JP3937819B2 - Resin-sealed optical module and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an optical module used for optical communication, and particularly to an optical module having an optical semiconductor element such as a laser diode or a photodiode and an optical fiber and sealed with a resin.
[0002]
[Prior art]
Conventionally, an optical module has a structure in which an optical semiconductor element and an optical fiber are fixed to a ceramic box from the viewpoint of reliability, and the ceramic box is covered with a metal or ceramic plate to keep the inside airtight. It was. The optical axes of the optical semiconductor element and the optical fiber are adjusted when the optical fiber is fixed to the pigtail in advance and the pigtail is welded to the ceramic box. However, since this optical module having a ceramic hermetic structure is expensive to manufacture, an optical module that is sealed with a resin has been developed from the viewpoint of cost reduction.
[0003]
FIG. 5 is a schematic longitudinal sectional view of a resin-sealed optical module disclosed in Japanese Patent Laid-Open No. 9-127376. In FIG. 5, 31 is a laser diode (referred to as LD), 32 is a photodiode (referred to as PD), 33 is an optical fiber, 34 is an element mounting substrate member, 35 is a frame substrate, 36 is a pressing substrate, and 37 is optical. A fiber support member, 38 is an optical fiber resin coating, 39 is a transparent resin, 40 is a mold resin, and 41 is a resin-encapsulated optical module.
[0004]
The resin-encapsulated optical module 41 disclosed in Japanese Patent Application Laid-Open No. 9-127376 includes a holding substrate 36 for fixing an optical fiber support member 37 in which an optical fiber 33 is inserted, and optical semiconductor elements such as LD 31 and PD 32. The mounted element mounting substrate member 34 is fixed to the frame substrate 35, the optical coupling portion between the optical semiconductor element and the optical fiber 33 is covered with a transparent resin 39, and the whole is sealed with a mold resin 40. is there.
[0005]
In Japanese Patent Laid-Open No. 11-68254, a silicon substrate for fixing an LD and an optical fiber and a lead frame for holding the silicon substrate are molded by casting with a thermosetting liquid resin in a mold. A resin-encapsulated optical module is disclosed.
[0006]
[Problems to be solved by the invention]
From the viewpoint of productivity, the sealing of the resin-encapsulated optical module 41 disclosed in Japanese Patent Application Laid-Open No. 9-127376 is performed by transfer molding capable of molding a large number of modules simultaneously and in a short time. In the case of performing, after the optical semiconductor element and the optical fiber 33 are optically coupled, that is, with the optical fiber 33 attached, the external force is applied to the optical fiber 33 by the molding pressure of the molding resin 40. Is added, and there is a problem that the alignment between the optical semiconductor element and the optical fiber 33 is shifted. In addition, a mold is used for transfer molding, and the mold is pressed with a high clamping force so that the mold resin does not leak due to pressure during molding, so the resin of the optical fiber sandwiched between the molds There was a problem that the coating 38 was damaged and the reliability of the optical fiber was lowered. In addition, since the optical fiber 33 is attached, there is a problem that it takes time to set the optical module in the mold and to remove the optical module from the mold, thereby reducing productivity.
[0007]
  In the resin-sealed optical module by casting disclosed in Japanese Patent Laid-Open No. 11-68254, the casting temperature cannot be increased due to the problem that the resin coating of the optical fiber deteriorates, and the resin-sealed optical module is long. Time-consuming and low optical module productivityKunaThere was a problem.
[0008]
Also, the conventional resin-encapsulated optical module is entirely sealed with resin, so it can be fixed in a short time to fix the pigtail to which the optical fiber is attached, and it has excellent sealing performance. There was a problem that welding could not be used.
The present invention was made in order to solve the problems of the conventional resin-encapsulated optical module as described above, and during resin molding, the misalignment between the optical semiconductor element and the optical fiber, the damage of the optical fiber, It is an object of the present invention to provide a resin-encapsulated optical module that does not cause deterioration, has high reliability, and is excellent in productivity.
