JP2008182026A - Method for manufacturing module loading function element - Google Patents

Method for manufacturing module loading function element Download PDF

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Publication number
JP2008182026A
JP2008182026A JP2007013815A JP2007013815A JP2008182026A JP 2008182026 A JP2008182026 A JP 2008182026A JP 2007013815 A JP2007013815 A JP 2007013815A JP 2007013815 A JP2007013815 A JP 2007013815A JP 2008182026 A JP2008182026 A JP 2008182026A
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Prior art keywords
sealing resin
functional element
resin
package
component
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Inventor
Yoshito Hotta
良人 掘田
Yoshito Fujii
誉人 藤井
Takahiro Asada
隆広 浅田
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Dexerials Corp
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Sony Chemical and Information Device Corp
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Priority to JP2007013815A priority Critical patent/JP2008182026A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a module loading a function element of the hollow exposing structure that may be resin-sealed in higher accuracy without use of an expensive dispenser. <P>SOLUTION: The method for manufacturing a module loading a function element includes: a resin printing step for forming a protruded sealing resin part 6a at an area near a hole part 2 by applying a sealing resin 6 for printing on a package forming member 1 of a first forming part 10; an integrating step for integrating the first forming part 10 and a second forming part 20 in the condition that a hole part 2 of the package forming member 1 and a function part 13 of the function element 12 are provided opposed to with each other by arranging a pier part 17 for damming the sealing resin 6 between the package forming member 1 of the first forming part 10 and a wiring substrate 11 of the second forming part 20; a resin hardening step for hardening the sealing resin 6a provided in a sealing object space 18 between the package forming member 1 of the first forming part 10 and the wiring substrate 11 of the second forming part; and a removing step for removing the pier part 17. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、例えば受光素子や発光素子等の機能素子を実装するモジュールの製造方法に関する。   The present invention relates to a method for manufacturing a module on which a functional element such as a light receiving element or a light emitting element is mounted.

従来、この種の機能素子実装モジュールとしては、例えば以下に説明するような中空構造のパッケージを有するものが知られている。
図５に示すように、この機能素子実装モジュール１００では、基板１０２上に枠状のスペーサ１０３を介して透光性部材１０４を取り付けて中空構造のパッケージ１０１が構成されている。そして、このパッケージ１０１内の基板１０２上に、光機能素子１０５を光機能部１０６を透光性部材１０４に対向させて配置し、光信号１０７の送受信を行うようになっている。 Conventionally, as this type of functional element mounting module, for example, a module having a hollow package as described below is known.
As shown in FIG. 5, in this functional element mounting module 100, a light-transmissive member 104 is attached on a substrate 102 via a frame-like spacer 103 to constitute a hollow package 101. An optical functional element 105 is arranged on the substrate 102 in the package 101 with the optical functional unit 106 facing the translucent member 104 to transmit and receive the optical signal 107.

しかしながら、この従来技術の場合、例えば波長４０５ｎｍという短波長の青紫レーザー光を透過させようとすると、透光性部材１０４として特殊なコーティングを施したガラスを用いなければならず、非常に高価になる。
さらに、従来技術の場合、透光性部材１０４を保持するためには枠状のスペーサ１０３は必須であり、このため小型化に限界があるという課題もある。 However, in the case of this prior art, for example, if a blue-violet laser beam having a short wavelength of 405 nm is to be transmitted, a glass with a special coating must be used as the translucent member 104, which is very expensive. .
Furthermore, in the case of the prior art, the frame-shaped spacer 103 is indispensable for holding the translucent member 104, and there is a problem that there is a limit to downsizing.

このような課題を解決するため、以下の例えば特許文献１に記載された従来技術も知られている。
この従来技術においては、図６（ａ）に示すように、基板２０２上に実装された光機能素子２０３の周囲に、液状封止樹脂２０６を堰き止めるための突堤部２０７を設け、光機能素子２０３と突堤部２０７との間に液状封止樹脂２０６を滴下して光機能素子２０３と突堤部２０７との間に液状封止樹脂２０６を充填する。 In order to solve such a problem, the prior art described in, for example, Patent Document 1 below is also known.
In this prior art, as shown in FIG. 6A, a jetty portion 207 for damming the liquid sealing resin 206 is provided around the optical functional element 203 mounted on the substrate 202, and the optical functional element is provided. A liquid sealing resin 206 is dropped between 203 and the jetty 207 to fill the liquid sealing resin 206 between the optical functional element 203 and the jetty 207.

そして、図６（ｂ）に示すように、光機能素子２０３の光機能部２０４に対応する孔部２０８を設けたパッケージ構成部材２０９を突堤部２０７上に当接配置し、所定の圧力で基板２０２方向に押圧することにより、パッケージ構成部材２０９の基板２０２側の面と液状封止樹脂２０６とを接触させ、その表面張力によりパッケージ構成部材２０９の孔部２０８の縁部において液状封止樹脂２０６を堰き止め、光機能素子２０３の光機能部２０４周囲の部分を覆うように液状封止樹脂２０６を充填する。   Then, as shown in FIG. 6B, a package component member 209 provided with a hole 208 corresponding to the optical function part 204 of the optical function element 203 is placed in contact with the jetty 207, and the substrate is formed with a predetermined pressure. The surface of the package constituent member 209 on the substrate 202 side and the liquid sealing resin 206 are brought into contact with each other by pressing in the 202 direction, and the liquid sealing resin 206 is formed at the edge of the hole 208 of the package constituent member 209 by the surface tension. The liquid sealing resin 206 is filled so as to cover the portion around the optical functional part 204 of the optical functional element 203.

そして、この状態で所定の温度で加熱することにより液状封止樹脂２０６を硬化させ、パッケージ構成部材２０９を基板２０２上に固着させた後、図６（ｃ）に示すように、突堤部２０７の内側近傍のスクライブライン２１０に沿ってダイシングを行うことにより、目的とする光機能素子実装モジュールを得る。   Then, in this state, the liquid sealing resin 206 is cured by heating at a predetermined temperature, and the package constituent member 209 is fixed on the substrate 202. Then, as shown in FIG. Dicing is performed along the scribe line 210 in the vicinity of the inside to obtain a target optical functional element mounting module.

しかし、この従来技術の場合、光機能素子２０３の光機能部２０４に液状封止樹脂２０６が流れ込んだり、逆に光機能素子２０３の接続部分（接続端子部、金線）が露出する場合があるため、モジュール製造の際の歩留まりが悪いという課題があり、これを回避しようとすると、液状封止樹脂２０６の高度なディスペンス精度が必要になり、高価なディスペンサを使用する必要がある。
特開２００６−１８６２８８ However, in the case of this conventional technique, the liquid sealing resin 206 may flow into the optical function part 204 of the optical function element 203, or conversely, the connection part (connection terminal part, gold wire) of the optical function element 203 may be exposed. For this reason, there is a problem that the yield in module manufacturing is poor. To avoid this problem, high dispensing accuracy of the liquid sealing resin 206 is required, and an expensive dispenser must be used.
JP 2006-186288 A

本発明は、このような従来の技術の課題を解決するためになされたもので、高価なディスペンサを用いることなく高精度で樹脂封止が可能な中空露出構造の機能素子モジュールの製造方法を提供することを目的とする。   The present invention has been made to solve the above-described problems of the conventional technology, and provides a method for manufacturing a functional element module having a hollow exposed structure capable of resin sealing with high accuracy without using an expensive dispenser. The purpose is to do.

