。基部は、第一面にはんだ付けされる接合面を有する。弾性接触部は、弾性変形して第二面に加圧接触する。弾性接触部は、外側面と、内側面と、第一端面及び第二端面と、を有する。外側面は、金属の薄板の一方の面によって構成される。内側面は、薄板の他方の面によって構成される。第一端面及び第二端面は、薄板の端面によって構成される。少なくとも外側面が薄板の表面に設けられためっき膜によって構成される。外側面は、第一端面に隣接する第一範囲と、第二端面に隣接する第二範囲と、第一範囲と第二範囲との間にある第三範囲とを有する。外側面は、第三範囲に接する面を基準面として、第一範囲が第一端面に近い箇所ほど基準面から離れる形状とされ、第二範囲が第二端面に近い箇所ほど基準面から離れる形状とされている。 One aspect of the present disclosure is a contact that can electrically connect a first surface and a second surface that is disposed perpendicular to the first surface. The contact includes a base portion and an elastic contact portion. The base has a joint surface that is soldered to the first surface. The elastic contact portion is elastically deformed and press-contacts with the second surface. The elastic contact portion has an outer surface, an inner surface, a first end surface, and a second end surface. The outer surface is constituted by one surface of a thin metal plate. The inner surface is constituted by the other surface of the thin plate. A 1st end surface and a 2nd end surface are comprised by the end surface of a thin plate. At least the outer surface is constituted by a plating film provided on the surface of the thin plate. The outer side surface has a first range adjacent to the first end surface, a second range adjacent to the second end surface, and a third range between the first range and the second range. The outer surface has a surface that is in contact with the third range as a reference surface, and the shape where the first range is closer to the first end surface is away from the reference surface, and the portion where the second range is closer to the second end surface is away from the reference surface It is said that.
　このように構成されたコンタクトによれば、常温を上回るような高温環境下で長期間にわたって使用された場合であっても、コンタクトの直流抵抗値が上昇するのを抑制することができる。 According to the contact configured in this way, it is possible to suppress an increase in the DC resistance value of the contact even when used for a long period of time in a high temperature environment exceeding normal temperature.
　本開示の別の一態様は、第一面と、第一面に対して垂直に配置される第二面とを電気的に接続可能なコンタクトの製造方法である。コンタクトは、基部と、弾性接触部と、を備える。基部は、第一面にはんだ付けされる接合面を有する。弾性接触部は、弾性変形して第二面に加圧接触する。弾性接触部は、外側面と、内側面と、第一端面及び第二端面と、を有する。外側面は、金属の薄板の一方の面によって構成される。内側面は、薄板の他方の面によって構成される。第一端面及び第二端面は、薄板の端面によって構成される。少なくとも外側面が薄板の表面に設けられためっき膜によって構成される。外側面は、第一端面に隣接する第一範囲と、第二端面に隣接する第二範囲と、第一範囲と第二範囲との間にある第三範囲とを有する。外側面は、第三範囲に接する面を基準面として、第一範囲が第一端面に近い箇所ほど基準面から離れる形状とされ、第二範囲が第二端面に近い箇所ほど基準面から離れる形状とされている。第一範囲を第一端面に近い箇所ほど基準面から離れる形状に加工する工程、及び第二範囲を第二端面に近い箇所ほど基準面から離れる形状加工する工程においては、金属の薄板に対して叩き加工が施される。 Another aspect of the present disclosure is a method for manufacturing a contact capable of electrically connecting a first surface and a second surface arranged perpendicular to the first surface. The contact includes a base portion and an elastic contact portion. The base has a joint surface that is soldered to the first surface. The elastic contact portion is elastically deformed and press-contacts with the second surface. The elastic contact portion has an outer surface, an inner surface, a first end surface, and a second end surface. The outer surface is constituted by one surface of a thin metal plate. The inner surface is constituted by the other surface of the thin plate. A 1st end surface and a 2nd end surface are comprised by the end surface of a thin plate. At least the outer surface is constituted by a plating film provided on the surface of the thin plate. The outer side surface has a first range adjacent to the first end surface, a second range adjacent to the second end surface, and a third range between the first range and the second range. The outer surface has a surface that is in contact with the third range as a reference surface, and the shape where the first range is closer to the first end surface is away from the reference surface, and the portion where the second range is closer to the second end surface is away from the reference surface It is said that. In the step of processing the first range closer to the first end surface into a shape away from the reference surface and the step of processing the second range closer to the second end surface away from the reference surface, the metal thin plate Tapping is applied.
　このように構成されたコンタクトの製造方法によれば、常温を上回るような高温環境下で長期間にわたって使用された場合であっても、直流抵抗値が上昇するのを抑制可能なコンタクトを製造することができる。 According to the contact manufacturing method configured as described above, a contact capable of suppressing an increase in DC resistance value even when used for a long period of time in a high temperature environment exceeding normal temperature is manufactured. be able to.
図１Ａは第一実施形態のコンタクトの斜視図である。図１Ｂは図１Ａに示すＩＢ部の拡大図である。FIG. 1A is a perspective view of a contact according to the first embodiment. FIG. 1B is an enlarged view of the IB section shown in FIG. 1A. 図２Ａは第一実施形態のコンタクトの平面図である。図２Ｂは第一実施形態のコンタクトの正面図である。図２Ｃは第一実施形態のコンタクトの右側面図である。図２Ｄは第一実施形態のコンタクトの背面図である。図２Ｅは第一実施形態のコンタクトの底面図である。FIG. 2A is a plan view of the contact of the first embodiment. FIG. 2B is a front view of the contact according to the first embodiment. FIG. 2C is a right side view of the contact according to the first embodiment. FIG. 2D is a rear view of the contact of the first embodiment. FIG. 2E is a bottom view of the contact according to the first embodiment. 図３Ａは図２Ａに示すＩＩＩＡ部の拡大図である。図３Ｂは図２Ａに示すＩＩＩＢ部の拡大図である。図３Ｃは図３Ａに示す箇所の水平断面図である。図３Ｄは図３Ｂに示す箇所の水平断面図である。FIG. 3A is an enlarged view of the IIIA portion shown in FIG. 2A. FIG. 3B is an enlarged view of the IIIB portion shown in FIG. 2A. FIG. 3C is a horizontal sectional view of the portion shown in FIG. 3A. FIG. 3D is a horizontal sectional view of the portion shown in FIG. 3B. 図４は第一実施形態のコンタクトの配設方法を示す説明図である。FIG. 4 is an explanatory view showing a contact arranging method according to the first embodiment. 図５Ａは第一実施形態のコンタクトにθずれが発生している状態を示す説明図である。図５Ｂは図５Ａ中に示すＶＢ部の横断面を拡大して示す拡大断面図である。FIG. 5A is an explanatory diagram illustrating a state in which a θ shift occurs in the contact according to the first embodiment. FIG. 5B is an enlarged cross-sectional view showing an enlarged cross section of the VB portion shown in FIG. 5A. は第一実施形態のコンタクトの抵抗値の経時変化を示すグラフである。FIG. 4 is a graph showing changes with time in the resistance value of the contact according to the first embodiment. FIG. 図７Ａは第二実施形態のコンタクトの斜視図である。図７Ｂは図７Ａに示すＶＩＩＢ部の拡大図である。FIG. 7A is a perspective view of a contact according to the second embodiment. FIG. 7B is an enlarged view of the VIIB section shown in FIG. 7A. 図８Ａは第二実施形態のコンタクトの平面図である。図８Ｂは第二実施形態のコンタクトの正面図である。図８Ｃは第二実施形態のコンタクトの右側面図である。図８Ｄは第二実施形態のコンタクトの背面図である。図８Ｅは第二実施形態のコンタクトの底面図である。FIG. 8A is a plan view of a contact according to the second embodiment. FIG. 8B is a front view of the contact of the second embodiment. FIG. 8C is a right side view of the contact according to the second embodiment. FIG. 8D is a rear view of the contact according to the second embodiment. FIG. 8E is a bottom view of the contact of the second embodiment. 図９は図８Ｂ中にＩＸ－ＩＸ線で示す切断箇所における断面図である。FIG. 9 is a cross-sectional view taken along the line IX-IX in FIG. 8B. 図１０Ａは第二実施形態のコンタクトの配設方法（その１）を示す説明図である。図１０Ｂは第二実施形態のコンタクトの配設方法（その２）を示す説明図である。FIG. 10A is an explanatory view showing a contact arranging method (No. 1) according to the second embodiment. FIG. 10B is an explanatory view showing a contact arranging method (No. 2) according to the second embodiment.
