JPH06251979A - Surface-mount electronic part - Google Patents

Abstract

PURPOSE:To provide a surface-mount electronic part composed of a capacitor provided with a pair of protruding lead terminals and the outer case in which the capacitor is inserted, wherein an engaging structure is provided to the electronic part to prevent a capacitor from coming off an outer case even if it is affected by heat in soldering. CONSTITUTION:A projection 10 formed on the inner surface of an outer case 6 is elastically deformed as it recedes from an insertion space of the case 6 which contains the capacitor 5 to allow the capacitor 5 to pass and made to elastically recover its initial shape to protrude into the insertion space to fix the capacitor 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in electronic components surface-mounted on a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, for example, in order to mount a capacitor on a surface, the capacitor (5) is housed in an outer case (6) made of synthetic resin as shown in FIGS. The pair of lead terminals (4) (4) provided has a structure in which it is bent toward the outer surface of the outer case (6).
(JP-A-4-88616, 4-109612 [H01G1 / 14]). In the assembly process, the capacitor (5) is inserted from the opening of the outer case (6) and installed in the outer case (6).

In this structure, as shown in FIGS. 10 and 11, the capacitor (5) is attached to the outer case (6) by the adhesive (13).
The ribs (14) are provided so as to project along the inner surface of the outer case (6) as shown in FIGS.
The frictional force between 4) and the condenser (5) causes the condenser to
A method of locking (5) in the outer case (6) can be considered.

[0004]

However, in the method shown in FIGS. 10 and 11, the capacitor (5) and the outer case are used.
When the air present in the gap (6) is sealed by the adhesive (13), this air expands due to the heat during soldering,
The internal pressure at this time may destroy the fixation by the adhesive (13).

Also in the method shown in FIGS. 12 and 13,
Due to the thermal deformation during soldering, the rib (14) and the capacitor
The frictional locking force between (5) is reduced, and there is a risk that the capacitor (5) will fall off the outer case (6) due to the action of impact force.

An object of the present invention is to prevent the component body from falling out of the outer case even if the component body is housed in the outer case and is affected by heat during soldering. The purpose is to provide a locking structure.

[0007]

In the surface mount component according to the present invention, a protrusion (10) is formed on the inner surface of the outer case (6), and the protrusion (10) recedes from the insertion space of the component body. It is elastically deformed in the direction to allow passage of the component body, and when elastically restored, the component body is formed at a height such that the component body can be inserted into the insertion space to lock the component body.

[0008]

[Operation] In the assembly process, the main body of the component is placed in the outer case
When pushing the inside of the case through the opening of (6), the protrusion (10) is pressed by the component body and elastically deformed to allow passage of the component body. Then, at the same time when the component body is installed in the outer case (6), the protrusion (10) elastically returns to enter the insertion space of the component body and lock the component body.

Thereafter, in the surface mounting process, even if the heat during soldering is transferred to the outer case (6) and the outer case (6) is slightly thermally deformed, the displacement amount of the protrusion (10) accompanying this is Since the height is sufficiently smaller than the height of the protrusion (10), the locked state is maintained. Further, since no adhesive is used to fix the component body in the outer case (6), destruction due to thermal expansion of air unlike the conventional case does not occur.

[0010]

In the surface mount electronic component according to the present invention, the protrusion of the outer case engages the component body sufficiently deeply to lock the component body. Even if affected, there is no risk that the component body will fall out of the outer case.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Some examples in which the present invention is applied to a surface mounting structure of a capacitor will be described in detail with reference to the drawings. Figure 3
As shown in Fig. 1, the capacitor (5) is composed of a pair of lead terminals in a cylindrical metal case (1) made of aluminum or the like and having a bottom.
(4) A metal case (1) is filled with a sealing body (3) which accommodates a capacitor element (2) having a protruding (4) and is made of epoxy resin or the like.