上記目的を達成するためになされた請求項１記載の発明は、所定形状の孔部を有するパッケージ構成部材を有する第１の構成部と、機能部が露出した状態で配線基板上に機能素子が実装された第２の構成部とを、封止樹脂によって封止して機能素子実装モジュールを製造する方法であって、前記第１の構成部のパッケージ構成部材上に印刷用封止樹脂を印刷塗布して前記孔部の近傍に突状の封止樹脂部を形成する樹脂印刷工程と、前記封止樹脂を堰き止めるための突堤部を前記第１の構成部のパッケージ構成部材と前記第２の構成部の配線基板との間に配置し、前記パッケージ構成部材の孔部と前記機能素子の機能部とを対向させた状態で、当該第１及び第２の構成部を押圧して一体化する一体化工程と、前記第１の構成部のパッケージ構成部材と前記第２の構成部の配線基板間の封止対象空間に存する前記封止樹脂部を硬化させる樹脂硬化工程と、前記突堤部を除去する除去工程と、を有する機能素子実装モジュールの製造方法である。
請求項２記載の発明は、請求項１記載の発明において、前記樹脂印刷工程において、前記一体化工程における前記第１の構成部のパッケージ構成部材上の封止樹脂部が前記第２の構成部の配線基板に接触して前記封止対象空間内に前記印刷用封止樹脂が充填されるように、前記パッケージ構成部材上に前記封止樹脂部を形成するものである。
請求項３記載の発明は、請求項１記載の発明において、前記樹脂印刷工程において、前記第１の構成部のパッケージ構成部材の孔部の近傍に印刷用封止樹脂を印刷塗布して堰き止め部を形成し、前記一体化工程の後に、前記封止対象空間に液状封止樹脂を注入して充填し、さらに、前記樹脂硬化工程において、前記堰き止め部及び前記液状封止樹脂を硬化させるものである。
請求項４記載の発明は、請求項３記載の発明において、前記樹脂印刷工程において、前記堰き止め部を、前記機能素子の機能部が設けられた機能部搭載面に接触するように形成するものである。
請求項５記載の発明は、請求項３記載の発明において、前記樹脂印刷工程において、前記堰き止め部を、前記機能素子に設けられた接続部分に接触しないように形成するものである。
請求項６記載の発明は、請求項１乃至５のいずれか１項記載の発明において、前記機能素子が、前記配線基板の接続部に対しワイヤーボンディング法によって電気的に接続されているものである。
請求項７記載の発明は、請求項１乃至６のいずれか１項記載の発明において、前記パッケージ構成部材の孔部を覆う保護用被覆部材を当該パッケージ構成部材上に設ける工程を更に有するものである。 In order to achieve the above object, the invention according to claim 1 is characterized in that a functional element is formed on a wiring board with a first structural part having a package structural member having a hole having a predetermined shape and a functional part exposed. A method of manufacturing a functional element mounting module by sealing a mounted second component with a sealing resin, and printing a sealing resin for printing on a package component of the first component A resin printing step of applying and forming a protruding sealing resin portion in the vicinity of the hole portion, and a jetty portion for damming the sealing resin as a package component member of the first component portion and the second component The first and second component parts are pressed and integrated in a state where the hole part of the package component member and the functional part of the functional element are opposed to each other. Integration process and package configuration of the first component Of a functional element mounting module comprising: a resin curing step of curing the sealing resin portion existing in a sealing target space between the material and the wiring substrate of the second component portion; and a removing step of removing the jetty portion Is the method.
The invention according to claim 2 is the invention according to claim 1, wherein, in the resin printing step, the sealing resin portion on the package component of the first component in the integration step is the second component. The sealing resin portion is formed on the package constituent member so as to be in contact with the wiring board and filled with the sealing resin for printing in the space to be sealed.
According to a third aspect of the present invention, in the first aspect of the present invention, in the resin printing step, the sealing resin for printing is printed and applied in the vicinity of the hole of the package constituent member of the first constituent part to block the dam. After the integration step, a liquid sealing resin is injected and filled in the sealing target space, and the damming portion and the liquid sealing resin are cured in the resin curing step. Is.
According to a fourth aspect of the present invention, in the invention according to the third aspect, in the resin printing step, the damming portion is formed so as to be in contact with a functional portion mounting surface provided with the functional portion of the functional element. It is.
According to a fifth aspect of the present invention, in the third aspect of the present invention, in the resin printing step, the damming portion is formed so as not to contact a connection portion provided in the functional element.
The invention according to claim 6 is the invention according to any one of claims 1 to 5, wherein the functional element is electrically connected to a connection portion of the wiring board by a wire bonding method. .
The invention according to claim 7 further includes the step of providing a protective covering member for covering the hole of the package constituent member on the package constituent member in the invention according to any one of claims 1 to 6. is there.

本発明の場合、印刷用封止樹脂を用い印刷によって封止樹脂部を形成するようにしていることから、容積による封止樹脂の計量が可能であり、しかも高粘度の封止樹脂を用いることができるため、ディスペンスによる封止樹脂を用いる従来技術に比べ、パッケージ構成部材の孔部への樹脂の広がり（フィレット）がなく、機能部と接続部分（接続端子部、金線）との距離が近い場合であっても、機能素子の機能部の近傍に精度良く封止樹脂を配置して樹脂封止を行うことができる。   In the case of the present invention, since the sealing resin portion is formed by printing using the sealing resin for printing, it is possible to measure the sealing resin by volume and use a high-viscosity sealing resin. Compared to the conventional technology using a sealing resin by dispensing, there is no resin spread (fillet) to the hole of the package component, and the distance between the functional part and the connection part (connection terminal part, gold wire) is Even in the case of close proximity, the resin sealing can be performed by accurately placing the sealing resin in the vicinity of the functional portion of the functional element.

その結果、本発明によれば、機能素子実装モジュールの製造歩留まりを向上させることができるとともに、高価な高精度のディスペンサを使用する必要がないので、製造コストを下げることができる。   As a result, according to the present invention, it is possible to improve the manufacturing yield of the functional element mounting module, and it is not necessary to use an expensive high-precision dispenser, so that the manufacturing cost can be reduced.

また、本発明によれば、印刷によって複数の封止樹脂部を短時間で形成することによって、ディスペンサによる封止樹脂の滴下の場合に比べ、生産効率を大幅に（１０倍以上）向上させることができる。   In addition, according to the present invention, by forming a plurality of sealing resin portions in a short time by printing, the production efficiency can be greatly improved (10 times or more) compared to the case of dropping the sealing resin by a dispenser. Can do.