　次に、上述のコンタクト及びその製造方法について、例示的な実施形態を挙げて説明する。
　（１）第一実施形態
　　［コンタクトの構成］
　図１Ａ，図１Ｂ，図２Ａ，図２Ｂ，図２Ｃ，図２Ｄ及び図２Ｅに示すコンタクト１は、第一面（例えば、電子回路基板の部品実装面。）と、第一面に対して垂直に配置される第二面（例えば、電子回路基板の近傍に配設される金属パネルの表面。）とを電気的に接続可能な導電性部品である。以下の説明では、図２Ａの平面図に表れる箇所が向けられる方向を上、図２Ｂの正面図に表れる箇所が向けられる方向を前、図２Ｃ右側面図に表れる箇所が向けられる方向を右、右の反対方向を左、図２Ｄの背面図に表れる箇所が向けられる方向を後、図２Ｅの底面図に表れる箇所が向けられる方向を下と規定する。ただし、これらの各方向は、コンタクト１を構成する各部の相対的な位置関係を簡潔に説明するために規定する方向にすぎない。よって、例えばコンタクト１の出荷時や使用時等に、コンタクト１がどのような方向に向けられるかは不定である。 Next, the contact and the manufacturing method thereof will be described with reference to exemplary embodiments.
(1) First embodiment [Contact configuration]
A contact 1 shown in FIGS. 1A, 1B, 2A, 2B, 2C, 2D, and 2E has a first surface (for example, a component mounting surface of an electronic circuit board) and is perpendicular to the first surface. 2 is a conductive component that can be electrically connected to a second surface (for example, a surface of a metal panel disposed in the vicinity of the electronic circuit board). In the following description, the direction in which the part appearing in the plan view of FIG. 2A is directed, the direction in which the part appearing in the front view of FIG. 2B is directed, the direction in which the part appearing in the right side view of FIG. The direction opposite to the right is defined as the left, the direction in which the part appearing in the rear view of FIG. 2D is directed is defined, and the direction in which the part appearing in the bottom view of FIG. However, each of these directions is only a direction defined in order to briefly explain the relative positional relationship between the respective parts constituting the contact 1. Therefore, for example, the direction in which the contact 1 is directed when the contact 1 is shipped or used is undefined.
　コンタクト１は、基部３と、弾性接触部５と、を備える。これら基部３及び弾性接触部５は、金属の薄板（第一実施形態の場合は、リフロー処理が施されたすずめっき付きのばね用ベリリウム銅の薄板。厚さ０．０８ｍｍ。）によって一体成形されている。基部３は、コンタクト１の使用時に想定される外力が作用してもほぼ変形しない程度の剛性が確保されている部分である。基部３は、上述の第一面にはんだ付けされる接合面３Ａを有する。弾性接触部５は、コンタクト１の使用時に想定される外力が作用するのに伴って弾性変形する部分である。弾性接触部５は、第二面との接触に伴って弾性変形し、その際に生ずる弾性力を第二面に作用させて、第二面に加圧接触する。 The contact 1 includes a base portion 3 and an elastic contact portion 5. The base portion 3 and the elastic contact portion 5 are integrally formed by a thin metal plate (in the case of the first embodiment, a thin plate of tin-plated spring beryllium copper subjected to reflow treatment, thickness 0.08 mm). ing. The base portion 3 is a portion that is secured to such a degree that it does not deform even when an external force assumed when the contact 1 is used. The base 3 has a joint surface 3A that is soldered to the first surface. The elastic contact portion 5 is a portion that elastically deforms when an external force assumed when the contact 1 is used acts. The elastic contact portion 5 is elastically deformed along with the contact with the second surface, and an elastic force generated at that time is applied to the second surface to make pressure contact with the second surface.
　第一実施形態の場合、基部３は、基部３の上面を構成する天板部１１と、天板部１１の左端から湾曲して下方へと延びる第一垂設壁１２Ａと、天板部１１の右端から湾曲して下方へと延びる第二垂設壁１２Ｂと、第一垂設壁１２Ａの前端から湾曲して右方へと延びる第一フック受け１３Ａと、第二垂設壁１２Ｂの前端から湾曲して左方へと延びる第二フック受け１３Ｂと、第一垂設壁１２Ａの下端から湾曲して右方へと延びる第一底板部１４Ａと、第二垂設壁１２Ｂの下端から湾曲して左方へと延びる第二底板部１４Ｂとを有する。第一底板部１４Ａ及び第二底板部１４Ｂの下面が、上述の接合面３Ａとなっている。 In the case of the first embodiment, the base portion 3 includes a top plate portion 11 constituting the upper surface of the base portion 3, a first hanging wall 12 </ b> A that curves from the left end of the top plate portion 11 and extends downward, and the top plate portion 11. A second hanging wall 12B that curves from the right end of the first hanging wall and extends downward, a first hook receiver 13A that curves from the front end of the first hanging wall 12A and extends to the right, and a front end of the second hanging wall 12B From the lower end of the second hanging wall 12B, the second bottom plate portion 14A that curves from the lower end of the first hanging wall 12A, and that curves from the lower end of the first hanging wall 12B. And a second bottom plate portion 14B extending leftward. The lower surfaces of the first bottom plate portion 14A and the second bottom plate portion 14B are the above-described bonding surface 3A.
