JPH1168254A - Optical module and manufacture of optical module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical module provided with superior optical coupling property and package moldability. SOLUTION: For this optical module 31, a silicon substrate 17, on which highly accurately optically coupled laser diode 19 and optical fiber 6 are fixed and mounted and a lead frame 22 for holding the silicon substrate 17, are integrally packaged by a sealing body 14, composed of the hardened object of thermosetting liquid resin for injection molding and provided with the fiber projection part 14a of a fillet form formed by surrounding the periphery of the substrate root part of the optical fiber 6, whose one part is extended from the silicon substrate 17.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an optical module and a method for manufacturing the same.

[0002]

2. Description of the Related Art A conventional optical module having an optical semiconductor element and an optical fiber is packaged (sealed) by a hermetic sealing method using a metal or ceramic material case. ing. Because these are hermetically sealed packaging,
Excellent long-term reliability. However, since it is necessary to process a metal or ceramic case with high precision and to match the optical coupling between the laser diode and the optical fiber, processes such as sealing assembly have been complicated. For this reason, mass productivity is low,
Optical modules were expensive.

On the other hand, in order to reduce the cost of an optical module, a sealing technique using a resin material as a packaging member is known. For example, in U.S. Pat.No. 4,915,519, a 16-pin dual in-line package (DIP)
There is disclosed a technology in which an optical module component is housed in a molded plastic frame and covered with a metal lid. In Japanese Patent Application Laid-Open No. 57-177580, a light conversion element including a light emitting element and a light receiving element and an integrated circuit are installed on a lead frame, and molded and sealed with a transparent resin such as an epoxy resin. A technique of inserting and bonding in an opaque housing is disclosed. The problem with this disclosed technique is that it is difficult to achieve optical coupling for each element. Further, JP-A-61-3108 and JP-A-7-19
Japanese Patent No. 3262 discloses a technique of a double-mold sealing method in which a transparent resin is molded on a lead frame having an optical semiconductor element, and then molded with the transparent resin.

[0004]

However, in the case system in which the plastic material and the lead frame of the prior art described above are molded in a case shape in advance and the optical semiconductor element parts are sequentially mounted on the case material, how the case material joint is formed The issue is how to ensure long-term reliability. In addition, in the double molding method, double sealing is performed to accurately realize optical coupling between the optical semiconductor element and the optical fiber, and two types of molds are required for double sealing. Therefore, there is a problem in that the cost increases.

Further, in the method of molding the entire optical semiconductor element component, the long-term reliability is improved as compared with the case method because of the entire mold sealing type without the sealing portion of the package, but (1) heat dissipation of the optical semiconductor element (2) The optical coupling relationship between the optical semiconductor element and the optical fiber, which is adjusted to a predetermined precision, is deviated due to the clamping of the mold and the flow of the molding resin when molding the member on which the optical fiber or the like is mounted. There is a problem to be solved.If the clamping force or the flow force increases, the substrate may be displaced, or the gold wire electrically connecting the electric wiring portion of the substrate and the lead frame may be broken. If the displacement is large, there is a possibility that the optical fiber is damaged or detached from an optical fiber supporting member such as a substrate.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an optical module of a plastic sealing type which leads to a low cost, and which has excellent optical coupling and package moldability, and which is excellent in mass productivity. It is to provide a manufacturing method of. Another object of the present invention is to provide an optical module in which the optical coupling of the optical semiconductor element is ensured and the heat radiation is improved at the same time.

[0007]

The feature of the optical module according to the present invention is that an optically coupled optical semiconductor element, a substrate on which an optical fiber is mounted, and a holder for holding the substrate are integrated by a sealing member. In the optical module, the sealing body is made of a cured product of a thermosetting liquid resin for injection molding, and a part of the sealing body extends from the substrate. The present invention has a fillet-shaped fiber projection formed so as to surround the base portion of the substrate.

Another feature of the optical module is that an optically coupled optical semiconductor element and a substrate on which an optical fiber is mounted, and a holder for holding the substrate are integrally packaged by a sealing member. An optical module, wherein the holder is:
The sealing body is made of a transparent liquid thermosetting silicone resin which is damped by the three-way or four-way dam and is injected and cured.

Another feature is an optical module in which a substrate on which an optically coupled optical semiconductor element and an optical fiber are mounted, and a holder for holding the substrate are integrally packaged by a sealing member. The holding body is made of a copper-polyimide wiring board having a three- or four-way dam, and the sealing body is a first sealing body in which the optical coupling portion is injected and cured with a transparent fixing body; The first object is to form a double sealing body with a second sealing body in which a thermosetting liquid resin is injected and cured so as to be blocked by the three-way or four-way dam while covering the first sealing body. The method for manufacturing an optical module according to the present invention, wherein a holding body holding an optically coupled optical semiconductor element and a substrate on which an optical fiber is mounted is attached to the optical fiber extending from the substrate. At the base of the board Inserting without touching the entire surface of the surface, clamping it with a mold having an injection port facing upward and open to the atmosphere, filling the thermosetting liquid resin first from the injection port, An elastic resin having a curing hardness characteristic softer than the curing hardness of the curable liquid resin is filled in the vicinity of the base portion of the substrate, and the thermosetting liquid resin is integrally sealed with the substrate and the holder. And at the same time hardening and molding as the body and the elastic resin as an elastic body.

According to the present invention, since the encapsulant is injected and molded, the optical coupling between the optical semiconductor element fixedly mounted on the substrate and the optical fiber in a predetermined precision can be avoided, and excellent optical coupling can be achieved. A plastic-sealed optical module that leads to high performance and low cost can be obtained. In addition, since a copper-polyimide wiring board having a large thermal conductivity and having a dam (weir) for preventing injection droop is adopted and the sealing body is injection-molded, both improvement in heat dissipation and securing of optical coupling are compatible.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. First, an optical module of a first example as a first embodiment according to the present invention will be described with reference to FIGS. In FIG. 1, an optical module 31 according to the first embodiment mounts an optical fiber 6 and a laser diode 19 or the like as an optical semiconductor element fixed by optical coupling with predetermined dimensional accuracy (that is, optically coupled). And a silicon substrate 17 as a substrate holding the wiring layer 11 formed on the outer surface, and a lead electrode 15 electrically connected to the optical semiconductor element, and forming the silicon substrate 17
And a lead frame 22 as a holding body for holding the optical fiber 6 extending from the silicon substrate 17 with a part of the sealing body surrounding the base portion of the substrate in the form of a fillet. This is a configuration integrally formed by a sealing body 14 having a fiber projecting portion 14a.

