JP2011040354A - Spring connector - Google Patents

Spring connector Download PDF

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JP2011040354A
JP2011040354A JP2009200884A JP2009200884A JP2011040354A JP 2011040354 A JP2011040354 A JP 2011040354A JP 2009200884 A JP2009200884 A JP 2009200884A JP 2009200884 A JP2009200884 A JP 2009200884A JP 2011040354 A JP2011040354 A JP 2011040354A
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spring
contact
pin
bypass means
spring connector
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Akira Oshitani
明良 押谷
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ACE FIVE KK
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ACE FIVE KK
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a spring connector capable of improving electrical connection performance, and capable of achieving further thinning. <P>SOLUTION: In the spring connector using a pin type terminal 11 equipped with a coil-shaped spring, a housing part 12 composed of conductive metal to house the spring, and a contact pin 4 which is supported in free sliding by the housing part, of which the tip part is biased by the spring and protruded from one end side of the housing part, and which is composed of the conductive metal is used. On the housing part, an electric bypath means 20 is attached which is composed of the conductive metal having a contact piece 27 extended out so as to be elastically contacted against the tip part of the contact pin. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、デジタルカメラやビデオカメラおよび携帯電話などの小型電子機器に実装されて、主にバッテリーパック(電池パック)のような接続用電極を備えた相手側電気部品との接続に用いられるスプリングコネクタに関するものである。  The present invention is a spring that is mounted on a small electronic device such as a digital camera, a video camera, and a cellular phone, and is mainly used for connection to a counterpart electrical component having a connection electrode such as a battery pack (battery pack). It relates to connectors.

従来、この種のスプリングコネクタとして、特開2004−55243号公報の図10,図11に示される押し当て式の形態が知られている。この従来の構造の一例を、図9(断面図)を参照して簡単に説明する。スプリングコネクタ50に用いるピン型端子51は、導電性材からなる筒部52と、筒部52内に収容されたコイル状のスプリング53と、筒部52に摺動自在に保持されスプリング53により付勢されて筒部52の一方の端部より先端部を突出させた接触ピン54と、筒部52の他方の端部に加締めなどにより接続されたターミナル片56とを備え、そのターミナル片56の下方端部57をプリント配線基板60上にプリント配線された接触端子部61に半田などにより接続させることにより、プリント配線基板60の回路と電気的に接続されるようになっている。そして、絶縁樹脂で成形されたハウジング58の一面より突出させた接触ピン54にバッテリーパック等の相手側電気部品(図示せず)の電極部を押し当てることにより、バッテリーパック等とプリント配線基板60とを電気的に接続させるようになっている。  Conventionally, as this type of spring connector, a pressing-type configuration shown in FIGS. 10 and 11 of JP-A-2004-55243 is known. An example of this conventional structure will be briefly described with reference to FIG. 9 (cross-sectional view). The pin-type terminal 51 used for the spring connector 50 includes a cylindrical portion 52 made of a conductive material, a coiled spring 53 accommodated in the cylindrical portion 52, and is slidably held in the cylindrical portion 52 and attached by the spring 53. A contact pin 54 that is biased so that its tip protrudes from one end of the cylindrical portion 52; and a terminal piece 56 that is connected to the other end of the cylindrical portion 52 by caulking or the like. The lower end portion 57 is electrically connected to the circuit of the printed wiring board 60 by connecting to the contact terminal portion 61 printed on the printed wiring board 60 with solder or the like. Then, an electrode part of a mating electrical component (not shown) such as a battery pack is pressed against the contact pin 54 that protrudes from one surface of the housing 58 that is formed of an insulating resin. Are electrically connected to each other.

また、この従来例によれば、接触ピン54は、筒部52の内穴径と略同径の抜け止め部55を有し、その抜け止め部55におけるスプリング53と接する側(図9における右方向側)の端面は、傾斜した形状をなしており、その端面をスプリング53により押圧することで接触ピン54が突出方向及び半径方向に付勢され、抜け止め部55の外周面が筒部52の内周面に当接して導通状態を得ることができるようになっている。そして、接触ピン54がプリント配線基板60に対して角度を有する方向(斜め方向)に摺動するようにピン型端子51は、傾斜してハウジング58に配置されており、この傾斜配置により上述の押し当て力の分力が接触ピン54をその半径方向に付勢する力として加わり、上述の導通状態をさらに良好にさせるとしている。  Further, according to this conventional example, the contact pin 54 has a retaining portion 55 having a diameter substantially the same as the diameter of the inner hole of the cylindrical portion 52, and the side that contacts the spring 53 in the retaining portion 55 (right side in FIG. 9). The end face on the direction side) has an inclined shape. When the end face is pressed by the spring 53, the contact pin 54 is urged in the protruding direction and the radial direction, and the outer peripheral surface of the retaining part 55 is the cylindrical part 52. It is possible to obtain a conduction state by contacting the inner peripheral surface. The pin-type terminal 51 is inclined and disposed in the housing 58 so that the contact pin 54 slides in a direction having an angle with respect to the printed wiring board 60 (an oblique direction). The component force of the pressing force is applied as a force for urging the contact pin 54 in the radial direction, thereby further improving the above-described conduction state.

