JP4868464B2 - Surface mount contact - Google Patents

Description

  The present invention belongs to the technical field of surface mount contacts that are surface-mounted on a printed circuit board in order to achieve electrical connection between the printed circuit board and, for example, a housing.

In order to achieve electrical connection between the printed circuit board and, for example, the housing, the surface mount contact that is surface-mounted on the printed circuit board includes two coil springs and an insulating holder that holds the two coil springs at an interval. There is a coil spring connector in which a flat surface formed on a holder at a position between two coil springs is used as a nozzle suction surface for suction by a suction nozzle.
JP 2002-170617 A

  In the case of the above-described coil spring connector, a flat surface located between two coil springs can be automatically mounted by suction with a suction nozzle, but is composed of two (or more) coil springs and an insulating holder. It has been desired to reduce the number of components, that is, a configuration having only one coil spring.

The surface mount contact according to claim 1,
A metal base provided with a nozzle suction surface for suction by a suction nozzle and a soldering surface that can be soldered and that faces downward when the nozzle suction surface faces upward;
And a conductive coil spring attached to the metal base so that the nozzle suction surface is exposed to the inner peripheral side.

  The surface mounting contact according to claim 1 is surface mounted by soldering a soldering surface to a printed circuit board. In addition, the point which solders only a soldering surface is not necessarily limited, For example, not only a soldering surface but the side surface etc. of a metal base may be soldered.

  In addition to the soldering surface, the metal base is provided with a nozzle suction surface for suction by the suction nozzle, and the soldering surface is directed downward when the nozzle suction surface is directed upward. The coil spring is attached to the metal base with the nozzle suction surface exposed to the inner peripheral side. By inserting the suction nozzle into the coil spring, the nozzle suction surface becomes the suction nozzle. And can be automatically mounted.

  A conductive coil spring that is electrically connected to the metal base functions as a contact, and is pressed against a conductor (for example, a housing or another printed circuit board) other than the printed circuit board to which the surface mount contact is soldered. It is done.

  Since the contact is a coil spring, even if it contacts an operator or another member, it is elastically deformed but not plastically deformed. Further, the contact point of the coil spring does not have a possibility of losing spring elasticity and being damaged when it is used repeatedly many times.

  The surface mount contact according to claim 2, wherein the nozzle suction surface is a top surface of a protrusion erected on the substrate portion, the coil spring is fitted on the protrusion, and the soldering surface is connected to the substrate portion from the substrate portion. The surface mount contact according to claim 1, wherein the surface mount contact is provided on a leg portion extending in a direction opposite to the protrusion.

  The nozzle suction surface is the top surface of the protrusion erected on the substrate part, and the coil spring is fitted to the protrusion, and does not require, for example, welding or the like, so that the operation of assembling the coil spring to the metal base is easy. .

  The surface mount contact according to claim 3 is the surface mount contact according to claim 1 or 2, wherein the coil spring has an opening through which the suction nozzle passes. Is suitable.

  The surface mount contact according to claim 4, wherein the coil spring is fitted into a protrusion provided on the metal base, and a return piece is provided at an upper end portion of the protrusion to prevent the coil spring from coming off. The surface mount contact according to claim 1, wherein the coil spring can be reliably prevented from falling off.

Next, embodiments of the present invention will be described based on examples of the present invention. The present invention is not limited to the following examples and the like, and it goes without saying that the present invention can be implemented in various ways without departing from the gist of the present invention.
[Example 1]
As shown in FIGS. 1, 2, and 3, the surface mount contact 1 of this embodiment includes a metal base 2 and a coil spring 3. The metal base 2 is made of sheet metal such as brass, phosphor bronze, beryllium copper, and stainless steel. The coil spring 3 is formed of a wire such as piano wire, beryllium copper, or stainless steel. In both cases, tin plating or the like may be applied.

The metal base portion 2 includes a rectangular substrate portion 4.
A protrusion 5 is erected at the center of the substrate portion 4. The protrusion 5 has a cylindrical shape, and its top surface 6 is parallel to the surface of the substrate portion 4. This top surface 6 is used as a nozzle suction surface.