Further, the optical module 31 of the first embodiment will be supplementarily explained from the manufacturing method. Note that the optical semiconductor element is hereinafter abbreviated as an optical element. In FIG. 2, a silicon substrate 17 having a V-shaped shallow V-groove 17a and a V-shaped deep V-groove 17b for mounting the optical fiber 6 is formed on a wiring layer 11 by anisotropic etching and sputtering of silicon, which is a known method. And the formation of The V-groove obtained by anisotropic etching of silicon aligns the optical coupling axis of the optical fiber 6 (the optical fiber wire 6a thereof) with the axis of the light emitting portion such as the laser diode 19 as an optical element with high precision.
In order to perform optical coupling (that is, optical coupling), the depth is adjusted to a predetermined depth in accordance with the dimensions of the optical fiber. These are known methods called a so-called passive alignment method.

In this embodiment, a laser diode or the like as an optical element (generally represented by a laser diode 19,
Is fixed at a predetermined position on a silicon substrate 17 having a V-groove, and a solder layer 16 for establishing electrical conduction is formed. It is desirable that the solder layer 16 be formed on the silicon substrate 17 from the viewpoint of the manufacturing operation. The solder layer 16 is desirably an alloy solder of gold and tin from the point of the reflow temperature or the like, and it is preferable that the optical element mounting portion on the silicon substrate 17 is coated by sputtering. For mounting the optical element on the silicon substrate 17, the optical element is aligned with a predetermined position on the silicon substrate 17 with high precision, and the solder layer 16 is partially melted by heating under nitrogen gas to perform temporary compression bonding. Then, the load is released, and a heat treatment is further performed to dissolve the solder layer 16, and the process is completed.

Thereafter, a silicon substrate on which the optical element is mounted
17 is bonded onto the lead frame 22 via the die attachment 23. The die attachment 23 may be any one as long as it is used for a semiconductor process, but one having high thermal conductivity is desirable in terms of heat dissipation. The optical fiber 6 is placed in the V-groove on the silicon substrate 17, and the fixing body 26 is potted and cured in order to fix the optical fiber 6a and the jacket 6b in the V-groove. In order to shorten the curing process time, it is desirable to use a UV-curable liquid adhesive as the fixing body 26. At this time, the alignment of the optical fiber 6 in the optical axis direction has a great influence on the output of the mounted optical module, so that it is necessary to perform the alignment with high accuracy.

Next, the electrical connection between the optical element and the wiring layer 11 (silicon substrate wiring portion), and furthermore, the electrical connection between the wiring layer 11 and the lead frame 22 are made by bonding with gold wires 24. In addition, the optical coupling portion between the optical element and the optical fiber is protected by potting using a transparent resin as the transparent fixing body 27 and curing and fixing. The transparent resin may be any resin such as an acrylate resin, an epoxy resin, and a silicone resin as long as it is transparent to the emitted light of the laser diode. Is preferred. Thus, the optical module member 28 is manufactured.

Next, as shown in FIGS. 3 and 4, the injection molding dies 1 and 2 (ie, casting) having the cavity 7 on one side and the cavity 28 on the other side, The optical module member 28 is mounted and packaged, and the optical module is sealed. That is, in the figure, the optical module member 28 is disposed between the cavities 7 and 8 of the molds 1 and 2,
The mold is tightened with bolts or the like using the mold fastening bolt holes 5a, b, c, d to clamp the lead frame 22 of the optical module member 28. The mold 1 and the mold 2 use a lead frame.
The mold fastening method may be in any form as long as the mold 22 is fixed.

When the optical module member 28 is clamped to the dies 1 and 2 by the lead frame 22,
The optical fiber 6 is in a state of protruding from the upwardly-opened air-opening inlet 4 formed by the molds 1 and 2,
The periphery of the outer surface of the base portion of the substrate of the optical fiber 6 is in a state in which it does not directly contact the mold 1 and the mold 2. That is, the optical fiber 6 is arranged such that the extending direction thereof is directed upward, and the jacket portion 6b of the optical fiber 6 is disposed substantially at the center of the diameter of the injection port 4, so that the optical module member 28 is It will be set to 2.

In other words, the optical module member 28 (see FIG. 3) is disposed on the molds 1 and 2 (see FIGS. 3 and 4) with the protruding portion of the optical fiber 6 facing upward, and the silicon substrate 17 is held. The lead frame 22 to be clamped by the molds 1 and 2,
The thermosetting liquid resin (or thermosetting liquid resin composition) formed as the sealing body 14 is filled from the injection port 4 (see FIG. 4) formed in the atmosphere open state by the molds 1 and 2. A fillet-shaped fiber projection 14a (see FIG. 4) in which a part of the sealing body 14 is formed so as to surround the base portion of the optical fiber 6 extending from the silicon substrate 17 (extending and protruding). 1) and the molding of the sealing body 14 itself. Finally, as shown in FIG. 5, unnecessary portions of the lead frame 22 are cut and removed, and finally, the lead electrodes 15 are formed, and the optical module 31 shown in FIG. 1 is completed.

The feature of the injection molding using the casting according to the present invention is that the injection port 4 formed by the mold 1 and the mold 2 is open to the atmosphere. Therefore, the optical fiber 6 extending from the substrate base of the silicon substrate 17 and disposed at the injection port 4 is disposed around the jacket portion 6b of the base part (including the vicinity) of the substrate of the extending optical fiber 6. Is in a state where it does not directly touch the molds 1 and 2 over the entire circumference and is located at the center of the injection port 4 which is open to the atmosphere.
Then, a thermosetting liquid resin cured and formed as the sealing body 14 is injected and filled into the cavities 7 and 8 from the injection port 4 so as to fill a part of the lower portion of the injection port 4, and is filled for a predetermined time. Heat curing is performed and the silicon substrate 17
And the lead frame 22 as a holder is integrally sealed.

Here, the above-mentioned fiber protrusion 14a will be supplementarily described. In order to maintain a high-precision optical coupling relationship between the optical semiconductor element and the optical fiber, which are fixedly mounted on the substrate at a predetermined size, it is important that no external force be applied to the optical semiconductor element and the optical fiber during molding. That is,
In the case of injection molding using a casting, it is necessary to prevent the casting from touching the optical fiber (jacket portion) over the entire circumference in order to prevent external force from being applied to the optical fiber. Therefore, the periphery of the optical fiber is open to the atmosphere, in other words, the air hole exists around the optical fiber.