本発明では、印刷工程において、一体化工程における第１の構成部のパッケージ構成部材上の封止樹脂部が第２の構成部の配線基板に接触して封止対象空間内に印刷用封止樹脂が充填されるように、パッケージ構成部材上に封止樹脂部を形成するようにすれば、１回の印刷工程で封止樹脂の充填を行うことができるので、製造工程をより簡素化することができる。   In the present invention, in the printing process, the sealing resin part on the package constituent member of the first constituent part in the integration step contacts the wiring board of the second constituent part and is sealed for printing in the space to be sealed. If the sealing resin portion is formed on the package component so as to be filled with the resin, the sealing resin can be filled in a single printing process, which further simplifies the manufacturing process. be able to.

本発明では、樹脂印刷工程において、第１の構成部のパッケージ構成部材の孔部の近傍に印刷用封止樹脂を印刷塗布して堰き止め部を形成し、一体化工程の後に、封止対象空間に液状封止樹脂を注入して充填し、さらに、樹脂硬化工程において、これら堰き止め部及び液状封止樹脂を硬化させるようにすれば、一体化工程の際に機能素子の機能部への液状封止樹脂の流れ込みを防止することができるので、ディスペンサによる封止樹脂の滴下の場合に比べて製造歩留まりを向上させることができるとともに、高価な高精度のディスペンサを使用する必要がないので、製造コストを下げることができる。   In the present invention, in the resin printing process, the sealing resin for printing is printed and applied in the vicinity of the hole of the package constituent member of the first constituent part to form the damming part. If the liquid sealing resin is injected and filled into the space, and the damming portion and the liquid sealing resin are cured in the resin curing step, the functional element of the functional element is integrated during the integration step. Since it is possible to prevent the liquid sealing resin from flowing in, it is possible to improve the production yield as compared with the case of dropping the sealing resin by a dispenser, and it is not necessary to use an expensive high-precision dispenser. Manufacturing cost can be reduced.

また、本発明によれば、第１の構成部のパッケージ構成部材の孔部の近傍に印刷によって封止樹脂による堰き止め部を形成することから、機能素子の機能部の周囲に形成される開口部の仕上がり具合を良好にすることができる。
特に、本発明で、樹脂印刷工程において、突堤部を、機能素子の機能部が設けられた機能部搭載面に接触するように形成すれば、一体化工程の際に機能素子の機能部への液状封止樹脂の流れ込みを確実に防止することができるので、製造歩留まりをより向上させることができる。 In addition, according to the present invention, since the damming portion by the sealing resin is formed by printing in the vicinity of the hole portion of the package component member of the first component portion, the opening formed around the functional portion of the functional element. The finish of the part can be improved.
In particular, in the present invention, in the resin printing process, if the jetty is formed so as to come into contact with the functional part mounting surface provided with the functional part of the functional element, the functional part of the functional element is connected to the functional part during the integration process. Since the flow of the liquid sealing resin can be reliably prevented, the manufacturing yield can be further improved.

一方、本発明で、樹脂印刷工程において、堰き止め部を、機能素子に設けられた接続部分に接触しないように形成すれば、封止対象空間に液状封止樹脂を注入して充填する際、機能素子上の接続部分に液状封止樹脂のみを接触させることができ、これにより封止樹脂の硬化の際に接続部分に与える熱応力を均一にしてその変形等を防止することができる。   On the other hand, in the present invention, in the resin printing process, if the damming portion is formed so as not to contact the connection portion provided in the functional element, when the liquid sealing resin is injected and filled in the sealing target space, Only the liquid sealing resin can be brought into contact with the connection portion on the functional element, whereby the thermal stress applied to the connection portion when the sealing resin is cured can be made uniform to prevent the deformation and the like.

また、従来、機能素子がワイヤーボンディング法によって配線基板上に実装されている場合には、印刷法によって樹脂封止を行うことができなかったが、本発明によれば、ワイヤーボンディング法によって基板上に機能素子が実装されている場合であっても、印刷法によって容易に樹脂封止を行うことができ、その結果、従来の製造装置を利用して効率良く安価に機能素子実装モジュールを製造することができる。
さらに、本発明において、パッケージ構成部材の孔部を覆う保護用被覆部材をパッケージ構成部材上に設ける工程を更に有する場合には、保護用被覆部材によって機能素子の機能部への異物の付着を防止可能な機能素子実装モジュールを提供することができる。 Conventionally, when the functional element is mounted on the wiring substrate by the wire bonding method, the resin sealing cannot be performed by the printing method. Even if functional elements are mounted on the resin, resin sealing can be easily performed by a printing method, and as a result, a functional element mounting module is manufactured efficiently and inexpensively using a conventional manufacturing apparatus. be able to.
Further, in the present invention, when the protective covering member that covers the hole of the package constituent member is further provided on the package constituent member, the protective covering member prevents foreign matter from adhering to the functional portion of the functional element. A possible functional element mounting module can be provided.

本発明によれば、高価なディスペンサを用いることなく高精度で効率良く樹脂封止を行うことができるので、中空露出構造の機能素子モジュールを安価に量産することができる。   According to the present invention, since resin sealing can be performed with high accuracy and efficiency without using an expensive dispenser, functional element modules having a hollow exposed structure can be mass-produced at low cost.

以下、本発明の好ましい実施の形態を図面を参照して詳細に説明する。
図１（ａ）〜（ｅ）は、本発明に係る機能素子実装モジュールの製造方法の実施の形態を示す断面工程図である。
本発明においては、以下に説明する第１の構成部１０と第２の構成部２０とを用いて機能素子実装モジュールを製造する。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
1A to 1E are cross-sectional process diagrams illustrating an embodiment of a method for manufacturing a functional element mounting module according to the present invention.
In the present invention, a functional element mounting module is manufactured using the first component 10 and the second component 20 described below.

図１（ａ）に示すように、本実施の形態においては、第１の構成部１０として、例えばプリント配線板、プラスチック板等からなり例えば矩形状の孔部２を設けたパッケージ構成部材１を有するものを用意する。   As shown in FIG. 1A, in the present embodiment, a package component 1 made of, for example, a printed wiring board, a plastic plate or the like and provided with a rectangular hole 2 is used as the first component 10. Prepare what you have.

本発明の場合、パッケージ構成部材１の孔部２の位置，形状は、後述する機能素子１２及び機能部１３の大きさ及び形状に対応するように、機能素子１２の機能部搭載面１２ａの大きさより若干小さく、かつ、機能部１３より若干大きい例えば矩形形状に形成するとよい。   In the case of the present invention, the position and shape of the hole 2 of the package component 1 correspond to the size and shape of the functional element 12 and the functional part 13, which will be described later, and the size of the functional part mounting surface 12a of the functional element 12. For example, it may be formed in a rectangular shape that is slightly smaller than that and slightly larger than the functional portion 13.