　第一実施形態の場合、弾性接触部５は、天板部１１の後端から湾曲して下方へと延びる垂下部２１と、垂下部２１の左端から左方へと突出する第一ストッパー２２Ａと、垂下部２１の右端から右方へと突出する第二ストッパー２２Ｂと、垂下部２１の下端から湾曲して前方へと延びる下側延在部２３と、下側延在部２３の前端から上方へと湾曲して後方へと折り返す折り返し部２４と、折り返し部２４から後方へと延びる上側延在部２５と、上側延在部２５の後端から湾曲して下方へと突出するフック部２６とを有する。 In the case of the first embodiment, the elastic contact portion 5 includes a drooping portion 21 that curves from the rear end of the top plate portion 11 and extends downward, and a first stopper 22A that protrudes leftward from the left end of the drooping portion 21. A second stopper 22B protruding rightward from the right end of the hanging part 21, a lower extending part 23 curved from the lower end of the hanging part 21 and extending forward, and an upper side from the front end of the lower extending part 23 A folded portion 24 bent back and bent backward, an upper extending portion 25 extending rearward from the folded portion 24, and a hook portion 26 curved downward from the rear end of the upper extending portion 25 and projecting downward Have
　下側延在部２３は、第一フック受け１３Ａ及び第二フック受け１３Ｂよりも後方にある垂下部２１から、第一フック受け１３Ａ及び第二フック受け１３Ｂの下方を通って、第一フック受け１３Ａ及び第二フック受け１３Ｂよりも前方へと延びる。上側延在部２５は、第一フック受け１３Ａ及び第二フック受け１３Ｂよりも前方にある折り返し部２４から、第一フック受け１３Ａ及び第二フック受け１３Ｂの上方を通って、第一フック受け１３Ａ及び第二フック受け１３Ｂよりも後方へと延びる。フック部２６は、第一フック受け１３Ａ及び第二フック受け１３Ｂの背面側へと入り込んでいる。 The lower extension 23 extends from the hanging portion 21 at the rear of the first hook receiver 13A and the second hook receiver 13B, and passes below the first hook receiver 13A and the second hook receiver 13B. 13A and the second hook receiver 13B extend forward. The upper extending portion 25 passes from above the first hook receiver 13A and the second hook receiver 13B from the folded portion 24 in front of the first hook receiver 13A and the second hook receiver 13B, and passes through the first hook receiver 13A. And it extends rearward rather than the second hook receiver 13B. The hook portion 26 enters the back side of the first hook receiver 13A and the second hook receiver 13B.
　第一ストッパー２２Ａ及び第二ストッパー２２Ｂは、垂下部２１が弾性変形して前方へと変位した場合に垂下部２１とともに前方へと変位し、第一垂設壁１２Ａ及び第二垂設壁１２Ｂに接触する位置まで変位したところで、垂下部２１が更に前方へと変位するのを規制する。フック部２６は、第一フック受け１３Ａ及び第二フック受け１３Ｂの背面に引っ掛かることにより、上側延在部２５が前方へと変位するのを規制する。 The first stopper 22A and the second stopper 22B are displaced forward together with the hanging portion 21 when the hanging portion 21 is elastically deformed and displaced forward, and the first and second hanging walls 12A and 12B are moved to the front. When the contact portion is displaced to a position where it comes into contact, the drooping portion 21 is restricted from being displaced further forward. The hook part 26 restricts the upper extension part 25 from being displaced forward by being hooked on the back surfaces of the first hook receiver 13A and the second hook receiver 13B.
　下側延在部２３は、第一フック受け１３Ａ及び第二フック受け１３Ｂによって上方への可動範囲が画定され、第一底板部１４Ａ及び第二底板部１４Ｂによって下方への可動範囲が画定されている。また、下側延在部２３は、第一垂設壁１２Ａ及び第二垂設壁１２Ｂによって左右方向への可動範囲が画定されている。上側延在部２５は、第一フック受け１３Ａ及び第二フック受け１３Ｂによって下方への可動範囲が画定されている。 The lower extending portion 23 has a movable range defined upward by the first hook receiver 13A and the second hook receiver 13B, and a movable range defined downward by the first bottom plate portion 14A and the second bottom plate portion 14B. Yes. The lower extending portion 23 has a movable range in the left-right direction defined by the first hanging wall 12A and the second hanging wall 12B. The upper extending portion 25 has a downward movable range defined by the first hook receiver 13A and the second hook receiver 13B.
　弾性接触部５は、外側面３１、内側面３２、第一端面３３Ａ及び第二端面３３Ｂを有する。外側面３１は、薄板の一方の面によって構成される。内側面３２は、薄板の他方の面によって構成される。第一端面３３Ａ及び第二端面３３Ｂは、薄板の端面によって構成される。外側面３１は、第一端面３３Ａに隣接する第一範囲３１Ａと、第二端面３３Ｂに隣接する第二範囲３１Ｂと、第一範囲３１Ａと第二範囲３１Ｂとの間にある第三範囲３１Ｃとを有する。 The elastic contact portion 5 has an outer surface 31, an inner surface 32, a first end surface 33A, and a second end surface 33B. The outer side surface 31 is constituted by one surface of a thin plate. The inner side surface 32 is constituted by the other surface of the thin plate. 33 A of 1st end surfaces and the 2nd end surface 33B are comprised by the end surface of a thin plate. The outer side surface 31 includes a first range 31A adjacent to the first end surface 33A, a second range 31B adjacent to the second end surface 33B, and a third range 31C between the first range 31A and the second range 31B. Have
　外側面３１は、図３Ａ及び図３Ｂに示すように、第三範囲３１Ｃに接する基準面４１を想定した場合に、第一範囲３１Ａが第一端面３３Ａに近い箇所ほど基準面４１から離れる形状とされ、第二範囲３１Ｂが第二端面３３Ｂに近い箇所ほど基準面４１から離れる形状とされている。外側面３１及び内側面３２は、図３Ｃ及び図３Ｄに表れるように、薄板の表面に設けられためっき膜４３によって構成される。外側面３１において、めっき膜４３は第一範囲３１Ａから第三範囲３１Ｃを経て第二範囲３１Ｂに至るまで連続するように設けられている。第一端面３３Ａ及び第二端面３３Ｂにおいては、薄板の母材４５が露出している。 As shown in FIG. 3A and FIG. 3B, the outer side surface 31 assumes a reference surface 41 in contact with the third range 31 </ b> C, and a shape in which the first range 31 </ b> A is closer to the first end surface 33 </ b> A is separated from the reference surface 41. The second range 31 </ b> B has a shape that is separated from the reference surface 41 as the position is closer to the second end surface 33 </ b> B. The outer side surface 31 and the inner side surface 32 are comprised by the plating film 43 provided in the surface of a thin plate so that it may appear in FIG. 3C and FIG. 3D. On the outer surface 31, the plating film 43 is provided so as to continue from the first range 31A to the second range 31B through the third range 31C. The thin base metal 45 is exposed at the first end surface 33A and the second end surface 33B.
　第一範囲３１Ａ及び第二範囲３１Ｂは、めっき膜４３が形成された金属の薄板から加工品を打ち抜いた後に、下側延在部２３から折り返し部２４を経て上側延在部２５に至る部分となる箇所の両縁に対して叩き加工を施すことにより、上述のような形状に加工される。第一範囲３１Ａ及び第二範囲３１Ｂに相当する部分は、叩き加工によって薄板の板厚が第一端面３３Ａ及び第二端面３３Ｂに近い箇所ほど薄くなる形状に加工される。その後、叩き加工が施された箇所に対して曲げ加工が施されて、折り返し部２４等が構成される。 The first range 31 </ b> A and the second range 31 </ b> B are a part from the lower extending part 23 to the upper extending part 25 through the folded part 24 after punching out the processed product from the metal thin plate on which the plating film 43 is formed. By applying a tapping process to both edges of the part, the shape is processed as described above. The portions corresponding to the first range 31A and the second range 31B are processed into a shape in which the plate thickness of the thin plate becomes thinner as the position is closer to the first end surface 33A and the second end surface 33B. Thereafter, the bend is applied to the portion subjected to the tapping, and the folded portion 24 and the like are configured.