On the other hand, since the casting has an injection port and the injection port is generally open to the atmosphere, it is effective to use the injection port also as the above-mentioned air hole. Of course, there is a configuration in which the injection port and the air hole are separately provided, but this is disadvantageous as compared with a case where both are used. As a result, the casting has an injection port facing upward and open to the atmosphere so that the sealing material to be injected before curing does not drip, and then extends from the substrate in accordance with the injection port. With the outgoing optical fiber facing upward, and
The optical fiber is held by a jig or the like so that the jacket is inserted into the approximate center of the injection port without touching the outer surface of the jacket at the base portion of the optical fiber with the casting. .

By the way, generally, a fillet (form) is formed on the surface of a sealing body made of a thermosetting liquid resin injected from an injection port open to the atmosphere and cured by contact with the atmosphere. This fillet is a name for the surface morphology caused by the natural shrinkage (cured state without receiving external stress) when the thermosetting liquid resin is cured under the atmospheric pressure. Depending on the tension according to the affinity at the interface with the surface, the surface mainly exhibits a descending surface, and in some cases, a rising surface.

FIG. 14 (a) shows the form of fillets on the descending surface, and shows AA 'of the cured product of the thermosetting liquid resin.
As shown by the cross section taken along the BB 'plane, the surface of the cured product is formed to descend below the AA' line (in the direction in which the optical fiber extends). FIG. 14 (b) shows a fillet form of the raised surface.
In the cross section of the plane B ', the surface of the cured product is formed to rise above the line AA' (in the direction in which the optical fiber extends). The AA 'point is two points on the outer surface of the injection-molded optical module, that is, the interface between the optical fiber (jacket portion) and the cured product as a sealing body, and the BB' point is from the AA 'point. There are two arbitrary points extending in the direction in which the optical fiber extends. In addition, it can be said that it is easy to understand that the point BB ′ is the shoulder of the sealing body. Incidentally, the thermosetting liquid resin such as an epoxy resin, an acrylate resin, or a silicone resin employed in the present embodiment has a relatively good affinity for a mold and a jacket portion, and therefore exhibits a descending surface.

Since the thermosetting liquid resin injected from the injection port is generally injected until the cavities 7 and 8 are completely filled, the lower portion of the injection port 4 having a small diameter is also filled. As a result, when the thermosetting liquid resin is cured to form the sealing body 14 as a cured product, the optical fiber 6 (the jacket portion 6b of the optical fiber 6) is formed at a part of the sealing body corresponding to the injection port. ), A fiber protrusion in the form of a fillet which is protruded and hardened around the base portion of the substrate is formed.

At this time, there is no necessity to fill the injection port, and if it is not, the part corresponding to the injection port as a part of the above-mentioned sealing body is sealed. A fillet is formed in a portion recessed from the body. Although a part of the recessed fillet-shaped sealing body is not preferable because the appearance of the product is impaired, the fiber protrusion described in the present invention is formed to be recessed at a portion corresponding to the injection port. It is understood that a fillet-shaped fiber protrusion is also included. In any case,
It can be said that the generation of the fillet due to the natural shrinkage is a proof that the optical coupling relationship with a predetermined accuracy is secured without applying an external force from the mold.

Therefore, by performing the sealing molding in such a state, the sealing body 14 made of the thermosetting liquid resin composition becomes a light in which a part of the sealing body extends from the silicon substrate 17. The fiber 6 has a fillet-shaped fiber projection 14a formed so as to surround the base portion of the substrate. Since the fiber projecting portion 14a has a fillet shape, the stress applied to the optical coupling portion between the optical fiber 6 and the laser diode 19 fixedly mounted in a highly accurate optical coupling dimension relationship is extremely small. For this reason, displacement (damage) of the optical coupling portion due to mold clamping stress and resin flow pressure during molding, which has conventionally occurred in the transfer molding method, does not occur. In addition, fluctuations of the gold wire and the internal transparent resin due to the resin flow pressure are also avoided,
Optical modules having good optical coupling properties will be mass-produced. Further, since the optical module according to the present invention covers the entire substrate and the optical coupling portion with the thermosetting resin composition, the optical module has no sealing portion and is excellent in mechanical strength and heat dissipation.

Before the curing step of the encapsulation molding, it is desirable to degas in a vacuum chamber or the like in order to remove voids in the thermosetting liquid resin composition in the mold. Subsequent curing of the thermosetting liquid resin composition is carried out by putting the entire mold into a heating furnace such as a thermostat, performing a heat treatment for a predetermined time, using a method in which a mold having a built-in heater is used, or a method using heat. Any method may be used as long as the curable liquid resin composition is heated and cured. Desirably, a method in which the mold is put into a heating furnace, and a method in which the mold is directly heated by an electric heater or a hot plate are preferable.

In the present invention, as shown in FIG. 1, since the optical fiber 6 has a structure protruding upward from the mold, the protruding portion of the optical fiber 6 is formed in the peripheral molds 1 and 2.
Optical fiber 6 using a jig so as not to touch
Is desirably configured to grasp the jacket portion 6b and pull it upward with low tension. This not only does not affect the high-precision optical coupling relationship between the optical semiconductor element and the optical fiber, but also at the curing temperature of the thermosetting liquid resin composition,
This is also to prevent the deterioration of the jacket portion 6b close to the mold. However, if the heat resistance of the jacket portion 6b is selected to be sufficiently higher than the curing temperature, there is no problem in this respect even if the mold and the jacket portion come into direct contact with each other.

Next, second and third embodiments of the optical module according to the present invention will be described. FIG. 6 is a diagram showing an optical module according to the second and third embodiments of the present invention. FIG. 7 is a diagram showing optical module substrates according to the second and third embodiments according to the present invention. In FIG. 6, the optical module 32 of the second and third embodiments is shown.
Is determined from the cured hardness of the sealing body 14 in order to prevent the optical fiber 6 from breaking or the like occurring near the fiber protrusion 14a formed at the portion where the optical fiber 6 protrudes from the main body of the sealing body 14. Also, the elastomer 13 is formed of a material having a soft cured hardness characteristic, and the elastomer 13 as an elastic body is formed on the fiber projection 14a.

Here, the elastomer as the above-mentioned elastic body is used.
13 will be described. In the optical module 31 of the first embodiment, when the optical fiber 6 projecting further from the fiber protrusion 14a is bent, the fiber protrusion 14a
At the root of the optical fiber 6, there is a possibility that the optical fiber 6 is cut. The reason for this is that stress is not absorbed by the fiber protrusion 14a when the optical fiber 6 is bent because the fiber protrusion 14a is too rigid. Accordingly, the stress generated when the optical fiber 6 is bent is absorbed by the elastomer 13 having a hardening hardness characteristic softer than the hardening hardness of the sealing body 14, that is, the elastomer 13 formed of an elastic material having elasticity. This is to avoid cutting at the root of the fiber protrusion 14a.

