JP2013236015A - Power module, installation structure of connection terminal in power module, and connection terminal - Google Patents

Power module, installation structure of connection terminal in power module, and connection terminal Download PDF

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JP2013236015A
JP2013236015A JP2012108676A JP2012108676A JP2013236015A JP 2013236015 A JP2013236015 A JP 2013236015A JP 2012108676 A JP2012108676 A JP 2012108676A JP 2012108676 A JP2012108676 A JP 2012108676A JP 2013236015 A JP2013236015 A JP 2013236015A
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connection terminal
holding member
power module
substrate
tightly wound
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Takahiro Fujii
貴広 藤井
Jun Tominaga
潤 冨永
Koji Ishikawa
浩嗣 石川
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NHK Spring Co Ltd
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NHK Spring Co Ltd
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Priority to JP2012108676A priority Critical patent/JP2013236015A/en
Priority to PCT/JP2013/062852 priority patent/WO2013168711A1/en
Priority to TW102116666A priority patent/TW201405769A/en
Publication of JP2013236015A publication Critical patent/JP2013236015A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
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    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
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    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
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    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
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    • H01L2924/1304—Transistor
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    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Geometry (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

【課題】接続端子が基板から外れにくく、良好な接触状態を安定的に維持することができるパワーモジュール、パワーモジュールにおける接続端子の取付構造および接続端子を提供する。
【解決手段】半導体素子が実装される基板と、線材をらせん状に巻回したコイルばね状をなし、外部の回路と接触することによって該回路と基板とを電気的に接続する導電性の接続端子と、基板の表面に接合され、該表面と直交する方向に延びる柱状をなし、接続端子を保持する導電性の保持部材と、を備え、接続端子は、線材が密着巻きされ、少なくとも一部が保持部材と接触して該保持部材に保持される密着巻き部と、密着巻き部よりも粗いピッチで線材が巻回される粗巻き部と、を有する。
【選択図】図２Provided are a power module that can prevent a connection terminal from coming off from a substrate and can stably maintain a good contact state, a connection terminal mounting structure in the power module, and a connection terminal.
A conductive connection for forming a substrate on which a semiconductor element is mounted and a coil spring formed by spirally winding a wire and electrically connecting the circuit and the substrate by contact with an external circuit. And a conductive holding member that is connected to the surface of the substrate and extends in a direction orthogonal to the surface, and holds the connection terminal. Has a tightly wound portion that comes into contact with the holding member and is held by the holding member, and a coarsely wound portion around which the wire is wound at a coarser pitch than the tightly wound portion.
[Selection] Figure 2

Description

本発明は、電力制御用の半導体素子を備えたパワーモジュール、パワーモジュールにおける接続端子の取付構造および接続端子に関する。   The present invention relates to a power module including a semiconductor element for power control, a connection terminal mounting structure in the power module, and a connection terminal.

従来、産業用、自動車用などの電力制御からモータ制御まで、幅広い分野に使用される省エネルギー化のキーデバイスとして、電力制御用の半導体素子を備えたパワーモジュールが知られている。パワーモジュールは、複数の半導体素子が実装された基板と、各半導体素子にそれぞれ接続されて電力の入出力を行う複数の接続端子とを備える。   2. Description of the Related Art Conventionally, a power module including a semiconductor element for power control is known as a key device for energy saving used in a wide range of fields from power control to motor control for industrial use and automobile use. The power module includes a substrate on which a plurality of semiconductor elements are mounted, and a plurality of connection terminals that are connected to the respective semiconductor elements and input / output power.

パワーモジュールにおいて、接続端子に対しては、外部の回路基板とパワーモジュールの基板との間の電気的導通を確実に行うことが求められる。例えば、下記特許文献１では、ピン状をなして基板の電極と接触する第１接触装置と、湾曲形状をなして外部の制御回路基板と接触する第２接触装置と、コイルばね状をなして第１接触装置と第２接触装置の間に設けられる弾性部分とを備えた接続端子が開示されている。このような構成を有する接続端子は、パワーモジュールのハウジングに形成される穴に挿通されて保持される。   In the power module, the connection terminals are required to reliably perform electrical continuity between the external circuit board and the power module board. For example, in Patent Document 1 below, a first contact device that forms a pin shape and contacts an electrode of a substrate, a second contact device that forms a curved shape and contacts an external control circuit substrate, and a coil spring shape A connection terminal including an elastic portion provided between the first contact device and the second contact device is disclosed. The connection terminal having such a configuration is inserted and held in a hole formed in the housing of the power module.

特開２００８−１５３６５７号公報JP 2008-153657 A

しかしながら、上記特許文献１に記載の従来技術の場合、接続端子がハウジングに対して完全に固定されているわけではないため、制御回路基板を装着して圧縮力を発生させないと基板から外れてしまいやすいという問題があった。   However, in the case of the prior art described in Patent Document 1, since the connection terminal is not completely fixed to the housing, it does not come out of the board unless a control circuit board is attached to generate a compressive force. There was a problem that it was easy.

また、上記特許文献１に記載の従来技術では、接続端子の荷重が制御回路基板による圧縮力に依存しているため、制御回路基板が振動等によって変形すると、接続端子と基板および制御回路基板との接触抵抗が変化してしまうという問題もあった。   In the prior art described in Patent Document 1, since the load of the connection terminal depends on the compressive force by the control circuit board, if the control circuit board is deformed by vibration or the like, the connection terminal, the board, and the control circuit board There was also a problem that the contact resistance of the wire changed.

本発明は、上記に鑑みてなされたものであって、接続端子が基板から外れにくく、良好な接触状態を安定的に維持することができるパワーモジュール、パワーモジュールにおける接続端子の取付構造および接続端子を提供することを目的とする。   The present invention has been made in view of the above, and a power module that can prevent a connection terminal from coming off from a substrate and can stably maintain a good contact state, a connection terminal mounting structure in the power module, and a connection terminal The purpose is to provide.

上述した課題を解決し、目的を達成するために、本発明に係るパワーモジュールは、半導体素子が実装される基板と、線材をらせん状に巻回したコイルばね状をなし、外部の回路と接触することによって該回路と前記基板とを電気的に接続する導電性の接続端子と、前記基板の表面に接合され、該表面と直交する方向に延びる柱状をなし、前記接続端子を保持する導電性の保持部材と、を備え、前記接続端子は、前記線材が密着巻きされ、少なくとも一部が前記保持部材と接触して該保持部材に保持される密着巻き部と、前記密着巻き部よりも粗いピッチで前記線材が巻回される粗巻き部と、を有することを特徴とする。   In order to solve the above-described problems and achieve the object, the power module according to the present invention has a substrate on which a semiconductor element is mounted, a coil spring formed by winding a wire in a spiral shape, and contacts an external circuit. And a conductive connection terminal for electrically connecting the circuit and the substrate, and a conductive material which is bonded to the surface of the substrate and has a column shape extending in a direction perpendicular to the surface, and holds the connection terminal. The connecting terminal, and the connection terminal is tightly wound around the wire, and is at least partially in contact with the holding member and held by the holding member, and is rougher than the tightly wound portion. And a coarsely wound portion around which the wire is wound at a pitch.

