JP2006245095A - Method for manufacturing semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a surface-mounting semiconductor light-emitting device having high connection reliability by reliably preventing resin from leaking when resin-sealing a semiconductor element. <P>SOLUTION: In the manufacturing method of the semiconductor device, the semiconductor element is mounted onto an element mounting substrate 3 in which grooved electrodes 6 are provided on one side in a row, and is resin-sealed by a resin package 5. The method includes a process for mounting the semiconductor element onto a manufacture substrate on which a through-hole that becomes the grooved electrode 6 is formed at a position that becomes one side of the element mounting substrate 3, a process for filling the through-hole with a first resin, a process for sealing the semiconductor element with a second resin to form a resin package 5, a process for cutting the manufacture substrate as an element mounting substrate and for setting the through hole to be the grooved electrode, and a process for removing the first resin remaining on the grooved electrode 6. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a semiconductor device in which a semiconductor element is mounted on an element mounting substrate having a groove electrode on one side surface and the semiconductor element is sealed with a resin.

  An optical semiconductor device which is an example of a semiconductor device is shown in FIG. As shown in FIG. 7, the optical semiconductor device 20 includes a substrate 21 on which semiconductor elements 22 such as a light emitting element 22a, a light receiving element 22b, and a control element 22c are mounted. A wiring pattern (not shown) is formed on the substrate 21 and is electrically connected to each semiconductor element 22 by wires. On one side surface of the substrate 21 in the longitudinal direction, groove-like electrodes 23 formed in a semi-cylindrical shape are provided in a row. The inner surface of the semi-cylindrical groove electrode 23 becomes a connection surface as a connection terminal. The semiconductor element 22 mounted on the substrate 21 is sealed with a resin package 24 formed of a light transmissive resin. Since the optical semiconductor device 20 shown in FIG. 7 is an infrared data communication module, the resin package 24 is an infrared transparent resin.

  In such a method of manufacturing an optical semiconductor device, first, through holes serving as groove-like electrodes are formed in a row at a position on one side of the element mounting substrate, and the through holes formed in this row are formed in a matrix. A manufacturing substrate formed in a shape is prepared. A semiconductor element is conductively mounted on the manufacturing substrate, and each optical semiconductor element on the manufacturing substrate is sealed to form a resin package. Then, a dicer is used to cut individual optical semiconductor devices. At that time, the through hole is cut into a semi-cylindrical shape.

However, in this manufacturing method, when sealing, molten resin may enter through the opening of the cylindrical through hole and cover the inside of the through hole. In this case, when dicing is performed after sealing to form one semiconductor device, the connection surface as the connection terminal is covered with the sealing resin. Therefore, a contact failure may occur during mounting on an external circuit board. Therefore, a resin film can be formed on the opening of the through hole on the surface side of the substrate on which the semiconductor element to be sealed is mounted, and the resin can be prevented from entering by covering the substrate. An infrared data communication module, which is an example of a surface-mount type semiconductor light emitting device manufactured in this way, is described in Patent Document 1.
JP 2002-198572 A

  In the infrared data communication module which is an example of the surface-mount type semiconductor light-emitting device described in Patent Document 1, the resist film is prevented from entering by forming a resist film in the opening of the through hole. Since the thickness is about 100 to 200 μm, when the resin is injected into the mold, the resist film is pressed and deformed in the opening of the through hole by the pressure of the resin, and a stronger pressure is applied to the deformed portion of the resist film. This causes a problem that the resist film is damaged and resin leakage occurs in the through hole. In this case, the sealing resin also adheres to the inner side surface of the through hole serving as the connection terminal, and a contact failure occurs when mounted on an external circuit board. Therefore, a semiconductor device with high connection reliability is required.

  Accordingly, an object of the present invention is to provide a method for manufacturing a surface-mounting type semiconductor light emitting device with high connection reliability by reliably preventing resin leakage during resin sealing of a semiconductor element.

  The semiconductor device manufacturing method of the present invention is a semiconductor device in which a semiconductor element is mounted on an element mounting substrate in which groove-like electrodes are provided in a row on one or both side surfaces, and the semiconductor element is resin-sealed with a resin package. In the manufacturing method, a step of mounting the semiconductor element on a manufacturing substrate in which a through-hole serving as a groove-like electrode is formed at a position on one or both side surfaces of the element mounting substrate, and a first resin in the through-hole Filling and curing, sealing the semiconductor element with a second resin to form the resin package, cutting the manufacturing substrate to form the element mounting substrate, and forming the through hole in the groove shape A step of forming an electrode; and a step of removing the first resin remaining in the grooved electrode.

  According to the method for manufacturing a semiconductor device of the present invention, since the first resin is filled in the through-hole that becomes the groove-shaped electrode in advance, the second resin adheres to the inner surface of the through-hole serving as the connection terminal. In addition, it is possible to prevent a contact failure from occurring during mounting on an external circuit board. Therefore, a semiconductor device with high connection reliability can be obtained.