Therefore, the feature of the optical module 32 of the second embodiment according to the present invention is that the laser diode 19 and the like and the optical fiber 6 optically coupled to the laser diode 19 and the like are fixed with a predetermined precision optical coupling dimensional relationship. An optical module in which a silicon substrate 17 fixedly mounted on the body 26 and formed with the wiring layer 11 and a lead frame 22 electrically connected to the laser diode 19 and the like and holding the silicon substrate 17 are sealed, An optical coupling portion between the laser diode 19 and the like and the optical fiber 6 is covered with a transparent body 27 transparent to the emitted light from the laser diode 19 and the like, and a thermosetting liquid resin composition as the sealing body 14 Is filled with a thermosetting liquid resin composition from the injection port 4 by using a casting mold having an injection port 4 which is open to the atmosphere and disposed above the protruding portion of the optical fiber 6. Cured Performed to form a sealing body 14 and the fiber protrusion 14a, then, further inlet 4 a thermosetting silicone resin filled with cured from there to a location that forms the elastomer 13.

On the other hand, after injecting the thermosetting liquid resin composition as the sealing body 14, a thermosetting silicone resin formed as the elastomer 13 is further injected in the uncured state as it is, And fiber projection 14a and elastomer
It is also possible to harden and mold 13 at the same time. In the case where the above-mentioned curing molding is carried out at the same time, the fiber projection of
In addition to avoiding cuts at the root of 14a, the adhesion between the sealing body 14 made of the thermosetting liquid resin composition and the elastomer 13 made of the thermosetting silicone resin is improved, and the curing time is shortened. This is advantageous in terms of

Therefore, the feature of the optical module 32 of the third embodiment according to the present invention is that a laser diode as an optical element is used.
19 and the like, an optical fiber 6 optically coupled to the optical element, a silicon substrate 17 on which the optical element and the optical fiber are mounted with a predetermined optical coupling dimensional relationship, and a lead frame 22 electrically connected to the optical element. An optical module in which an optical element, a silicon substrate, and a part of a lead frame are sealed, and a resin composition in which an optical coupling portion between the optical element and an optical fiber is transparent to light emitted from the optical element. (Transparent body 27) and sealed body 14
Molding using a thermosetting liquid resin composition as a mold is performed by using a casting mold in which an optical fiber protruding portion is disposed at an upper portion, and from an injection port 4 located at the optical fiber protruding portion of the casting mold. After filling the thermosetting liquid resin composition, a thermosetting silicone resin is further filled on the liquid surface of the thermosetting liquid resin composition, and the thermosetting liquid resin composition and the thermosetting silicone resin are cured. Then, the sealing body 14, the fiber protrusion 14a and the elastomer 13 are formed at the same time.

The thermosetting liquid resin composition as the sealing body 14 used in the present invention may be any one which is used for semiconductor encapsulation or is used as a liquid structural adhesive. Anything is fine. In order to reduce the thermal stress after curing, it is desirable to contain a large amount of an inorganic filler and to have a low thermal expansion. Base resin of thermosetting liquid resin composition
As the thermosetting liquid resin, an epoxy resin having good fluidity and electric properties is suitable. Meanwhile, elastomer
13, when epoxy resin is adopted as the sealing body 14,
As a material having a cured hardness characteristic softer than the cured hardness of the epoxy resin, for example, a thermosetting silicone resin is desirable.

The lead frame used in the present invention
The 22 can be a 42 iron-nickel alloy so-called 42 alloy or copper used in a resin-sealed semiconductor device. In order to improve the heat dissipation of the optical semiconductor device, a lead frame using copper having high thermal conductivity is preferable. Further, in the present invention, after the sealing with the thermosetting liquid resin composition as the sealing body 14 is completed, the optical module bases 29 and 30 (package bases) shown in FIGS. By bending, optical modules 31 and 32 as shown in FIGS. 1 and 6 are obtained. The other end of the optical fiber is provided with a connector (not shown) that enables connection with an optical device.

Next, fourth and fifth embodiments of the optical module according to the present invention will be described. The fourth and fifth embodiments are intended to improve the heat dissipation of an optical element, particularly a laser diode, and to ensure optical coupling, with a metal case having a large heat conductivity and a thermosetting liquid resin composition. Is carried out without using a mold. FIG. 8 is a view illustrating a process of manufacturing an optical module according to a fourth embodiment of the present invention. A fourth embodiment will be described with reference to FIGS. 8A to 8C showing a process of manufacturing the optical module 36 of the fourth embodiment. In FIG. 8, the optical module 36 of the fourth embodiment includes an optically coupled laser diode 19 and the like, a silicon substrate 17 on which the optical fiber 6 is mounted, and a copper substrate 33 as a holder for holding the substrate. An optical module that is integrally packaged by a sealing body, comprising a copper substrate 33
Is made of a copper-polyimide wiring board having a three- or four-way dam formed thereon, and the sealing body is made of a transparent liquid thermosetting silicone resin as a transparent sealing body 27a which is blocked and injected and cured by the three- or four-way dam. Configuration.

That is, the optical module 36 of the fourth embodiment shown in FIG.
In the manufacturing process, a polyimide insulating layer is formed on a large heat conductive copper plate having three-way dams 33a at three corners,
The laser diode 19 is fixed on a copper substrate 33 as a copper-polyimide wiring substrate on which a copper wiring 34 is formed via the polyimide insulating layer with a fixing body 26 made of an ultraviolet curing adhesive.
The optical module member 9 fixedly mounted on the silicon substrate 17 with the optical fiber 6 and the optical fiber 6 in a predetermined optical coupling dimension relationship was fixed. Then, the wiring layer 11 of the silicon substrate 17 and the copper substrate
Bonding connection between the copper wiring 34 of 33 with the gold wire 24,
An optical module base 35 was obtained. And laser diode
The optical coupling portion between the optical fiber 19 and the optical fiber 6, the bonding portion between the wiring layer 11 and the copper wiring 34, and the copper substrate portion surrounded by the three-way dam 33a are connected to a liquid thermosetting silicone resin (that is, Example of thermosetting liquid resin composition for molding)
Is potted (injection-coated) so as to be blocked by the three-way dam 33a, and cured for a predetermined time to form a transparent sealing body 27a as a sealing body. An optical module 36 is obtained.