そして、所定のパターン孔４を有する印刷用のマスク３をパッケージ構成部材１上に載置し、スキージ５を用いてパッケージ構成部材１上に印刷用封止樹脂６の印刷塗布を行い、図１（ｂ）に示すように、パッケージ構成部材１の孔部２の近傍に突状の封止樹脂部６ａを形成する（樹脂印刷工程）。   Then, a printing mask 3 having a predetermined pattern hole 4 is placed on the package constituent member 1, and a printing sealing resin 6 is printed on the package constituent member 1 using the squeegee 5. As shown in (b), a projecting sealing resin portion 6a is formed in the vicinity of the hole 2 of the package component 1 (resin printing step).

本発明の場合、パッケージ構成部材１上に形成する封止樹脂部６ａの位置，大きさは使用する機能素子１２のサイズによっても異なり特に限定されることはないが、例えば後述する図１（ｃ）に示すように、パッケージ構成部材１の孔部２の周囲で、かつ、突堤部１７の内側の位置において機能素子１２との間の空間１８に収容されるように、印刷塗布の条件を設定することが好ましい。   In the case of the present invention, the position and size of the sealing resin portion 6a formed on the package constituent member 1 differ depending on the size of the functional element 12 to be used and are not particularly limited. For example, FIG. ), The conditions for the printing application are set so that they are accommodated in the space 18 between the functional element 12 around the hole 2 of the package component 1 and at the inner side of the jetty 17. It is preferable to do.

また、この封止樹脂部６ａの形状は、機能素子１２の形状に応じて、例えば、矩形リング形状に形成することが好ましい。
さらに、印刷用封止樹脂６の粘度は特に限定されることはないが、作業性や品質の観点からは、５０〜３５０Ｐａ・ｓのもの用いることが好ましい。
また、印刷用封止樹脂６の種類は特に限定されることはないが、封止品質の観点からは、エポキシ系、シリコーン系を用いることが好ましい。
なお、本発明の場合、モジュールの構成を考慮すると、印刷用封止樹脂６としては熱硬化型のものを用いることが好ましい。 The sealing resin portion 6a is preferably formed in a rectangular ring shape, for example, according to the shape of the functional element 12.
Further, the viscosity of the printing sealing resin 6 is not particularly limited, but from the viewpoint of workability and quality, it is preferable to use one having a viscosity of 50 to 350 Pa · s.
Further, the type of the sealing resin 6 for printing is not particularly limited, but from the viewpoint of sealing quality, it is preferable to use an epoxy type or a silicone type.
In the case of the present invention, considering the module configuration, it is preferable to use a thermosetting resin as the printing sealing resin 6.

一方、図１（ｃ）に示すように、第２の構成部２０は、配線基板１１上に機能素子１２が実装されて構成されている。
本実施の形態では、図示しない配線パターンが形成された配線基板１１上に、例えば発光素子等の機能素子１２が、その機能部１３を配線基板１１表面に対して反対側を向けて固定され、その機能素子１２の接続端子部１４と、配線基板１１の外部端子１６が金線１５を用いて電気的に接続されるようになっている。 On the other hand, as shown in FIG. 1C, the second configuration unit 20 is configured by mounting the functional element 12 on the wiring substrate 11.
In the present embodiment, a functional element 12, such as a light emitting element, is fixed on a wiring substrate 11 on which a wiring pattern (not shown) is formed, with the functional unit 13 facing the surface opposite to the surface of the wiring substrate 11, The connection terminal portion 14 of the functional element 12 and the external terminal 16 of the wiring substrate 11 are electrically connected using a gold wire 15.

さらに、本実施の形態では、配線基板１１の機能素子１２の実装面と同一の面に、印刷用封止樹脂６を堰き止めるための例えばプラスチック材料からなる突堤部１７が接着剤（図示せず）によって貼付されている。   Further, in the present embodiment, a jetty portion 17 made of, for example, a plastic material for damming the printing sealing resin 6 is provided on the same surface as the mounting surface of the functional element 12 of the wiring board 11 with an adhesive (not shown). ).

本発明の場合、突堤部１７の形状は特に限定されることはないが、印刷用封止樹脂６を確実に堰き止める観点からは、機能素子１２の周囲においてリング形状（例えば矩形形状）に形成することが好ましい。   In the case of the present invention, the shape of the jetty portion 17 is not particularly limited, but is formed in a ring shape (for example, a rectangular shape) around the functional element 12 from the viewpoint of reliably damming the printing sealing resin 6. It is preferable to do.

なお、突堤部１７の配線基板１１表面に対する高さは、後述する一体化工程の際にその頂部が金線１５のループ頂点部分の位置より高く、かつ、パッケージ構成部材１に形成する封止樹脂部６ａの高さより低くなるように条件を設定することが好ましい。   The height of the jetty portion 17 with respect to the surface of the wiring board 11 is higher than the position of the loop apex portion of the gold wire 15 in the integration process described later, and the sealing resin formed on the package component 1 It is preferable to set the conditions so as to be lower than the height of the portion 6a.

このような構成を有する第１及び第２の構成部１０、２０を用い、本実施の形態では、図１（ｃ）に示すように、第２の構成部２０の機能素子１２側の部分を鉛直下方に向けた状態で、機能素子１２の機能部１３と第１の構成部１０のパッケージ構成部材１の孔部２とを対向させるように位置決めし、第１の構成部１０に対して第２の構成部２０を押圧することにより、突堤部１７を介して第１及び第２の構成部１０、２０を一体化する（一体化工程）。
なお、印刷用封止樹脂６の流出を確実に防止する観点からは、突堤部１７の頂部とパッケージ構成部材１との間に接着剤（図示せず）を配置することが好ましい。 In the present embodiment, the first and second components 10 and 20 having such a configuration are used. As shown in FIG. 1C, the portion of the second component 20 on the functional element 12 side is used. In a state of being directed vertically downward, the functional part 13 of the functional element 12 and the hole 2 of the package constituent member 1 of the first constituent part 10 are positioned so as to face each other, and the first constituent part 10 is By pressing the second component 20, the first and second components 10 and 20 are integrated via the jetty portion 17 (integration step).
From the viewpoint of reliably preventing the printing sealing resin 6 from flowing out, it is preferable to arrange an adhesive (not shown) between the top of the jetty 17 and the package component 1.

そして、この一体化工程により、図１（ｄ）に示すように、第１及び第２の構成部１０、２０間において、機能素子１２の機能部１３が露出して周囲部分を覆うように印刷用封止樹脂６が充填される。
すなわち、一体化工程の際、パッケージ構成部材１と配線基板１１に挟まれて外側方向に広がろうとする印刷用封止樹脂６は、突堤部１７に押し戻されパッケージ構成部材１の表面１ａに沿って孔部２に向って移動するが、パッケージ構成部材１の表面１ａと機能素子１２の機能部搭載面１２ａとの間の微小な隙間（クリアランス）において印刷用封止樹脂６の表面張力によって孔部２の縁部で堰き止められ、これにより機能素子１２の機能部１３に侵入せずに留まった状態になる。 Then, by this integration step, as shown in FIG. 1D, printing is performed so that the functional portion 13 of the functional element 12 is exposed and covers the surrounding portion between the first and second constituent portions 10 and 20. The sealing resin 6 is filled.
That is, during the integration process, the sealing resin 6 for printing that is sandwiched between the package component 1 and the wiring substrate 11 and spreads outward is pushed back by the jetty 17 and along the surface 1 a of the package component 1. The hole moves by the surface tension of the sealing resin 6 for printing in a minute gap (clearance) between the surface 1a of the package component 1 and the functional part mounting surface 12a of the functional element 12. The edge of the portion 2 is dammed up, so that the state remains without entering the functional portion 13 of the functional element 12.