特開2004−55243号公報(図10,図11)Japanese Patent Laying-Open No. 2004-55243 (FIGS. 10 and 11)

薄型化が進む小型電子機器においては、この種のスプリングコネクタにおいても、その電気的接続性能を維持向上しつつ、さらに薄型化(例えば、小型チップ部品と同様にプリント配線基板上の実装高さが1.5mm以下)が図れる形態であることが望ましい。  In small electronic devices that are becoming thinner, even with this type of spring connector, while maintaining and improving its electrical connection performance, it is even thinner (for example, the mounting height on a printed wiring board is the same as that of small chip components). 1.5 mm or less) is desirable.

上述のような従来の技術では、抜け止め部55の外周面が筒部52の内周面に当接して導通回路を形成させる構成であり、この当接による電気的接続を安定的なものとすべく、接触ピン54と筒部52には金メッキなどの耐食メッキが施される。しかし、筒部52の内穴は、めくら穴であり、(小型化のために内穴径が小さくなる場合は、なおさら)メッキ液および洗浄液が内穴の奥まで充分に流入および流出されず、メッキ不良が生じ易く、これによる導通不良が生じ易いという不具合があった。  In the conventional technology as described above, the outer peripheral surface of the retaining portion 55 is in contact with the inner peripheral surface of the cylindrical portion 52 to form a conduction circuit, and electrical connection by this contact is stable. Therefore, the contact pin 54 and the cylindrical portion 52 are subjected to corrosion resistance plating such as gold plating. However, the inner hole of the cylindrical portion 52 is a blind hole, and (especially, when the inner hole diameter is reduced for downsizing) the plating solution and the cleaning solution are not sufficiently flown into and out of the inner hole, There is a problem that plating failure is likely to occur, and conduction failure due to this is likely to occur.

また、上述のような従来の技術では、ピン型端子51は、実装するプリント配線基板60に対して傾斜してハウジング58に配置されており、この傾斜をさせた分だけ、(ハウジング58の基底面から上面までの)高さ寸法が大となる。  In the conventional technique as described above, the pin-type terminal 51 is disposed in the housing 58 so as to be inclined with respect to the printed wiring board 60 to be mounted. The height dimension (from surface to top) becomes large.

さらに、ピン型端子51を配置するハウジング58において、筒部52の周囲部分の肉厚寸法は、ピン型端子51を保持する強度や成形材料(絶縁樹脂)の成形加工性の制約から、最低限度が設定されるものであり(熱可塑性樹脂の場合、図9における筒部52の上方側および下方側の肉厚は、それぞれ0.2〜0.3mm以上の寸法を確保するのが一般的であり)、ハウジング58を含めた実装高さの薄型化(低背化)を妨げている。  Furthermore, in the housing 58 in which the pin-type terminal 51 is arranged, the thickness of the peripheral portion of the cylindrical portion 52 is at least a minimum due to the strength of holding the pin-type terminal 51 and the molding processability of the molding material (insulating resin). (In the case of a thermoplastic resin, it is common to ensure that the thickness of the upper side and the lower side of the cylindrical portion 52 in FIG. 9 is 0.2 to 0.3 mm or more, respectively. Yes), the mounting height including the housing 58 is prevented from being reduced (low profile).

よって、本発明の目的とするところは、上述のごとき従来技術の有する問題点を解決するものであって、電気的接続性能を向上させるとともに、さらなる薄型化が実現可能なスプリングコネクタを提供することにある。  Accordingly, an object of the present invention is to solve the problems of the prior art as described above, and to provide a spring connector that can improve the electrical connection performance and can be further reduced in thickness. It is in.

上記目的を達成するために、請求項1に記載のスプリングコネクタは、コイル状のスプリングと、そのスプリングを収容する導電性金属よりなる収容部と、前記収容部に摺動自在に支持されるとともに前記スプリングにより付勢されて前記収容部の一端側より先端部を突出させた導電性金属よりなる接触ピンとを備えたピン型端子を用いたスプリングコネクタにおいて、前記収容部には、前記接触ピンの先端部に対して弾性接触するように延出する接触片を有した導電性金属よりなる電気的バイパス手段が装着されている。  In order to achieve the above object, the spring connector according to claim 1 is a coil-shaped spring, a receiving portion made of a conductive metal for receiving the spring, and a slidably supported by the receiving portion. In a spring connector using a pin-type terminal provided with a contact pin made of a conductive metal that is urged by the spring and protrudes from the one end side of the housing portion, the housing portion includes the contact pin. An electrical bypass means made of a conductive metal having a contact piece extending so as to be in elastic contact with the distal end portion is mounted.