That is, in order to improve workability in terms of unifying the materials and processes and shortening the curing time, the use of a transparent sealing body 27a which serves as a sealing body and a transparent body is further used.
Since a mold is not used, a dam is provided on the copper substrate 33 in three or four directions to prevent inadvertent dripping of the sealing body to be injected.
This is characterized in that the copper substrate 33 as a holder is a kind of metal case.
The formation of the copper wiring 34 can be obtained by patterning a single-sided copper foil of a substrate having a three-layer structure made of copper foil, polyimide and copper foil into a lead electrode shape of an optical module by etching. And
This copper-polyimide wiring board is used to process a three-dimensionally shaped dam or the like by press molding in advance as necessary.

FIG. 9 is a view showing a process of manufacturing an optical module according to a fifth embodiment of the present invention. The steps from manufacturing the optical module 36 of the fifth embodiment to the fifth embodiment will be described. In FIG. 9, the optical module 38 of the fifth embodiment comprises a silicon substrate 17 on which the optically coupled laser diode 19 and the like and the optical fiber 6 are mounted, and a copper substrate 33 as a holder for holding the substrate. An optical module that is integrally packaged by a sealing body, and the copper substrate 33 is
The sealing body is made of a copper-polyimide wiring board having a three- or four-sided dam. The sealing body includes a transparent fixed body 27 as a first sealing body in which a transparent silicon resin is injected and cured at an optical coupling portion, and the first sealing body. A second thermosetting liquid resin is injected and cured so as to be blocked by a three- or four-way dam while covering the stop body.
And a sealing body 14 as a sealing body.

That is, the optical module 36 of the fifth embodiment shown in FIG.
In the process of manufacturing, on a copper substrate 33 as a copper polyimide wiring substrate formed with a three-way dam 33a and copper wiring 34,
The optical module member 9 having the laser diode 19 or the like and the optical fiber 6 fixedly mounted on the silicon substrate 17 with a predetermined precision optical coupling dimensional relationship by the fixed body 26 is fixed. 34 was bonded and connected with the gold wire 24.

Then, a transparent silicon resin was potted (injected and applied) to the optical coupling portion between the laser diode 19 and the optical fiber 6 and cured, thereby forming a transparent fixed body 27 as a first sealing body. Further, the first sealing body portion;
By bonding and curing an epoxy resin as another embodiment of the thermosetting liquid resin composition for injection molding on the bonding portion and the copper substrate portion surrounded by the three-way dam 33a, Sealing body as second sealing body
14 were integrally formed to form a double seal. By forming such a double sealing body, an optical module having good optical coupling and heat radiation properties is obtained. In the fifth embodiment, in order to improve the reliability including the sealing property, a double sealing using an epoxy resin having a mechanical strength larger than that of the liquid thermosetting silicone resin of the fourth embodiment is employed on the outside. It is characterized by its structure. Further, the fourth embodiment and the fifth embodiment
In the case of the embodiment, the above-described fiberette-shaped fiber protrusion is formed around the optical fiber 6 located at the boundary with the transparent sealing body 27a or the sealing body.

Further, the assembling order and the manufacturing method of the optical module according to the present invention are not limited to the fourth and fifth embodiments. That is, the silicon substrate 17 on which the laser diode 19 and the like are mounted is fixed to the copper substrate 33, and thereafter, the laser diode 19 and the optical fiber 6 arranged in the optical coupling dimensional relationship with a predetermined accuracy are fixed to the silicon by the fixed body 26. It is fixed to the substrate 17. Then, the bonding between the laser diode 19 and the like, the wiring layer 11 and the copper wiring 34 is performed by the gold wire 24. Thereafter, the optical coupling portion, the bonding portion, and the copper substrate portion surrounded by the three-way dam 33a are integrally sealed and molded with the transparent sealing body 27a or the transparent fixing body 27 and the sealing body 14, It is also possible to obtain an optical module.

As described above, in the optical module using the copper-polyimide wiring board according to the present invention, in addition to the prevention of the deviation of the optical coupling relationship with a predetermined accuracy, the heat generated by the laser diode is transferred from the silicon substrate to the copper polyimide. Since conduction is performed in the order of the wiring board and heat can be efficiently dissipated, good laser emission characteristics can be obtained.

[0044]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an optical module according to the present invention will be described.
This will be described with reference to some specific examples. (Embodiment 1) Regarding the optical module of Embodiment 1, the optical module of the first embodiment shown in FIG. 1, the optical module in the manufacturing steps shown in FIGS. 3, 4 and 5, and the optical module in the middle step shown in FIG. This will be described with reference to a base. First, in a step shown in FIG. 2A, a wiring layer 11 having a wiring pattern is formed on a silicon substrate 17 having a shallow V-groove 17a and a deep V-groove 17b formed by anisotropic etching of silicon. Then, a gold and tin alloy solder layer 16 is formed on the optical element mounting portion.

In the shallow V-groove 17a formed in the silicon substrate 17, the optical fiber 6a having a diameter of 0.1 (mm) is mounted, and in the deep V-groove 17b, the jacket 6b of the optical fiber 6 is mounted. It has become. A laser diode 19 and a photodiode 20 are placed on this silicon substrate 17 with high precision using an infrared transmission microscope, and the silicon substrate 17 is heated under nitrogen gas, and the load is 20 g at 220 (° C.) for 1 minute. Temporary crimping was performed. Thereafter, the load was removed, the components were heated to 340 (° C.) under nitrogen gas, and the diodes were fixed on the silicon substrate 17 by performing solder reflow, whereby the optical element body 21 was formed.

Next, in the step shown in FIG. 2B, this optical element body 21 is used as a 0.25 (mm) -thick copper lead frame 22 as a holder for holding a silicon substrate 17 as a substrate.
Then, it is bonded through a die attachment 23 and cured at 150 (° C.) for 2 hours. Then, in the step shown in FIG. 2C, the connection between each diode and the wiring layer 11 and the connection between the wiring layer 11 and the lead frame 22 are performed by bonding with a gold wire 24 of 25 (μm). Further, in the steps shown in FIGS. 2C to 2D, the other end of the optical fiber 6 provided with an SC connector (not shown) at one end is exposed to form an optical fiber 6a. Optical fiber 6a shallow V
The jacket portion 6b was arranged in the deep V-groove 17b in the groove 17a.
Then, the optical fiber 6a, the jacket 6b, and both V
An ultraviolet curable acrylate adhesive as the fixing body 26 was potted so as to cover the groove. Then, the fixed body 26 was cured by irradiating ultraviolet rays, and the laser diode 19 and the optical fiber 6 were fixedly mounted on the silicon substrate 17 in a highly accurate optical coupling relationship.

