JP2003161865A - Resin-sealed optical module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin-sealed optical module excellent in reliability and productivity, in which resin molding does not cause a misalignment between an optical semiconductor element and optical fiber or breakage and degradation of the optical fiber. <P>SOLUTION: The resin-sealed optical module has a pigtail in which an optical fiber is disposed, and a hole which constitutes a part of an optical waveguide. It is provided with a spacer to which the pigtail is jointed, an optical transparent plug which stops the hole of spacer, an element mounting board member on which an optical semiconductor element and a lens are mounted, and a wiring board where the element mounting board member and the spacer are provided on the same plane. At least an optical waveguide between the optical semiconductor element, the lens, and the plug is sealed with a transparent first resin, while the outside of the first resin is sealed with an opaque second resin. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical module used for optical communication, and more particularly to an optical module having an optical semiconductor element such as a laser diode or a photodiode and an optical fiber and sealed with a resin. is there.

[0002]

2. Description of the Related Art Conventionally, from the viewpoint of reliability, an optical module has an optical semiconductor element and an optical fiber fixed to a ceramic box, and the ceramic box is covered with a metal or ceramic plate. The structure was kept airtight. And
The optical axes of the optical semiconductor element and the optical fiber were aligned with each other when the optical fiber was fixed to the pigtail in advance and the pigtail was welded to the ceramic box. However, since the optical module having the ceramic hermetic structure has a high manufacturing cost, an optical module sealed with a resin has been developed from the viewpoint of cost reduction.

FIG. 5 is a schematic vertical sectional view of a resin-sealed optical module disclosed in Japanese Patent Laid-Open No. 9-127376. In FIG. 5, 31 is a laser diode (denoted as LD), 32 is a photodiode (denoted as PD), 33
Is an optical fiber, 34 is an element mounting substrate member, 35 is a frame substrate, 36 is a pressing substrate, 37 is an optical fiber supporting member, 38 is a resin coating of the optical fiber, 39 is a transparent resin, 4
Reference numeral 0 is a mold resin, and 41 is a resin-sealed optical module.

The resin-sealed optical module 41 disclosed in Japanese Unexamined Patent Publication No. 9-127376 discloses a holding substrate 36 for fixing an optical fiber support member 37 in which an optical fiber 33 is inserted, and a light such as an LD 31 or a PD 32. An element mounting substrate member 34 on which a semiconductor element is mounted is fixed to a frame substrate 35, an optical coupling portion between the optical semiconductor element and the optical fiber 33 is covered with a transparent resin 39, and the whole is sealed with a mold resin 40. To do.

Further, in Japanese Patent Application Laid-Open No. 11-68254, a silicon substrate fixing an LD and an optical fiber and a lead frame holding the silicon substrate are cast in a mold with a thermosetting liquid resin. Discloses a resin-sealed optical module molded in.

[0006]

[Patent Document 1] Japanese Patent Application Laid-Open No. 9-127
Resin-sealed optical module 4 disclosed in Japanese Patent No. 376
From the viewpoint of productivity, when the molding resin of No. 1 is molded by transfer molding capable of simultaneously molding a large number of modules in a short time, the optical semiconductor element and the optical fiber 33 are optically coupled. After that, that is, since the optical fiber 33 is to be molded, the optical fiber 3 is molded by the molding pressure of the molding resin 40.
There is a problem that an external force is applied to 3 and the alignment between the optical semiconductor element and the optical fiber 33 is misaligned. In addition, a mold is used for transfer molding, and the mold is pressed with a high clamping force so that the mold resin does not leak due to the pressure during molding, so the resin of the optical fiber sandwiched between the molds There is a problem that the coating 38 is damaged and the reliability of the optical fiber is lowered. And the optical fiber 33
Since the optical module is attached, there is a problem that it takes time to set the optical module in the mold and to take it out from the mold, which lowers productivity.

In the resin-sealed optical module by casting disclosed in Japanese Unexamined Patent Publication No. 11-68254, the casting temperature cannot be raised because of the problem that the resin coating of the optical fiber is deteriorated, and the resin sealing is performed. There is a problem that it takes a long time to stop and the productivity of the optical module becomes low.