本発明に係るパワーモジュールは、上記発明において、前記保持部材は、前記密着巻き部を保持する中空部が形成されたことを特徴とする。   The power module according to the present invention is characterized in that, in the above invention, the holding member is formed with a hollow portion for holding the tightly wound portion.

本発明に係るパワーモジュールは、上記発明において、前記保持部材は、前記中空部と面する内周面に設けられ、前記接続端子を抜け止めする抜け止め手段を有することを特徴とする。   The power module according to the present invention is characterized in that, in the above-mentioned invention, the holding member has a retaining means for retaining the connection terminal provided on an inner peripheral surface facing the hollow portion.

本発明に係るパワーモジュールは、上記発明において、前記抜け止め手段は、前記内周面に設けられた凹部であり、前記密着巻き部は、前記凹部と嵌合し、当該密着巻き部の他の部分よりも径が大きいフランジ部を有することを特徴とする。   In the power module according to the present invention, in the above invention, the retaining means is a recess provided in the inner peripheral surface, and the tightly wound portion is fitted with the recessed portion, It has the flange part whose diameter is larger than a part, It is characterized by the above-mentioned.

本発明に係るパワーモジュールは、上記発明において、前記抜け止め手段は、前記内周面から突起した突起部であることを特徴とする。   The power module according to the present invention is characterized in that, in the above invention, the retaining means is a protruding portion protruding from the inner peripheral surface.

本発明に係るパワーモジュールは、上記発明において、前記接続端子は、前記保持部材の外周面に圧入されることを特徴とする。   In the power module according to the present invention as set forth in the invention described above, the connection terminal is press-fitted into an outer peripheral surface of the holding member.

本発明に係るパワーモジュールは、上記発明において、前記保持部材の外周面に設けられ、前記接続端子を保持した状態で該接続端子を抜け止めする抜け止め手段を有することを特徴とする。   The power module according to the present invention is characterized in that, in the above invention, the power module has a retaining means that is provided on an outer peripheral surface of the holding member and prevents the connection terminal from being detached while the connection terminal is retained.

本発明に係るパワーモジュールは、上記発明において、前記抜け止め手段は、前記外周面の一部が切り欠かれた切欠部であり、前記密着巻き部は、前記切欠部と嵌合し、当該密着巻き部の他の部分よりも径が小さい小径部を有することを特徴とする。   In the power module according to the present invention, in the above invention, the retaining means is a notch part in which a part of the outer peripheral surface is notched, and the tightly wound part is fitted to the notch part, It has the small diameter part whose diameter is smaller than the other part of a winding part, It is characterized by the above-mentioned.

本発明に係るパワーモジュールにおける接続端子の取付構造は、半導体素子と、該半導体素子が実装される基板と、外部の回路と前記基板とを電気的に接続する導電性の接続端子とを備えたパワーモジュールにおける接続端子の取付構造であって、前記基板の表面に接合され、該表面と直交する方向に延びる柱状をなし、前記接続端子を保持する導電性の保持部材を備え、前記接続端子は、線材がらせん状に密着巻きされ、少なくとも一部が前記保持部材と接触して該保持部材に保持される密着巻き部と、前記密着巻き部よりも粗いピッチで前記線材がらせん状に巻回される粗巻き部と、を有することを特徴とする。   A mounting structure of a connection terminal in a power module according to the present invention includes a semiconductor element, a substrate on which the semiconductor element is mounted, and a conductive connection terminal that electrically connects an external circuit and the substrate. A connection structure for a connection terminal in a power module, comprising a columnar shape bonded to the surface of the substrate and extending in a direction perpendicular to the surface, and having a conductive holding member for holding the connection terminal, The wire is tightly wound in a spiral shape, at least part of which is in contact with the holding member and is held by the holding member, and the wire is wound in a spiral shape at a coarser pitch than the tightly wound portion. And a coarsely wound portion.

本発明に係るパワーモジュールにおける接続端子の取付構造は、上記発明において、前記保持部材は、前記密着巻き部を保持する中空部が形成されたことを特徴とする。   The attachment structure of the connection terminal in the power module according to the present invention is characterized in that, in the above invention, the holding member is formed with a hollow portion for holding the tightly wound portion.

本発明に係るパワーモジュールにおける接続端子の取付構造は、上記発明において、前記接続端子は、前記保持部材の外周面に圧入されることを特徴とする。   The attachment structure of the connection terminal in the power module according to the present invention is characterized in that, in the above invention, the connection terminal is press-fitted into an outer peripheral surface of the holding member.

本発明に係る接続端子は、半導体素子と、該半導体素子が実装される基板と、前記基板の表面に接合され、該表面と直交する方向に延びる柱状をなす導電性の保持部材とを備えたパワーモジュールの一部をなし、前記保持部材に保持されることによって外部の回路と前記基板とを電気的に接続する導電性の接続端子であって、線材がらせん状に密着巻きされ、少なくとも一部が前記保持部材と接触して該保持部材に保持される密着巻き部と、前記密着巻き部よりも粗いピッチで前記線材がらせん状に巻回される粗巻き部と、を備えたことを特徴とする。   A connection terminal according to the present invention includes a semiconductor element, a substrate on which the semiconductor element is mounted, and a conductive holding member that is joined to the surface of the substrate and has a columnar shape extending in a direction orthogonal to the surface. A conductive connection terminal that is part of a power module and is electrically connected to an external circuit and the substrate by being held by the holding member, and the wire is tightly wound in a spiral shape. A tightly wound portion that is held by the holding member in contact with the holding member, and a coarsely wound portion in which the wire is wound spirally at a pitch that is coarser than the tightly wound portion. Features.