本発明の場合、パッケージ構成部材１の孔部２の大きさは特に限定されることはないが、印刷用封止樹脂６の機能素子１２の機能部１３への流れ込みの阻止をより効果的に達成する観点からは、機能部１３の周囲において、機能部１３との距離が０．１ｍｍ以上、好ましくは０．５ｍｍ以下となるように、孔部２の大きさを設定することが望ましい。
また、同様の観点から、機能素子１２の機能部搭載面１２ａとパッケージ構成部材１の表面１ａのクリアランスは、０．０５〜０．５ｍｍに設定することが好ましい。 In the case of the present invention, the size of the hole 2 of the package constituent member 1 is not particularly limited, but more effectively prevents the printing sealing resin 6 from flowing into the functional part 13 of the functional element 12. From the viewpoint of achieving, it is desirable to set the size of the hole 2 so that the distance from the functional unit 13 is 0.1 mm or more, preferably 0.5 mm or less around the functional unit 13.
From the same viewpoint, the clearance between the functional part mounting surface 12a of the functional element 12 and the surface 1a of the package component 1 is preferably set to 0.05 to 0.5 mm.

そして、この状態で所定の温度で加熱することにより印刷用封止樹脂６を硬化させ、第１及び第２の構成部１０、２０を固着させる。
その後、図１（ｅ）に示すように、パッケージ構成部材１の外側面に保護部材１９を貼付した後、突堤部１７の内側近傍のスクライブライン３０に沿ってダイシングを行うことにより、目的とする機能素子実装モジュールを得る。
なお、保護部材１９としては、板状の部材からなりパッケージ構成部材１表面に固着されるもののほか、パッケージ構成部材１に対する接着力が弱くパッケージ構成部材１から剥離可能なフィルム状のものを用いることもできる。 In this state, the printing sealing resin 6 is cured by heating at a predetermined temperature, and the first and second components 10 and 20 are fixed.
Thereafter, as shown in FIG. 1 (e), the protective member 19 is attached to the outer surface of the package component 1, and then dicing is performed along the scribe line 30 in the vicinity of the inner side of the jetty portion 17. A functional element mounting module is obtained.
The protective member 19 is a plate-shaped member that is fixed to the surface of the package constituent member 1, or a film-like member that has a weak adhesive force to the package constituent member 1 and can be peeled off from the package constituent member 1. You can also.

以上述べたように本実施の形態においては、印刷用封止樹脂６を用い印刷によって封止樹脂部６ａを形成するようにしていることから、容積による封止樹脂の計量が可能であり、しかも高粘度の封止樹脂を用いることができるため、ディスペンスによる封止樹脂を用いる従来技術に比べ、パッケージ構成部材の孔部への樹脂の広がり（フィレット）がなく、機能部１３と接続端子部１４との距離が近い場合であっても、機能素子１２の機能部１３の近傍に精度良く封止樹脂を配置して樹脂封止を行うことができる。   As described above, in the present embodiment, since the sealing resin portion 6a is formed by printing using the printing sealing resin 6, it is possible to measure the sealing resin by volume. Since a high-viscosity sealing resin can be used, the function part 13 and the connection terminal part 14 do not have a resin spread (fillet) in the hole of the package component member as compared with the conventional technique using a sealing resin by dispensing. Even when the distance to is close, the sealing resin can be accurately placed in the vicinity of the functional portion 13 of the functional element 12 for resin sealing.

その結果、本実施の形態によれば、機能素子実装モジュールの製造歩留まりを向上させることができるとともに、高価な高精度のディスペンサを使用する必要がないので、製造コストを下げることができる。
また、本実施の形態によれば、一回の印刷工程によって複数の封止樹脂部６ａを短時間で形成することができるので、ディスペンサによる液状封止樹脂の滴下の場合に比べ、生産効率を大幅に向上させることができる。 As a result, according to the present embodiment, it is possible to improve the manufacturing yield of the functional element mounting module, and it is not necessary to use an expensive high-precision dispenser, so that the manufacturing cost can be reduced.
In addition, according to the present embodiment, since a plurality of sealing resin portions 6a can be formed in a short time by a single printing process, the production efficiency is improved as compared with the case of dropping liquid sealing resin by a dispenser. It can be greatly improved.

図２（ａ）〜（ｅ）は、本発明の他の実施の形態の要部を示す断面工程図、図３は、同実施の形態の液状封止樹脂注入工程を示す斜視図であり、以下、上記実施の形態と対応する部分には同一の符号を付しその詳細な説明を省略する。   2 (a) to 2 (e) are cross-sectional process diagrams showing the main part of another embodiment of the present invention, FIG. 3 is a perspective view showing a liquid sealing resin injection process of the same embodiment, In the following, parts corresponding to those in the above embodiment are given the same reference numerals, and detailed description thereof is omitted.

本実施の形態では、まず、上記実施の形態と同様の印刷用のマスクとスキージ（図示せず）を用いてパッケージ構成部材１上に印刷用封止樹脂６の印刷塗布を行い、図２（ａ）に示すように、パッケージ構成部材１の孔部２の近傍に突状の堰き止め部（封止樹脂部）６０を形成する。   In the present embodiment, first, the printing sealing resin 6 is printed on the package component 1 using the same printing mask and squeegee (not shown) as in the above embodiment, and FIG. As shown in a), a projecting damming portion (sealing resin portion) 60 is formed in the vicinity of the hole 2 of the package component 1.

そして、図２（ｂ）（ｃ）に示すように、上記実施の形態と同様に、第２の構成部２０の機能素子１２側の部分を鉛直下方に向けた状態で、機能素子１２の機能部１３と第１の構成部１０のパッケージ構成部材１の孔部２とを対向させるように位置決めし、第１の構成部１０に対して第２の構成部２０を押圧して第１及び第２の構成部１０、２０を一体化する。   Then, as shown in FIGS. 2B and 2C, the function of the functional element 12 with the portion on the functional element 12 side of the second component 20 facing vertically downward, as in the above embodiment. Position the portion 13 and the hole 2 of the package component 1 of the first component 10 so as to face each other, and press the second component 20 against the first component 10 to press the first and first The two components 10 and 20 are integrated.