  Legs 7 extend from two parallel sides of the substrate part 4. The leg portion 7 extends from the substrate portion 4 opposite to the protruding direction of the protrusion 5 by bending the substrate portion 4 at a right angle. Moreover, the front-end | tip part of the leg part 7 is bend | folded at a right angle again. The lower surface of the tip portion is parallel to the surface of the substrate portion 4 and serves as a soldering surface 8. That is, the top surface 6 and the soldering surface 8 are arranged so as to sandwich the substrate portion 4, and the substrate portion 4 (surface), the top surface 6 and the soldering surface 8 are parallel to each other. As shown in FIG. 2, if the top surface 6 is directed upward, the soldering surface 8 is directed downward.

  The coil spring 3 is fitted to the protrusion 5 in a range of 2-3 turns from the lower end portion 9. That is, the inner diameter is substantially constant in the range of 2-3 turns from the lower end portion 9. On the other hand, from the vicinity of the protrusion 5 to the upper end portion 10, it has a trumpet shape (conical frustum shape) whose inner diameter increases on the upper end portion 10 side.

  The coil spring 3 is formed in the shape shown in FIGS. On the other hand, the metal base 2 is formed into a shape shown in FIGS. Then, the lower half of the coil spring 3 is fitted to the protrusion 5 to form the surface mount contact 1, but in this embodiment, the surface conductivity of the surface mount contact 1 is ensured by applying gold plating after the fitting. It also has a rust-proofing effect. And in a taping process, it is accommodated (embossed packing) in the emboss of an emboss tape, and is shipped.

  The surface mounting contact 1 can be applied to an automatic mounting machine in an embossed packaging, but the coil spring 3 exposes the top surface 6 of the protrusion 5 to the inner peripheral side as well shown in FIG. 1 (a) and FIG. Since it is attached to the protrusion 5 (metal base 2), the suction nozzle 11 of the automatic execution machine is inserted into the inner peripheral side of the trumpet-shaped portion of the coil spring 3 as shown in FIG. The nozzle can be adsorbed.

  The surface mounting contact 1 is taken out from the emboss by suction of the nozzle, automatically mounted on the printed circuit board, and then surface mounted by soldering the soldering surface 8 to the printed circuit board by reflow soldering.

  The substrate portion 4 has a rectangular shape, and a coil spring 3 is fitted to a protrusion 5 erected at the center thereof, and a pair of leg portions 7 extend from two parallel sides of the substrate portion 4. Therefore, the suction point by the suction nozzle 11 (the top surface 6 of the protrusion 5) is very close to the center of gravity of the surface mount contact 1 (not so far). Accordingly, the weight balance is good when the nozzle is sucked, and the surface mounting contact 1 does not tilt, so that the automatic mounting position on the printed circuit board is also accurate.

  The coil spring 3 attached to the metal base 2 functions as a contact, and is brought into pressure contact with a conductor (for example, a housing or another printed board) different from the printed board to which the surface mounting contact 1 is soldered. At that time, the coil spring 3 is compressed, so that the pressure contact between the coil spring 3 and the housing or the like is maintained.

Since this surface mount contact 1 is a coil spring 3, even if it contacts an operator or another member, it will only be elastically deformed and will not be plastically deformed. The contact point of the coil spring 3 is not likely to break due to loss of spring elasticity when used repeatedly many times.
[Example 2]
As shown in FIGS. 4 and 5, the surface mount contact 1 a of the present embodiment includes a return piece 12 projecting obliquely downward from the upper end portion of the protrusion 5. As is apparent from a comparison between FIGS. 1 and 2 and FIGS. 4 and 5, the configuration is the same as that of the surface mount contact 1 of Example 1 except for the protruding return piece 12.