As shown in FIG. 1 to FIG.
(5) is housed in an outer case (6) made of synthetic resin.
In the outer case (6), a capacitor housing space (9) having a diameter slightly smaller than the outer shape of the capacitor (5) is formed, and
A pair of lead wire engaging holes 7 and 7 are provided on the back surface of the case.

The pair of lead terminals (4) and (4) are bent and formed, bent and extended from the end surface (11) of the capacitor, and the tip portions of which the direction is changed by 180 degrees are respectively the lead wire engaging holes (7). (7)
Has been inserted and locked.

Further, on the inner peripheral wall of the outer case (6), a projection (10) is integrally formed at a position near the opening end face (8).
As shown in FIG. 3, when the capacitor (5) is installed at a predetermined position in the outer case (6), the protrusion (10) has an inscribed circle inside the case defined by the tip of the protrusion (10) outside the capacitor (5). It has a height smaller than the diameter, and the projection (10) locks the capacitor end face (11).

In the assembling process, the capacitor (5) is pushed toward the inside of the outer case (6) and inserted into the inside of the capacitor accommodating space (9). In this process, the protrusion (10) of the outer case (6) is pressed by the capacitor (5) and elastically deforms to allow passage of the capacitor (5). When the condenser (5) reaches the inner part of the condenser housing space (9), the protrusion (10) elastically returns to the end surface (1) of the condenser (5).
1) is locked.

The protrusions (10) can be provided at a plurality of openings on the inner wall of the outer case (6). Further, as shown in FIG. 4, if a pair of slits (12) and (12) are opened on both sides of the outer case (6) with the protrusion (10) sandwiched between them, the capacitor (5) is placed inside the outer case (6). It is possible to reduce the force required to push in.

In the embodiment shown in FIGS. 5 to 7, in the capacitor (5), the sealing body (3) is inserted into the opening of the metal case (1) for accommodating the capacitor element (2), and the metal case ( The opening end of 1) is closed and wound. Further, a narrowed portion (15) is formed over the entire circumference at the end of the metal case (1) surrounding the sealing body (3).

On the other hand, on the inner peripheral wall of the outer case (6), a projection (10) is integrally formed at a position facing the narrowed portion (15). As shown in Fig. 7, the capacitor (5) is the outer case (6).
The protrusion (10) has a height such that the inscribed circle in the case defined by the tip of the protrusion (10) is smaller than the outer diameter of the capacitor (5) when installed inside the inner part. The protrusion (10) engages with the constricted part (15) of the condenser (5),
Lock (5).

In the assembling process, in the process of pushing the capacitor (5) toward the inside of the outer case (6), the protrusion (10) of the outer case (6) is pressed by the capacitor (5) and elastically deforms, Allow the capacitor (5) to pass. Then, when the capacitor (5) reaches the inner part, the projection (10) elastically recovers and fits into the narrowed portion (15) of the capacitor (5).

The outer case (6) can be formed in a cylindrical shape with both ends open as shown in FIG. In this case, the capacitor (5) is restrained from moving back and forth within the outer case (6) by the engagement of the protrusion (10). Particularly in the structure, the outer case (6) and the capacitor (5)
Since the air existing in the gap of (1) flows out from both openings of the outer case (6) due to the thermal expansion at the time of soldering, the effect of removing the internal pressure is excellent.

In the embodiment of FIGS. 5 to 7 or the embodiment of FIG. 8, the protrusions (10) can be provided at a plurality of locations on the inner peripheral wall of the outer case (6) as shown in FIG.

As described above, according to the surface mount electronic component of the present invention, even if the surface mount electronic component is affected by heat at the time of soldering or a strong impact force is applied in the surface mount state, a reliable engagement structure by the protrusion is provided. Since it is adopted, there is no fear that the capacitor (5) will fall out of the outer case (6).

The above description of the embodiments is for explaining the present invention, and should not be construed as limiting the invention described in the claims or limiting the scope. Further, the configuration of each part of the present invention is not limited to the above embodiment, but various modifications can be made within the technical scope described in the claims.