本発明の場合、パッケージ構成部材１上に形成する堰き止め部６０の位置，大きさは使用する機能素子１２のサイズによっても異なり特に限定されることはないが、例えば図２（ｃ）に示すように、パッケージ構成部材１の孔部２の周囲近傍で、かつ、機能素子１２と対向するように、印刷塗布の条件を設定することが好ましい。   In the case of the present invention, the position and size of the damming portion 60 formed on the package component 1 differ depending on the size of the functional element 12 to be used and are not particularly limited. For example, as shown in FIG. As described above, it is preferable to set the conditions for the printing application so as to be in the vicinity of the periphery of the hole 2 of the package component 1 and to face the functional element 12.

また、堰き止め部６０の形状は特に限定されることはないが、後述する液状封止樹脂６１を確実に堰き止める観点からは、パッケージ構成部材１の孔部２の周囲においてリング形状（例えば矩形形状）に形成することが好ましい。   Further, the shape of the damming portion 60 is not particularly limited, but from the viewpoint of surely damaging the liquid sealing resin 61 described later, a ring shape (for example, a rectangular shape) around the hole 2 of the package component 1 (Shape).

また、同様の観点から、本実施の形態の場合、堰き止め部６０の高さは、図２（ｃ）に示すように、第１及び第２の構成部１０、２０を一体化させた場合に堰き止め部６０の頂部が機能素子１２の機能部搭載面１２ａに当接するように、印刷塗布の条件を設定することが好ましい。   From the same viewpoint, in the case of the present embodiment, the height of the damming portion 60 is obtained when the first and second constituent portions 10 and 20 are integrated as shown in FIG. It is preferable to set the conditions for the printing application so that the top of the damming unit 60 contacts the functional unit mounting surface 12a of the functional element 12.

そして、このような一体化工程により、パッケージ構成部材１の孔部２の周囲において、機能部１３が露出した状態で、パッケージ構成部材１の表面１ａと機能素子１２の機能部搭載面１２ａとの隙間を塞ぐように堰き止め部６０が形成される。   And by such an integration process, in the state which the functional part 13 exposed around the hole 2 of the package structural member 1, the surface 1a of the package structural member 1 and the functional part mounting surface 12a of the functional element 12 Damping portion 60 is formed so as to close the gap.

そして、この状態で、図２（ｃ）（ｄ）に示すように、第１及び第２の構成部１０、２０間に形成された封止対象空間１８に液状封止樹脂６１を注入して充填する。
この場合、例えば、図３に示すように、モジュール側方に延ばして形成した第１の構成部１０のパッケージ構成部材１上に液状封止樹脂６１を滴下することによって、第１及び第２の構成部１０、２０の側部の封止対象空間１８の開口部分を介して封止対象空間１８内に液状封止樹脂６１が入り込み、その結果、液状封止樹脂６１の表面張力によって第１及び第２の構成部１０の封止対象空間１８内をパッケージ構成部材１に沿って容易に移動させることができる。 In this state, as shown in FIGS. 2 (c) and 2 (d), the liquid sealing resin 61 is injected into the sealing target space 18 formed between the first and second components 10 and 20. Fill.
In this case, for example, as shown in FIG. 3, the first and second liquid sealing resins 61 are dropped by dropping the liquid sealing resin 61 on the package component 1 of the first component 10 formed to extend to the side of the module. The liquid sealing resin 61 enters the sealing target space 18 through the opening portions of the sealing target space 18 on the side portions of the components 10 and 20, and as a result, the first and second liquid sealing resins 61 are affected by the surface tension of the liquid sealing resin 61. The inside of the sealing target space 18 of the second component 10 can be easily moved along the package component 1.

さらに、本実施の形態の場合は、隙間なく形成した堰き止め部６０によって液状封止樹脂６１を確実に堰き止めることができるので、封止対象空間１８内に液状封止樹脂６１を短時間で隙間なく充填させることができる。
この場合、使用する液状封止樹脂６１の粘度は特に限定されることはないが、浸透性の観点からは、１〜５０Ｐａ・ｓのものを用いることが好ましい。
また、液状封止樹脂６１の種類は特に限定されることはないが、封止品質向上の観点からは、エポキシ系樹脂もしくは、シリコーン系樹脂を用いることが好ましい。 Furthermore, in the case of the present embodiment, the liquid sealing resin 61 can be reliably dammed by the damming portion 60 formed without a gap, so that the liquid sealing resin 61 can be placed in the sealing target space 18 in a short time. It can be filled without gaps.
In this case, the viscosity of the liquid sealing resin 61 to be used is not particularly limited, but it is preferable to use a liquid sealing resin having a viscosity of 1 to 50 Pa · s from the viewpoint of permeability.
The type of the liquid sealing resin 61 is not particularly limited, but from the viewpoint of improving the sealing quality, it is preferable to use an epoxy resin or a silicone resin.

なお、本発明の場合、上述したように、封止対象空間１８内に光を照射しにくいというモジュール構成を考慮すると、液状封止樹脂６１としては熱硬化型のものを用いることが好ましい。   In the case of the present invention, as described above, it is preferable to use a thermosetting resin as the liquid sealing resin 61 in consideration of the module configuration in which it is difficult to irradiate light into the sealing target space 18.

そして、この状態で所定の温度で加熱することにより堰き止め部６０及び液状封止樹脂６１を硬化させ、第１及び第２の構成部１０、２０を硬化樹脂６ｃによって固着封止する（図２（ｅ）参照）。
その後、図２（ｅ）に示すように、パッケージ構成部材１の外側面に保護部材１９を貼付した後、突堤部１７の内側近傍のスクライブライン３０に沿ってダイシングを行うことにより、目的とする機能素子実装モジュールを得る。 In this state, the damming portion 60 and the liquid sealing resin 61 are cured by heating at a predetermined temperature, and the first and second components 10 and 20 are fixedly sealed with the cured resin 6c (FIG. 2). (See (e)).
Thereafter, as shown in FIG. 2 (e), the protective member 19 is pasted on the outer surface of the package component 1 and then dicing is performed along the scribe line 30 in the vicinity of the inner side of the jetty portion 17. A functional element mounting module is obtained.

以上述べたように本実施の形態によれば、一体化工程の際に機能素子１２の機能部１３への液状封止樹脂６１の流れ込みを確実に防止することができるので、ディスペンサによる封止樹脂の滴下の場合に比べて製造歩留まりを向上させることができるとともに、高価な高精度のディスペンサを使用する必要がないので、製造コストを下げることができる。
その他の構成及び作用効果については上述の実施の形態と同一であるのでその詳細な説明を省略する。 As described above, according to the present embodiment, it is possible to reliably prevent the liquid sealing resin 61 from flowing into the functional portion 13 of the functional element 12 during the integration process. The manufacturing yield can be improved as compared with the case of dripping, and it is not necessary to use an expensive high-precision dispenser, so that the manufacturing cost can be reduced.
Since other configurations and operational effects are the same as those of the above-described embodiment, detailed description thereof is omitted.

図４（ａ）〜（ｃ）は、本発明のさらに他の実施の形態の要部を示す断面工程図であり、以下、上記実施の形態と対応する部分には同一の符号を付しその詳細な説明を省略する。   4 (a) to 4 (c) are cross-sectional process diagrams showing the main part of still another embodiment of the present invention. In the following, parts corresponding to those of the above embodiment are denoted by the same reference numerals. Detailed description is omitted.