In addition, the conventional resin-sealed optical module is
Since the whole is sealed with resin, there is a problem that the pigtail with the optical fiber can be fixed to the optical module in a short time and welding with excellent sealing property of the fixing part cannot be used. It was The present invention has been made to solve the problems of the conventional resin-sealed optical module as described above, and during resin molding, misalignment between the optical semiconductor element and the optical fiber and damage to the optical fiber or It is an object of the present invention to provide a resin-sealed optical module which does not cause deterioration, has high reliability, and has excellent productivity.

[0009]

In a first resin-sealed optical module according to the present invention, an optical semiconductor element mounted on an element mounting substrate member and an optical fiber are arranged on the same optical axis. In the resin-sealed optical module, the pigtail having the optical fiber provided therein and held and fixed, and the hole forming a part of an optical waveguide portion between the optical fiber and the optical semiconductor element, A spacer bonded to each other, an optically transparent stopper that closes the hole of the spacer, a lens that is on the optical axis and that is provided between the optical semiconductor element and the stopper, and the element mounting A wiring board having the substrate member and the spacer provided on the same surface, and at least a portion of the optical waveguide portion between the optical semiconductor element and the plug is sealed with a transparent first resin, A second opaque outer side of the first resin Those sealed with resin.

A second resin-sealed optical module according to the present invention is the same as the first resin-sealed optical module, wherein the plug is a lens.

A third resin-sealed optical module according to the present invention is the same as the first or second resin-sealed optical module,
The lens is provided on the element mounting substrate member.

A fourth resin-sealed optical module according to the present invention is a resin-sealed optical module having a structure in which an optical semiconductor device mounted on a device mounting board member and an optical fiber are arranged on the same optical axis. A pigtail in which the optical fiber is provided and held and fixed, and a hole forming a part of an optical waveguide portion between the optical fiber and the optical semiconductor element,
A spacer to which the pigtail is joined, an optically transparent lens that closes the hole of the spacer, and a wiring substrate provided with the element mounting substrate member and the spacer on the same surface, At least the space between the optical semiconductor element and the lens of the optical waveguide portion is sealed with a transparent first resin, and the outside of the first resin is sealed with an opaque second resin. .

A fifth resin-sealed optical module according to the present invention is the resin-sealed optical module according to any one of the first to fourth aspects of the present invention, wherein the element mounting substrate member is a silicon substrate.

A sixth resin-sealed optical module according to the present invention is the resin-sealed optical module according to any one of the first to fifth inventions, wherein the spacer is made of metal.

A seventh resin-sealed optical module according to the present invention is the resin-sealed optical module according to any one of the first to sixth aspects of the present invention, wherein the first resin is a silicone resin.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1. FIG. 1 is a schematic sectional view showing the structure of a resin-sealed optical module according to the first embodiment of the present invention. In FIG. 1, 1 is LD, 2 is P
D, 3 is an optical semiconductor element, 4 is an element mounting substrate member, 5 is an optical fiber, 6 is a pigtail, 7 is a spacer, 8 is an optical waveguide hole, 9 is a wiring board, 10 is a first lens, and 11 is Plug, 12 is resin coating of optical fiber, 13 is transparent resin, 1
Reference numeral 4 is a mold resin, 15 is an external electrode, and 20 is a resin-sealed optical module.