このように収容部に装着された電気的バイパス手段が(好適には、収容部の一端側に近接する位置で接触片の先端部が当接するように)接触ピンの先端部に対して弾性接触する(良好なメッキ処理が容易な延出形状の)接触片を有した構成は、接触ピンから(例えば、実装されるプリント配線基板へ)繋がる電気的導通経路において、良好な導通経路を加えることを容易にし、電気的接続の信頼性向上が図れる。また、このように導通経路を増大させた構成は、(従来例のように、ピン型端子を基板に対して傾斜して配置させなくとも導通状態を良好にできるため)薄型化に有利である。  The electrical bypass means thus mounted on the housing part is elastically contacted with the tip part of the contact pin (preferably so that the tip part of the contact piece abuts at a position close to one end side of the container part). The configuration with contact pieces (extended shape that facilitates good plating treatment) adds a good conduction path in the electrical conduction path that connects from the contact pin (for example, to the printed wiring board to be mounted). And the reliability of electrical connection can be improved. In addition, the configuration in which the conduction path is increased in this manner is advantageous for thinning (since the conductive state can be improved without arranging the pin-type terminal inclined with respect to the substrate as in the conventional example). .

また、請求項2によれば、前記電気的バイパス手段は、薄板材から打ち抜き加工および曲げ加工され、前記収容部の外周面を部分的に覆う(接触ピンの突出方向と基板面とが平行するように平置きされて基板に実装される場合、好適には、実装作業時の吸着面となる平面部を有した)板状基部と、前記収容部の外周面と嵌め合うように前記板状基部から延出する(好適には、その延出端部に収容部の外周面を抱え込むように内側に向き合って突出する突状部が形成された)少なくとも一対の側面部とを具備し、前記接触片は前記板状基部と前記側面部のいずれか一方または双方から延出している。  According to a second aspect of the present invention, the electrical bypass means is punched and bent from a thin plate material and partially covers the outer peripheral surface of the accommodating portion (the protruding direction of the contact pin and the substrate surface are parallel to each other). When mounted on a board in a flat manner as described above, preferably, the plate-like base portion (having a flat surface portion serving as a suction surface during mounting work) and the plate-like shape so as to be fitted to the outer peripheral surface of the housing portion At least a pair of side surfaces extending from the base (preferably formed with projecting portions projecting inward so as to hold the outer peripheral surface of the accommodating portion at the extended end), and The contact piece extends from one or both of the plate-like base and the side surface.

このように(好適には、コイル状のスプリングを収容する形態として、小型であっても強度的に有利で、外力からスプリングを保護することに適した円筒状の構造の)収容部に対して、側面部が嵌め合わせられる形態は、上述の装着を(例えば、溶接や接着材の使用などの複雑さを伴う接合方法に因らず、簡単な圧入操作により行えるため)容易にさせるものである。さらに、側面部を利用して接触片の延出数の増加が可能であるため、(さらに導通経路が加えられ)電気的接続の信頼性が向上できる。そして、薄板材から加工される電気的バイパス手段にて収容部を(吸着面を設けるためなどの目的で)覆う構成は、(例えば、絶縁樹脂で覆う構成と比較し)薄型化に有利である。  In this way (preferably with a cylindrical structure suitable for protecting the spring from external force, which is advantageous in terms of strength as a form for accommodating the coiled spring, even if it is small) The form in which the side portions are fitted is to facilitate the above-described mounting (for example, because it can be performed by a simple press-fitting operation regardless of the joining method involving the complexity such as welding or use of an adhesive). . Furthermore, since it is possible to increase the number of contact pieces extending using the side surface portion (addition of a conduction path), the reliability of electrical connection can be improved. And the structure which covers an accommodating part (for the purpose of providing an adsorption surface etc.) with the electrical bypass means processed from a thin plate material is advantageous for thickness reduction (for example, compared with the structure covered with an insulating resin). .