本実施の形態においても、図４（ａ）に示すように、上記実施の形態と同様に、図示しない印刷用のマスクとスキージを用いてパッケージ構成部材１上に印刷用封止樹脂６の印刷塗布を行い、パッケージ構成部材１の孔部２の近傍に突状の堰き止め部６０ａを形成し、その後、第２の構成部２０の機能素子１２側の部分を鉛直下方に向けた状態で第１の構成部１０に対して第２の構成部２０を押圧して第１及び第２の構成部１０、２０を一体化する。   Also in the present embodiment, as shown in FIG. 4A, the printing sealing resin 6 is printed on the package component 1 using a printing mask and squeegee (not shown) as in the above embodiment. Application is performed to form a projecting damming portion 60a in the vicinity of the hole 2 of the package component 1, and then the second component 20 on the functional element 12 side is directed vertically downward. The first component 10 and the second component 20 are integrated by pressing the second component 20 against the first component 10.

本実施の形態の場合は、金線１５ａのループ頂部形状がほぼ平坦になるようにワイヤボンディングを行うとともに、堰き止め部６０ａの高さを、第１及び第２の構成部１０、２０を一体化させた場合に堰き止め部６０ａの頂部が金線１５ａに接触しないように、印刷塗布の条件を設定する。
そして、図４（ａ）（ｂ）に示すように、上記実施の形態と同様に、第１及び第２の構成部１０、２０間に形成された封止対象空間１８に液状封止樹脂６１を注入して充填する。 In the case of the present embodiment, wire bonding is performed so that the shape of the top of the loop of the gold wire 15a is substantially flat, and the height of the blocking portion 60a is integrated with the first and second components 10 and 20. The printing application conditions are set so that the top of the damming portion 60a does not contact the gold wire 15a.
And as shown to Fig.4 (a) (b), liquid sealing resin 61 is provided in the sealing object space 18 formed between the 1st and 2nd component parts 10 and 20 similarly to the said embodiment. Inject and fill.

本実施の形態では、堰き止め部６０ａの頂部と機能素子１２の機能部搭載面１２ａとの間の極めて微小な隙間（クリアランス）において液状封止樹脂６１の表面張力によって堰き止め部６０ａの内縁部で堰き止められ、これにより液状封止樹脂６１が機能素子１２の機能部１３に侵入せずに留まった状態になる。   In the present embodiment, the inner edge portion of the damming portion 60a is formed by the surface tension of the liquid sealing resin 61 in a very small gap (clearance) between the top of the damming portion 60a and the functional portion mounting surface 12a of the functional element 12. Thus, the liquid sealing resin 61 stays in the functional element 13 of the functional element 12 without entering.

そして、この状態で所定の温度で加熱することにより堰き止め部６０ａ及び液状封止樹脂６１を硬化させ、第１及び第２の構成部１０、２０を硬化樹脂６ｄによって固着封止する（図２（ｃ）参照）。
その後、図２（ｃ）に示すように、パッケージ構成部材１の外側面に保護部材１９を貼付した後、突堤部１７の内側近傍のスクライブライン３０に沿ってダイシングを行うことにより、目的とする機能素子実装モジュールを得る。 In this state, the damming portion 60a and the liquid sealing resin 61 are cured by heating at a predetermined temperature, and the first and second constituent portions 10 and 20 are fixedly sealed with the cured resin 6d (FIG. 2). (See (c)).
Thereafter, as shown in FIG. 2 (c), the protective member 19 is attached to the outer surface of the package component 1, and then dicing is performed along the scribe line 30 in the vicinity of the inner side of the jetty portion 17. A functional element mounting module is obtained.

以上述べたように本実施の形態によれば、特に、封止対象空間１８に液状封止樹脂６１を注入して充填する際、機能素子１２上の接続部分（特に金線１５ａ）に液状封止樹脂６１のみを接触させることができ、これにより樹脂硬化工程において接続部分に与える熱応力を均一にしてその変形等を防止することができる。
その他の構成及び作用効果については上述の実施の形態と同一であるのでその詳細な説明を省略する。 As described above, according to the present embodiment, particularly when the liquid sealing resin 61 is injected and filled into the space 18 to be sealed, the liquid sealing is applied to the connection portion (particularly the gold wire 15a) on the functional element 12. Only the stop resin 61 can be brought into contact, and thereby, the thermal stress applied to the connection portion in the resin curing step can be made uniform to prevent the deformation thereof.
Since other configurations and operational effects are the same as those of the above-described embodiment, detailed description thereof is omitted.

なお、本発明は上述の実施の形態に限られることなく、種々の変更を行うことができる。
例えば、上述の実施の形態においては、第１の構成部を第２の構成部に対して下方に押圧するようにしたが、本発明はこれに限られず、第１及び第２の構成部を相対的に押圧して一体化できれば、押圧方法はどのような形式であってもよい。 The present invention is not limited to the above-described embodiment, and various changes can be made.
For example, in the above-described embodiment, the first component is pressed downward against the second component, but the present invention is not limited to this, and the first and second components are Any pressing method may be used as long as it can be relatively pressed and integrated.

また、上述の実施の形態においては、突堤部を第２の構成部の配線基板上に設けるようにしたが、本発明はこれに限られず、第１の構成部のパッケージ構成部材上に設けることもできる。
ただし、印刷工程の作業性の観点からは、上述の実施の形態のように、第２の構成部の配線基板上に設けることが好ましい。 Further, in the above-described embodiment, the jetty is provided on the wiring board of the second component, but the present invention is not limited to this, and is provided on the package component of the first component. You can also.
However, from the viewpoint of workability in the printing process, it is preferable to provide the wiring board on the second component as in the above-described embodiment.

また、上述した樹脂印刷工程及び一体化工程は、真空中で行うこともできる。このような工程を真空中で行えば、ボイドの発生が抑制され、形状が安定するというメリットがある。
さらに、本発明は、光機能素子実装モジュールのみならず、種々のＭＥＭＳ（Ｍｉｃｒｏ Ｅｌｅｃｔｒｏ Ｍｅｃｈａｎｉｃａｌ Ｓｙｓｔｅｍ）用部品に適用することができるものである。 Moreover, the resin printing process and integration process mentioned above can also be performed in a vacuum. If such a process is performed in a vacuum, generation | occurrence | production of a void is suppressed and there exists a merit that a shape becomes stable.
Further, the present invention can be applied not only to an optical functional element mounting module but also to various MEMS (Micro Electro Mechanical System) parts.