In the steps shown in FIGS. 2 (d) to 2 (e), a transparent fixed body 27 is attached to the optical coupling portion between the laser diode 19 of the optical element body 21 and the optical fiber 6 (the optical fiber 6a).
Potting is performed using a transparent silicone resin as above, followed by vacuum degassing for removing voids in the silicone resin, and then heating at 150 (° C.) for 2 hours to cure the transparent fixed body 27 Thus, an optical module member 28 was manufactured.

Next, as shown in FIGS. 3 and 4, while holding the optical fiber 6 so as to be positioned above using a jig (not shown), the optical fiber 6 The above-mentioned optical module member 28 is set in the dies 1 and 2 so as to be disposed substantially at the center. Thereafter, as shown in FIGS. 3 and 4, a thermosetting liquid resin (that is, an epoxy resin) as a sealing body 14 is supplied from the injection port 4 formed by the mold to the upper edge surface of the mold 2 (see FIG. 3). 4. A position slightly lower than the upper edge 4a) of the inlet 4 shown in FIG. 4 (for example, a position recessed by about 3 mm from the upper edge 4a).
In other words, the injection is performed to a position slightly higher than the upper edges 7a, 8a of the cavities 7, 8 (for example, a position protruding by about 3 mm from the upper edge 8a). Incidentally, as the thermosetting liquid resin of the sealing body 14, it is possible to select a material having a glass transition temperature equal to or higher than the molding temperature, to reduce the shrinkage rate during molding,
This is preferable because the amount of warpage of the package is reduced.

At this time, as described above, the optical module member 28 is clamped between the mold 1 and the mold 2 via the lead frame 22. In addition, as in the case of this embodiment,
The height of the mold 1 is made larger than the height of the mold 2,
It is desirable to facilitate the injection operation. Therefore, the upper edge 4a of the injection port 4 in the present embodiment is the upper edge surface of the mold 2 on one side. Further, the peripheral edge of the lead frame 22 and the edge surface of the mold 2 are flush with each other.

Next, the entire mold is evacuated to remove voids existing in the injected sealing body 14 and the cavities 7 and 8 of the molds 1 and 2. (° C.), and heat-hardens the sealing body 14 for 3 hours.
The optical module substrate 29 shown in FIG. 5 is obtained by curing the thermosetting liquid resin composition and then taking it out of the molds 1 and 2. At this time, as shown in FIG.
As a part of 14, a fiber protrusion 1 with a height of about 3 (mm)
4a is formed. Then, unnecessary portions of the lead frame 22 are cut off from the optical module base body 29 to form a plurality of lead electrodes 15, and a bending process is performed.
The optical module 31 of the first embodiment shown in FIG.

(Embodiment 2) An optical module according to Embodiment 2 will be described with reference to FIGS. Most of the second embodiment is manufactured in the same process as the first embodiment. The difference is that the elastomer 13 is formed on the upper part of the fiber protrusion 14a supporting the optical fiber 6. That is, after the optical module member 28 is manufactured in the step shown in FIG.
As shown in FIG. 7, the optical fiber member 6 is placed in the molds 1 and 2 at substantially the center of the diameter of the injection port 4 so that the optical module member 28 is formed.
After that, an epoxy resin as a sealing body 14 is injected from the injection port 4 to a position slightly lower than the upper edge 4a of the injection port 4 of the mold 2 to a concave position of about 3 (mm). . Then, in order to remove the voids in both cavities and the sealing body 14, the entire mold is evacuated to a vacuum, and the entire mold is put into a constant temperature bath of 150 (° C.). To cure.

Next, a liquid thermosetting silicone resin for forming the elastomer 13 was gently injected from the injection ports 4 of the molds 1 and 2 until the liquid silicone resin was flush with the upper edge 4 a of the injection port 4. Then, the entire mold is put into a thermostat of 150 (° C), and 2
After heating for a time, the liquid thermosetting silicone resin was cured to form the elastomer 13. After that, the mold
The optical module substrate 30 as shown in FIG. Then, the lead frame 22 of the optical module base 30 was cut and formed and bent to form a plurality of lead electrodes 15, thereby producing the optical module 32 of the second embodiment as shown in FIG.

In this embodiment, as shown in FIGS. 5 and 7, the dimensions of the fiber projection 14a and the elastomer 13 are each set to about 3 (mm). However, it is needless to say that the dimensions are not limited to this. The upper surface of the fiber protrusion 14a
The same shape as the main body of the sealing body 14, that is, a dimension shape in which the fiber protrusion 14a does not protrude, or a size shape slightly recessed from the surface of the sealing body 14 is possible. However, due to stress absorption, at least the elastomer
Desirably, 13 has a size and shape protruding from the body of the sealing body 14.

(Embodiment 3) Embodiment 3 has almost the same configuration as Embodiment 2, except that Embodiment 3 differs from Embodiment 2 in that
Embodiment 3 lies in that the fiber protrusion 14a and the elastomer 13 are simultaneously cured in the same step. That is, after the optical module member 28 is manufactured in the step shown in FIG. 2, the optical fiber 6 is arranged in the mold at substantially the center of the diameter of the injection port 4 in the step shown in FIGS. Then, the optical module member 28 is fixed. Thereafter, an epoxy resin as a sealing body 14 is injected from the injection port 4 to a protruding position of about 3 (mm) slightly above the upper edges 7a, 8a of the cavities 7, 8. Then, the entire mold was evacuated to remove voids in the cavity and the sealing body.

Next, a liquid thermosetting silicone resin for forming the elastomer 13 is injected from the injection port 4 of the mold.
Gently into the upper edge 4a. Then, mold 150
(° C) and heated for 3 hours.
The fiber protrusion 14a and the elastomer 13 were simultaneously cured. Then, the optical module base 30 as shown in FIG. 7 was taken out of the mold. After that, the lead electrode 15 was cut and formed into a bend to produce the optical module 32 of the third embodiment shown in FIG. As described above, the optical module according to the third embodiment is partially the same as the optical module according to the second embodiment, although the manufacturing process is partially different from that according to the second embodiment.

Embodiments 4 to 7 show optical modules that improve the heat dissipation of the optical element while ensuring optical coupling. (Example 4) Example 4 (and Examples 5 and 6)
An optical module adopting a copper-polyimide wiring substrate as a holder for holding a substrate on which an optical semiconductor element and an optical fiber are optically coupled in a predetermined dimensional relationship while holding the substrate in order to improve heat dissipation. About the optical module of Example 4,
A description will be given with reference to the manufacturing process of the optical module of the fourth embodiment shown in FIG.