本発明によれば、線材をらせん状に巻回したコイルばね状をなし、外部の回路と接触することによって該回路と基板とを電気的に接続する導電性の接続端子と、基板の表面に接合され、該表面と直交する方向に延びる柱状をなし、接続端子を保持する導電性の保持部材と、を備え、接続端子は、線材が密着巻きされ、少なくとも一部が保持部材と接触して該保持部材に保持される密着巻き部と、密着巻き部よりも粗いピッチで線材が巻回される粗巻き部と、を有するため、密着巻き部と保持部材との接触によって接続端子が基板から外れにくく、良好な接触状態を安定的に維持することができる。   According to the present invention, a coil spring shape in which a wire is wound in a spiral shape is formed, and a conductive connection terminal that electrically connects the circuit and the substrate by contact with an external circuit, and a surface of the substrate. And a conductive holding member that holds the connection terminal. The connection terminal has a wire rod tightly wound, and at least part of the connection terminal is in contact with the holding member. Since the contact winding portion held by the holding member and the rough winding portion around which the wire is wound at a coarser pitch than the contact winding portion, the connection terminal is removed from the substrate by the contact between the contact winding portion and the holding member. It is difficult to come off and a good contact state can be stably maintained.

図１は、本発明の実施の形態１に係るパワーモジュールの構成を示す斜視図である。1 is a perspective view showing a configuration of a power module according to Embodiment 1 of the present invention. 図２は、本発明の実施の形態１に係るパワーモジュールの要部の構成を示す断面図である。FIG. 2 is a cross-sectional view showing a configuration of a main part of the power module according to Embodiment 1 of the present invention. 図３は、本発明の実施の形態２に係るパワーモジュールの要部の構成を示す断面図である。FIG. 3 is a cross-sectional view showing the configuration of the main part of the power module according to Embodiment 2 of the present invention. 図４は、本発明の実施の形態３に係るパワーモジュールの要部の構成を示す断面図である。FIG. 4 is a cross-sectional view showing the configuration of the main part of the power module according to Embodiment 3 of the present invention. 図５は、本発明の実施の形態４に係るパワーモジュールの要部の構成を示す断面図である。FIG. 5 is a cross-sectional view showing the configuration of the main part of the power module according to Embodiment 4 of the present invention. 図６は、本発明の実施の形態５に係るパワーモジュールの要部の構成を示す断面図である。FIG. 6 is a cross-sectional view showing a configuration of a main part of a power module according to Embodiment 5 of the present invention.

以下、添付図面を参照して本発明を実施するための形態（以下、「実施の形態」という）を説明する。なお、図面は模式的なものであって、各部分の厚みと幅との関係、それぞれの部分の厚みの比率などは現実のものとは異なる場合もあることに留意すべきであり、図面の相互間においても互いの寸法の関係や比率が異なる部分が含まれる場合があることは勿論である。   DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention (hereinafter referred to as “embodiments”) will be described with reference to the accompanying drawings. It should be noted that the drawings are schematic, and the relationship between the thickness and width of each part, the ratio of the thickness of each part, and the like may be different from the actual ones. Of course, there may be included portions having different dimensional relationships and ratios.

（実施の形態１）
図１は、本発明の実施の形態１に係るパワーモジュールの構成を示す斜視図である。図２は、本実施の形態１に係るパワーモジュールの要部の構成を示す断面図である。図１および図２に示すパワーモジュール１は、複数の半導体素子が実装された基板２と、外部の回路と電気的に接触することによって、該回路と基板２とを電気的に接続する導電性の接続端子３と、基板２の表面に接合され、該表面と直交する方向に延びる柱状をなし、接続端子３を保持する導電性の保持部材４と、を備える。 (Embodiment 1)
1 is a perspective view showing a configuration of a power module according to Embodiment 1 of the present invention. FIG. 2 is a cross-sectional view showing a configuration of a main part of the power module according to the first embodiment. The power module 1 shown in FIG. 1 and FIG. 2 has a conductive property that electrically connects a substrate 2 on which a plurality of semiconductor elements are mounted and an external circuit, thereby electrically connecting the circuit and the substrate 2. And a conductive holding member 4 that holds the connection terminal 3 in a columnar shape that is joined to the surface of the substrate 2 and extends in a direction orthogonal to the surface.

基板２は、絶縁性の樹脂またはセラミックスなどの絶縁性材料を用いて構成される板状の母材５と、母材５の主面に実装される複数の半導体素子６と、母材５の主面に設けられる複数の電極７と、半導体素子６と電極７とを電気的に接続するワイヤ８とを有する。   The substrate 2 includes a plate-shaped base material 5 formed using an insulating material such as an insulating resin or ceramics, a plurality of semiconductor elements 6 mounted on the main surface of the base material 5, and the base material 5. It has the some electrode 7 provided in a main surface, and the wire 8 which electrically connects the semiconductor element 6 and the electrode 7. FIG.

母材５を構成するセラミックスとしては、例えば窒化アルミニウム、窒化珪素等の窒化物系セラミックスや、アルミナ、マグネシア、ジルコニア、ステアタイト、フォルステライト、ムライト、チタニア、シリカ、サイアロン等の酸化物系セラミックスを適用することができる。このうち、耐久性、熱伝導性等の観点からは、窒化物系セラミックスが好ましい。   Examples of the ceramic constituting the base material 5 include nitride ceramics such as aluminum nitride and silicon nitride, and oxide ceramics such as alumina, magnesia, zirconia, steatite, forsterite, mullite, titania, silica, and sialon. Can be applied. Among these, nitride ceramics are preferable from the viewpoint of durability, thermal conductivity, and the like.

半導体素子６は、ダイオード、トランジスタ、ＩＧＢＴ（絶縁ゲートバイポーラトランジスタ）等のパワーデバイスのいずれかである。なお、図１ではすべての半導体素子を「半導体素子６」として記載しているが、これらの半導体素子６は互いに種類が異なっていてもよい。半導体素子６は、半田によって基板２上に接合される。   The semiconductor element 6 is any one of power devices such as a diode, a transistor, and an IGBT (insulated gate bipolar transistor). In FIG. 1, all semiconductor elements are described as “semiconductor elements 6”, but these semiconductor elements 6 may be of different types. The semiconductor element 6 is bonded onto the substrate 2 by solder.

電極７は、銅またはアルミニウムなどの金属または合金を用いてパターニングすることによって、基板２に実装された半導体素子６などに電気信号を伝送するための回路パターンの一部をなす。   The electrode 7 forms a part of a circuit pattern for transmitting an electric signal to the semiconductor element 6 or the like mounted on the substrate 2 by patterning using a metal or alloy such as copper or aluminum.