[0009]
[Means for Solving the Problems]
  A first resin-encapsulated optical module according to the present invention is the resin-encapsulated optical module having a configuration in which an optical semiconductor element mounted on an element mounting substrate member and an optical fiber are disposed on the same optical axis. A pigtail in which an optical fiber is provided and held and fixed, a spacer that forms a part of an optical waveguide portion between the optical fiber and the optical semiconductor element, and a spacer to which the pigtail is joined; The optically transparent plug that closes the hole of the spacer, the lens that is on the optical axis and is provided between the optical semiconductor element and the plug, the element mounting substrate member, and the spacer are the same. A wiring board provided on the surface, and at least a gap between the optical semiconductor element and the plug of the optical waveguide portion is transparent.TreeSealed with grease,Except the pigtailSaidTransparentThe outside of the resin is opaquemoldIt is sealed with resin.
[0010]
The second resin-encapsulated optical module according to the present invention is the first resin-encapsulated optical module in which the plug is a lens.
[0011]
A third resin-encapsulated optical module according to the present invention is the first or second resin-encapsulated optical module, in which a lens is provided on an element mounting substrate member.
[0012]
  A fourth resin-encapsulated optical module according to the present invention is the resin-encapsulated optical module having a configuration in which an optical semiconductor element mounted on an element mounting substrate member and an optical fiber are disposed on the same optical axis. A pigtail in which a fiber is internally held and fixed; a spacer that forms a part of an optical waveguide portion between the optical fiber and the optical semiconductor element; and the spacer to which the pigtail is joined, An optically transparent lens that closes the hole of the spacer, and a wiring board on which the element mounting substrate member and the spacer are provided on the same surface, and at least the optical semiconductor element of the optical waveguide portion and the Transparent to the lensTreeSealed with grease,Except the pigtailSaidTransparentThe outside of the resin is opaquemoldIt is sealed with resin.
[0013]
A fifth resin-encapsulated optical module according to the present invention is the resin-encapsulated optical module according to any one of the first to fourth aspects of the present invention, wherein the element mounting substrate member is a silicon substrate.
[0014]
A sixth resin-encapsulated optical module according to the present invention is the resin-encapsulated optical module according to any one of the first to fifth inventions, wherein the spacer is made of metal.
[0015]
  A seventh resin-encapsulated optical module according to the present invention is the resin-encapsulated optical module according to any one of the first to sixth aspects of the present invention.TransparentThe resin is a silicone resin.
  In addition, a method for manufacturing a resin-encapsulated optical module according to the present invention includes a resin-encapsulated optical module having a configuration in which an optical semiconductor element mounted on an element mounting substrate member and an optical fiber are arranged on the same optical axis. In the manufacturing method, the spacer having the step of mounting the optical semiconductor element and the lens on the element mounting substrate member, a hole forming a part of the optical waveguide portion, and an optically transparent plug for closing the hole, and the element A step of installing a mounting board member on the same surface of the wiring board so that light emitted from the optical semiconductor element passes through the hole after passing through the lens; and between the optical semiconductor element and the plug A pigtail in which the optical fiber is installed and held and fixed after the step of sealing with a transparent resin, the step of sealing the outside of the transparent resin with an opaque mold resin, and the step of sealing with the mold resin The A step of the optical axis of the serial optical fiber and the optical axis of said optical semiconductor element and the lens is joined to the spacer so as to coincide, and has a.
  Another method for manufacturing a resin-encapsulated optical module according to the present invention is a resin-encapsulated light having a configuration in which an optical semiconductor element mounted on an element mounting substrate member and an optical fiber are disposed on the same optical axis. In the module manufacturing method, a spacer having a step of mounting the optical semiconductor element on the element mounting substrate member, a hole forming a part of the optical waveguide portion, and an optically transparent lens closing the hole, and the element mounting And a step of installing the substrate member on the same surface of the wiring board so that light emitted from the optical semiconductor element passes through the hole, and sealing between the optical semiconductor element and the lens with a transparent resin A step of sealing the outer side of the transparent resin with an opaque mold resin, and a step of sealing the mold resin with the mold resin. When And bonding the spacers so that the optical axis coincides the serial optical semiconductor element and the lens, and has a.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1 FIG.
