JP2008166740A - 固体発光ダイの光学的プリフォーム並びにその作製および組み立ての方法及びシステム - Google Patents

固体発光ダイの光学的プリフォーム並びにその作製および組み立ての方法及びシステム Download PDF

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Publication number
JP2008166740A
JP2008166740A JP2007307647A JP2007307647A JP2008166740A JP 2008166740 A JP2008166740 A JP 2008166740A JP 2007307647 A JP2007307647 A JP 2007307647A JP 2007307647 A JP2007307647 A JP 2007307647A JP 2008166740 A JP2008166740 A JP 2008166740A
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Japan
Prior art keywords
preform
light emitting
solid state
state light
emitting die
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Pending
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JP2007307647A
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English (en)
Japanese (ja)
Inventor
Peter S Andrews
エス． アンドリューズ ピーター
Ronan P Le Toquin
ピー． レ トーキン ロナン
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Wolfspeed Inc
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Cree Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means

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JP2007307647A 2006-11-28 2007-11-28 固体発光ダイの光学的プリフォーム並びにその作製および組み立ての方法及びシステム Pending JP2008166740A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/563,840 US20080121911A1 (en) 2006-11-28 2006-11-28 Optical preforms for solid state light emitting dice, and methods and systems for fabricating and assembling same

Related Child Applications (1)

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JP2011147460A Division JP2011188001A (ja) 2006-11-28 2011-07-01 固体発光ダイの光学的プリフォーム並びにその作製および組み立ての方法及びシステム

Publications (1)

Publication Number Publication Date
JP2008166740A true JP2008166740A (ja) 2008-07-17

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JP2007307647A Pending JP2008166740A (ja) 2006-11-28 2007-11-28 固体発光ダイの光学的プリフォーム並びにその作製および組み立ての方法及びシステム
JP2011147460A Pending JP2011188001A (ja) 2006-11-28 2011-07-01 固体発光ダイの光学的プリフォーム並びにその作製および組み立ての方法及びシステム

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JP2011147460A Pending JP2011188001A (ja) 2006-11-28 2011-07-01 固体発光ダイの光学的プリフォーム並びにその作製および組み立ての方法及びシステム

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US (1) US20080121911A1 (enExample)
JP (2) JP2008166740A (enExample)
DE (1) DE102007055170A1 (enExample)

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JP2010258281A (ja) * 2009-04-27 2010-11-11 Nichia Corp 発光素子チップ組立体およびその製造方法
JP2011222852A (ja) * 2010-04-13 2011-11-04 Nitto Denko Corp 光半導体装置
WO2011142097A1 (ja) * 2010-05-13 2011-11-17 パナソニック株式会社 実装用基板及びその製造方法、発光モジュール並びに照明装置
KR20120028492A (ko) * 2010-09-15 2012-03-23 서울반도체 주식회사 발광 다이오드 패키지 및 그 제조 방법
WO2012053134A1 (ja) * 2010-10-22 2012-04-26 パナソニック株式会社 実装用基板、発光装置及びランプ
JP2012160664A (ja) * 2011-02-02 2012-08-23 Bridgestone Kbg Co Ltd 青色ｌｅｄから得られた白色光及びこれに用いるシリコーンテープ
JP2012527763A (ja) * 2009-05-19 2012-11-08 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Ｌｅｄのための光散乱及び変換板
JP2012532452A (ja) * 2009-06-30 2012-12-13 スリーエム イノベイティブ プロパティズ カンパニー 電流集中に基づく色調整を伴うエレクトロルミネセント素子
JP2013504187A (ja) * 2009-09-03 2013-02-04 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 半導体ボディとアイソレーション層と平面導体構造とを備えたオプトエレクトロニクス素子および該オプトエレクトロニクス素子の製造方法
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CN103383986A (zh) * 2012-05-04 2013-11-06 旭明光电股份有限公司 具有波长转换层的发光二极管晶粒及其制造方法
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