（ａ）〜（ｅ）：本発明に係る機能素子実装モジュールの製造方法の実施の形態を示す断面工程図である。(A)-(e): It is sectional process drawing which shows embodiment of the manufacturing method of the functional element mounting module which concerns on this invention. （ａ）〜（ｅ）：本発明の他の実施の形態の要部を示す断面工程図である。(A)-(e): It is sectional process drawing which shows the principal part of other embodiment of this invention. 同実施の形態の液状封止樹脂注入工程を示す斜視図である。It is a perspective view which shows the liquid sealing resin injection | pouring process of the embodiment. （ａ）〜（ｃ）：本発明のさらに他の実施の形態の要部を示す断面工程図である。(A)-(c): It is sectional process drawing which shows the principal part of other embodiment of this invention. 従来の機能素子実装モジュールの断面構成図である。It is a cross-sectional block diagram of the conventional functional element mounting module. （ａ）〜（ｃ）：従来の機能素子実装モジュールの製造方法の要部を示す断面工程図である。(A)-(c): It is sectional process drawing which shows the principal part of the manufacturing method of the conventional functional element mounting module.

符号の説明Explanation of symbols

１…パッケージ構成部材
２…孔部
３…印刷用のマスク
５…スキージ
６…印刷用封止樹脂
６ａ…封止樹脂部
１０…第１の構成部
１１…配線基板
１２…機能素子
１２ａ…機能部搭載面
１３…機能部
１７…突堤部
１８…封止対象空間
２０…第２の構成部
６０…堰き止め部（封止樹脂部）
６１…液状封止樹脂 DESCRIPTION OF SYMBOLS 1 ... Package component 2 ... Hole 3 ... Printing mask 5 ... Squeegee 6 ... Printing sealing resin 6a ... Sealing resin part 10 ... 1st component 11 ... Wiring board 12 ... Functional element 12a ... Functional part Mounting surface 13 ... Functional part 17 ... Jetty part 18 ... Space to be sealed 20 ... Second component part 60 ... Damping part (sealing resin part)
61 ... Liquid sealing resin

Claims (7)

所定形状の孔部を有するパッケージ構成部材を有する第１の構成部と、機能部が露出した状態で配線基板上に機能素子が実装された第２の構成部とを、封止樹脂によって封止して機能素子実装モジュールを製造する方法であって、
前記第１の構成部のパッケージ構成部材上に印刷用封止樹脂を印刷塗布して前記孔部の近傍に突状の封止樹脂部を形成する樹脂印刷工程と、
前記封止樹脂を堰き止めるための突堤部を前記第１の構成部のパッケージ構成部材と前記第２の構成部の配線基板との間に配置し、前記パッケージ構成部材の孔部と前記機能素子の機能部とを対向させた状態で、当該第１及び第２の構成部を押圧して一体化する一体化工程と、
前記第１の構成部のパッケージ構成部材と前記第２の構成部の配線基板間の封止対象空間に存する前記封止樹脂部を硬化させる樹脂硬化工程と、
前記突堤部を除去する除去工程と、を有する機能素子実装モジュールの製造方法。 A first constituent part having a package constituent member having a hole having a predetermined shape and a second constituent part having a functional element mounted on the wiring board in a state where the functional part is exposed are sealed with a sealing resin. A method of manufacturing a functional element mounting module,
A resin printing step of printing and applying a printing sealing resin on the package constituent member of the first constituent part to form a protruding sealing resin part in the vicinity of the hole; and
A jetty for damming the sealing resin is disposed between the package component of the first component and the wiring board of the second component, and the hole of the package component and the functional element An integration step of pressing and integrating the first and second constituent parts in a state where the functional parts are opposed to each other;
A resin curing step of curing the sealing resin portion existing in a sealing target space between the package component of the first component and the wiring board of the second component;
And a removing step for removing the jetty portion. 前記樹脂印刷工程において、前記一体化工程における前記第１の構成部のパッケージ構成部材上の封止樹脂部が前記第２の構成部の配線基板に接触して前記封止対象空間内に前記印刷用封止樹脂が充填されるように、前記パッケージ構成部材上に前記封止樹脂部を形成する請求項１記載の機能素子実装モジュールの製造方法。   In the resin printing step, the sealing resin portion on the package constituent member of the first constituent portion in the integration step contacts the wiring board of the second constituent portion, and the printing is performed in the space to be sealed. The method for manufacturing a functional element mounting module according to claim 1, wherein the sealing resin portion is formed on the package constituent member so as to be filled with a sealing resin for use. 前記樹脂印刷工程において、前記第１の構成部のパッケージ構成部材の孔部の近傍に印刷用封止樹脂を印刷塗布して堰き止め部を形成し、前記一体化工程の後に、前記封止対象空間に液状封止樹脂を注入して充填し、さらに、前記樹脂硬化工程において、前記堰き止め部及び前記液状封止樹脂を硬化させる請求項１記載の機能素子実装モジュールの製造方法。   In the resin printing step, a sealing resin for printing is printed and applied near the hole of the package component of the first component to form a damming portion, and after the integration step, the sealing object The method for manufacturing a functional element mounting module according to claim 1, wherein a liquid sealing resin is injected and filled into the space, and further, the damming portion and the liquid sealing resin are cured in the resin curing step. 前記樹脂印刷工程において、前記堰き止め部を、前記機能素子の機能部が設けられた機能部搭載面に接触するように形成する請求項３記載の機能素子実装モジュールの製造方法。   The method of manufacturing a functional element mounting module according to claim 3, wherein, in the resin printing step, the damming portion is formed so as to contact a functional part mounting surface provided with the functional part of the functional element. 前記樹脂印刷工程において、前記堰き止め部を、前記機能素子に設けられた接続部分に接触しないように形成する請求項３記載の機能素子実装モジュールの製造方法。   The method of manufacturing a functional element mounting module according to claim 3, wherein in the resin printing step, the damming portion is formed so as not to contact a connection portion provided in the functional element. 前記機能素子が、前記配線基板の接続部に対しワイヤーボンディング法によって電気的に接続されている請求項１乃至５のいずれか１項記載の機能素子実装モジュールの製造方法。   The method for manufacturing a functional element mounting module according to claim 1, wherein the functional element is electrically connected to a connection portion of the wiring board by a wire bonding method. 前記パッケージ構成部材の孔部を覆う保護用被覆部材を当該パッケージ構成部材上に設ける工程を更に有する請求項１乃至６のいずれか１項記載の機能素子実装モジュールの製造方法。   The method for manufacturing a functional element mounting module according to any one of claims 1 to 6, further comprising a step of providing a protective covering member for covering the hole of the package constituent member on the package constituent member.
JP2007013815A 2007-01-24 2007-01-24 Method for manufacturing module loading function element Pending JP2008182026A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012506140A (en) * 2008-10-17 2012-03-08 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Light emitting device
WO2013129026A1 (en) * 2012-02-28 2013-09-06 オリンパス株式会社 Photoelectric conversion module and optical transmission unit

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012506140A (en) * 2008-10-17 2012-03-08 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Light emitting device
WO2013129026A1 (en) * 2012-02-28 2013-09-06 オリンパス株式会社 Photoelectric conversion module and optical transmission unit
JP2013178378A (en) * 2012-02-28 2013-09-09 Olympus Corp Photoelectric conversion module and optical transmission unit
US9625664B2 (en) 2012-02-28 2017-04-18 Olympus Corporation Photoelectric conversion module and optical transmission unit

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