For example, it is possible to use the locking structure by the projection of each of the above-mentioned embodiments and the locking structure by the rib (14) shown in FIGS. 12 and 13 together. Further, the present invention can be applied not only to the capacitor (5) but also to various surface mount electronic parts.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a surface mount component according to the present invention.

FIG. 2 is a front view of the surface mount component of FIG. 1 in an assembled state.

FIG. 3 is a partially cutaway side view of the above.

FIG. 4 is a perspective view of an outer case showing another embodiment having slits.

FIG. 5 is an exploded perspective view of another embodiment in which a throttle portion is formed.

6 is a front view of the surface-mounted component shown in FIG. 5 in an assembled state.

FIG. 7 is a partially cutaway side view of the above.

FIG. 8 is a partially cutaway side view of another embodiment in which both ends of the outer case are opened.

FIG. 9 is a front view of an outer case showing another embodiment in which a plurality of protrusions are formed.

FIG. 10 is a front view of a conventional surface mount component.

11 is a partially cutaway side view of the surface mount component of FIG.

FIG. 12 is a front view showing another conventional example.

13 is a partially cutaway side view of the conventional example of FIG.

[Explanation of symbols]

 (5) Capacitor (4) Lead terminal (6) Outer case (9) Capacitor housing space (10) Protrusion

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[Procedure amendment]

[Submission date] December 3, 1993

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0012

[Correction method] Change

[Correction content]

As shown in FIG. 1 to FIG.
(5) is housed in an outer case (6) made of synthetic resin.
The outer case (6), together with the capacitor capacitor housing space slightly larger diameter than the outer shape of (5) (9) is formed,
A pair of lead wire engaging holes 7 and 7 are provided on the back surface of the case.

[Procedure Amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0016

[Correction method] Change

[Correction content]

[0016] Incidentally, the projections (10), it is also possible to provide a plurality 箇 office of the outer casing (6) inner wall. Further, as shown in FIG. 4, if a pair of slits (12) and (12) are opened on both sides of the outer case (6) with the protrusion (10) sandwiched between them, the capacitor (5) is placed inside the outer case (6). It is possible to reduce the force required to push in.

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0017

[Correction method] Change

[Correction content]

In the embodiment shown in FIGS. 5 to 7, in the capacitor (5), the sealing body (3) is inserted into the opening of the metal case (1) for accommodating the capacitor element (2), and the metal case ( The opening end of 1) is closed and wound. Further, a narrowed portion (15) is formed over the entire circumference in the vicinity of the end portion of the metal case (1) surrounding the sealing body (3).

[Procedure amendment 4]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 6

[Correction method] Change

[Correction content]

[Figure 6]

[Procedure Amendment 5]

[Document name to be corrected] Drawing

[Correction target item name] Figure 9

[Correction method] Change

[Correction content]

[Figure 9]

Claims (3)

[Claims] 1. A component body in which a component element having a pair of lead terminals (4) (4) provided in a protruding manner is housed in a metal case (1), and at least one end is opened, and the component body is opened through the opening. And a pair of lead terminals (4) and (4) bent outward from the opening of the outer case (6) and extending at the tip of the outer case (6). For surface-mounted electronic components along the outer surface of the outer case (6)
A protrusion (10) is formed on the inner surface of the component, and the protrusion (10) elastically deforms in the direction of retracting from the insertion space of the component body to allow passage of the component body, and when elastically restored, the component body A surface mount electronic component, which is formed at a height capable of protruding into an insertion space and locking a component body. 2. The surface mount electronic component according to claim 1, wherein the protrusion (10) is provided at a position where the protrusion hits an end portion of a side surface of the component body and locks the component body. 3. A recess is formed on the outer peripheral surface of the component body,
2. The surface mount electronic component according to claim 1, wherein the protrusion (10) is provided so as to fit in the recess and lock the component body.