JP2008210380A5 - - Google Patents

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Publication number
JP2008210380A5
JP2008210380A5 JP2008022212A JP2008022212A JP2008210380A5 JP 2008210380 A5 JP2008210380 A5 JP 2008210380A5 JP 2008022212 A JP2008022212 A JP 2008022212A JP 2008022212 A JP2008022212 A JP 2008022212A JP 2008210380 A5 JP2008210380 A5 JP 2008210380A5
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JP
Japan
Prior art keywords
processing
circuit
data
signal
majority
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Application number
JP2008022212A
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English (en)
Japanese (ja)
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JP5121479B2 (ja
JP2008210380A (ja
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Priority to JP2008022212A priority Critical patent/JP5121479B2/ja
Priority claimed from JP2008022212A external-priority patent/JP5121479B2/ja
Publication of JP2008210380A publication Critical patent/JP2008210380A/ja
Publication of JP2008210380A5 publication Critical patent/JP2008210380A5/ja
Application granted granted Critical
Publication of JP5121479B2 publication Critical patent/JP5121479B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008022212A 2007-02-02 2008-02-01 無線システム Expired - Fee Related JP5121479B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008022212A JP5121479B2 (ja) 2007-02-02 2008-02-01 無線システム

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007024001 2007-02-02
JP2007024001 2007-02-02
JP2008022212A JP5121479B2 (ja) 2007-02-02 2008-02-01 無線システム

Publications (3)

Publication Number Publication Date
JP2008210380A JP2008210380A (ja) 2008-09-11
JP2008210380A5 true JP2008210380A5 (enExample) 2011-02-10
JP5121479B2 JP5121479B2 (ja) 2013-01-16

Family

ID=39675695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008022212A Expired - Fee Related JP5121479B2 (ja) 2007-02-02 2008-02-01 無線システム

Country Status (4)

Country Link
US (1) US8009050B2 (enExample)
JP (1) JP5121479B2 (enExample)
KR (1) KR101460979B1 (enExample)
CN (1) CN101236596B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1956523B1 (en) * 2007-02-02 2013-05-29 Semiconductor Energy Laboratory Co., Ltd. Wireless identification system, semiconductor device, and communication device
JP5301299B2 (ja) * 2008-01-31 2013-09-25 株式会社半導体エネルギー研究所 半導体装置
KR101611643B1 (ko) 2008-10-01 2016-04-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
US9563834B2 (en) * 2013-04-10 2017-02-07 Honeywell International, Inc. High temperature tolerant RFID tag

Family Cites Families (28)

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Publication number Priority date Publication date Assignee Title
JPS53120295A (en) * 1977-03-30 1978-10-20 Toshiba Corp Subject discrimination device
JPS61211786A (ja) * 1985-03-16 1986-09-19 Hitachi Maxell Ltd Ｉｃカ−ド
CA1268828A (en) 1986-02-08 1990-05-08 Yasuharu Yoshida Multilevel modulator capable of producing a composite modulated signal comprising a quadrature amplitude modulated component and a phase modulated component
JPS63239576A (ja) * 1987-03-27 1988-10-05 Toshiba Corp 携帯可能電子装置
JPH02161585A (ja) * 1988-12-15 1990-06-21 Toppan Printing Co Ltd 電子カードシステム
JPH066329A (ja) * 1992-06-24 1994-01-14 Nec Eng Ltd 多数決判定回路
JPH06332794A (ja) * 1993-05-25 1994-12-02 Hitachi Ltd データ送出装置
US5661470A (en) * 1994-03-04 1997-08-26 Karr; Gerald S. Object recognition system
JP3694987B2 (ja) * 1996-06-25 2005-09-14 石川島播磨重工業株式会社 三重系フォールトトレラントシステム
JP3568180B2 (ja) 1997-06-12 2004-09-22 株式会社日立国際電気 データ伝送装置
JP3179060B2 (ja) 1997-06-19 2001-06-25 株式会社東芝 情報データ多重化伝送システムとその多重化装置及び分離装置
JP3542707B2 (ja) * 1997-12-05 2004-07-14 富士通株式会社 電子現金金庫
JP2000115804A (ja) * 1998-09-22 2000-04-21 Neucore Technol Inc カード式半導体メモリ装置
JP2000149194A (ja) 1998-11-12 2000-05-30 Toshiba Corp 駐車管理システム
JP2001344213A (ja) 2000-05-31 2001-12-14 Hitachi Ltd 生体認証システム
JP4269502B2 (ja) * 2000-09-07 2009-05-27 三菱マテリアル株式会社 データキャリア
JP2003067683A (ja) 2001-08-30 2003-03-07 Omron Corp 生産ラインにおける認識システム
JP2003287587A (ja) * 2002-03-27 2003-10-10 Toshiba Corp プラント保護計装装置
US7973313B2 (en) 2003-02-24 2011-07-05 Semiconductor Energy Laboratory Co., Ltd. Thin film integrated circuit device, IC label, container comprising the thin film integrated circuit, manufacturing method of the thin film integrated circuit device, manufacturing method of the container, and management method of product having the container
US7768405B2 (en) 2003-12-12 2010-08-03 Semiconductor Energy Laboratory Co., Ltd Semiconductor device and manufacturing method thereof
KR101333278B1 (ko) * 2004-03-09 2013-12-02 카운슬 오브 사이언티픽 앤드 인더스트리얼 리서치 시각적인 반사 스펙트럼 반응을 이용한 향상된 위조 화폐 검출기
US7366465B2 (en) * 2004-11-19 2008-04-29 Sirit Technologies Inc. Homodyne RFID receiver and method
US7209040B2 (en) 2004-11-19 2007-04-24 Sirit Technologies, Inc. Homodyne RFID receiver and method
US7783581B2 (en) 2005-01-05 2010-08-24 Nec Corporation Data learning system for identifying, learning apparatus, identifying apparatus and learning method
US20070002140A1 (en) * 2005-05-03 2007-01-04 Greg Benson Trusted monitoring system and method
US7545276B2 (en) 2005-09-13 2009-06-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
EP1850267B1 (en) 2006-04-28 2011-11-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and position detecting method using the semiconductor device
EP1956523B1 (en) 2007-02-02 2013-05-29 Semiconductor Energy Laboratory Co., Ltd. Wireless identification system, semiconductor device, and communication device

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