FIG. 1 is a schematic cross-sectional view showing the structure of a resin-encapsulated optical module according to Embodiment 1 of the present invention. In FIG. 1, 1 is an LD, 2 is a PD, 3 is an optical semiconductor element, 4 is an element mounting substrate member, 5 is an optical fiber, 6 is a pigtail, 7 is a spacer, 8 is a hole in an optical waveguide, and 9 is a wiring board. Reference numeral 10 denotes a first lens, 11 denotes a plug, 12 denotes a resin coating of an optical fiber, 13 denotes a transparent resin, 14 denotes a molding resin, 15 denotes an external electrode, and 20 denotes a resin-encapsulated optical module.
[0017]
As shown in FIG. 1, the resin-encapsulated optical module 20 of the present embodiment has the same wiring board 9 having an internal electrode (not shown) and an external electrode 15 electrically connected to the internal electrode. The element mounting substrate member 4 and the spacer 7 are placed in contact with the surface. Although not shown in FIG. 1, in addition to the element mounting board member 4 and the spacer 7, other semiconductor elements and components such as resistors and capacitors may be mounted on the wiring board 9.
The element mounting substrate member 4 is provided with an optical semiconductor element 3 such as LD1 or PD2 at a predetermined position opposite to the end in contact with the spacer 7, and substantially coincides with the optical axis of the emitted light from the LD1, The first lens 10 is installed at a position that focuses on the outgoing light surface of the LD 1. In the present embodiment, the first lens 10 is a spherical lens, but it may be an aspherical lens other than the spherical lens, or the lens may be fixed in advance with a holder or the like. In addition, although the number of the first lens 10 is one, a plurality of lens groups may be provided and the combined focal points may be installed so as to be connected to the outgoing light surface of the LD 1.
Although not shown in FIG. 1, other semiconductor elements and components such as resistors and capacitors are mounted on the element mounting board member 4 at a place other than the optical waveguide portion formed by the optical semiconductor element 3 and the lens 10. You may do it.
[0018]
The spacer 7 is provided with an optical waveguide hole 8 of a size that allows light emitted from the LD 1 to pass through the light substantially parallel to the first lens 10. In the present embodiment, the shape of the hole 8 is circular. However, the shape is not limited to this shape, and may be, for example, an ellipse or a quadrangle.
A plug 11 for preventing the transparent resin 13 from leaking at the time of sealing is provided in the hole 8 so as to be substantially flush with the surface of the spacer 7 facing the first lens 10. The plug 11 is optically transparent with respect to the light emitted from the LD 1.
In the present embodiment, the stopper 11 is provided so as to be substantially flush with the face of the spacer 7 facing the first lens 10, but it may be provided inside the hole 8.
The spacer 7 has a pigtail 6 in which the optical fiber 5 is installed and fixed on the surface opposite to the surface facing the first lens 10, the optical axis of the optical fiber 5, the LD 1 and the first lens 1. The optical axis of the lens 10 is provided so as to coincide.
[0019]
A portion where the optical semiconductor element 3 such as LD 1 or PD 2 is provided and a portion from the LD 1 to the first lens 10 and the spacer plug 11 in the optical waveguide portion are sealed with a transparent resin 13. The outer side of the transparent resin 13, the element mounting substrate member 4, the mounting surface of the element mounting substrate member 4 of the wiring substrate 9, and the surface of the spacer 7 facing the first lens 10 are opaque molds. Sealed with resin 14.
In the present embodiment, the element mounting substrate member 4 mounting surface of the wiring substrate 9 and the surface of the spacer 7 facing the first lens 10 are sealed with an opaque mold resin 14. The side surface portion of the spacer 7 may also be sealed with the mold resin 14. When the wiring substrate 9 and the side surfaces of the spacer 7 are sealed with the mold resin 14, the moisture resistance of the resin-encapsulated optical module 20 is further improved.
[0020]
As the wiring substrate 9, an organic substrate, a ceramic substrate, a glass ceramic substrate, or the like can be used. preferable. As the ceramic substrate, a general-purpose and low-cost alumina substrate is particularly preferable. A glass-ceramic substrate based on alumina is particularly preferable because it is versatile and low-cost.