さらに、請求項3によれば、前記収容部の外周面は大径部および小径部を有する段付き形状とされ、前記板状基部と前記側面部のいずれか一方または双方からは前記大径部および前記小径部間の段付き面に係合せしめる係止部が具備され、その係合により、前記電気的バイパス手段が前記収容部のその長手軸に沿う方向の動きを規制するように構成している。この構成により、ピン型端子と電気的バイパス手段の相互の位置関係が容易に定まり、実装作業時などの取り扱いの際に、ピン型端子が(装着された)電気的バイパス手段から不用意にずれたり外れたりすることを防いでいる。また、ピン型端子にその長手軸方向の外力(例えば、相手側電気部品の押し当て力)が加わる際に、電気的バイパス手段がこれを受け止められる(プリント配線基板に実装された状態では、電気的バイパス手段を半田付け固定するプリント配線基板がさらにこれを受け止められる)ため、スプリングの付勢力が維持され、電気的接続の信頼性が維持できる。  Furthermore, according to Claim 3, the outer peripheral surface of the said accommodating part is made into the stepped shape which has a large diameter part and a small diameter part, and the said large diameter part from any one or both of the said plate-shaped base and the said side part. And a locking portion that is engaged with a stepped surface between the small diameter portions, and by the engagement, the electric bypass means is configured to restrict movement of the housing portion in the direction along the longitudinal axis. ing. With this configuration, the positional relationship between the pin-type terminal and the electrical bypass means is easily determined, and the pin-type terminal is inadvertently displaced from the (mounted) electrical bypass means during handling such as mounting work. It prevents it from coming off or coming off. Further, when an external force in the longitudinal axis direction (for example, a pressing force of the mating electrical component) is applied to the pin-type terminal, the electrical bypass means receives this (in a state where it is mounted on the printed wiring board, The printed wiring board for soldering and fixing the mechanical bypass means can be further received), so that the biasing force of the spring is maintained and the reliability of the electrical connection can be maintained.

上述したように、本発明のスプリングコネクタは、電気的導通経路を増加させることが容易であるため接続性能の向上が可能であるとともに、さらなる薄型化が実現可能なものである。  As described above, since the spring connector of the present invention can easily increase the electrical conduction path, the connection performance can be improved and further reduction in thickness can be realized.

本発明のスプリングコネクタの第一実施例を示した正面図  The front view which showed the 1st Example of the spring connector of this invention 図1で示したスプリングコネクタの側面図  Side view of the spring connector shown in FIG. 図1で示したスプリングコネクタのA−A断面図  AA sectional view of the spring connector shown in FIG. 図1で示したスプリングコネクタを構成する電気的バイパス手段の斜視図  The perspective view of the electrical bypass means which comprises the spring connector shown in FIG. 図1で示したスプリングコネクタの使用例を示した側面図  Side view showing an example of using the spring connector shown in FIG. 本発明のスプリングコネクタの第二実施例を示した側面図  The side view which showed the 2nd Example of the spring connector of this invention 図6で示したスプリングコネクタを構成するピン型端子の平面図  The top view of the pin type terminal which comprises the spring connector shown in FIG. 図6で示したスプリングコネクタを構成する電気的バイパス手段の斜視図  The perspective view of the electrical bypass means which comprises the spring connector shown in FIG. 従来のスプリングコネクタを示した断面図  Sectional view showing a conventional spring connector

以下、添付図面の図1から図8に基づき本発明の実施の形態を説明する。図1から図5は、本発明のスプリングコネクタの第1の実施例を示しており、図1は正面図、図2は側面図、図3はA−A断面図、図4は構成部品である電気的バイパス手段の斜視図、図5は使用例の側面図である。  Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 8 of the accompanying drawings. 1 to 5 show a first embodiment of a spring connector according to the present invention. FIG. 1 is a front view, FIG. 2 is a side view, FIG. 3 is a cross-sectional view along AA, and FIG. FIG. 5 is a side view of an example of use. FIG.

スプリングコネクタ10のピン型端子11は、図9に示す従来のピン型端子とほぼ同様の形態であり、銅合金等の導電性材からなる(実装高さ1.5mm以下の薄型化に適用出来るように、外径を約1.3mmとした)円筒状の収容部12と、収容部12内に収容されるコイル状のスプリング3と、収容部12に摺動自在に支持され、スプリング3により付勢されてチューブ12の一端より先端部5が突出する接触ピン4とを備えている。また、抜け止め部6の傾斜端面7をスプリング3により押圧することで接触ピン4が突出方向及び半径方向に付勢され、抜け止め部6の外周面がチューブ12の内周面に押し当てられ導通状態を得ることができるようになっている。  The pin-type terminal 11 of the spring connector 10 has substantially the same form as the conventional pin-type terminal shown in FIG. 9, and is made of a conductive material such as a copper alloy (applicable for thinning with a mounting height of 1.5 mm or less. The cylindrical housing portion 12 having an outer diameter of about 1.3 mm, a coiled spring 3 housed in the housing portion 12, and slidably supported by the housing portion 12. A contact pin 4 that is urged and protrudes from one end of the tube 12 is provided. Further, by pressing the inclined end surface 7 of the retaining portion 6 with the spring 3, the contact pin 4 is urged in the protruding direction and the radial direction, and the outer peripheral surface of the retaining portion 6 is pressed against the inner peripheral surface of the tube 12. A conduction state can be obtained.

