JP2008193358A - 撮像素子ユニット - Google Patents

撮像素子ユニット Download PDF

Info

Publication number
JP2008193358A
JP2008193358A JP2007024852A JP2007024852A JP2008193358A JP 2008193358 A JP2008193358 A JP 2008193358A JP 2007024852 A JP2007024852 A JP 2007024852A JP 2007024852 A JP2007024852 A JP 2007024852A JP 2008193358 A JP2008193358 A JP 2008193358A
Authority
JP
Japan
Prior art keywords
spacer
image sensor
circuit board
image
thermal conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007024852A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008193358A5 (enExample
Inventor
Yoichiro Okumura
洋一郎 奥村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Imaging Corp
Original Assignee
Olympus Imaging Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Imaging Corp filed Critical Olympus Imaging Corp
Priority to JP2007024852A priority Critical patent/JP2008193358A/ja
Publication of JP2008193358A publication Critical patent/JP2008193358A/ja
Publication of JP2008193358A5 publication Critical patent/JP2008193358A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2007024852A 2007-02-02 2007-02-02 撮像素子ユニット Pending JP2008193358A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007024852A JP2008193358A (ja) 2007-02-02 2007-02-02 撮像素子ユニット

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007024852A JP2008193358A (ja) 2007-02-02 2007-02-02 撮像素子ユニット

Publications (2)

Publication Number Publication Date
JP2008193358A true JP2008193358A (ja) 2008-08-21
JP2008193358A5 JP2008193358A5 (enExample) 2010-02-25

Family

ID=39753025

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007024852A Pending JP2008193358A (ja) 2007-02-02 2007-02-02 撮像素子ユニット

Country Status (1)

Country Link
JP (1) JP2008193358A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013210229A (ja) * 2012-03-30 2013-10-10 Hitachi High-Technologies Corp 検査装置及び撮像素子
US12028597B2 (en) 2020-01-27 2024-07-02 Olympus Corporation Image pickup apparatus and endoscope

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004006564A (ja) * 2002-03-28 2004-01-08 Sharp Corp 積層型半導体装置
JP2006186483A (ja) * 2004-12-27 2006-07-13 Konica Minolta Photo Imaging Inc 撮像ユニットおよび撮像素子の放熱構造

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004006564A (ja) * 2002-03-28 2004-01-08 Sharp Corp 積層型半導体装置
JP2006186483A (ja) * 2004-12-27 2006-07-13 Konica Minolta Photo Imaging Inc 撮像ユニットおよび撮像素子の放熱構造

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013210229A (ja) * 2012-03-30 2013-10-10 Hitachi High-Technologies Corp 検査装置及び撮像素子
US12028597B2 (en) 2020-01-27 2024-07-02 Olympus Corporation Image pickup apparatus and endoscope

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