[0021]
As the element mounting substrate member 4, a silicon substrate, a metal carrier, or a ceramic substrate can be used. Since the silicon substrate can be processed by a semiconductor process, the processing accuracy is good, and the optical semiconductor element 3 and the first lens 10 of the LD 1 and PD 2 can be positioned with high accuracy. For this reason, silicon substrates can be passively aligned to secure optical accuracy by performing active alignment that performs optical alignment without fixing optical alignment, reducing manufacturing time and increasing productivity. Is preferable.
[0022]
The spacer 7 is made of metal or ceramic that can be welded so that the pigtail 6 can be joined with high accuracy in a short time. In particular, the spacer 7 is provided with a hole 8 serving as an optical waveguide, and a metal is preferable from the viewpoint of ease of drilling and cost. Although it does not specifically limit as a metal, Stainless steel is especially preferable from the surface of workability and versatility, and 42 alloy which is an iron-nickel alloy from the surface of low thermal expansibility is especially preferable.
[0023]
The plug 11 may be made of the same material as that used for the lens of the optical module in terms of optical transparency.
[0024]
A silicone resin is used as the transparent resin 13. Silicone-based resins are preferable because they diffuse water but have a small function of adsorbing water, that is, the amount of water absorption is small, so that corrosion of the optical semiconductor element hardly occurs.
Moreover, as the transparent resin 13, an ultraviolet curable resin or a thermosetting resin is used. If the transparent resin 13 spreads between application and curing, it becomes difficult to form an optical waveguide, so it is necessary to keep the shape in a convex shape. An ultraviolet curable resin is preferable because it can be cured immediately after application and before the shape to be retained is destroyed by ultraviolet irradiation, so that the shape can be retained.
Even a thermosetting resin is translucent, but it is used by adding a small amount of fine silica within a range that satisfies the transmittance to improve thixotropy and impart shape retention. That is, as the transparent resin 13, it is only necessary to ensure a transmittance of 30% or more (1 mm thickness) in the wavelength range of an optical signal emitted or received by the optical semiconductor element 3.
[0025]
The opaque mold resin 14 is preferably an epoxy resin having good moldability and adhesiveness.
[0026]
Next, the manufacturing process of the resin-encapsulated optical module 20 of the present embodiment will be described.
First, the LD 1, the PD 2, and the first lens 10 are fixed at predetermined positions on the upper surface of the element mounting substrate member 4. LD1 and PD2 are fixed with solder or an adhesive. The first lens 10 forms a groove along the optical waveguide on the upper surface of the element mounting substrate member 4, and is fixed to a predetermined position of the groove using an adhesive.
[0027]
The spacer 7 is formed in a hole at a position to be an optical waveguide, and a step portion in which the plug 11 can be inserted larger than the diameter of the hole is provided in the hole 8, and the optically transparent plug 11 is bonded to the step portion.
Next, the element mounting board member 4 and the spacer 7 are placed on the wiring board 9 and fixed with solder. At this time, the element mounting substrate member 4 and the spacer 7 pass through the hole 8 of the spacer 7 after the light emitted from the LD 1 provided on the element mounting substrate member 4 passes through the first lens 10. Installed.
The semiconductor elements and components mounted on the LD 1, PD 2, and the element mounting substrate member 4, and the semiconductor elements and components mounted on the wiring board 9 are connected to the internal electrodes communicating with the external electrodes 15 of the wiring board by wire bonding or the like. Is electrically connected.
[0028]
Next, the optical semiconductor element 3 such as LD1 or PD2 and the optical waveguide portion from LD1 to the plug 11 that closes the hole 8 of the spacer 7 through the first lens 10 are sealed with a transparent resin 13 using a dispenser. . Further, the semi-finished product of this optical module is set in a mold, the outside of the transparent resin 13, the element mounting board member 4, the mounting surface of the element mounting board member 4 of the wiring board 9, and the spacer 7. The surface facing the first lens 10 is sealed with an opaque mold resin by transfer molding. At this time, the side surface portion of the wiring board 9 may be sealed as long as the external electrode is not covered. The spacer 7 may also seal its side surface.
In this embodiment, the optical module is sealed with an opaque mold resin by transfer molding, but may be cast by using a mold.