As shown in FIG. 1, a resin-sealed optical module 20 of the present embodiment is a wiring board having internal electrodes (not shown) and external electrodes 15 electrically connected to the internal electrodes. On the same surface of 9, the element mounting substrate member 4 and the spacer 7 are placed in contact with each other. Although not shown in FIG. 1, in addition to the element mounting board member 4 and the spacer 7, other semiconductor elements and components such as resistors and capacitors may be mounted on the wiring board 9. In the element mounting board member 4,
The optical semiconductor element 3 such as LD1 or PD2 is installed at a predetermined position on the opposite side to the end in contact with the spacer 7, and the optical semiconductor element 3 substantially coincides with the optical axis of the emitted light of the LD1 and is focused on the emitted light surface of the LD1. The first lens 10 is installed at the connecting position. Although the first lens 10 is a spherical lens in the present embodiment, it may be an aspherical lens other than the spherical lens, or the lens may be fixed in advance by a holder or the like. Further, although the first lens 10 is one, it may be installed so that a plurality of lens groups are formed and the combined focus thereof is connected to the emission light surface of the LD 1. Although not shown in FIG. 1, other semiconductor elements and components such as resistors and capacitors are also mounted on the element mounting substrate member 4 at locations other than the optical waveguide portion formed by the optical semiconductor element 3 and the lens 10. You may.

The spacer 7 is provided with a hole 8 of an optical waveguide having a size that allows the light emitted from the LD 1 and made substantially parallel by the first lens 10 to pass therethrough. In this embodiment,
Although the shape of the hole 8 is circular, the shape is not limited to this and may be, for example, an ellipse or a quadrangle. A plug 11 for preventing the transparent resin 13 from leaking at the time of sealing is provided in the hole 8 so as to be substantially flush with the surface of the spacer 7 facing the first lens 10. The plug 11 is optically transparent to the light emitted from the LD 1. In this embodiment, the stopper 11 is the first lens 1 of the spacer 7.
Although it is provided so as to be substantially flush with the surface facing 0,
It may be provided inside the hole 8. The spacer 7 has an optical fiber 5 on the surface opposite to the surface facing the first lens 10.
The pigtail 6 is internally provided and held and fixed so that the optical axes of the optical fiber 5 and the LD 1 and the first lens 10 coincide with each other.

The portion where the optical semiconductor element 3 such as LD1 and PD2 is provided and the portion from the LD1 to the first lens 10 and the stopper 11 of the spacer in the optical waveguide portion are sealed with the transparent resin 13. Then, the outside of the transparent resin 13, the element mounting board member 4, the mounting surface of the wiring board 9 on which the element mounting board member 4 is mounted, and the first lens 10 of the spacer 7.
The surface opposite to is sealed with an opaque mold resin 14. In the present embodiment, the element mounting substrate member 4 mounting surface of the wiring board 9 and the surface of the spacer 7 facing the first lens 10 are sealed with the opaque mold resin 14. The side surface of the spacer 7 may also be sealed with the mold resin 14. Wiring board 9 and spacer 7
If the side surface of the resin-sealed optical module 20 is sealed with the mold resin 14, the moisture resistance of the resin-sealed optical module 20 is further improved.

The wiring substrate 9 may be an organic substrate, a ceramic substrate, a glass ceramic substrate, or the like. However, the electrical loss of high frequency signals is small and the design of a high frequency circuit is relatively easy. Ceramic substrates are preferred. As the ceramic substrate, a general-purpose and low-cost alumina substrate is particularly preferable. The glass-ceramic substrate is also particularly preferably one based on alumina because it is versatile and low in cost.

As the element mounting substrate member 4, a silicon substrate, a metal carrier or a ceramic substrate can be used. Since the silicon substrate can be processed by a semiconductor process, the processing accuracy is good, and the optical semiconductor element 3 of the LD 1 or PD 2 and the first lens 10 can be positioned accurately. Therefore, the silicon substrate does not need to perform active alignment for optically aligning it, but can fix passive optical alignment by securing it at a predetermined position, which can shorten the manufacturing time.
This is preferable because productivity is improved.

The spacer 7 is made of a metal or ceramic capable of welding the pigtail 6 in a short time and with high precision. In particular, the spacer 7 is provided with a hole 8 serving as an optical waveguide, and a metal is preferable in terms of easiness of hole processing and cost. The metal is not particularly limited,
Stainless steel is particularly preferable in terms of workability and versatility, and 42 alloy which is an iron-nickel alloy is particularly preferable in terms of low thermal expansion.

From the viewpoint of optical transparency, the plug 11 may be made of the same material as that used for the lens of the optical module.