接続端子３は、線材をらせん状に巻回したコイルばねであり、線材が密着巻きされ、保持部材４の中空部４１に圧入されて保持部材４に密着固定される密着巻き部３１と、密着巻き部３１よりも粗いピッチで線材が巻回され、先端で外部の制御回路基板（図示せず）と接触する粗巻き部３２とを有する。接続端子３の外径は、中空部４１の径よりも若干大きい。以上の構成を有する接続端子３は金属または合金を用いて構成される。具体的には、接続端子３は、例えばりん青銅、クロム銅、ベリリウム銅またはコルソン銅などの銅合金を用いて構成される。   The connection terminal 3 is a coil spring in which a wire is wound in a spiral shape, the wire is tightly wound, and is tightly wound around the hollow portion 41 of the holding member 4 and tightly fixed to the holding member 4. A wire rod is wound at a pitch that is coarser than that of the winding portion 31, and has a rough winding portion 32 that comes into contact with an external control circuit board (not shown) at the tip. The outer diameter of the connection terminal 3 is slightly larger than the diameter of the hollow portion 41. The connection terminal 3 having the above configuration is configured using a metal or an alloy. Specifically, the connection terminal 3 is configured using, for example, a copper alloy such as phosphor bronze, chrome copper, beryllium copper, or Corson copper.

保持部材４は、基板２の電極７の表面と直交する方向に立設され、中空円筒状をなす金属または合金からなる。保持部材４は、円筒状に形成される中空部４１で接続端子３の密着巻き部３１を密着した状態で保持する。保持部材４は、電極７に対して半田等によって接合される。   The holding member 4 is erected in a direction orthogonal to the surface of the electrode 7 of the substrate 2 and is made of a metal or alloy having a hollow cylindrical shape. The holding member 4 holds the tightly wound portion 31 of the connection terminal 3 in a close contact state with a hollow portion 41 formed in a cylindrical shape. The holding member 4 is joined to the electrode 7 with solder or the like.

接続端子３を保持部材４に固定する際には、保持部材４の内周面を削って新生面を露出させた後、密着巻き部３１の外径が縮小する方向に密着巻き部３１をねじった状態で中空部４１へ挿入し、圧入する。これにより、パワーモジュール１における接続端子３の取付構造が実現される。   When fixing the connection terminal 3 to the holding member 4, the inner circumferential surface of the holding member 4 is scraped to expose the new surface, and then the tightly wound portion 31 is twisted in a direction in which the outer diameter of the tightly wound portion 31 is reduced. Insert into the hollow part 41 in a state and press fit. Thereby, the attachment structure of the connection terminal 3 in the power module 1 is implement | achieved.

以上説明した本発明の実施の形態１によれば、線材をらせん状に巻回したコイルばね状をなし、外部の回路と接触することによって該回路と基板とを電気的に接続する導電性の接続端子と、基板の表面に接合され、該表面と直交する方向に延びる柱状をなし、接続端子を保持する導電性の保持部材と、を備え、接続端子は、線材が密着巻きされ、少なくとも一部が保持部材と接触して該保持部材に保持される密着巻き部と、密着巻き部よりも粗いピッチで線材が巻回される粗巻き部と、を有するため、密着巻き部と保持部材との接触によって接続端子が基板から外れにくく、良好な接触状態を安定的に維持することができる。   According to Embodiment 1 of the present invention described above, a coil spring is formed by winding a wire in a spiral shape, and the conductive and electrically connected circuit and substrate are brought into contact with an external circuit. A connection terminal and a conductive holding member that is bonded to the surface of the substrate and extends in a direction perpendicular to the surface, and holds the connection terminal. The contact portion is in contact with the holding member and the tightly wound portion held by the holding member, and the coarsely wound portion around which the wire is wound at a pitch coarser than the tightly wound portion. Due to this contact, the connection terminal is unlikely to be detached from the substrate, and a good contact state can be stably maintained.

また、本実施の形態１によれば、接続端子を保持部材の中空部へ圧入するだけでよいため、接続端子の交換を容易に行うことができる。   Moreover, according to this Embodiment 1, since it is only necessary to press-fit the connection terminal into the hollow portion of the holding member, the connection terminal can be easily replaced.

（実施の形態２）
図３は、本発明の実施の形態２に係るパワーモジュールの要部の構成を示す断面図である。同図に示すパワーモジュール９は、基板２と、外部の回路と基板２とを電気的に接続する導電性の接続端子１０と、基板２の表面に接合され、該表面と直交する方向に延びる柱状をなし、接続端子１０を保持する導電性の保持部材１１と、を備える。 (Embodiment 2)
FIG. 3 is a cross-sectional view showing the configuration of the main part of the power module according to Embodiment 2 of the present invention. The power module 9 shown in the figure is bonded to the surface of the substrate 2, the conductive connection terminal 10 for electrically connecting the external circuit and the substrate 2, and extends in a direction perpendicular to the surface. And a conductive holding member 11 that has a columnar shape and holds the connection terminal 10.

接続端子１０はコイルばねであり、保持部材１１の外周部に圧入されて密着固定される密着巻き部１０１と、先端で制御回路基板と接触する粗巻き部１０２とを有する。接続端子１０の内径は、保持部材１１の径よりも若干小さい。接続端子１０は、接続端子３と同様の材料を用いて構成される。   The connection terminal 10 is a coil spring, and has a tightly wound portion 101 that is press-fitted into the outer peripheral portion of the holding member 11 and fixed in close contact, and a coarsely wound portion 102 that comes into contact with the control circuit board at the tip. The inner diameter of the connection terminal 10 is slightly smaller than the diameter of the holding member 11. The connection terminal 10 is configured using the same material as that of the connection terminal 3.

保持部材１１は、基板２の電極７の表面と直交する方向に立設され、円柱状をなす金属または合金からなる。保持部材１１は、外周部で接続端子１０の密着巻き部１０１を密着した状態で保持する。保持部材１１は、電極７に対して半田等によって接合される。   The holding member 11 is erected in a direction orthogonal to the surface of the electrode 7 of the substrate 2 and is made of a columnar metal or alloy. The holding member 11 holds the tightly wound portion 101 of the connection terminal 10 in a close contact state at the outer peripheral portion. The holding member 11 is joined to the electrode 7 with solder or the like.

接続端子１０を保持部材１１に固定する際には、保持部材１１の外周面を削って新生面を露出させた後、密着巻き部１０１の内径が拡大する方向に密着巻き部１０１をねじった状態で保持部材１１へ圧入する。これにより、パワーモジュール９における接続端子１０の取付構造が実現される。   When fixing the connection terminal 10 to the holding member 11, the outer peripheral surface of the holding member 11 is shaved to expose the new surface, and then the tightly wound portion 101 is twisted in the direction in which the inner diameter of the tightly wound portion 101 is enlarged. Press fit into the holding member 11. Thereby, the attachment structure of the connection terminal 10 in the power module 9 is implement | achieved.