　以上のように構成されたコンタクト１は、例えば図４に示すように、電子回路基板５１の部品実装面に表面実装されて、電子回路基板５１とともに所定の場所に配設される。その際、コンタクト１の弾性接触部５は、例えば電子回路基板５１の近傍に配設されている金属パネル５３の表面に接触し、電子回路基板５１と金属パネル５３を電気的に接続する。このとき、電子回路基板５１の部品実装面に対して金属パネル５３の表面が垂直方向にスライドするように、電子回路基板５１及び金属パネル５３のいずれか一方を他方に対して相対的に移動させることにより、コンタクト１を所期の位置に配置することができる。 For example, as shown in FIG. 4, the contact 1 configured as described above is surface-mounted on the component mounting surface of the electronic circuit board 51 and is disposed at a predetermined location together with the electronic circuit board 51. In that case, the elastic contact part 5 of the contact 1 contacts the surface of the metal panel 53 arrange | positioned in the vicinity of the electronic circuit board 51, for example, and connects the electronic circuit board 51 and the metal panel 53 electrically. At this time, either the electronic circuit board 51 or the metal panel 53 is moved relative to the other so that the surface of the metal panel 53 slides in the vertical direction with respect to the component mounting surface of the electronic circuit board 51. As a result, the contact 1 can be arranged at an intended position.
　ところで、電子回路基板５１の部品実装面上にコンタクト１を実装する際には、図５Ａに示すように、コンタクト１の実装位置が、部品実装面に垂直な軸線を回転中心として回転方向にずれることがある。以下、このようなずれのことをθずれとも称する。θずれが発生している場合、コンタクト１の弾性接触部５は、左端又は右端いずれかのエッジ部分で金属パネル５３の表面に接触しやすくなる。図５Ａには、弾性接触部５が右端のエッジ部分で金属パネル５３の表面に接触する場合を例示してある。以下、図５Ａに例示した方向にθずれが生じている場合を想定して説明を続ける。 By the way, when the contact 1 is mounted on the component mounting surface of the electronic circuit board 51, as shown in FIG. 5A, the mounting position of the contact 1 is shifted in the rotation direction about the axis perpendicular to the component mounting surface. Sometimes. Hereinafter, such a shift is also referred to as a θ shift. When the θ shift occurs, the elastic contact portion 5 of the contact 1 easily comes into contact with the surface of the metal panel 53 at either the left end or the right end. In FIG. 5A, the case where the elastic contact part 5 contacts the surface of the metal panel 53 in the edge part of a right end is illustrated. Hereinafter, the description will be continued assuming a case where a θ shift occurs in the direction illustrated in FIG. 5A.
　上記コンタクト１の場合、第一範囲３１Ａ及び第二範囲３１Ｂには上述の叩き加工が施されている。そのため、上述のようなθずれが発生したとしても、図５Ｂに示すように、めっき膜４３の最端部は金属パネル５３の表面に接触せず、第一範囲３１Ａ又は第二範囲３１Ｂのいずれか（図５Ｂでは第二範囲３１Ｂの場合を例示。）と第三範囲３１Ｃとの境界付近が金属パネル５３の表面に接触する。そのため、θずれが発生したとしても、めっき膜４３の最端部（図５Ｂに示す例の場合は最右端。）には、金属パネル５３との接触に伴う負荷が作用しにくい状態にある。 In the case of the contact 1, the first range 31A and the second range 31B are subjected to the tapping process described above. Therefore, even if the above-described θ deviation occurs, as shown in FIG. 5B, the outermost end portion of the plating film 43 does not contact the surface of the metal panel 53, and either the first range 31A or the second range 31B. (FIG. 5B illustrates the case of the second range 31B) and the vicinity of the boundary between the third range 31C and the surface of the metal panel 53. Therefore, even if the θ shift occurs, the load associated with the contact with the metal panel 53 is hardly applied to the outermost end portion of the plating film 43 (the rightmost end in the example shown in FIG. 5B).
　したがって、めっき膜４３の最端部が金属パネル５３との接触に伴って欠けたり削れたり剥がれたりする（以下、これらを総称して欠損するとも言う。）のを抑制できる。よって、めっき膜４３の最端部が欠損しにくい分だけ、薄板の母材４５と金属パネル５３が直接接触する状態に至るのを抑制することができる。これにより、めっき膜４３よりも酸化しやすい母材４５の表面が金属パネル５３に接する状態になるのを抑制でき、常温を上回るような高温環境下で長期間にわたって使用された場合であっても、コンタクト１の直流抵抗値が上昇するのを抑制できる。 Therefore, it is possible to suppress the endmost portion of the plating film 43 from being chipped, scraped, or peeled off in contact with the metal panel 53 (hereinafter also collectively referred to as “missing”). Therefore, it is possible to suppress the state where the thin plate base material 45 and the metal panel 53 are in direct contact with each other as much as the end portion of the plating film 43 is less likely to be lost. Thereby, it can suppress that the surface of the base material 45 which is easier to oxidize than the plating film 43 will be in the state which contact | connects the metal panel 53, and even when it is a case where it is used over a long period of time in the high temperature environment which exceeds normal temperature. It is possible to suppress an increase in the DC resistance value of the contact 1.
　また、コンタクト１が金属パネル５３に対して図５Ｂに例示するような接触状態にある場合、第二範囲３１Ｂと金属パネル５３との間には空隙が形成される。したがって、仮にめっき膜４３の最端部が幾らか欠損したとしても、その欠損箇所が金属パネル５３に接触する可能性を低減できる。したがって、この点においても、母材４５の表面が金属パネル５３に接する状態になるのを抑制でき、コンタクト１の直流抵抗値が上昇するのを抑制できる。 Further, when the contact 1 is in contact with the metal panel 53 as illustrated in FIG. 5B, a gap is formed between the second range 31 </ b> B and the metal panel 53. Therefore, even if the outermost end portion of the plating film 43 is somewhat damaged, the possibility that the damaged portion contacts the metal panel 53 can be reduced. Therefore, also in this point, it can suppress that the surface of the base material 45 will be in the state which contact | connects the metal panel 53, and can suppress that the direct current | flow resistance value of the contact 1 raises.