A silicone resin is used as the transparent resin 13. A silicone-based resin is preferable because it diffuses water but has a small function of adsorbing water, that is, it absorbs a small amount of water, so that corrosion of the optical semiconductor element does not easily occur.
Further, as the transparent resin 13, an ultraviolet curable resin or a thermosetting resin is used. If the transparent resin 13 spreads from the time it is applied to the time it is cured, it becomes difficult to form an optical waveguide, so it is necessary to maintain the shape in a convex shape. A UV-curable resin is preferred because it can be cured immediately after application by UV irradiation before the shape to be retained is collapsed and the shape can be retained. Even a thermosetting resin can be used by adding a small amount of fine silica within a range that is translucent but satisfies the transmittance to improve thixotropy and impart shape retention. That is, as the transparent resin 13, it suffices to ensure a transmittance of 30% or more (1 mm thickness) in the wavelength range of the optical signal emitted or received by the optical semiconductor element 3.

The opaque mold resin 14 is preferably an epoxy resin having good moldability and adhesiveness.

Next, a manufacturing process of the resin-sealed optical module 20 of this embodiment will be described. First, the LD 1, the PD 2, and the first lens 10 are fixed to predetermined positions on the upper surface of the element mounting substrate member 4. LD1 and PD2 are fixed with solder or an adhesive agent. The first lens 10 has a groove formed on the upper surface of the element mounting substrate member 4 along the optical waveguide, and is fixed at a predetermined position of the groove with an adhesive.

A hole is formed in the spacer 7 at a position to be an optical waveguide, and a step portion having a diameter larger than the diameter of the hole into which the plug 11 can be inserted is formed in the hole, and the optically transparent plug 11 is bonded to the step portion. Next, the element mounting board member 4 and the spacer 7 are placed on the wiring board 9 and fixed by soldering. At this time, the element mounting substrate member 4 and the spacer 7 are
The light emitted from the LD 1 provided on the element mounting substrate member 4 is installed so as to pass through the hole 8 of the spacer 7 after passing through the first lens 10. And LD1, PD2,
The semiconductor elements and components mounted on the element mounting board member 4 and the semiconductor elements and components mounted on the wiring board 9 are electrically connected to internal electrodes communicating with the external electrodes 15 of the wiring board by wire bonding or the like. It

Next, the optical semiconductor element 3 such as LD1 and PD2
Then, the LD 1 and the optical waveguide portion from the LD 1 to the plug 11 that closes the hole 8 of the spacer 7 are sealed with the transparent resin 13 using a dispenser. Further, the semi-finished product of this optical module is set in a mold, and the outside of the transparent resin 13, the element mounting board member 4, the mounting surface of the wiring board 9 on which the element mounting board member 4 is mounted, and the spacer 7. First lens 1
The surface facing 0 is sealed with an opaque mold resin by transfer molding. At this time, the side surface portion of the wiring board 9 may be sealed within the range where the external electrodes are not covered. The spacer 7 may also have its side surface sealed. In the present embodiment, the optical module is sealed with an opaque mold resin,
It is performed by transfer molding, but may be performed by casting using a mold.

Finally, the pigtail 5 to which the optical fiber 4 is fixed is fixed to the spacer 7 by YAG welding while being optically aligned, and the resin-sealed optical module 2
Complete 0.

The resin-sealed optical module 20 of this embodiment
The LD1 and the PD2 are mounted on the element mounting substrate member 4, but either one of the LD1 and the PD2 may be mounted. When only the PD 2 is mounted, the first lens 10 is installed at a position that focuses on the light receiving surface of the PD 2.

The resin-sealed optical module 20 of this embodiment
Is a structure in which the optical fiber is attached after resin sealing the optical module, and even when the molding resin is sealed by transfer molding, no undue force is applied to the optical fiber, so the optical axis does not shift, and Since there is no damage to the resin coating of the optical fiber, it is possible to produce a resin-sealed optical module with a low defect occurrence rate and high productivity. Also, in sealing the mold resin by casting using a mold, the mold temperature can be increased, so that the curing time can be shortened and the resin-sealed optical module can be produced with high productivity.