As shown in FIG. 8A, on a copper polyimide wiring substrate as a copper substrate 33 having three-way dams 33a provided at three corners and copper wiring 34, a process shown in FIG. In, the optical module member 9 was bonded via a die attachment (not shown), and the die attachment was heated and cured at 150 (° C.) for 2 hours. This optical module member 9 is
2. Manufacturing from the optical module member manufacturing process shown in FIG. 2 (processes excluding the lead frame 22, the die attachment 23, the gold wire 24 connecting the laser diode 19 and the like to the wiring layer 11 in the processes a to d). Is possible,
A silicon substrate 17 has a laser diode 19 as an optical element and an optical fiber 6a of an optical fiber 6 fixedly mounted on a fixed body 26 while being optically coupled in a predetermined dimensional relationship. After that, the wiring layer 11 of the silicon substrate 17 and the copper wiring 34 of the copper substrate 33 were connected by bonding with the gold wire 24 to obtain an optical module base 35.

Next, in a step shown in FIG. 8C, an optical coupling portion between the laser diode 19 and the optical fiber 6 is formed.
A liquid thermosetting liquid as a transparent sealing body 27a serving as a transparent body and a sealing body is formed on the bonding portion between the wiring layer 11, the copper wiring 34 and the gold wire 24, and the copper substrate portion surrounded by the three-way dam 33a. The silicone resin was potted (injected and applied) so as to be blocked by the three-way dam 33a. And
After performing vacuum degassing for removing voids in the silicone resin, the resin was cured by heating at 150 (° C.) for 2 hours, thereby integrally forming a transparent sealing body 27 as a sealing body. That is, FIG.
The packaged optical module 36 shown in FIG.

Fifth Embodiment A fifth embodiment is an optical module having a configuration and a manufacturing method similar to those of the fourth embodiment. FIG. 14 shows an assembling and sealing process of another embodiment of the optical module using the copper polyimide wiring board. The optical module according to the fifth embodiment will be described with reference to the manufacturing process of the optical module according to the fifth embodiment illustrated in FIG. In the figure, FIG.
The step shown in FIG. 9B is the same as the intermediate step in FIGS. 8A and 8B of the fourth embodiment, and the optical module base 3 shown in FIG.
5 is the same substrate obtained in the same step as in Example 4.

In the step shown in FIG. 9C, a liquid thermosetting silicone resin as a transparent fixing body 27 is potted (injected and applied) to the optical coupling portion between the laser diode 19 and the optical fiber 6 of the optical module member 9. Then, after performing vacuum degassing for removing voids in the silicone resin, the transparent fixed body 27 was cured by heating at 150 (° C.) for 2 hours.
A first sealing body was formed. After that, the first sealing body portion made of the transparent fixed body 27, the wiring layer 11, the copper wiring 34, and the gold wire
In the bonding portion of 24 and the copper substrate portion surrounded by the three-way dam 33a, an epoxy resin as a thermosetting liquid resin is blocked by the three-way dam 33a,
Potting (injection coating) was performed. Then, after performing vacuum degassing for removing voids, the mixture is heat-cured at 150 (° C.) for 3 hours to integrally form a sealing body 14 as a second sealing body. An optical module packaged with sealing was manufactured.

Embodiment 6 Embodiment 6 is an example of a printed board type optical module 45 manufactured using the optical module 38 of Embodiment 5, that is, an optical module using a copper polyimide wiring board. This is an example of mounting on a printed wiring board. FIG. 10 is a view showing an optical module according to a sixth embodiment of the present invention. The optical module of the sixth embodiment will be described from the step of manufacturing a printed board type optical module 45. In the first step, as shown in FIG. 11, an electrode part 42 and a fixing part 41 for attaching the optical module are provided.
A printed board 40 was prepared in which a, 41b, 41c, and 41d were fixed to the through-hole 43 of the board 44 by soldering.

Then, in the next step, the optical module 38 of the fifth embodiment is mounted on the printed circuit board 40 by the fixing portions 41a and 41a.
The printed circuit board type optical module 45 shown in FIG. 10 was fabricated by mounting the optical module 38 via 1b, 41c and 41d and connecting the electrodes of the optical module 38 and the electrodes of the printed circuit board 40. FIG.
FIG. 11 is an enlarged view showing an electrode portion of the optical module shown in FIG. 10 in detail. The connection between the electrode of the optical module 38 and the electrode of the printed circuit board 40 is enlarged and shown in detail. In the above Examples 4 to 6, excellent heat dissipation is exhibited by the effect of the copper polyimide wiring substrate, and misalignment of optical coupling is prevented by injection molding, so that a good optical module is provided.

(Embodiment 7) Embodiment 7 is an example in which an optical module according to the present invention is mixedly mounted on a multi-chip having multiple functions to form a multi-chip optical module. FIG. 13 is a view showing an optical module according to a seventh embodiment of the present invention. The optical module of the seventh embodiment will be described from the step of manufacturing the multi-chip optical module 58. In the step shown in FIG. 13A, some of the steps (a to e) of the manufacturing process of the optical module member shown in FIG.
In the process lead frame 22 and die attachment
An optical module member 10 that can be manufactured by the process excluding step 23) is prepared, and in FIG. 13B, the optical module member 10 is mounted on a multi-printed board 51 by a die attachment (not shown). Then, it was cured by heating at 150 (° C.) for 2 hours. The multi-printed board 51 is a board
This is a multi-chip having a plurality of semiconductor devices 52, 53, 54 mounted on 57. Further, bonding was performed between the wiring layer 11 on the optical module member 10 and the electrode pad 56 on the multi-printed substrate 51 using the gold wire 24.

Then, in the step shown in FIG.
Epoxy resin as the sealing material 14 was potted so as to cover the optical module member 10 and the bonding portion of the gold wire 24. Thereafter, the sealing material 14 was heated and cured at 150 (° C.) for 3 hours, thereby producing a multi-chip optical module 58. In the seventh embodiment, since heat is radiated from the optical element through the substrate 57 having a relatively large area,
A multi-chip optical module 58 exhibiting excellent heat dissipation and preventing misalignment is provided.

With the optical module of the present embodiment as described above, the stress applied to the optical coupling portion between the laser diode and the optical fiber during the molding of the package is reduced.
The occurrence of displacement (optical coupling deviation or the like) during molding is avoided. In addition, the optical module is excellent in moisture resistance because it is an integrally molded package product without a sealing portion. Especially,
Sealed with a thermosetting liquid resin composition having a glass transition temperature equal to or higher than the molding temperature, so that the shrinkage during molding is small, the amount of warpage of the package is small, and the flatness of the solder ball mounting surface is excellent. There is.

Table 1 shows the result of confirming the above.