　　［性能試験］
　上述のような形状の第一範囲３１Ａ及び第二範囲３１Ｂを設けることにより、直流抵抗値の上昇をどの程度抑制できるかを確認するため、以下に説明するようなヒートサイクル試験を実施した。まず、試験対象物としては、以下のような構造物が作製される。コンタクト１がプリント配線板に表面実装される。そのプリント配線板に対して垂直な位置に金めっき銅板が配置され、コンタクト１が金めっき銅板に対して加圧接触するように配置される。コンタクト１と金めっき銅板との相対位置は、コンタクト１の弾性接触部５が１０％圧縮されるように設定される。プリント配線板と金めっき銅板は、スペーサ等を介して位置決めされ、必要な箇所はビス等の固定具で固定されて、互いの相対位置がずれないように構成される。 [performance test]
In order to confirm how much the increase of the DC resistance value can be suppressed by providing the first range 31A and the second range 31B having the shapes as described above, a heat cycle test as described below was performed. First, the following structures are produced as test objects. The contact 1 is surface-mounted on the printed wiring board. A gold-plated copper plate is disposed at a position perpendicular to the printed wiring board, and the contact 1 is disposed so as to be in pressure contact with the gold-plated copper plate. The relative position between the contact 1 and the gold-plated copper plate is set so that the elastic contact portion 5 of the contact 1 is compressed by 10%. The printed wiring board and the gold-plated copper plate are positioned via a spacer or the like, and necessary portions are fixed by a fixing tool such as a screw so that the relative positions of each other are not shifted.
　このように構成された試験対象物が、環境試験器（型式名：ＳＨ－２４２、エスペック株式会社製）の槽内に設置される。槽内の温度は－４０℃と１２５℃との間で周期的に変更される。より詳しくは、槽内の温度を１２５℃まで上昇させた後、１２５℃のまま２時間保持する。その後、槽内の温度を１時間かけて－４０℃まで下降させた後、－４０℃のまま２時間保持する。その後、槽内の温度を１時間かけて１２５℃まで上昇させ、以降は、上述の周期で槽内の温度を変更する。処理時間が０時間、１００時間、２５０時間、５００時間となるタイミングで、コンタクト１の抵抗値を抵抗計（ミリオームハイテスタ）によって測定する。 The test object configured as described above is installed in a tank of an environmental tester (model name: SH-242, manufactured by ESPEC Corporation). The temperature in the bath is periodically changed between −40 ° C. and 125 ° C. More specifically, after raising the temperature in the tank to 125 ° C., the temperature is maintained at 125 ° C. for 2 hours. Thereafter, the temperature in the tank is lowered to −40 ° C. over 1 hour, and then kept at −40 ° C. for 2 hours. Thereafter, the temperature in the tank is increased to 125 ° C. over 1 hour, and thereafter, the temperature in the tank is changed at the above-described cycle. The resistance value of the contact 1 is measured by a resistance meter (milliohm high tester) at a timing when the processing time becomes 0 hour, 100 hours, 250 hours, and 500 hours.
　試験結果を図６に示す。図６に示すグラフからは、上述のような形状の第一範囲３１Ａ及び第二範囲３１Ｂが設けられた実施例の場合、安定して抵抗値の上昇が抑制されていることがわかる。したがって、実施例のコンタクト１を用いれば、長期にわたって直流抵抗値の上昇を抑制でき、安定したＥＭＣ対策効果を得ることができる。一方、上述のような形状の第一範囲３１Ａ及び第二範囲３１Ｂが設けられていない比較例の場合、処理時間１００時間の時点で抵抗値が著しく上昇することがわかる。 The test results are shown in FIG. From the graph shown in FIG. 6, it can be seen that in the example in which the first range 31 </ b> A and the second range 31 </ b> B having the above-described shapes are provided, the increase in the resistance value is stably suppressed. Therefore, if the contact 1 of an Example is used, the raise of DC resistance value can be suppressed over a long period of time, and the stable EMC countermeasure effect can be acquired. On the other hand, in the case of the comparative example in which the first range 31A and the second range 31B having the shapes as described above are not provided, it can be seen that the resistance value remarkably increases at the processing time of 100 hours.
　このような抵抗値の上昇は、例えば、めっき膜４３が欠損した箇所（すなわち、母材４５が露出した箇所。）においてコンタクト１が金属パネル５３に接触し、接触箇所となっている母材４５表面に酸化被膜が形成されることに原因があるのではないかと推察される。また、比較例の場合は、単に抵抗値が上昇するだけではなく、抵抗値が上昇したり下降したりし、その変動幅が大きいことがわかる。このような抵抗値の変動が発生する理由は、例えば、比較例の接触箇所に酸化被膜が形成されるのに伴って抵抗値が上昇した後、酸化被膜が削れると抵抗値が下降する、といった現象によるものではないかと推察される。したがって、比較例の場合は、長期にわたって直流抵抗値の上昇を抑制することは難しく、また、安定したＥＭＣ対策効果を得ることも難しいことがわかる。 Such an increase in resistance value is caused by, for example, the contact of the contact 1 with the metal panel 53 at a location where the plating film 43 is missing (ie, the location where the base material 45 is exposed), and the base material 45 serving as a contact location. It is assumed that there is a cause for the formation of an oxide film on the surface. Moreover, in the case of a comparative example, it turns out that not only resistance value rises but resistance value rises or falls, and the fluctuation range is large. The reason why such a variation in the resistance value occurs is that, for example, the resistance value increases as the oxide film is formed at the contact portion of the comparative example, and then the resistance value decreases when the oxide film is scraped. It is guessed that this is due to a phenomenon. Therefore, in the case of the comparative example, it is difficult to suppress an increase in the DC resistance value over a long period of time, and it is difficult to obtain a stable EMC countermeasure effect.
　　［効果］
　以上説明した通り、上記コンタクト１によれば、常温を上回るような高温環境下で長期間にわたって使用された場合であっても、コンタクトの直流抵抗値が上昇するのを抑制することができる。 [effect]
As described above, according to the contact 1, it is possible to suppress an increase in the DC resistance value of the contact even when it is used for a long time in a high temperature environment exceeding normal temperature.
　（２）第二実施形態
　次に、第二実施形態について説明する。
　　［コンタクトの構成］
　図７Ａ，図７Ｂ，図８Ａ，図８Ｂ，図８Ｃ，図８Ｄ及び図８Ｅに示すコンタクト６１は、第一面（例えば、電子回路基板の部品実装面。）と、第一面に対して垂直に配置される第二面（例えば、電子回路基板の近傍に配設される金属パネルの表面。）とを電気的に接続可能な導電性部品である。以下の説明では、第一実施形態と同様に左右前後上下の各方向を規定する。 (2) Second Embodiment Next, a second embodiment will be described.
[Composition of contact]
The contact 61 shown in FIGS. 7A, 7B, 8A, 8B, 8C, 8D, and 8E is perpendicular to the first surface (for example, the component mounting surface of the electronic circuit board) and the first surface. 2 is a conductive component that can be electrically connected to a second surface (for example, a surface of a metal panel disposed in the vicinity of the electronic circuit board). In the following description, the respective directions of the left, right, front, rear, top and bottom are defined as in the first embodiment.