  According to a first aspect of the present invention, there is provided a method of manufacturing a semiconductor device in which a semiconductor element is mounted on an element mounting substrate in which groove-like electrodes are provided in rows on one or both side surfaces, and the semiconductor element is resin-sealed with a resin package. , A step of mounting a semiconductor element on a manufacturing substrate in which a through-hole serving as a groove-like electrode is formed at a position on one or both side surfaces of the element mounting substrate, and the through-hole is filled with a first resin and cured. A step of sealing a semiconductor element with a second resin to form a resin package, a step of cutting the manufacturing substrate to form an element mounting substrate, and forming a through-hole as a grooved electrode, and remaining in the grooved electrode And a step of removing the first resin.

  When forming the resin package with the second resin, the first resin is filled and cured in advance in the through-holes to be grooved electrodes provided on the manufacturing substrate, so that the press-fitted second resin It is possible to prevent the second resin from entering the through hole without the first resin being deformed or pushed out by the pressure. Therefore, it is possible to prevent the second resin from adhering to the inner side surface of the through hole serving as the connection terminal and causing a contact failure when mounted on an external circuit board.

  According to a second invention of the present application, when the manufacturing substrate is cut to form an element mounting substrate and the through hole is formed as a grooved electrode, the through electrode is formed at a position where the grooved electrode becomes a groove that gradually spreads sideways. It is characterized by cutting a hole.

  Since the through hole is cut at a position where the groove gradually expands to the side, and the through hole is used as a groove electrode, when removing the first resin remaining in the groove electrode, the through hole is removed from the groove. The first cured resin can be removed without being disturbed.

  The third invention of the present application is characterized in that the first resin filled in the through hole is an epoxy resin to which a wax component is added.

  When removing the first resin from the groove electrode, the first resin is an epoxy resin to which a wax component is added, so that the adhesion between the first resin and the inner surface of the groove electrode is reduced. And the first resin can be easily removed from the grooved electrode.

(Embodiment)
A method for manufacturing a semiconductor device according to an embodiment of the present invention will be described using an optical semiconductor device as an example.

  First, an optical semiconductor device obtained by a method for manufacturing a semiconductor device according to an embodiment of the present invention will be described with reference to FIG. 1A and 1B are diagrams for explaining an optical semiconductor device obtained by a method for manufacturing a semiconductor device according to an embodiment of the present invention. FIG. 1A is a front view, FIG. 1B is a plan view, and FIG. (D) is a side view. FIG. 2 is a plan view in which the resin package of FIG. 1B is omitted.

  As shown in FIGS. 1 and 2, the optical semiconductor device 1 includes a semiconductor element 4 mounted on an element mounting substrate 3 on which a wiring pattern 2 is formed, and the semiconductor element 4 is sealed with a resin package 5. .

  The element mounting substrate 3 is formed in a substantially rectangular shape, and groove electrodes 6 are provided in a row on one side surface thereof. The groove electrode 6 is formed in a semi-cylindrical shape, and is electrically connected to the wiring pattern 2 and electrically connected to an electrode 7 provided on a surface opposite to the mounting surface of the semiconductor element 4. The inner side surface 6a of the semi-cylindrical groove electrode 6 becomes a connection surface as a connection terminal. This connection surface is plated with gold in order to improve solder mountability.

  The semiconductor element 4 includes a light emitting element 4a, a light receiving element 4b, and a control element 4c. The light emitting element 4 a, the light receiving element 4 b, and the control element 4 c are bonded to the element mounting substrate 3 by the paste 8 and are electrically connected to the wiring pattern 2 by the wires 9.

  The resin package 5 is provided with a hemispherical lens portion 5a on the light emitting surface of the light emitting element 4a and the light incident surface of the light receiving element 4b. If the light emitting element 4a and the light receiving element 4b communicate with infrared rays, the resin package 5 uses a resin having infrared transparency. For example, an epoxy resin can be used for the resin package 5.

  A method of manufacturing a semiconductor device according to the embodiment of the present invention configured as described above will be described with reference to the drawings. FIG. 3 is a plan view for explaining a production substrate. FIG. 4 is a plan view of a state in which a resin package is formed on the manufacturing substrate. FIG. 5 is a plan view for explaining a cutting position of the through hole when the manufacturing substrate is cut. FIG. 6 is a front view of an individual semiconductor light emitting device.

  As shown in FIG. 3, first, the production substrate 10 is prepared. In the manufacturing substrate 10, the wiring pattern 2 is formed at a position to be an individual element mounting substrate 3, and the through holes 11 to be grooved electrodes 6 are arranged in rows at a position to be one side surface of the element mounting substrate 3. Is formed. The through holes 11 formed in a row with these wiring patterns 2 are formed in a matrix.

  Next, a resin (first resin) is filled into the through hole 11 of the manufacturing substrate 10. As the first resin, an epoxy resin having thermosetting properties and a wax component (release agent such as carnauba or polyethylene) added can be used. The epoxy resin to which the wax component is added is a resin having low adhesion to the gold plating applied to the surface of the through hole 11. The filling can be easily filled in the through hole 11 by placing an appropriate amount of the first resin on the production substrate 10 and leveling the upper surface of the production substrate 10 with a squeegee. Then, the production substrate 10 in which the first resin is filled in the through hole 11 is heated in a heating furnace to cure the resin. The resin filled in the through-hole 11 can be used even if it is photo-curing, but it is desirable to use a thermo-curing resin because light does not easily reach the depth of the through-hole 11.