以上説明した本発明の実施の形態２によれば、実施の形態１と同様、接続端子が基板から外れにくく、良好な接触状態を安定的に維持することができる。また、接続端子の交換も容易に行うことができる。   According to the second embodiment of the present invention described above, as in the first embodiment, the connection terminals are unlikely to be detached from the substrate, and a good contact state can be stably maintained. In addition, the connection terminals can be easily replaced.

また、本実施の形態２によれば、接続端子を保持部材の外周側に圧入するため、接続端子の径を内周側に圧入する場合と比較して大きくすることができる。したがって、接続端子の成形が容易であるとともに、保持部材への挿入も容易である。   Further, according to the second embodiment, since the connection terminal is press-fitted into the outer peripheral side of the holding member, the diameter of the connection terminal can be increased as compared with the case of press-fitting into the inner peripheral side. Therefore, it is easy to form the connection terminal, and it is easy to insert the connection terminal into the holding member.

なお、本実施の形態２において、保持部材を中空円筒形状としてもよい。   In the second embodiment, the holding member may have a hollow cylindrical shape.

（実施の形態３）
図４は、本発明の実施の形態３に係るパワーモジュールの要部の構成を示す断面図である。同図に示すパワーモジュール１２は、基板２と、外部の回路と基板２とを電気的に接続する導電性の接続端子１３と、基板２の表面に接合され、該表面と直交する方向に延びる柱状をなし、接続端子１３を保持する導電性の保持部材１４と、を備える。 (Embodiment 3)
FIG. 4 is a cross-sectional view showing the configuration of the main part of the power module according to Embodiment 3 of the present invention. The power module 12 shown in the figure is bonded to the surface of the substrate 2, the conductive connection terminal 13 that electrically connects the external circuit and the substrate 2, and extends in a direction perpendicular to the surface. And a conductive holding member 14 that has a columnar shape and holds the connection terminal 13.

接続端子１３はコイルばねであり、保持部材１４に圧入されて密着固定される密着巻き部１３１と、先端で制御回路基板と接触する粗巻き部１３２とを有する。接続端子１３は、接続端子３と同様の材料を用いて構成される。   The connection terminal 13 is a coil spring, and has a tightly wound portion 131 that is press-fitted into the holding member 14 and is firmly fixed thereto, and a coarsely wound portion 132 that comes into contact with the control circuit board at the tip. The connection terminal 13 is configured using the same material as the connection terminal 3.

密着巻き部１３１は、粗巻き部１３２と連結し、粗巻き部１３２から遠ざかるにつれて径が徐々に小さくなるテーパ部１３１ａと、テーパ部１３１ａの最小径をなす端部に連結する小径部１３１ｂと、小径部１３１ｂの中間部に設けられ、長手方向に沿って径が徐々に大きくなった後、再び小径部１３１ｂと同じ径に戻るフランジ部１３１ｃと、を有する。   The tightly wound portion 131 is connected to the coarsely wound portion 132, and a taper portion 131a that gradually decreases in diameter as it moves away from the coarsely wound portion 132; a small diameter portion 131b that is connected to an end that forms the minimum diameter of the tapered portion 131a; A flange portion 131c is provided at an intermediate portion of the small-diameter portion 131b and returns to the same diameter as the small-diameter portion 131b after the diameter gradually increases along the longitudinal direction.

保持部材１４は、基板２の電極７の表面と直交する方向に立設され、中空部１４１が形成された円筒状をなす金属または合金からなる。中空部１４１の高さ方向の略中央部と面する内周面には、保持部材１４の外周側に穿設された凹部１４２が形成されている。凹部１４２は、フランジ部１３１ｃの外周面と略一致する形状をなしており、フランジ部１３１ｃと嵌合することにより、接続端子１３の保持部材１４からの抜け止めを行う。凹部１４２の最大径は、フランジ部１３１ｃの最大径よりも若干小さい。以上の構成を有する保持部材１４は、電極７に対して半田等によって接合される。   The holding member 14 is erected in a direction perpendicular to the surface of the electrode 7 of the substrate 2 and is made of a cylindrical metal or alloy in which a hollow portion 141 is formed. A concave portion 142 formed on the outer peripheral side of the holding member 14 is formed on the inner peripheral surface facing the substantially central portion in the height direction of the hollow portion 141. The concave portion 142 has a shape that substantially coincides with the outer peripheral surface of the flange portion 131c, and prevents the connection terminal 13 from coming off from the holding member 14 by fitting with the flange portion 131c. The maximum diameter of the recess 142 is slightly smaller than the maximum diameter of the flange portion 131c. The holding member 14 having the above configuration is joined to the electrode 7 by soldering or the like.

接続端子１３を保持部材１４に固定する際には、保持部材１４の内周面を削って新生面を露出させた後、密着巻き部１３１の外径が縮小する方向に密着巻き部１３１をねじった状態で中空部１４１へ挿入し、フランジ部１３１ｃが凹部１４２と嵌合するように圧入する。これにより、パワーモジュール１２における接続端子１３の取付構造が実現される。   When fixing the connection terminal 13 to the holding member 14, the inner peripheral surface of the holding member 14 is scraped to expose the new surface, and then the tightly wound portion 131 is twisted in a direction in which the outer diameter of the tightly wound portion 131 decreases. In the state, it inserts in the hollow part 141, and it press-fits so that the flange part 131c may fit with the recessed part 142. FIG. Thereby, the attachment structure of the connection terminal 13 in the power module 12 is implement | achieved.

以上説明した本発明の実施の形態３によれば、実施の形態１と同様、接続端子が基板から外れにくく、良好な接触状態を安定的に維持することができる。特に、本実施の形態３においては、保持部材の内周面に抜け止め手段としての凹部が形成される一方、接続端子には凹部と嵌合可能なフランジ部が設けられるため、接続端子が一段と抜けにくくなる。   According to the third embodiment of the present invention described above, as in the first embodiment, the connection terminals are unlikely to be detached from the substrate, and a good contact state can be stably maintained. In particular, in the third embodiment, a concave portion as a retaining means is formed on the inner peripheral surface of the holding member, while the connecting terminal is provided with a flange portion that can be fitted to the concave portion. It becomes difficult to come off.

（実施の形態４）
図５は、本発明の実施の形態４に係るパワーモジュールの要部の構成を示す断面図である。同図に示すパワーモジュール１５は、基板２と、外部の回路と基板２とを電気的に接続する導電性の接続端子１６と、基板２の表面に接合され、該表面と直交する方向に延びる柱状をなし、接続端子１６を保持する導電性の保持部材１７と、を備える。 (Embodiment 4)
FIG. 5 is a cross-sectional view showing the configuration of the main part of the power module according to Embodiment 4 of the present invention. The power module 15 shown in the figure is bonded to the surface of the substrate 2, the conductive connection terminal 16 that electrically connects the external circuit and the substrate 2, and extends in a direction perpendicular to the surface. And a conductive holding member 17 that has a columnar shape and holds the connection terminal 16.