　コンタクト６１は、基部３と、弾性接触部５と、を備える。これら基部３及び弾性接触部５は、金属の薄板（第二実施形態の場合は、リフロー処理が施されたすずめっき付きのばね用ベリリウム銅の薄板。厚さ０．０８ｍｍ。）によって一体成形されている。基部３は、コンタクト６１の使用時に想定される外力が作用してもほぼ変形しない程度の剛性が確保されている部分である。基部３は、上述の第一面にはんだ付けされる接合面３Ａを有する。弾性接触部５は、コンタクト６１の使用時に想定される外力が作用するのに伴って弾性変形する部分である。弾性接触部５は、第二面との接触に伴って弾性変形し、その際に生ずる弾性力を第二面に作用させて、第二面に加圧接触する。 The contact 61 includes a base portion 3 and an elastic contact portion 5. The base portion 3 and the elastic contact portion 5 are integrally formed by a thin metal plate (in the case of the second embodiment, a thin plate of tin-plated spring beryllium copper with a reflow treatment, thickness 0.08 mm). ing. The base 3 is a portion that is secured to such a degree that it does not deform even when an external force assumed when the contact 61 is used. The base 3 has a joint surface 3A that is soldered to the first surface. The elastic contact portion 5 is a portion that is elastically deformed as an external force assumed when the contact 61 is used acts. The elastic contact portion 5 is elastically deformed along with the contact with the second surface, and an elastic force generated at that time is applied to the second surface to make pressure contact with the second surface.
　第二実施形態の場合、基部３は、基部３の上面を構成する天板部１１と、天板部１１の左端から湾曲して下方へと延びる第一垂設壁１２Ａと、天板部１１の右端から湾曲して下方へと延びる第二垂設壁１２Ｂと、第一垂設壁１２Ａの下端から湾曲して右方へと延びる第一底板部１４Ａと、第二垂設壁１２Ｂの下端から湾曲して左方へと延びる第二底板部１４Ｂとを有する。第一底板部１４Ａ及び第二底板部１４Ｂの下面が、上述の接合面３Ａとなっている。また、第二実施形態の場合、第一垂設壁１２Ａには第一開口部７１Ａが設けられ、第二垂設壁１２Ｂには第二開口部７１Ｂが設けられている。 In the case of the second embodiment, the base portion 3 includes a top plate portion 11 constituting the upper surface of the base portion 3, a first hanging wall 12A that curves from the left end of the top plate portion 11 and extends downward, and the top plate portion 11. A second hanging wall 12B that curves from the right end of the first hanging wall and extends downward, a first bottom plate portion 14A that curves from the lower end of the first hanging wall 12A and extends to the right, and a lower end of the second hanging wall 12B And a second bottom plate portion 14B that curves to the left and extends to the left. The lower surfaces of the first bottom plate portion 14A and the second bottom plate portion 14B are the above-described bonding surface 3A. In the second embodiment, the first hanging wall 12A is provided with a first opening 71A, and the second hanging wall 12B is provided with a second opening 71B.
　第二実施形態の場合、弾性接触部５は、天板部１１の後端から湾曲して下方へと延びる垂下部２１と、垂下部２１の左端から左方へと突出する第一ストッパー２２Ａと、垂下部２１の右端から右方へと突出する第二ストッパー２２Ｂとを有する。また、弾性接触部５は、図９に示すように、垂下部２１の下端から湾曲して前方へと延びる第一水平部８１と、第一水平部８１の前端から湾曲して斜め後上方へと延びる傾斜部８２と、傾斜部８２の上端から湾曲して前方へと延びる第二水平部８３と、第二水平部８３の前端から下方へと湾曲して後方へと折り返す折り返し部２４と、折り返し部２４の後端から湾曲して上方へと延びる立ち上げ部８４と、立ち上げ部８４の上端から湾曲して後方へと延びる第三水平部８５とを有する。さらに、弾性接触部５は、図８Ａから図８Ｅまでの各図に示すように、第三水平部８５の左端から左方へと突出する第一突出部８６Ａと、第三水平部８５の右端から右方へと突出する第二突出部８６Ｂとを有する。 In the case of the second embodiment, the elastic contact portion 5 includes a drooping portion 21 that curves from the rear end of the top plate portion 11 and extends downward, and a first stopper 22A that protrudes leftward from the left end of the drooping portion 21. The second stopper 22B protrudes rightward from the right end of the hanging part 21. Further, as shown in FIG. 9, the elastic contact portion 5 is curved from the lower end of the drooping portion 21 and extends forward, and is curved from the front end of the first horizontal portion 81 and obliquely rearward and upward. An inclined part 82 that extends from the upper end of the inclined part 82 and extends forward, and a folded part 24 that curves downward from the front end of the second horizontal part 83 and folds backward. It has a rising portion 84 that curves from the rear end of the folded portion 24 and extends upward, and a third horizontal portion 85 that curves from the upper end of the rising portion 84 and extends backward. 8A to 8E, the elastic contact portion 5 includes a first protrusion 86A that protrudes from the left end of the third horizontal portion 85 to the left, and a right end of the third horizontal portion 85. And a second projecting portion 86B projecting to the right.
　第一突出部８６Ａは、第一開口部７１Ａの内周側へと入り込んでいる。これにより、第一突出部８６Ａの可動範囲は、第一開口部７１Ａの内周面によって画定されている。第二突出部８６Ｂは、第二開口部７１Ｂの内周側へと入り込んでいる。これにより、第二突出部８６Ｂの可動範囲は、第二開口部７１Ｂの内周面によって画定されている。第一ストッパー２２Ａ及び第二ストッパー２２Ｂは、垂下部２１が弾性変形して前方へと変位した場合に垂下部２１とともに前方へと変位し、第一垂設壁１２Ａ及び第二垂設壁１２Ｂに接触する位置まで変位したところで、垂下部２１が更に前方へと変位するのを規制する。 The first protrusion 86A enters the inner peripheral side of the first opening 71A. Thereby, the movable range of the first protrusion 86A is defined by the inner peripheral surface of the first opening 71A. The second protrusion 86B enters the inner peripheral side of the second opening 71B. Thereby, the movable range of the 2nd protrusion part 86B is demarcated by the internal peripheral surface of the 2nd opening part 71B. The first stopper 22A and the second stopper 22B are displaced forward together with the hanging portion 21 when the hanging portion 21 is elastically deformed and displaced forward, and the first and second hanging walls 12A and 12B are moved to the front. When the contact portion is displaced to a position where it comes into contact, the drooping portion 21 is restricted from being displaced further forward.
　弾性接触部５は、外側面３１、内側面３２、第一端面３３Ａ及び第二端面３３Ｂを有する。外側面３１は、薄板の一方の面によって構成される。内側面３２は、薄板の他方の面によって構成される。第一端面３３Ａ及び第二端面３３Ｂは、薄板の端面によって構成される。外側面３１は、第一端面３３Ａに隣接する第一範囲３１Ａと、第二端面３３Ｂに隣接する第二範囲３１Ｂと、第一範囲３１Ａと第二範囲３１Ｂとの間にある第三範囲３１Ｃとを有する。 The elastic contact portion 5 has an outer surface 31, an inner surface 32, a first end surface 33A, and a second end surface 33B. The outer side surface 31 is constituted by one surface of a thin plate. The inner side surface 32 is constituted by the other surface of the thin plate. 33 A of 1st end surfaces and the 2nd end surface 33B are comprised by the end surface of a thin plate. The outer side surface 31 includes a first range 31A adjacent to the first end surface 33A, a second range 31B adjacent to the second end surface 33B, and a third range 31C between the first range 31A and the second range 31B. Have
　第一実施形態と同程度の詳細な図示は省略するが、第一範囲３１Ａ及び第二範囲３１Ｂには第一実施形態と同様の叩き加工が施され、これにより、第一範囲３１Ａ及び第二範囲３１Ｂは第一実施形態と同様な形状に加工されている。したがって、第二実施形態のコンタクト６１であっても、第一実施形態のコンタクト１と同様な作用、効果を奏し、直流抵抗値の上昇を抑制することができる。 Although the detailed illustration similar to that of the first embodiment is omitted, the first range 31A and the second range 31B are subjected to the same tapping process as the first embodiment, thereby the first range 31A and the second range 31B. The range 31B is processed into the same shape as the first embodiment. Therefore, even the contact 61 of the second embodiment can exhibit the same operations and effects as the contact 1 of the first embodiment, and can suppress an increase in the DC resistance value.