Embodiment 2. FIG. 2 is a schematic sectional view showing the structure of the resin-sealed optical module according to the second embodiment of the present invention. In FIG. 2, reference numeral 21 is a second lens.

As shown in FIG. 2, the resin-sealed optical module 20 of the present embodiment has a second lens 21 in place of the plug 11 of the resin-sealed optical module of the first embodiment.
The structure is the same as that of the first embodiment except that the hole 8 of the spacer 7 is closed. As with the first lens 10, a spherical lens or an aspherical lens is also used for the second lens 21. In the present embodiment, since the second lens 21 is provided near the optical fiber 5, light can be condensed and transmitted to the optical fiber 5, and the optical fiber 5 and the optical semiconductor element 3 can be connected to each other. The optical coupling becomes stronger.

Embodiment 3. FIG. 3 is a schematic sectional view showing the structure of the resin-sealed optical module according to the third embodiment of the present invention. As shown in FIG. 3, in the resin-sealed optical module 20 of the present embodiment, the second lens 21 having a diameter larger than the diameter of the hole 8 is provided near the end of the element mounting substrate member 4 in contact with the spacer 7. Then, when the element mounting board member 4 and the spacer 7 are installed on the wiring board 9, the second lens 21 is arranged so as to cover the hole 8, and the second lens 21 is bonded to the spacer 7. Other than that, the structure is the same as that of the second embodiment. In the present embodiment, the second lens 21 can be provided on the element mounting substrate member 4,
The alignment between the optical semiconductor element 3 and the second lens 21 is easy.

Fourth Embodiment FIG. 4 is a schematic sectional view showing the structure of the resin-sealed optical module according to the fourth embodiment of the present invention. In the present embodiment, the element mounting substrate member 4
The structure is the same as that of the second embodiment except that the first lens 10 is not provided above, and the element mounting substrate member 4 can be shortened, so that the resin-sealed optical module 20 can be further downsized.

[0036]

EXAMPLES The present invention will be described in more detail by way of examples.

Example 1. As an element mounting board member, a wiring substrate is formed on the front surface and a gold plating is applied to the back surface of the silicon substrate 4 (length 5 mm x width 3 mm x thickness 0.5 m).
m) is used. The silicon substrate 4 is placed in a predetermined position at L
D1 and PD2 and spherical first lens 10 (diameter 1 mm)
And are fixed. After the positioning, the first lens 10 is fixed to the V groove provided in the silicon substrate 4 with an adhesive or the like. As the wiring board 9, an alumina substrate (length 12 mm x
A width of 10 mm and a thickness of 1 mm) is used. On the alumina wiring board 9, first, the silicon substrate 4 on which the LD 1, PD 2 and the first lens 10 are mounted is fixed at a predetermined position by soldering.

As the spacer 7, a stainless steel plate (width 6 mm × height 5 mm × thickness 2 mm) is used. The spacer 7 is provided with a hole 8 (diameter 1.5 mm) for the optical waveguide, and the hole 8 has a diameter of 2 mm around the hole on the side facing the first lens 10. An optically transparent stopper 11 is adhered to the portion with an adhesive. The spacer 7 having the hole 8 for the optical waveguide and the hole 8 closed with the optically transparent plug 11 has the surface on which the plug 11 is provided as the first lens 1
It is joined to the alumina wiring board 9 by solder so as to face 0.

In addition, a semiconductor element or an electronic component is fixed to a predetermined position on the wiring board 9 by soldering, if necessary. Then, the optical semiconductor element 3 or the semiconductor element or the electronic component is connected to the electrodes of the silicon substrate or the alumina wiring substrate 9 by a gold wire.

The optical waveguide portion between the LD 1, PD 2, the first lens 10 and the plug 11 is sealed with an optically transparent silicone resin 13. This sealing is performed by applying silicone resin 13 to the optical waveguide portion with a dispenser and heating and curing at a predetermined temperature and time. The outside of the sealing portion of the transparent resin 13 is sealed with an epoxy opaque mold resin. The encapsulation with the opaque mold resin is performed by transfer molding for 90 seconds by setting a semi-finished product of the optical module in a multi-die. After transfer molding, the sealed optical module is taken out of the mold and kept at 160 ° C.
The post-curing of the molding resin is performed under the condition of 6 hours.