収容部12の上面(図1における上方向の面)を覆うように嵌合装着された電気的バイパス手段20は、(厚さが0.1mm程度の)薄板状の導電性金属板から打ち抜き曲げ加工されており、(図5に示すごとく、接触ピン4の突出方向とプリント配線基板60の上面とが平行するように)平置き配置でプリント配線基板60に自動実装する際、吸着ノズルの吸着面となる平面部22を有した板状基部21を具備している。また、収容部12の外周面13と嵌め合うように前記板状基部21から下方(図1における下方向)に延出する一対の側面部23a,23bには、その延出端部24a,24bにおいて(装着状態において、収容部12に向かう)内側方向に向き合って(例えば、絞り加工や切り曲げ加工により)突出する突状部25a、25bが形成されている。  The electrical bypass means 20 fitted and mounted so as to cover the upper surface (upper surface in FIG. 1) of the accommodating portion 12 is punched and bent from a thin plate-like conductive metal plate (having a thickness of about 0.1 mm). When being automatically mounted on the printed wiring board 60 in a flat arrangement (so that the protruding direction of the contact pins 4 and the upper surface of the printed wiring board 60 are parallel to each other) as shown in FIG. A plate-like base portion 21 having a flat portion 22 to be a surface is provided. The pair of side surface portions 23a and 23b extending downward (downward in FIG. 1) from the plate-like base portion 21 so as to be fitted to the outer peripheral surface 13 of the accommodating portion 12 have extended end portions 24a and 24b. , Projecting portions 25a and 25b that project inward (for example, by drawing or cutting) in the inner direction (toward the housing portion 12 in the mounted state) are formed.

そして、収容部12は、金属板からなる(その弾性力により)側面部23a,23bに挟持されつつ、突状部25a、25bにより抱き込まれるようにして電気的バイパス手段20に保持される。この状態で、収容部12と電気的バイパス手段20は電気的に導通可能であることがわかる。また、この嵌着状態は、予め、突状部25a、25bの対向間隔を収容部12の外径より狭く設定し、その対向間にピン型端子11の収容部12部分を差し込むことにより、容易に実現できる。  And the accommodating part 12 is hold | maintained at the electrical bypass means 20 so that it may be held by the protruding parts 25a and 25b, being pinched | interposed into the side parts 23a and 23b which consist of metal plates (by the elastic force). In this state, it can be seen that the accommodating portion 12 and the electrical bypass means 20 can be electrically connected. In addition, this fitting state is facilitated by setting the interval between the protruding portions 25a and 25b in advance to be narrower than the outer diameter of the accommodating portion 12, and inserting the accommodating portion 12 portion of the pin-type terminal 11 between the opposed portions. Can be realized.

また、板状基部21から接触ピン4の先端部5方向に延出する接触片27は、先端部5に対して(収容部12に電気的バイパス手段20が装着される過程で接触片27の先端部28が接触ピンの先端部5により押し上げられて)弾性接触するように設定された舌状の片持ちばね構造となっている。そして、接触ピン4の過度な傾きにより接触片27が変形するなどの支障が生じ難いように、収容部12の一端側に近接する位置で接触片27の(先端部5の外周面上を滑らかに摺動できるよう円弧状に曲げ加工された)先端部28が接触ピン4の先端部5に当接している。このように(メッキ不良が生じ難い)剥き出し形状の先端部5に対して弾性接触する(メッキ不良が生じ難い)延出形状の接触片27を具備した構成は、接触ピン4が収容部12の内周面に当接して形成される導通経路とは別に、接触ピン4が直接的に電気的バイパス手段20と当接する安定的な導通経路を得ることを実現している。なお、接触片27の先端部28は、接触ピン4の外周面に沿うように凹状断面構造としたり、二股構造としても良い。  Further, the contact piece 27 extending from the plate-like base portion 21 toward the distal end portion 5 of the contact pin 4 is connected to the distal end portion 5 (in the process of attaching the electrical bypass means 20 to the housing portion 12). The tongue-shaped cantilever spring structure is set so that the distal end portion 28 is pushed up by the distal end portion 5 of the contact pin and is in elastic contact. Then, the contact piece 27 (smoothly on the outer peripheral surface of the tip portion 5) is positioned at a position close to one end side of the housing portion 12 so that troubles such as deformation of the contact piece 27 due to excessive inclination of the contact pin 4 are unlikely to occur. The tip 28 is bent into an arc shape so that it can slide in contact with the tip 5 of the contact pin 4. As described above, in the configuration including the extended contact piece 27 that is in elastic contact with the exposed tip portion 5 (which is unlikely to cause plating failure) (the plating pin is less likely to cause plating failure) Apart from the conduction path formed in contact with the inner peripheral surface, it is possible to obtain a stable conduction path in which the contact pin 4 directly contacts the electrical bypass means 20. The tip 28 of the contact piece 27 may have a concave cross-sectional structure along the outer peripheral surface of the contact pin 4 or a bifurcated structure.