[0029]
Finally, the pigtail 5 with the optical fiber 4 fixed to the spacer 7 is fixed by YAG welding while optically aligning, thereby completing the resin-encapsulated optical module 20.
[0030]
In the resin-encapsulated optical module 20 of the present embodiment, the LD1 and PD2 are mounted on the element mounting substrate member 4, but either one of LD1 or PD2 may be used. When only PD2 is mounted, the first lens 10 is installed at a position that focuses on the light receiving surface of PD2.
[0031]
The resin-encapsulated optical module 20 according to the present embodiment has a structure in which an optical fiber is attached after the optical module is resin-encapsulated, and an excessive force is not applied to the optical fiber even when molding resin is encapsulated by transfer molding. Since the optical axis is not shifted and the resin coating of the optical fiber is not damaged by the mold, the incidence of defects is small, and a resin-encapsulated optical module can be produced with high productivity.
Also, in molding resin sealing by casting using a mold, since the mold temperature can be increased, the curing time can be shortened, and a resin-encapsulated optical module can be produced with high productivity.
[0032]
Embodiment 2. FIG.
FIG. 2 is a schematic cross-sectional view showing the structure of the resin-encapsulated optical module according to Embodiment 2 of the present invention. In FIG. 2, reference numeral 21 denotes a second lens.
[0033]
As shown in FIG. 2, the resin-encapsulated optical module 20 of the present embodiment is provided with a second lens 21 instead of the plug 11 of the resin-encapsulated optical module of the first embodiment, and the holes of the spacer 7 The structure is the same as that of the first embodiment except that 8 is closed. Similarly to the first lens 10, the second lens 21 is a spherical lens or an aspheric lens.
In the present embodiment, since the second lens 21 is provided near the optical fiber 5, the light can be collected and transmitted to the optical fiber 5, and the optical fiber 5 and the optical semiconductor element 3 Optical coupling becomes stronger.
[0034]
Embodiment 3 FIG.
FIG. 3 is a schematic cross-sectional view showing the structure of the resin-encapsulated optical module according to Embodiment 3 of the present invention.
As shown in FIG. 3, in the resin-encapsulated optical module 20 of the present embodiment, the second lens 21 larger than the diameter of the hole 8 is provided in the vicinity of the end of the element mounting substrate member 4 that contacts the spacer 7. When the element mounting board member 4 and the spacer 7 are installed on the wiring board 9, the second lens 21 is disposed so as to cover the hole 8, and the second lens 21 is bonded to the spacer 7. Except for this, the structure is the same as that of the second embodiment.
In the present embodiment, the second lens 21 can be provided on the element mounting substrate member 4, and the alignment between the optical semiconductor element 3 and the second lens 21 is easy.
[0035]
Embodiment 4 FIG.
FIG. 4 is a schematic cross-sectional view showing the structure of the resin-encapsulated optical module according to Embodiment 4 of the present invention.
In this embodiment, except that the first lens 10 is not provided on the element mounting substrate member 4, the structure is the same as in the second embodiment, and the element mounting substrate member 4 can be shortened. The light stop module 20 can be further downsized.
[0036]
【Example】
The present invention will be described in more detail with reference to examples.
[0037]
Example 1.
As the element mounting substrate member, a silicon substrate 4 (length 5 mm × width 3 mm × thickness 0.5 mm) having a wiring circuit formed on the front surface and gold plating on the back surface is used. In the silicon substrate 4, the LD 1, the PD 2, and the spherical first lens 10 (diameter 1 mm) are fixed at predetermined positions. The first lens 10 is fixed with an adhesive or the like in the V groove provided in the silicon substrate 4 after positioning.
As the wiring substrate 9, an alumina substrate (length 12 mm × width 10 mm × thickness 1 mm) having nickel / gold plating applied to the wiring and electrode portions is used. First, the silicon substrate 4 on which the LD 1, the PD 2, and the first lens 10 are mounted is fixed to the alumina wiring substrate 9 by soldering at a predetermined position.
[0038]
As the spacer 7, a stainless steel plate (width 6 mm × height 5 mm × thickness 2 mm) is used. The spacer 7 is provided with an optical waveguide hole 8 (diameter 1.5 mm). The hole 8 has a diameter of 2 mm around the hole facing the first lens 10 and is stepped. An optically transparent stopper 11 is adhered to the part with an adhesive.