After encapsulating with an opaque mold resin, the optical module is arranged so that the pigtail 6 having the optical fiber 5 fixed to the spacer 7 is optically aligned with the Y-axis.
Attach by AG welding.

Example 2. In this embodiment, the silicon substrate 4
In addition, LD1 and PD2 and the spherical first lens 10 (diameter 1 m
m) and the spherical second lens 21 (diameter 3 mm) are fixed, and the stopper 11 is not provided in the optical waveguide hole 8 (diameter 1.5 mm) of the spacer 7 of the stainless steel plate. The resin-sealed optical module 20 has the same structure as that of the first embodiment, except that the second lens 21 provided at the end of the silicone substrate 4 that contacts the spacer 7 closes the hole 8 of the spacer.

[0043]

The first resin-sealed optical module according to the present invention is a resin-sealed optical module in which the optical semiconductor element mounted on the element mounting substrate member and the optical fiber are arranged on the same optical axis. In an optical module, a pigtail in which the optical fiber is provided and held and fixed, and a hole forming a part of an optical waveguide portion between the optical fiber and the optical semiconductor element are joined, and the pigtail is joined. A spacer, an optically transparent stopper that closes the hole of the spacer, a lens that is on the optical axis, and is provided between the optical semiconductor element and the stopper,
A wiring board having the element mounting board member and the spacer provided on the same surface, wherein at least a portion of the optical waveguide portion between the optical semiconductor element and the plug is transparent;
And a structure in which an optical fiber can be attached after the optical module is resin-sealed, and the first resin is sealed with an opaque second resin on the outside of the first resin. It is possible to produce a resin-sealed optical module with a low incidence of defects during sealing and with high productivity.

The second resin-sealed optical module according to the present invention is different from the first resin-sealed optical module in that the stopper is the lens and the lens is provided near the optical fiber, so that the light is collected. Light can be transmitted to the optical fiber, and the optical coupling between the optical fiber and the optical semiconductor device can be strengthened.

The third resin-sealed optical module according to the present invention is the same as the first or second resin-sealed optical module,
Since the lens is provided on the element mounting substrate member, the alignment between the optical semiconductor element and the lens is easy, the manufacturing time can be shortened, and the productivity is improved.

A fourth resin-sealed optical module according to the present invention is a resin-sealed optical module having a structure in which an optical semiconductor device mounted on a device mounting board member and an optical fiber are arranged on the same optical axis. A pigtail in which the optical fiber is provided and held and fixed, and a hole forming a part of an optical waveguide portion between the optical fiber and the optical semiconductor element,
A spacer to which the pigtail is joined, an optically transparent lens that closes the hole of the spacer, and a wiring substrate provided with the element mounting substrate member and the spacer on the same surface, At least the space between the optical semiconductor element and the lens of the optical waveguide portion is sealed with a transparent first resin, and the outside of the first resin is sealed with an opaque second resin. Since the lens is provided in the hole of the spacer, the element mounting board member can be shortened, and the resin-sealed optical module can be further downsized.

A fifth resin-sealed optical module according to the present invention is the resin-sealed optical module according to any one of the first to fourth aspects of the present invention, wherein the element mounting substrate member is a silicon substrate. Since the substrate can be processed by a semiconductor process, the processing accuracy is good, and the optical semiconductor element and the lens can be accurately positioned. Therefore, it is possible to perform passive alignment in which optical accuracy can be ensured by fixing it at a predetermined position without performing active alignment for optically aligning, and it is possible to reduce manufacturing time and improve productivity.

A sixth resin-sealed optical module according to the present invention is the resin-sealed optical module according to any one of the first to fifth aspects of the present invention, in which the spacer is made of metal, and holes are easily drilled. Since the pigtail can be joined by welding with a short joining time, the manufacturing time can be shortened and the productivity can be improved. When the pigtails are joined by welding, the airtightness of the joint is high, and therefore the reliability of the resin-sealed optical module is improved.