また、側面部23a,23bの下方端部26a,26bは、平置きされたピン型端子11の(図1における収容部12の外周下面である)最下部とほぼ同一の高さで形成されており、図5に示す平置き実装の場合、下方端部26a,26bは、プリント配線基板60の接触端子部61に当接している。そして、(通常、クリーム半田が塗布される)接触端子部61と下方端部26a,26bとが、(リフロー炉などの加熱により)半田付けされることにより、電気的バイパス手段20は、プリント配線基板60に電気的に接続されるとともに、下方端部26a,26bによって支持されて安定した状態に固定される。なお、下方端部26a,26bより、さらに下方に向けて突出する爪状突起を設け、プリント配線基板60にはこの突起と係合可能な配置で位置決め孔を設け、この係合により、プリント配線基板60上におけるスプリングコネクタ10の配置(位置決め)精度を高めても良い。  Further, the lower end portions 26a and 26b of the side surface portions 23a and 23b are formed at substantially the same height as the lowermost portion of the flat-type pin-type terminal 11 (which is the outer peripheral lower surface of the accommodating portion 12 in FIG. 1). In the case of the flat mounting shown in FIG. 5, the lower end portions 26 a and 26 b are in contact with the contact terminal portion 61 of the printed wiring board 60. The contact terminal portion 61 (usually coated with cream solder) and the lower end portions 26a and 26b are soldered (by heating in a reflow furnace or the like), so that the electrical bypass means 20 is printed wiring. While being electrically connected to the substrate 60, it is supported by the lower ends 26a and 26b and fixed in a stable state. A claw-like projection that protrudes further downward from the lower ends 26a and 26b is provided, and a positioning hole is provided in the printed wiring board 60 so as to be engageable with the projection. The placement (positioning) accuracy of the spring connector 10 on the substrate 60 may be increased.

また、図5は、プリント配線基板60に低背(薄型)実装である平置き配置にて実装されたスプリングコネクタ10に対して、相手側電気部品であるバッテリーパック70を(図5における矢印B方向に)押し当てた装機完了状態を示しており、接触ピン4は、収容部12内部に押し込まれている。そして、図2と比較すれば、その押し当て過程において、接触片27の先端部28は、接触ピン4の先端部5の外周面を弾性接触状態で摺動することがわかる。そして、これら押し当て過程および装機完了状態において、バッテリーパック70の電極部71と接触ピン4の先端部5とは電気的に導通可能であり、さらに、接触ピン4とプリント配線基板60との間には、(図3に示すごとく)接触ピン4の抜け止め部6の外周面が収容部12の内周面に当接して形成される導通経路と、電気的バイパス手段20の接触片27が接触ピン4に当接して形成される導通経路とが、共に確保されていることがわかる。また、従来例のごとくの絶縁樹脂で成形されたハウジングを用いた構造と比較し、薄板の板状基部21のみに収容部12の上方(図5における上方向)が覆われた構造は、薄型化に適したものであることがわかる。  Further, FIG. 5 shows that the battery pack 70, which is a mating electrical component, is attached to the spring connector 10 mounted on the printed wiring board 60 in a flat layout that is low-profile (thin) mounting (arrow B in FIG. 5). The equipment completion state is shown in which the contact pin 4 is pushed into the housing portion 12. Compared with FIG. 2, it can be seen that the tip portion 28 of the contact piece 27 slides in an elastic contact state on the outer peripheral surface of the tip portion 5 of the contact pin 4 in the pressing process. In the pressing process and the equipment completion state, the electrode part 71 of the battery pack 70 and the tip part 5 of the contact pin 4 can be electrically connected, and further, the contact pin 4 and the printed wiring board 60 can be electrically connected. In the meantime (as shown in FIG. 3), a conduction path formed by the outer peripheral surface of the retaining portion 6 of the contact pin 4 abutting against the inner peripheral surface of the housing portion 12, and the contact piece 27 of the electrical bypass means 20. It can be seen that a conduction path formed by contacting the contact pin 4 is secured. Further, the structure in which the upper portion (upward direction in FIG. 5) of the housing portion 12 is covered only by the thin plate-like base portion 21 is thinner than the structure using the housing formed of the insulating resin as in the conventional example. It turns out that it is a thing suitable for conversion.

なお、この実施例では、平置き実装を前提に、電気的バイパス手段20の下方端部26a,26bがプリント配線基板60に接続される形態にて説明したが、電気的バイパス手段20の後端部29側をプリント配線基板60に接続させる形態(すなわち、縦置き実装)でも良く、この形態も上述の導通経路を増大させる効果を有する。また、収容部12を円筒状の外形としたが、外形が角形状であっても良い。  In this embodiment, the lower end portions 26a and 26b of the electrical bypass means 20 are connected to the printed wiring board 60 on the premise of flat mounting, but the rear end of the electrical bypass means 20 is described. A configuration in which the portion 29 side is connected to the printed wiring board 60 (that is, vertical mounting) may be employed, and this configuration also has the effect of increasing the above-described conduction path. Moreover, although the accommodating part 12 was made into the cylindrical external shape, an external shape may be square shape.