接続端子１６はコイルばねであり、保持部材１７に圧入されて密着固定される密着巻き部１６１と、先端で制御回路基板と接触する粗巻き部１６２とを有する。接続端子１６は、接続端子３と同様の材料を用いて構成される。   The connection terminal 16 is a coil spring, and has a tightly wound portion 161 that is press-fitted into the holding member 17 and is firmly fixed thereto, and a coarsely wound portion 162 that comes into contact with the control circuit board at the tip. The connection terminal 16 is configured using the same material as the connection terminal 3.

密着巻き部１６１は、粗巻き部１６２と連結し、粗巻き部１６２から遠ざかるにつれて径が徐々に小さくなるテーパ部１６１ａと、テーパ部１６１ａの最小径を有する端部に連結する小径部１６１ｂとを有する。   The tightly wound portion 161 is connected to the coarsely wound portion 162, and a tapered portion 161a whose diameter gradually decreases as the distance from the coarsely wound portion 162 is increased, and a small diameter portion 161b that is connected to an end portion having the minimum diameter of the tapered portion 161a. Have.

保持部材１７は、基板２の電極７の表面と直交する方向に立設され、円柱状の中空部１７１が形成された円筒状の金属または合金からなる。中空部１７１の高さ方向の略中央部には、小径部１６１ｂの巻き方に沿ったらせん状をなし、内周面から中空部１７１へ向けて突起する突起部１７２が形成されている。突起部１７２は、密着巻き部１６１の隣接する線材の間に進入し、接続端子１６の保持部材１７からの抜け止めを行う。中空部１７１の径は、小径部１６１ｂの外径よりも若干小さい。以上の構成を有する保持部材１７は、電極７に対して半田等によって接合される。   The holding member 17 is made of a cylindrical metal or alloy that is erected in a direction orthogonal to the surface of the electrode 7 of the substrate 2 and in which a cylindrical hollow portion 171 is formed. A projecting portion 172 is formed at a substantially central portion in the height direction of the hollow portion 171 to form a spiral shape along the winding direction of the small diameter portion 161b and project from the inner peripheral surface toward the hollow portion 171. The protruding portion 172 enters between adjacent wires of the tightly wound portion 161 and prevents the connection terminal 16 from coming off from the holding member 17. The diameter of the hollow portion 171 is slightly smaller than the outer diameter of the small diameter portion 161b. The holding member 17 having the above configuration is joined to the electrode 7 with solder or the like.

接続端子１６を保持部材１７に固定する際には、保持部材１７の内周面を削って新生面を露出させた後、密着巻き部１６１の外径が縮小する方向に密着巻き部１６１をねじった状態で中心軸の周りに回転させながら中空部１７１へ圧入する。この圧入の際、小径部１６１ｂが所定の長さ分だけ突起部１７２を乗り越えて中空部１７１の内部へ進入するようにする。これにより、パワーモジュール１５における接続端子１６の取付構造が実現される。   When fixing the connection terminal 16 to the holding member 17, the inner circumferential surface of the holding member 17 is scraped to expose the new surface, and then the tightly wound portion 161 is twisted in a direction in which the outer diameter of the tightly wound portion 161 is reduced. In this state, it is press-fitted into the hollow portion 171 while rotating around the central axis. At the time of this press-fitting, the small diameter portion 161 b gets over the projection 172 by a predetermined length and enters the hollow portion 171. Thereby, the attachment structure of the connection terminal 16 in the power module 15 is implement | achieved.

以上説明した本発明の実施の形態４によれば、実施の形態１と同様、接続端子が基板から外れにくく、良好な接触状態を安定的に維持することができる。特に、本実施の形態４においては、保持部材の内周面に抜け止め手段としての突起部が形成されるため、接続端子が一段と抜けにくくなる。   According to the fourth embodiment of the present invention described above, as in the first embodiment, the connection terminals are not easily detached from the substrate, and a good contact state can be stably maintained. In particular, in the fourth embodiment, since the protrusion as the retaining means is formed on the inner peripheral surface of the holding member, the connection terminal is more difficult to come off.

（実施の形態５）
図６は、本発明の実施の形態５に係るパワーモジュールの要部の構成を示す断面図である。同図に示すパワーモジュール１８は、基板２と、外部の回路と基板２とを電気的に接続する導電性の接続端子１９と、基板２の表面に接合され、該表面と直交する方向に延びる柱状をなし、接続端子１９を保持する導電性の保持部材２０と、を備える。 (Embodiment 5)
FIG. 6 is a cross-sectional view showing a configuration of a main part of a power module according to Embodiment 5 of the present invention. The power module 18 shown in the figure is bonded to the surface of the substrate 2, the conductive connection terminals 19 that electrically connect the external circuit and the substrate 2, and extends in a direction perpendicular to the surface. And a conductive holding member 20 that has a columnar shape and holds the connection terminal 19.

接続端子１９はコイルばねであり、保持部材２０の外周部に圧入されて密着固定される密着巻き部１９１と、先端で制御回路基板と接触する粗巻き部１９２とを有する。接続端子１９は、接続端子３と同様の材料を用いて構成される。   The connection terminal 19 is a coil spring, and has a tightly wound portion 191 that is press-fitted into the outer peripheral portion of the holding member 20 and is firmly fixed thereto, and a coarsely wound portion 192 that contacts the control circuit board at the tip. The connection terminal 19 is configured using the same material as that of the connection terminal 3.

密着巻き部１９１は、粗巻き部１９２と連結する連結部１９１ａと、連結部１９１ａの端部に連結して連結部１９１ａよりも径が小さい小径部１９１ｂとを有する。   The tightly wound portion 191 includes a connecting portion 191a that is connected to the rough winding portion 192, and a small-diameter portion 191b that is connected to the end portion of the connecting portion 191a and has a smaller diameter than the connecting portion 191a.

保持部材２０は、基板２の電極７の表面と直交する方向に立設され、略円柱状をなす金属または合金からなる。保持部材２０は、外周部で接続端子１９を密着した状態で保持する。保持部材２０は、電極７に対して半田等によって接合される。   The holding member 20 is erected in a direction orthogonal to the surface of the electrode 7 of the substrate 2 and is made of a substantially columnar metal or alloy. The holding member 20 holds the connection terminal 19 in close contact with the outer peripheral portion. The holding member 20 is joined to the electrode 7 with solder or the like.