Since the surface mounting contact 1 a includes the return piece 12, there is no possibility that the coil spring 3 falls off the protrusion 5. In addition, the same effects as those of the first embodiment can be obtained.
[Example 3]
As shown in FIG. 6, the surface mount contact 1 b of the present embodiment includes a locking portion 13 formed by bending the end of the coil spring 3 on the lower end portion 9 side. The locking portion 13 is locked to the end surface of the substrate portion 4. As is clear from a comparison between FIG. 1 and FIG. 6, the configuration is the same as that of the surface mount contact 1 of Example 1 except for the locking portion 13.

Since the surface mounting contact 1b has the locking portion 13 provided at the end of the coil spring 3 locked to the end surface of the substrate portion 4, the coil spring 3 and the metal base portion 2 can be prevented from rotating relative to each other. In addition, the same effects as those of the first embodiment can be obtained.
[Example 4]
As shown in FIG. 7, the surface mount contact 1c of this embodiment is wound with the same inner diameter from the lower end portion 9 to the upper end portion 14 without making the coil spring 3 into a trumpet shape. As apparent from the comparison between FIG. 1 and FIG. 7, the configuration is the same as that of the surface mount contact 1 of Example 1 except for the presence or absence of a change in the winding diameter of the coil spring 3.

Since the surface mount contact 1c has no change in the winding diameter of the coil spring 3 (the winding diameter is constant), the forming process of the coil spring 3 is simplified, and the cost can be reduced accordingly. In addition, the same effects as those of the first embodiment can be obtained.
[Example 5]
As shown in FIG. 8, in the surface mount contact 1d of the present embodiment, the winding diameter of the upper half of the coil spring 3 is made smaller on the upper end 15 side. As is clear from a comparison between FIG. 1 and FIG. 8, the configuration is the same as that of the surface mount contact 1 of Example 1 except for the winding shape of the coil spring 3.

  The surface mount contact 1d gradually reduces the winding diameter of the upper half of the coil spring 3 as it approaches the upper end 15 to make the coil spring 3 bullet-shaped. Even if it contacts, it can prevent applying big force. In addition, the same effects as those of the first embodiment can be obtained.

The top view (a), left view (b), front view (c), right view (d), bottom view (e), and perspective view (f) of the surface mount contact of Example 1. 1 is a longitudinal sectional view of a surface mount contact of Example 1. FIG. FIG. 3 is a longitudinal sectional view for explaining nozzle suction of the surface-mounted contact according to the first embodiment. The front view of the surface mount contact of Example 2. FIG. FIG. 6 is a longitudinal sectional view of a surface mount contact according to a second embodiment. FIG. 6 is a front view of a surface mount contact according to a third embodiment. The front view of the surface mount contact of Example 4. FIG. FIG. 10 is a front view of a surface mount contact according to a fifth embodiment.

Explanation of symbols

1, 1a, 1b, 1c, 1d ... surface mount contact,
2 ... Metal base,
3 ... Coil spring,
4 ... substrate part,
5 ... protrusions,
6 ... Top surface (nozzle suction surface),
7 ... Legs,
8 ... soldering surface,
9 ... lower end,
10, 14, 15 ... upper end,
11 ... Suction nozzle,
12 ... Return piece,
13: Locking part.

Claims (4)

A metal base provided with a nozzle suction surface for suction by a suction nozzle and a soldering surface that can be soldered and that faces downward when the nozzle suction surface faces upward;
A surface mount contact, comprising: a conductive coil spring attached to the metal base so that the nozzle suction surface is exposed to the inner peripheral side. The nozzle suction surface is a top surface of a protrusion erected on the substrate portion,
The coil spring is fitted to the protrusion,
2. The surface mounting contact according to claim 1, wherein the soldering surface is provided on a leg portion extending in a direction opposite to the protrusion from the substrate portion. The surface mount contact according to claim 1, wherein the coil spring has an opening through which the suction nozzle passes. The coil spring is fitted to a protrusion provided on the metal base,
4. The surface mount contact according to claim 1, wherein a return piece for preventing the coil spring from coming off is provided at an upper end portion of the protrusion.

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