A spacer 7 having a hole 8 for an optical waveguide, and the hole 8 is closed with an optically transparent plug 11, has an alumina wiring so that the surface on which the plug 11 is provided faces the first lens 10. Bonded to the substrate 9 with solder.
[0039]
In addition, a semiconductor element or an electronic component is fixed to a predetermined position of the wiring board 9 with solder as necessary. The optical semiconductor element 3, the semiconductor element, and the electronic component, and the electrodes of the silicon substrate and the alumina wiring substrate 9 are connected by a gold wire.
[0040]
The optical waveguide portion between the LD 1, the PD 2, the first lens 10 and the plug 11 is sealed with an optically transparent silicone resin 13. This sealing is performed by applying a silicone resin 13 to the optical waveguide portion with a dispenser and heat-curing at a predetermined temperature and time.
The outside of the sealing portion of the transparent resin 13 is sealed with an epoxy opaque mold resin. Sealing with an opaque mold resin is performed by transfer molding for 90 seconds by setting a semi-finished product of an optical module in a multi-piece mold. After transfer molding, the sealed optical module is taken out from the mold, and post-curing of the mold resin is performed at 160 ° C. for 6 hours.
[0041]
After sealing with an opaque mold resin, the optical module attaches the pigtail 6 with the optical fiber 5 fixed to the spacer 7 by YAG welding while taking optical alignment.
[0042]
Example 2
In this embodiment, LD1, PD2, a spherical first lens 10 (diameter 1 mm), and a spherical second lens 21 (diameter 3 mm) are fixed to a silicon substrate 4, and an optical waveguide of a spacer 7 made of stainless steel plate. The stopper hole 11 is not provided in the hole 8 (1.5 mm in diameter), and the spacer hole 8 is blocked by the second lens 21 provided at the end of the silicone substrate 4 in contact with the spacer 7. The resin-encapsulated optical module 20 has the same structure as that of the first embodiment except that.
[0043]
【The invention's effect】
  A first resin-encapsulated optical module according to the present invention is the resin-encapsulated optical module having a configuration in which an optical semiconductor element mounted on an element mounting substrate member and an optical fiber are disposed on the same optical axis. A pigtail in which an optical fiber is provided and held and fixed, a spacer that forms a part of an optical waveguide portion between the optical fiber and the optical semiconductor element, and a spacer to which the pigtail is joined; The optically transparent plug that closes the hole of the spacer, the lens that is on the optical axis and is provided between the optical semiconductor element and the plug, the element mounting substrate member, and the spacer are the same. A wiring board provided on the surface, and at least a gap between the optical semiconductor element and the plug of the optical waveguide portion is transparent.TreeSealed with grease,Except the pigtailSaidTransparentThe outside of the resin is opaquemoldIt is sealed with resin and has a structure in which an optical fiber can be attached after the optical module is sealed with resin. The incidence of defects during resin sealing is small, and the resin sealing is performed with high productivity. Can produce light-stop modules.
[0044]
The second resin-encapsulated optical module according to the present invention is the same as the first resin-encapsulated optical module, since the plug is a lens and a lens is provided near the optical fiber. It can be transmitted to an optical fiber, and the optical coupling between the optical fiber and the optical semiconductor element can be strengthened.
[0045]
A third resin-encapsulated optical module according to the present invention is the first or second resin-encapsulated optical module, wherein the lens is provided on the element mounting substrate member, and the alignment between the optical semiconductor element and the lens is performed. Is easy, manufacturing time can be shortened, and productivity is improved.
[0046]
  A fourth resin-encapsulated optical module according to the present invention is the resin-encapsulated optical module having a configuration in which an optical semiconductor element mounted on an element mounting substrate member and an optical fiber are disposed on the same optical axis. A pigtail in which a fiber is internally held and fixed; a spacer that forms a part of an optical waveguide portion between the optical fiber and the optical semiconductor element; and the spacer to which the pigtail is joined, An optically transparent lens that closes the hole of the spacer, and a wiring board on which the element mounting substrate member and the spacer are provided on the same surface, and at least the optical semiconductor element of the optical waveguide portion and the Transparent to the lensTreeSealed with grease,Except the pigtailSaidTransparentThe outside of the resin is opaquemoldSince it is sealed with resin and the lens is provided in the hole of the spacer, the element mounting substrate member can be shortened, and the resin-sealed optical module can be further reduced in size.