図6から図8は、本発明のスプリングコネクタの第二実施例を示しており、図6は側面図、図7は構成部品であるピン型端子の平面図、図8は構成部品である電気的バイパス手段の斜視図である。  6 to 8 show a second embodiment of the spring connector of the present invention. FIG. 6 is a side view, FIG. 7 is a plan view of a pin-type terminal as a component, and FIG. FIG.

上述の第一実施例と比較して、スプリングコネクタ30のピン型端子31は、収容部の外周形状を一部変えており、電気的バイパス手段40は、側面部の形状の一部および接触片の具備数を変えている。収容部32の外周面33は、その外径が異なる大径部34および小径部35による段付き形状となっており、その大径部34と小径部35の間には段付き面36が形成されている。また、二対の側面部43a,43b,43c,43dのうち、一方の側面部43c,43dからは、(嵌着状態において、収容部32の軸心に向かう)内側方向に向き合って突出する係止部46a,46bが具備されている。  Compared with the first embodiment described above, the pin-type terminal 31 of the spring connector 30 has partly changed the outer peripheral shape of the accommodating portion, and the electrical bypass means 40 has a part of the shape of the side surface portion and the contact piece. The number of equipment is changed. The outer peripheral surface 33 of the housing portion 32 has a stepped shape with a large diameter portion 34 and a small diameter portion 35 having different outer diameters, and a stepped surface 36 is formed between the large diameter portion 34 and the small diameter portion 35. Has been. Further, of the two pairs of side surface portions 43a, 43b, 43c, and 43d, the one side surface portions 43c and 43d protrude in an inward direction (toward the axis of the housing portion 32 in the fitted state). Stop portions 46a and 46b are provided.

そして、ピン型端子31と電気的バイパス手段40の装着状態において、係止部46a,46bは、小径部35に嵌りつつ段付き面36に係合可能な構成とされていることがわかる。さらに、この係合関係により、電気的バイパス手段40に対するピン型端子31の(収容部32のその長手軸に沿う方向の)動きが規制されることがわかる。そして、図5に示されるように、バッテリーパック70を押し当てた状態において、その押し当て力を電気的バイパス手段40および実装するプリント配線基板60が受け、ピン型端子31が後退することを防ぎ、バッテリーパック70とスプリングコネクタ10と接続を安定させている。なお、係止部46a,46bは、側面部43c,43dから突出した形態としたが、板状基部41から突出させても良い。  Then, it can be seen that in the mounted state of the pin-type terminal 31 and the electrical bypass means 40, the locking portions 46 a and 46 b are configured to be able to engage with the stepped surface 36 while fitting into the small diameter portion 35. Furthermore, it can be seen that this engagement relationship restricts the movement of the pin-type terminal 31 relative to the electrical bypass means 40 (in the direction along the longitudinal axis of the accommodating portion 32). Then, as shown in FIG. 5, when the battery pack 70 is pressed, the pressing force is received by the electrical bypass means 40 and the printed wiring board 60 to be mounted to prevent the pin-type terminal 31 from moving backward. The connection between the battery pack 70 and the spring connector 10 is stabilized. In addition, although the latching | locking part 46a, 46b was made into the form protruded from the side part 43c, 43d, you may make it protrude from the plate-shaped base 41. FIG.

また、側面部43a,43bからは、接触ピン4の先端部5方向に接触片47a,47bが延出しており、それぞれ、先端部5に対して(収容部32に電気的バイパス手段40が装着される過程で接触片47a,47bの先端部が接触ピンの先端部5により押し広げられて)弾性接触するように設定された舌状の片持ちばね構造となっている。  Further, contact pieces 47a and 47b extend from the side surface portions 43a and 43b in the direction of the distal end portion 5 of the contact pin 4, and the electrical bypass means 40 is attached to the accommodating portion 32 with respect to the distal end portion 5, respectively. In this process, the tip portions of the contact pieces 47a and 47b are pushed and widened by the tip portion 5 of the contact pin, so that a tongue-like cantilever spring structure is set so as to make elastic contact.

このように、接触ピン4に対して弾性接触する接触片47a,47bを複数具備した構成は、接触ピン4と電気的バイパス手段40との導通経路を増大させており、電気的接続性能を向上させている。なお、接触片47a,47bは、側面部43c,43dから延出した形態としたが、さらに加えて、板状基部41から延出させて3片構成としても良い。  As described above, the configuration including a plurality of contact pieces 47a and 47b that elastically contact the contact pin 4 increases the conduction path between the contact pin 4 and the electrical bypass means 40, thereby improving the electrical connection performance. I am letting. Although the contact pieces 47a and 47b are extended from the side surfaces 43c and 43d, the contact pieces 47a and 47b may be further extended from the plate-like base 41 to have a three-piece configuration.