保持部材２０の外周面であって電極７に接合する部分には、他の部分よりも径が小さく切り欠かれた切欠部２０１が形成されている。切欠部２０１は、密着巻き部１９１の小径部１９１ｂと密着することにより、接続端子１９の保持部材２０からの抜け止めを行う。保持部材２０は、電極７に対して半田等によって接合される。   A portion of the outer peripheral surface of the holding member 20 that is joined to the electrode 7 is formed with a notch 201 having a diameter that is smaller than that of the other portion. The notch 201 keeps the connection terminal 19 from coming off from the holding member 20 by being in close contact with the small-diameter portion 191b of the tightly wound portion 191. The holding member 20 is joined to the electrode 7 with solder or the like.

接続端子１９を保持部材２０に固定する際には、保持部材２０の外周面を削って新生面を露出させた後、密着巻き部１９１の内径が拡大する方向に密着巻き部１９１をねじった状態で保持部材２０の外周面へ圧入し、小径部１９１ｂを切欠部２０１に嵌合させて密着固定する。これにより、パワーモジュール１８における接続端子１９の取付構造が実現される。   When fixing the connection terminal 19 to the holding member 20, the outer peripheral surface of the holding member 20 is shaved to expose the new surface, and then the tightly wound portion 191 is twisted in the direction in which the inner diameter of the tightly wound portion 191 is enlarged. The holding member 20 is press-fitted into the outer peripheral surface, and the small-diameter portion 191b is fitted into the notch portion 201 to be closely fixed. Thereby, the attachment structure of the connection terminal 19 in the power module 18 is realized.

以上説明した本発明の実施の形態５によれば、実施の形態１と同様、接続端子が基板から外れにくく、良好な接触状態を安定的に維持することができる。特に、本実施の形態５においては、保持部材の外周面に抜け止め手段としての切欠部が形成されるため、接続端子が一段と抜けにくくなる。   According to the fifth embodiment of the present invention described above, as in the first embodiment, the connection terminals are unlikely to be detached from the substrate, and a good contact state can be stably maintained. In particular, in the fifth embodiment, since the notch portion as the retaining means is formed on the outer peripheral surface of the holding member, the connection terminal is more difficult to come off.

また、本実施の形態５によれば、接続端子を保持部材の外周側に圧入するため、接続端子の径を大きくすることができる。したがって、接続端子の成形が容易であるとともに、保持部材への挿入も容易である。   Further, according to the fifth embodiment, since the connection terminal is press-fitted into the outer peripheral side of the holding member, the diameter of the connection terminal can be increased. Therefore, it is easy to form the connection terminal, and it is easy to insert the connection terminal into the holding member.

なお、本実施の形態５において、保持部材を中空円筒形状としてもよい。   In the fifth embodiment, the holding member may have a hollow cylindrical shape.

また、本実施の形態５において、保持部材の切欠部は、保持部材の任意の位置に形成することができる。その場合、切欠部の形成位置に応じて接続端子の小径部を設けることはいうまでもない。   In the fifth embodiment, the notch portion of the holding member can be formed at an arbitrary position of the holding member. In that case, needless to say, the small diameter portion of the connection terminal is provided according to the formation position of the notch.

ここまで、本発明の実施するための形態を説明してきたが、本発明は、上述した実施の形態１〜５によってのみ限定されるべきものではない。例えば、本発明において、制御信号用と電流用とで接続端子および保持部材の径を変えてもよい。具体的には、大電流を流す電流用の接続端子および保持部材の径を、比較的少ない電流で済む制御信号用の接続端子および保持部材の径よりそれぞれ大きくしてもよい。   Up to this point, the mode for carrying out the present invention has been described, but the present invention should not be limited only by the above-described first to fifth embodiments. For example, in the present invention, the diameters of the connection terminal and the holding member may be changed for the control signal and the current. Specifically, the diameters of the connection terminal for current and the holding member through which a large current flows may be larger than the diameters of the connection terminal for control signal and the holding member that require a relatively small current.

また、本発明において、保持部材は角柱状をなしていてもよいし、中空角柱状をなしていてもよい。   In the present invention, the holding member may have a prismatic shape or a hollow prismatic shape.

また、本発明において、基板の表面を保持部材の高さまで樹脂で封止してもよい。このような樹脂として、例えばフィラーとしてシリカ粉末が充填されたエポキシ樹脂を適用することができる。   Moreover, in this invention, you may seal the surface of a board | substrate with resin to the height of a holding member. As such a resin, for example, an epoxy resin filled with silica powder as a filler can be used.

また、本発明において、シリコンなどの樹脂、またはマシナブルセラミックスなどの絶縁性材料を用いて形成され、基板に取り付けられて複数の接続端子を個別に収容する接続端子ホルダを設けてもよい。   In the present invention, a connection terminal holder that is formed using an insulating material such as a resin such as silicon or a machinable ceramic and that is attached to a substrate and individually accommodates a plurality of connection terminals may be provided.

このように、本発明は、ここでは記載していないさまざまな実施の形態等を含みうるものであり、特許請求の範囲により特定される技術的思想を逸脱しない範囲内において種々の設計変更等を施すことが可能である。   Thus, the present invention can include various embodiments and the like not described herein, and various design changes and the like can be made without departing from the technical idea specified by the claims. It is possible to apply.

１、９、１２、１５、１８ パワーモジュール
２ 基板
３、１０、１３、１６、１９ 接続端子
４、１１、１４、１７、２０ 保持部材
５ 母材
６ 半導体素子
７ 電極
８ ワイヤ
３１、１０１、１３１、１６１、１９１ 密着巻き部
３２、１０２、１３２、１６２、１９２ 粗巻き部
４１、１４１、１７１ 中空部
１３１ａ、１６１ａ テーパ部
１３１ｂ、１６１ｂ、１９１ｂ 小径部
１３１ｃ フランジ部
１４２ 凹部
１７２ 突起部
１９１ａ 連結部
２０１ 切欠部 1, 9, 12, 15, 18 Power module 2 Substrate 3, 10, 13, 16, 19 Connection terminal 4, 11, 14, 17, 20 Holding member 5 Base material 6 Semiconductor element 7 Electrode 8 Wire 31, 101, 131 161, 191 Closely wound part 32, 102, 132, 162, 192 Coarse wound part 41, 141, 171 Hollow part 131a, 161a Tapered part 131b, 161b, 191b Small diameter part 131c Flange part 142 Concave part 172 Protruding part 191a Connecting part 201 Notch

Claims (12)