[0047]
A fifth resin-encapsulated optical module according to the present invention is the resin-encapsulated optical module according to any one of the first to fourth aspects of the present invention, wherein the element mounting substrate member is a silicon substrate, Since it can be processed by a semiconductor process, the processing accuracy is good, and the optical semiconductor element and the lens can be positioned with high accuracy. Therefore, it is possible to perform passive alignment that can ensure optical accuracy by fixing at a predetermined position without performing active alignment that optically aligns, shortening manufacturing time, and improving productivity.
[0048]
A sixth resin-encapsulated optical module according to the present invention is the resin-encapsulated optical module according to any one of the first to fifth embodiments of the present invention, wherein the spacer is made of metal, and hole processing is easy. However, because pigtails can be joined by short welding, manufacturing time can be shortened and productivity can be improved. Since the pigtail is joined by welding, the airtightness of the joint is high, so that the reliability of the resin-encapsulated optical module is improved.
[0049]
  A seventh resin-encapsulated optical module according to the present invention is the resin-encapsulated optical module according to any one of the first to sixth aspects of the present invention.TransparentSince the resin is a silicone resin, the optical waveguide portion is excellent in transparency and has little influence on the corrosion of the optical semiconductor element due to humidity.
  In addition, a method for manufacturing a resin-encapsulated optical module according to the present invention includes a resin-encapsulated optical module having a configuration in which an optical semiconductor element mounted on an element mounting substrate member and an optical fiber are arranged on the same optical axis. In the manufacturing method, the spacer having the step of mounting the optical semiconductor element and the lens on the element mounting substrate member, a hole forming a part of the optical waveguide portion, and an optically transparent plug for closing the hole, and the element A step of installing a mounting board member on the same surface of the wiring board so that light emitted from the optical semiconductor element passes through the hole after passing through the lens; and between the optical semiconductor element and the plug A pigtail in which the optical fiber is installed and held and fixed after the step of sealing with a transparent resin, the step of sealing the outside of the transparent resin with an opaque mold resin, and the step of sealing with the mold resin The And a step of bonding to the spacer so that the optical axis of the optical fiber coincides with the optical axis of the optical semiconductor element and the lens, so that the incidence of defects during resin sealing is small and high. With productivity, resin-encapsulated optical modules can be produced.
  Another method for manufacturing a resin-encapsulated optical module according to the present invention is a resin-encapsulated light having a configuration in which an optical semiconductor element mounted on an element mounting substrate member and an optical fiber are disposed on the same optical axis. In the module manufacturing method, a spacer having a step of mounting the optical semiconductor element on the element mounting substrate member, a hole forming a part of the optical waveguide portion, and an optically transparent lens closing the hole, and the element mounting And a step of installing the substrate member on the same surface of the wiring board so that light emitted from the optical semiconductor element passes through the hole, and sealing between the optical semiconductor element and the lens with a transparent resin A step of sealing the outer side of the transparent resin with an opaque mold resin, and a step of sealing the mold resin with the mold resin. When And a step of bonding to the spacer so that the optical axis of the recording semiconductor element and the lens coincide with each other, so that the occurrence rate of defects during resin sealing is small, and the resin sealing is performed with high productivity. Can produce optical modules.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view showing the structure of a resin-encapsulated optical module according to Embodiment 1 of the present invention.
FIG. 2 is a schematic cross-sectional view showing the structure of a resin-encapsulated optical module according to Embodiment 2 of the present invention.
FIG. 3 is a schematic cross-sectional view showing the structure of a resin-encapsulated optical module according to Embodiment 3 of the present invention.
FIG. 4 is a schematic cross-sectional view showing the structure of a resin-encapsulated optical module according to Embodiment 4 of the present invention.