  The semiconductor element 4 is mounted on the manufacturing substrate 10. This is because the semiconductor element 4 is placed on the paste applied at the position where the semiconductor element 4 is disposed, thereby bonding the manufacturing substrate 10 and the semiconductor element 4 together.

  Then, the manufacturing substrate 10 is clamped with a mold composed of a lower mold in which a concave portion to be the lens portion 5a is formed and an upper mold that is a flat surface, and a resin ( The second resin is injected to perform resin sealing. Even if the second resin forming the resin package 5 is pumped into the mold, the first resin is deformed or pushed out because the first resin is filled in the through hole 11 and hardened. Never do. Therefore, it is possible to prevent the second resin from entering the through hole 11.

  In this manner, the resin package 5 is formed in which the lens portion 5a is provided at the light emitting position of the light emitting element 4a and the light incident position of the light receiving element 4b. FIG. 4 shows the manufacturing substrate 10 on which the resin package 5 is formed.

  As shown in FIG. 4, with a dicer, the A1-A1 line, A2-A2 line and the production substrate 10 are sequentially cut to divide the row, and then the B1-B1 line, B2-B2 line and the vertical column are cut sequentially. Individual semiconductor light emitting devices. In order to obtain individual semiconductor light emitting devices, the through hole 11 is cut. At this time, the through hole 11 is cut at a position where the through hole 11 becomes a groove gradually expanding toward the side. That is, as shown in FIG. 5, if the through-hole 11 is cut into a groove-like electrode at a position on the inner side from the imaginary line L connecting the centers of the through-holes 11, the groove-like electrode is directed to the side. Since the groove gradually expands and becomes an arc of a semicircle or less in plan view, the first resin filled in the through hole 11 can be easily taken out.

  As shown in FIG. 6, the first resin 12 is removed from the semiconductor light emitting device 1 with the cured first resin 12 remaining on the grooved electrode 6. This can be performed by a magnetic polishing apparatus that removes burrs formed on the cut surface when the manufacturing substrate 10 is cut with a dicer. By using a magnetic polishing apparatus, burrs can be removed and the first resin 12 can be removed. Therefore, the removal of the first resin can be performed without adding a new process. This magnetic polishing apparatus is an apparatus in which a semiconductor light-emitting device 1 that performs deburring is placed in a container together with a needle-shaped polishing member, and a magnetic field is applied from outside the container to stir the polishing member. By this stirring, the polishing member removes burrs formed on the end face at the time of cutting, and removes the first resin remaining in the grooved electrode 6.

  In this way, it is possible to prevent the second resin from adhering to the inner side surface of the through hole serving as the connection terminal and causing a contact failure when mounted on an external circuit board.

  Since the present invention can improve the connection reliability by reliably preventing the resin leakage at the time of resin sealing of the semiconductor element, the semiconductor device is mounted on the element mounting substrate provided with the groove electrode on one side surface. It can be suitably used in a method for manufacturing a semiconductor device in which an element is mounted and the semiconductor element is sealed with resin.

It is a figure explaining the optical semiconductor device obtained by the manufacturing method of the semiconductor device which concerns on embodiment of this invention, (a) is a front view, (b) is a top view, (c) is a bottom view, (d) Is a side view FIG. 1B is a plan view in which the resin package is omitted. Plan view explaining the production substrate Plan view of resin package formed on the production board Plan view explaining the cutting position of the through hole when cutting the production substrate Front view of individual semiconductor light emitting devices FIG. 6 illustrates an optical semiconductor device that is an example of a semiconductor device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor light-emitting device 2 Wiring pattern 3 Element mounting board | substrate 4 Semiconductor element 4a Light emitting element 4b Light receiving element 4c Control element 5 Resin package 5a Lens part 6 Groove electrode 6a Inner side surface 7 Electrode 8 Paste 9 Wire 10 Manufacturing board 11 Through hole 12 1st 1 resin

Claims (3)

In a method of manufacturing a semiconductor device in which a semiconductor element is mounted on an element mounting substrate in which groove electrodes are provided in rows on one or both side surfaces, and the semiconductor element is resin-sealed with a resin package.
Mounting the semiconductor element on a manufacturing substrate in which a through-hole serving as a grooved electrode is formed at a position which is one or both side surfaces of the element mounting substrate;
Filling and curing the first resin in the through hole;
Sealing the semiconductor element with a second resin to form the resin package;
Cutting the manufacturing substrate to form the element mounting substrate, and forming the through hole as the groove electrode;
And a step of removing the first resin remaining in the groove electrode. When the manufacturing substrate is cut to form the element mounting substrate and the through hole is used as the groove-shaped electrode, the through-hole is formed at a position where the groove-shaped electrode becomes a groove that gradually spreads laterally. The semiconductor device manufacturing method according to claim 1, wherein the semiconductor device is cut. 3. The method of manufacturing a semiconductor device according to claim 1, wherein the first resin filling the through hole is an epoxy resin to which a wax component is added.

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