半導体素子が実装される基板と、
線材をらせん状に巻回したコイルばね状をなし、外部の回路と接触することによって該回路と前記基板とを電気的に接続する導電性の接続端子と、
前記基板の表面に接合され、該表面と直交する方向に延びる柱状をなし、前記接続端子を保持する導電性の保持部材と、
を備え、
前記接続端子は、
前記線材が密着巻きされ、少なくとも一部が前記保持部材と接触して該保持部材に保持される密着巻き部と、
前記密着巻き部よりも粗いピッチで前記線材が巻回される粗巻き部と、
を有することを特徴とするパワーモジュール。 A substrate on which a semiconductor element is mounted;
A coil spring shape in which a wire is wound in a spiral shape, and a conductive connection terminal that electrically connects the circuit and the substrate by contact with an external circuit;
A conductive holding member which is bonded to the surface of the substrate and has a column shape extending in a direction perpendicular to the surface, and holds the connection terminal;
With
The connection terminal is
The wire rod is tightly wound, and at least part of the wire is in contact with the holding member and is held by the holding member;
A coarsely wound portion around which the wire is wound at a coarser pitch than the tightly wound portion;
A power module comprising: 前記保持部材は、前記密着巻き部を保持する中空部が形成されたことを特徴とする請求項１に記載のパワーモジュール。   The power module according to claim 1, wherein the holding member has a hollow portion that holds the tightly wound portion. 前記保持部材は、前記中空部と面する内周面に設けられ、前記接続端子を抜け止めする抜け止め手段を有することを特徴とする請求項２に記載のパワーモジュール。   3. The power module according to claim 2, wherein the holding member includes a retaining means that is provided on an inner peripheral surface facing the hollow portion and prevents the connection terminal from being detached. 前記抜け止め手段は、
前記内周面に設けられた凹部であり、
前記密着巻き部は、
前記凹部と嵌合し、当該密着巻き部の他の部分よりも径が大きいフランジ部を有することを特徴とする請求項３に記載のパワーモジュール。 The retaining means is
A recess provided in the inner peripheral surface,
The tightly wound portion is
The power module according to claim 3, wherein the power module has a flange portion that fits into the concave portion and has a larger diameter than other portions of the tightly wound portion. 前記抜け止め手段は、
前記内周面から突起した突起部であることを特徴とする請求項３に記載のパワーモジュール。 The retaining means is
The power module according to claim 3, wherein the power module is a protrusion protruding from the inner peripheral surface. 前記接続端子は、前記保持部材の外周面に圧入されることを特徴とする請求項１に記載のパワーモジュール。   The power module according to claim 1, wherein the connection terminal is press-fitted into an outer peripheral surface of the holding member. 前記保持部材の外周面に設けられ、前記接続端子を保持した状態で該接続端子を抜け止めする抜け止め手段を有することを特徴とする請求項６に記載のパワーモジュール。   The power module according to claim 6, further comprising a retaining unit that is provided on an outer peripheral surface of the holding member and prevents the connection terminal from being detached while the connection terminal is being held. 前記抜け止め手段は、
前記外周面の一部が切り欠かれた切欠部であり、
前記密着巻き部は、
前記切欠部と嵌合し、当該密着巻き部の他の部分よりも径が小さい小径部を有することを特徴とする請求項７に記載のパワーモジュール。 The retaining means is
A part of the outer peripheral surface is notched,
The tightly wound portion is
The power module according to claim 7, wherein the power module has a small diameter portion that fits into the cutout portion and has a smaller diameter than other portions of the tightly wound portion. 半導体素子と、該半導体素子が実装される基板と、外部の回路と前記基板とを電気的に接続する導電性の接続端子とを備えたパワーモジュールにおける接続端子の取付構造であって、
前記基板の表面に接合され、該表面と直交する方向に延びる柱状をなし、前記接続端子を保持する導電性の保持部材を備え、
前記接続端子は、
線材がらせん状に密着巻きされ、少なくとも一部が前記保持部材と接触して該保持部材に保持される密着巻き部と、
前記密着巻き部よりも粗いピッチで前記線材がらせん状に巻回される粗巻き部と、
を有することを特徴とするパワーモジュールにおける接続端子の取付構造。 A connection structure for a connection terminal in a power module, which includes a semiconductor element, a substrate on which the semiconductor element is mounted, and an external circuit and a conductive connection terminal that electrically connects the substrate,
A columnar shape bonded to the surface of the substrate and extending in a direction orthogonal to the surface, and having a conductive holding member that holds the connection terminal,
The connection terminal is
A tightly wound portion in which the wire is tightly wound in a spiral shape, and at least part of the wire is in contact with the holding member and is held by the holding member;
A coarsely wound portion in which the wire is spirally wound at a coarser pitch than the tightly wound portion;
A connection terminal mounting structure in a power module, comprising: 前記保持部材は、前記密着巻き部を保持する中空部が形成されたことを特徴とする請求項９に記載のパワーモジュールにおける接続端子の取付構造。   The mounting structure of the connection terminal in the power module according to claim 9, wherein the holding member has a hollow portion that holds the tightly wound portion. 前記接続端子は、前記保持部材の外周面に圧入されることを特徴とする請求項９に記載のパワーモジュールにおける接続端子の取付構造。   The connection terminal mounting structure in the power module according to claim 9, wherein the connection terminal is press-fitted into an outer peripheral surface of the holding member. 半導体素子と、該半導体素子が実装される基板と、前記基板の表面に接合され、該表面と直交する方向に延びる柱状をなす導電性の保持部材とを備えたパワーモジュールの一部をなし、前記保持部材に保持されることによって外部の回路と前記基板とを電気的に接続する導電性の接続端子であって、
線材がらせん状に密着巻きされ、少なくとも一部が前記保持部材と接触して該保持部材に保持される密着巻き部と、
前記密着巻き部よりも粗いピッチで前記線材がらせん状に巻回される粗巻き部と、
を備えたことを特徴とする接続端子。 A part of a power module including a semiconductor element, a substrate on which the semiconductor element is mounted, and a conductive holding member that is bonded to the surface of the substrate and extends in a direction orthogonal to the surface, A conductive connection terminal for electrically connecting an external circuit and the substrate by being held by the holding member;
A tightly wound portion in which the wire is tightly wound in a spiral shape, and at least part of the wire is in contact with the holding member and is held by the holding member;
A coarsely wound portion in which the wire is spirally wound at a coarser pitch than the tightly wound portion;
A connection terminal characterized by comprising:
JP2012108676A 2012-05-10 2012-05-10 Power module, installation structure of connection terminal in power module, and connection terminal Withdrawn JP2013236015A (en)

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