　また、第二実施形態のコンタクト６１は、金属パネルと接触させる際に、例えば図１０Ａ及び図１０Ｂに示すように、電子回路基板と金属パネルとの相対的なスライド方向を、金属パネルが上昇する方向（図１０Ａ参照。）及び金属パネルが加工する方向（図１０Ｂ参照。）、どちらの方向にすることもできる。したがって、第一実施形態のコンタクト６１以上に、金属パネルと接触させる際の取り付け方向に関する自由度が高く、作業性を良好にすることができる。 Further, when the contact 61 of the second embodiment is brought into contact with the metal panel, for example, as shown in FIGS. 10A and 10B, the metal panel rises in the relative sliding direction between the electronic circuit board and the metal panel. Either the direction (see FIG. 10A) and the direction in which the metal panel is processed (see FIG. 10B) can be used. Therefore, the degree of freedom regarding the mounting direction when contacting the metal panel is higher than that of the contact 61 of the first embodiment, and workability can be improved.
　　［効果］
　以上説明した通り、上記コンタクト６１によれば、常温を上回るような高温環境下で長期間にわたって使用された場合であっても、コンタクトの直流抵抗値が上昇するのを抑制することができる。 [effect]
As described above, according to the contact 61, it is possible to suppress an increase in the DC resistance value of the contact even when it is used for a long period of time in a high temperature environment exceeding normal temperature.
　（３）他の実施形態
　以上、コンタクト及びその製造方法について、例示的な実施形態を挙げて説明したが、上述の実施形態は本開示の一態様として例示されるものにすぎない。すなわち、本開示は、上述の例示的な実施形態に限定されるものではなく、本開示の技術的思想を逸脱しない範囲内において、様々な形態で実施することができる。 (3) Other Embodiments While the contact and the manufacturing method thereof have been described with reference to the exemplary embodiment, the above-described embodiment is merely illustrated as one aspect of the present disclosure. In other words, the present disclosure is not limited to the exemplary embodiments described above, and can be implemented in various forms without departing from the technical idea of the present disclosure.
　例えば、上記実施形態では、第一範囲３１Ａ及び第二範囲３１Ｂに対して叩き加工を施すことにより、第一範囲３１Ａ及び第二範囲３１Ｂの形状を端部寄りほど板厚が薄くなる形状に加工していたが、同様の形状に加工できるのであれば、加工方法は叩き加工に限定されない。 For example, in the above-described embodiment, the first range 31A and the second range 31B are subjected to a tapping process so that the shape of the first range 31A and the second range 31B is processed so that the plate thickness decreases toward the end. However, the processing method is not limited to tapping as long as it can be processed into the same shape.
　また、上記実施形態では、めっき膜４３としてすずめっき膜、母材４５としてばね用ベリリウム銅を例示したが、めっき膜４３及び母材４５の材質は任意に変更可能である。
　なお、上記各実施形態における一つの構成要素によって実現していた機能を、複数の構成要素によって実現するように構成してもよい。また、複数の構成要素によって実現していた機能を一つの構成要素によって実現するように構成してもよい。また、上記各実施形態の構成の一部を省略してもよい。また、上記各実施形態の構成の少なくとも一部を、他の上記実施形態の構成に対して付加、置換等してもよい。 Moreover, in the said embodiment, although the tin plating film was illustrated as the plating film 43 and the beryllium copper for springs was used as the base material 45, the material of the plating film 43 and the base material 45 can be changed arbitrarily.
In addition, you may comprise so that the function implement | achieved by the one component in each said embodiment may be implement | achieved by a some component. Moreover, you may comprise so that the function implement | achieved by the some component may be implement | achieved by one component. Moreover, you may abbreviate | omit a part of structure of said each embodiment. In addition, at least a part of the configuration of each of the above embodiments may be added to or replaced with the configuration of the other above embodiments.
　また、上述したコンタクト及びその製造方法の他、上述のコンタクトが実装された電子回路基板、上述のコンタクトを収容した部品供給体（例えば、キャリアテープや収容トレイなど。）など、種々の形態で本開示を実現することもできる。 In addition to the contact and the manufacturing method thereof, the electronic circuit board on which the contact is mounted, a component supply body (for example, a carrier tape or a storage tray) that stores the contact, and the like in various forms. Disclosure can also be realized.
　（４）補足
　なお、以上説明した例示的な実施形態から明らかなように、本開示のコンタクト及びその製造方法は、更に以下に挙げるような構成を備えていてもよい。 (4) Supplement As will be apparent from the exemplary embodiments described above, the contact and the manufacturing method thereof of the present disclosure may further include the following configurations.
　まず、本開示のコンタクトにおいて、第一範囲は、第一端面に近い箇所ほど薄板の板厚が薄くなる形状とされてもよい。第二範囲は、第二端面に近い箇所ほど薄板の板厚が薄くなる形状とされていてもよい。 First, in the contact according to the present disclosure, the first range may have a shape in which the thickness of the thin plate becomes thinner as the position is closer to the first end surface. The second range may be a shape in which the plate thickness of the thin plate decreases as the position is closer to the second end surface.
　また、本開示のコンタクトの製造方法は、叩き加工が施された後に曲げ加工を施すことにより、叩き加工が施された箇所を湾曲させてもよい。 In addition, the contact manufacturing method of the present disclosure may bend the portion subjected to the tapping process by performing the bending process after the tapping process is performed.
　１，６１…コンタクト、３…基部、３Ａ…接合面、５…弾性接触部、１１…天板部、１２Ａ…第一垂設壁、１２Ｂ…第二垂設壁、１３Ａ…第一フック受け、１３Ｂ…第二フック受け、１４Ａ…第一底板部、１４Ｂ…第二底板部、２１…垂下部、２２Ａ…第一ストッパー、２２Ｂ…第二ストッパー、２３…下側延在部、２４…折り返し部、２５…上側延在部、２６…フック部、３１…外側面、３１Ａ…第一範囲、３１Ｂ…第二範囲、３１Ｃ…第三範囲、３２…内側面、３３Ａ…第一端面、３３Ｂ…第二端面、４３…めっき膜、４５…母材、７１Ａ…第一開口部、７１Ｂ…第二開口部、８１…第一水平部、８２…傾斜部、８３…第二水平部、８４…立ち上げ部、８５…第三水平部、８６Ａ…第一突出部、８６Ｂ…第二突出部。
  DESCRIPTION OF SYMBOLS 1,61 ... Contact, 3 ... Base part, 3A ... Joining surface, 5 ... Elastic contact part, 11 ... Top plate part, 12A ... First hanging wall, 12B ... Second hanging wall, 13A ... First hook receptacle, 13B: Second hook receiver, 14A: First bottom plate portion, 14B: Second bottom plate portion, 21: Hanging portion, 22A: First stopper, 22B: Second stopper, 23: Lower extension portion, 24: Folded portion , 25 ... upper extension part, 26 ... hook part, 31 ... outer side surface, 31A ... first range, 31B ... second range, 31C ... third range, 32 ... inner side surface, 33A ... first end surface, 33B ... first Two end faces, 43 ... plating film, 45 ... base material, 71A ... first opening, 71B ... second opening, 81 ... first horizontal part, 82 ... inclined part, 83 ... second horizontal part, 84 ... start-up 85, the third horizontal portion, 86A, the first projecting portion, 86B, the second projecting portion.