なお、本実施例において、スプリングコネクタをプリント配線基板に実装する際、スプリングコネクタ単体を個々に実装するような形態としたが、複数のスプリングコネクタを一括して実装する(例えば、プラスチックホルダーや金具などの整列部材に並べて組み込み、半田付け後に整列部材を取り外して薄型構造に戻すなどの)形態としても良い。  In this embodiment, when the spring connector is mounted on the printed wiring board, the spring connector is mounted individually. However, a plurality of spring connectors are mounted in a lump (for example, a plastic holder or a metal fitting). Or the like, such that the alignment member is detached and returned to a thin structure after soldering.

3 スプリング
4 接触ピン
5 接触ピンの先端部
11,31 ピン型端子
12,32 収容部
13,33 外周面
20,40 電気的バイパス手段
21,41 板状基部
23,43 側面部
27,47 接触片
36 段付き面
46 係止部
3 Spring 4 Contact pin 5 Contact pin tip 11, 31 Pin type terminal 12, 32 Housing part 13, 33 Outer peripheral surface 20, 40 Electrical bypass means 21, 41 Plate-like base 23, 43 Side part 27, 47 Contact piece 36 Stepped surface 46 Locking portion

Claims (3)

コイル状のスプリングと、そのスプリングを収容する導電性金属よりなる収容部と、前記収容部に摺動自在に支持されるとともに前記スプリングにより付勢されて前記収容部の一端側より先端部を突出させた導電性金属よりなる接触ピンとを備えたピン型端子を用いたスプリングコネクタにおいて、
前記収容部には、前記接触ピンの先端部に対して弾性接触するように延出する接触片を有した導電性金属よりなる電気的バイパス手段が装着されていることを特徴とするスプリングコネクタ。
A coil-shaped spring, a housing portion made of a conductive metal that houses the spring, and a sliding portion that is slidably supported by the housing portion and is biased by the spring and protrudes from the one end side of the housing portion In a spring connector using a pin-type terminal provided with a contact pin made of a conductive metal,
An electrical bypass means made of a conductive metal having a contact piece extending so as to be in elastic contact with the tip end portion of the contact pin is attached to the housing portion.
前記電気的バイパス手段は、薄板材から打ち抜き加工および曲げ加工され、前記収容部の外周面を部分的に覆う板状基部と、前記収容部の外周面と嵌め合うように前記板状基部から延出する少なくとも一対の側面部とを具備し、前記接触片は前記板状基部と前記側面部のいずれか一方または双方から延出していることを特徴とする請求項1に記載のスプリングコネクタ。  The electrical bypass means is stamped and bent from a thin plate material, and extends from the plate-like base so as to be fitted with the plate-like base part that partially covers the outer peripheral surface of the containing part. 2. The spring connector according to claim 1, further comprising at least a pair of side surface portions to be extended, wherein the contact piece extends from one or both of the plate-like base portion and the side surface portion. 前記収容部の外周面は大径部および小径部を有する段付き形状とされ、前記板状基部と前記側面部のいずれか一方または双方からは前記大径部および前記小径部間の段付き面に係合せしめる係止部が具備され、その係合により、前記電気的バイパス手段が前記収容部のその長手軸に沿う方向の動きを規制することを特徴とする請求項2に記載のスプリングコネクタ。  The outer peripheral surface of the accommodating part is a stepped shape having a large diameter part and a small diameter part, and a stepped surface between the large diameter part and the small diameter part is provided from one or both of the plate-like base part and the side face part. 3. A spring connector according to claim 2, further comprising a locking portion that is engaged with the spring, wherein the electrical bypass means restricts the movement of the housing portion in the direction along the longitudinal axis. .
JP2009200884A 2009-08-10 2009-08-10 Spring connector Pending JP2011040354A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102780111A (en) * 2011-05-11 2012-11-14 Smk株式会社 Pressure welding type connector
WO2015198714A1 (en) * 2014-06-23 2015-12-30 京セラコネクタプロダクツ株式会社 Battery connector
CN114447710A (en) * 2021-12-22 2022-05-06 番禺得意精密电子工业有限公司 Conductive terminal, electric connector and connecting device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102780111A (en) * 2011-05-11 2012-11-14 Smk株式会社 Pressure welding type connector
WO2015198714A1 (en) * 2014-06-23 2015-12-30 京セラコネクタプロダクツ株式会社 Battery connector
CN114447710A (en) * 2021-12-22 2022-05-06 番禺得意精密电子工业有限公司 Conductive terminal, electric connector and connecting device
CN114447710B (en) * 2021-12-22 2023-08-08 番禺得意精密电子工业有限公司 Conductive terminal, electric connector and connecting device

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