A seventh resin-sealed optical module according to the present invention is the resin-sealed optical module according to any one of the first to sixth aspects of the present invention, wherein the first resin is a silicone resin, and the optical waveguide part Has excellent transparency, and has little influence on the corrosion of the optical semiconductor element due to humidity.

[Brief description of drawings]

FIG. 1 is a schematic sectional view showing a structure of a resin-sealed optical module according to a first embodiment of the present invention.

FIG. 2 is a schematic sectional view showing a structure of a resin-sealed optical module according to a second embodiment of the present invention.

FIG. 3 is a schematic sectional view showing a structure of a resin-sealed optical module according to a third embodiment of the present invention.

FIG. 4 is a schematic sectional view showing a structure of a resin-sealed optical module according to a fourth embodiment of the present invention.

FIG. 5 is a schematic vertical sectional view of a resin-sealed optical module disclosed in Japanese Patent Laid-Open No. 9-127376.

[Explanation of symbols]

1 LD, 2 PD, 3 optical semiconductor element, 4 element mounting substrate member, 5 optical fiber, 6 pigtail, 7 spacer, 8 optical waveguide hole, 9 wiring board, 10 1st
Lens, 11 plugs, 12 optical fiber resin coating, 1
3 transparent resin, 14 mold resin, 15 external electrodes,
20 resin-sealed optical module, 21 second lens, 3
5 frame substrate, 36 pressing substrate, 37 optical fiber supporting member.

Continued front page    (72) Inventor Hirofumi Fujioka             2-3 2-3 Marunouchi, Chiyoda-ku, Tokyo             Inside Ryo Electric Co., Ltd. (72) Inventor Akino Sawai             2-3 2-3 Marunouchi, Chiyoda-ku, Tokyo             Inside Ryo Electric Co., Ltd. F term (reference) 2H037 AA01 BA03 BA12 CA13 CA14                       DA03 DA04 DA05 DA18 DA36

Claims (7)

[Claims] 1. In a resin-sealed optical module having a structure in which an optical semiconductor element mounted on an element mounting substrate member and an optical fiber are arranged on the same optical axis, the optical fiber is internally provided and held and fixed. With a pigtail and a hole that forms a part of an optical waveguide portion between the optical fiber and the optical semiconductor element, and a spacer to which the pigtail is joined, and an optical that closes the hole of the spacer. A transparent stopper, a lens provided on the optical axis between the optical semiconductor element and the stopper, and a wiring board provided with the element mounting substrate member and the spacer on the same surface are provided. At least the space between the optical semiconductor element and the plug of the optical waveguide portion is sealed with a transparent first resin, and the outside of the first resin is sealed with an opaque second resin. A resin-sealed optical module characterized by the above. 2. The resin-sealed optical module according to claim 1, wherein the plug is a lens. 3. The resin-sealed optical module according to claim 1, wherein the lens is provided on the element mounting substrate member. 4. A resin-sealed optical module having a structure in which an optical semiconductor element mounted on an element mounting substrate member and an optical fiber are arranged on the same optical axis, wherein the optical fiber is internally provided and held and fixed. A spacer that has a pigtail and a hole that forms a part of an optical waveguide portion between the optical fiber and the optical semiconductor element, and a spacer to which the pigtail is joined, and an optical transparent that closes the hole of the spacer. A lens and a wiring board having the element mounting board member and the spacer provided on the same surface, and a first transparent section at least between the optical semiconductor element and the lens of the optical waveguide section. The resin-sealed optical module, wherein the first resin is sealed with an opaque second resin and the outside of the first resin is sealed with the second resin. 5. The resin-sealed optical module according to claim 1, wherein the element mounting substrate member is a silicon substrate. 6. The resin-sealed optical module according to claim 1, wherein the spacer is made of metal. 7. The resin-sealed optical module according to claim 1, wherein the first resin is a silicone resin.