FIG. 5 is a schematic vertical sectional view of a resin-sealed optical module disclosed in Japanese Patent Laid-Open No. 9-127376.
[Explanation of symbols]
1 LD, 2 PD, 3 optical semiconductor element, 4 element mounting substrate member, 5 optical fiber, 6 pigtail, 7 spacer, 8 optical waveguide hole, 9 wiring board, 10 first lens, 11 plug, 12 optical fiber Resin coating, 13 transparent resin, 14 mold resin, 15 external electrode, 20 resin-encapsulated optical module, 21 second lens, 35 frame substrate, 36 holding substrate, 37 optical fiber support member.

Claims (9)

In a resin-encapsulated optical module having a configuration in which an optical semiconductor element mounted on an element mounting substrate member and an optical fiber are disposed on the same optical axis, the pigtail in which the optical fiber is installed and fixed, A spacer that forms part of an optical waveguide portion between an optical fiber and the optical semiconductor element, a spacer to which the pigtail is joined, and an optically transparent plug that closes the hole of the spacer; A lens provided on the optical axis and provided between the optical semiconductor element and the plug; and a wiring board provided with the element mounting board member and the spacer on the same surface. between the at least the optical semiconductor element plug of the optical waveguide portion is sealed by a transparent tree fat, and wherein the outside of the transparent resin except the pigtail is sealed with an opaque molding resin Resin-sealed optical module   The resin-encapsulated optical module according to claim 1, wherein the stopper is a lens.   The resin-encapsulated optical module according to claim 1, wherein the lens is provided on the element mounting substrate member. In a resin-encapsulated optical module having a configuration in which an optical semiconductor element and an optical fiber mounted on an element mounting substrate member are arranged on the same optical axis, the pigtail in which the optical fiber is internally installed and fixed, and the light A spacer that forms a part of an optical waveguide portion between a fiber and the optical semiconductor element; a spacer to which the pigtail is joined; an optically transparent lens that closes the hole of the spacer; and said spacer element mounting board member is provided with a wiring board provided on the same surface, at least between the optical semiconductor element and the lens of the optical waveguide portion is sealed by a transparent tree butter, A resin-encapsulated optical module, wherein the outer side of the transparent resin except for the pigtail is sealed with an opaque mold resin.   5. The resin-encapsulated optical module according to claim 1, wherein the element mounting substrate member is a silicon substrate.   The resin-encapsulated optical module according to claim 1, wherein the spacer is a metal. The resin-encapsulated optical module according to claim 1, wherein the transparent resin is a silicone resin. In the manufacturing method of the resin-encapsulated optical module having the configuration in which the optical semiconductor element mounted on the element mounting substrate member and the optical fiber are arranged on the same optical axis,
A spacer having a step of mounting the optical semiconductor element and the lens on the element mounting substrate member, a hole forming a part of the optical waveguide portion, and an optically transparent plug for closing the hole, and the element mounting substrate member Are disposed on the same surface of the wiring board so that light emitted from the optical semiconductor element passes through the hole after passing through the lens, and a transparent resin is provided between the optical semiconductor element and the plug. A step of sealing, a step of sealing the outer side of the transparent resin with an opaque mold resin, and a step of sealing with the mold resin after the optical fiber is installed and held and fixed. And a step of joining to the spacer so that the optical axes of the optical semiconductor element and the lens coincide with each other. In the manufacturing method of the resin-encapsulated optical module having the configuration in which the optical semiconductor element mounted on the element mounting substrate member and the optical fiber are arranged on the same optical axis,
A step of mounting the optical semiconductor element on the element mounting substrate member; a spacer having a hole forming a part of the optical waveguide portion; and an optically transparent lens closing the hole; and the element mounting substrate member. A step of placing the light emitted from the optical semiconductor element on the same surface of the wiring board so as to pass through the hole, a step of sealing between the optical semiconductor element and the lens with a transparent resin, and the transparent A step of sealing the outside of the resin with an opaque mold resin; and a step of sealing the optical fiber with the mold resin after the step of sealing with the mold resin, the optical axis of the optical fiber, the optical semiconductor element, and the optical fiber And a step of bonding to the spacer so that the optical axis of the lens coincides with the lens.

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