Claims (4)

  1. 　第一面と、前記第一面に対して垂直に配置される第二面とを電気的に接続可能なコンタクトであって、
    　前記第一面にはんだ付けされる接合面を有する基部と、
    　弾性変形して前記第二面に加圧接触する弾性接触部と、
    　を備え、
    　前記弾性接触部は、金属の薄板の一方の面によって構成される外側面と、前記薄板の他方の面によって構成される内側面と、前記薄板の端面によって構成される第一端面及び第二端面と、を有し、少なくとも前記外側面が前記薄板の表面に設けられためっき膜によって構成され、
    　前記外側面は、前記第一端面に隣接する第一範囲と、前記第二端面に隣接する第二範囲と、前記第一範囲と前記第二範囲との間にある第三範囲とを有し、前記第三範囲に接する面を基準面として、前記第一範囲が前記第一端面に近い箇所ほど前記基準面から離れる形状とされ、前記第二範囲が前記第二端面に近い箇所ほど前記基準面から離れる形状とされている、
    　コンタクト。     A contact capable of electrically connecting a first surface and a second surface arranged perpendicular to the first surface,
    A base having a joining surface soldered to the first surface;
    An elastic contact portion that is elastically deformed and pressurizes and contacts the second surface;
    With
    The elastic contact portion includes an outer surface constituted by one surface of a thin metal plate, an inner surface constituted by the other surface of the thin plate, and a first end surface and a second end surface constituted by end surfaces of the thin plate. And at least the outer surface is constituted by a plating film provided on the surface of the thin plate,
    The outer side surface includes a first range adjacent to the first end surface, a second range adjacent to the second end surface, and a third range between the first range and the second range. The surface that is in contact with the third range is a reference surface, and the portion closer to the first end surface is closer to the reference surface, and the second range is closer to the second end surface. It is supposed to be a shape away from the surface,
    contact.
  2. 　請求項１に記載のコンタクトであって、
    　前記第一範囲は、前記第一端面に近い箇所ほど前記薄板の板厚が薄くなる形状とされ、
    　前記第二範囲は、前記第二端面に近い箇所ほど前記薄板の板厚が薄くなる形状とされている、
    　コンタクト。     The contact according to claim 1,
    Said 1st range is made into the shape where the plate | board thickness of the said thin plate becomes thin as the location near the said 1st end surface,
    Said 2nd range is made into the shape where the plate | board thickness of the said thin plate becomes thin as the location near said 2nd end surface,
    contact.
  3. 　第一面と、前記第一面に対して垂直に配置される第二面とを電気的に接続可能なコンタクトの製造方法であって、
    　前記コンタクトは、
    　前記第一面にはんだ付けされる接合面を有する基部と、
    　弾性変形して前記第二面に加圧接触する弾性接触部と、
    　を備え、
    　前記弾性接触部は、金属の薄板の一方の面によって構成される外側面と、前記薄板の他方の面によって構成される内側面と、前記薄板の端面によって構成される第一端面及び第二端面と、を有し、少なくとも前記外側面が前記薄板の表面に設けられためっき膜によって構成され、
    　前記外側面は、前記第一端面に隣接する第一範囲と、前記第二端面に隣接する第二範囲と、前記第一範囲と前記第二範囲との間にある第三範囲とを有し、前記第三範囲に接する面を基準面として、前記第一範囲が前記第一端面に近い箇所ほど前記基準面から離れる形状とされ、前記第二範囲が前記第二端面に近い箇所ほど前記基準面から離れる形状とされており、
    　前記第一範囲を前記第一端面に近い箇所ほど前記基準面から離れる形状に加工する工程、及び前記第二範囲を前記第二端面に近い箇所ほど前記基準面から離れる形状加工する工程においては、前記金属の薄板に対して叩き加工が施される、
    　コンタクトの製造方法。     A method of manufacturing a contact capable of electrically connecting a first surface and a second surface arranged perpendicular to the first surface,
    The contact is
    A base having a joining surface soldered to the first surface;
    An elastic contact portion that is elastically deformed and pressurizes and contacts the second surface;
    With
    The elastic contact portion includes an outer surface constituted by one surface of a thin metal plate, an inner surface constituted by the other surface of the thin plate, and a first end surface and a second end surface constituted by end surfaces of the thin plate. And at least the outer surface is constituted by a plating film provided on the surface of the thin plate,
    The outer side surface includes a first range adjacent to the first end surface, a second range adjacent to the second end surface, and a third range between the first range and the second range. The surface that is in contact with the third range is a reference surface, and the portion closer to the first end surface is closer to the reference surface, and the second range is closer to the second end surface. It is supposed to be a shape away from the surface,
    In the step of processing the first range closer to the first end surface, the step away from the reference surface, and the step of processing the second range closer to the second end surface away from the reference surface, Tapping is performed on the metal thin plate,
    Contact manufacturing method.
  4. 　請求項３に記載のコンタクトの製造方法であって、
    　前記叩き加工が施された後に曲げ加工を施すことにより、前記叩き加工が施された箇所を湾曲させる
    　コンタクトの製造方法。
          A method of manufacturing a contact according to claim 3,
    A method of manufacturing a contact in which a portion subjected to the tapping process is bent by bending the tapping process.
PCT/JP2019/012622 2018-03-29 2019-03-25 Contact and method of manufacturing same WO2019189040A1 (en)

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JP7304838B2 (en) * 2020-06-29 2023-07-07 株式会社エスマークスコーポレーション contact

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006155931A (en) * 2004-11-25 2006-06-15 Yazaki Corp Plating support method of terminal, and terminal using this
JP2008218187A (en) * 2007-03-05 2008-09-18 Kobe Steel Ltd COPPER ALLOY TERMINAL WITH Sn PLATING AND ITS MANUFACTURING METHOD
JP2014072317A (en) * 2012-09-28 2014-04-21 Kitagawa Ind Co Ltd Contact member

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006155931A (en) * 2004-11-25 2006-06-15 Yazaki Corp Plating support method of terminal, and terminal using this
JP2008218187A (en) * 2007-03-05 2008-09-18 Kobe Steel Ltd COPPER ALLOY TERMINAL WITH Sn PLATING AND ITS MANUFACTURING METHOD
JP2014072317A (en) * 2012-09-28 2014-04-21 Kitagawa Ind Co Ltd Contact member

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