[0067]

[Table 1]

As shown in Table 1, the light output fluctuation and the thermal resistance of the optical module before and after sealing with the thermosetting liquid resin compositions in Examples 1 to 5 and 7 were all shown. The fluctuation of the optical output is 0.05 dB or less, which indicates that the optical module according to the present invention has good optical coupling. In particular, in Examples 4 and 5, it was found that excellent heat dissipation was exhibited due to the effect of the copper polyimide wiring board.

[0069]

As described above, according to the present invention, there is provided an optical module having good optical coupling properties, good package moldability, low cost, and excellent mass productivity. In addition, by using a copper polyimide wiring board with high heat dissipation,
Provided is an optical module which can simultaneously secure optical coupling and improve heat radiation.

On the other hand, the optical module according to the present invention has an effect that high mass productivity can be obtained by using a multi-cavity mold and an automatic dispenser for a liquid resin composition. As shown in the sixth embodiment, it is possible to easily mount the optical module on a printed circuit board, and further to easily apply the present invention to the multi-chip optical module shown in the seventh embodiment. .

[Brief description of the drawings]

FIG. 1 is a diagram showing an optical module of a first embodiment according to the present invention.

FIG. 2 is a view showing a manufacturing process of an optical module member according to an embodiment of the present invention.

FIG. 3 is a view showing a manufacturing process in which the optical module member of FIG. 3 is set in a mold.

FIG. 4 is a view showing a manufacturing process after the optical module member of FIG. 3 is set in a mold.

FIG. 5 is a view showing an optical module substrate according to a first embodiment of the present invention.

FIG. 6 is a view showing an optical module according to a second embodiment and a third embodiment according to the present invention.

FIG. 7 is a diagram showing optical module substrates according to a second embodiment and a third embodiment according to the present invention.

FIG. 8 is a view showing a process of manufacturing an optical module according to a fourth embodiment of the present invention.

FIG. 9 is a view showing a process of manufacturing an optical module according to a fifth embodiment of the present invention.

FIG. 10 is a diagram showing an optical module according to a sixth embodiment of the present invention.

11 is a diagram showing a printed circuit board of the optical module shown in FIG.

FIG. 12 is an enlarged view showing an electrode portion of the optical module shown in FIG. 10 in detail.

FIG. 13 is a view illustrating a process of manufacturing an optical module according to a seventh embodiment of the present invention.

FIG. 14 is a diagram illustrating a fillet form.

[Explanation of symbols]

1, 2, die, 4 injection port, 4a upper edge, 5a, b, c, d ... bolt hole for die fastening, 6 ... optical fiber, 6a ... optical fiber wire, 6b ... jacket part, 7 , 8 ... cavity, 9,1
0, 28: Optical module member, 11: Wiring layer, 13: Elastomer, 14: Sealing body, 14a: Fiber protrusion, 15: Lead electrode, 16: Solder layer, 17: Silicon substrate, 17a: Shallow V
Groove 17b Deep V-groove 19 Laser diode 20 Photodiode 21 Optical element body 22 Lead frame 23 Die attachment 24 Gold wire 26 Fixed body 27 Transparent fixed body 27a… Transparent sealing body, 29, 30, 35…
Optical module base, 31, 32, 36, 38 ... Optical module, 33
... copper substrate, 33a ... three-way dam, 34 ... copper wiring, 40 ... printed circuit board, 41a, 41b, 41c, 41d ... fixed part, 42 ... electrode part, 43 ...
Through-holes, 44, 57: Substrate, 45: Printed circuit board type optical module, 46, 47, 56: Electrode pad, 48: Polyimide layer, 50: Solder, 51: Multi printed board, 52, 53, 54
... Semiconductor device, 55 ... Lead electrode, 58 ... Multi-chip type optical module.

Continued on the front page (72) Inventor Toshimasa Miura 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside of Hitachi, Ltd. (72) Inventor Shoichi Takahashi 5--20-1, Kamimizuhoncho, Kodaira-shi, Tokyo Semiconductor Company, Hitachi, Ltd.

Claims (6)

[Claims] An optical module in which a substrate on which an optically coupled optical semiconductor element and an optical fiber are mounted, and a holder for holding the substrate are integrally formed by a sealing member. The body is made of a cured product of a thermosetting liquid resin for injection molding, and has a fillet shape in which a part of the sealing body is formed around a base portion of the optical fiber extending from the substrate. An optical module having a fiber protrusion. 2. The light according to claim 1, further comprising an elastic body formed by curing from a material having a hardening hardness characteristic softer than the hardening hardness of the sealing body, the elastic body being superposed on the fiber protrusion. module. 3. An optical module in which a substrate on which an optically coupled optical semiconductor element and an optical fiber are mounted, and a holder for holding the substrate are packaged integrally by a sealing body. The body is made of a copper-polyimide wiring board having a three-way or four-way dam formed thereon, and the sealing body is made of a transparent liquid thermosetting silicone resin that is blocked and injected and cured by the three-way or four-way dam. Optical module. 4. An optical module in which a substrate on which an optically coupled optical semiconductor element and an optical fiber are mounted, and a holder for holding the substrate are integrally packaged by a sealing body. The body is made of a copper-polyimide wiring board having a three- or four-sided dam, and the sealing body is a first sealing body in which a transparent fixing body is injected and hardened at the optical coupling portion, and the first sealing body. An optical module comprising a double sealing body with a second sealing body in which a thermosetting liquid resin is injected and cured so as to be blocked by the three-way or four-way dam while covering. 5. A holder for holding an optically coupled optical semiconductor element and a substrate on which an optical fiber is placed, wherein the optical fiber extending from the substrate is connected to the entire outer surface of the optical fiber at the base portion of the substrate. Clamping with a mold having an injection port facing upward and open to the atmosphere while inserting without touching, the thermosetting liquid resin filled from the injection port is integrated with the substrate and the holder. A method for manufacturing an optical module, wherein the optical module is molded as a sealed body. 6. A holder for holding an optically coupled optical semiconductor element and a substrate on which an optical fiber is placed, wherein the optical fiber extending from the substrate is connected to the entire outer surface of the optical fiber at the base portion of the substrate. Clamping with a mold having an injection port facing upward and open to the atmosphere while inserting without touching, filling the thermosetting liquid resin first from the injection port, and then the thermosetting liquid An elastic resin having a cured hardness characteristic softer than the cured hardness of the resin is filled in the vicinity of the base portion of the substrate, and the thermosetting liquid resin is integrally sealed with the substrate and the holder as a sealing body. In addition, a method for manufacturing an optical module, wherein the elastic resin is used as an elastic body and simultaneously cured and molded.