JP2008147611A5 - - Google Patents

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Publication number
JP2008147611A5
JP2008147611A5 JP2007106386A JP2007106386A JP2008147611A5 JP 2008147611 A5 JP2008147611 A5 JP 2008147611A5 JP 2007106386 A JP2007106386 A JP 2007106386A JP 2007106386 A JP2007106386 A JP 2007106386A JP 2008147611 A5 JP2008147611 A5 JP 2008147611A5
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JP
Japan
Prior art keywords
emitting device
light emitting
metal member
light
height
Prior art date
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Granted
Application number
JP2007106386A
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English (en)
Japanese (ja)
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JP5023781B2 (ja
JP2008147611A (ja
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Priority to JP2007106386A priority Critical patent/JP5023781B2/ja
Priority claimed from JP2007106386A external-priority patent/JP5023781B2/ja
Publication of JP2008147611A publication Critical patent/JP2008147611A/ja
Publication of JP2008147611A5 publication Critical patent/JP2008147611A5/ja
Application granted granted Critical
Publication of JP5023781B2 publication Critical patent/JP5023781B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007106386A 2006-11-13 2007-04-13 発光装置 Active JP5023781B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007106386A JP5023781B2 (ja) 2006-11-13 2007-04-13 発光装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006306996 2006-11-13
JP2006306996 2006-11-13
JP2007106386A JP5023781B2 (ja) 2006-11-13 2007-04-13 発光装置

Publications (3)

Publication Number Publication Date
JP2008147611A JP2008147611A (ja) 2008-06-26
JP2008147611A5 true JP2008147611A5 (pt) 2010-05-20
JP5023781B2 JP5023781B2 (ja) 2012-09-12

Family

ID=39607406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007106386A Active JP5023781B2 (ja) 2006-11-13 2007-04-13 発光装置

Country Status (1)

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JP (1) JP5023781B2 (pt)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5217800B2 (ja) 2008-09-03 2013-06-19 日亜化学工業株式会社 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法
US7923739B2 (en) * 2009-06-05 2011-04-12 Cree, Inc. Solid state lighting device
US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US8710525B2 (en) * 2010-03-15 2014-04-29 Nichia Corporation Light emitting device
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
TW201251140A (en) 2011-01-31 2012-12-16 Cree Inc High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
JP5941249B2 (ja) 2011-02-02 2016-06-29 日亜化学工業株式会社 発光装置
CN103348496A (zh) 2011-02-07 2013-10-09 克利公司 用于发光二极管（led）发光的部件和方法
JP2013004905A (ja) * 2011-06-21 2013-01-07 Mitsubishi Chemicals Corp 半導体発光装置用パッケージ及び半導体発光装置
KR101957884B1 (ko) * 2012-05-14 2019-03-13 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 조명 장치
JP5732619B2 (ja) * 2012-06-27 2015-06-10 パナソニックＩｐマネジメント株式会社 発光装置及びそれを用いた照明装置
CN103904207A (zh) * 2014-04-04 2014-07-02 利亚德光电股份有限公司 晶片电路
DE102017100165A1 (de) 2017-01-05 2018-07-05 Jabil Optics Germany GmbH Lichtemittierende Anordnung und lichtemittierendes System
KR102261288B1 (ko) * 2017-03-14 2021-06-04 현대자동차 주식회사 자동차 외장용 발광다이오드 패키지
JP6669217B2 (ja) * 2018-08-30 2020-03-18 日亜化学工業株式会社 パッケージ及びそれを用いた発光装置
JP7054008B2 (ja) * 2019-08-27 2022-04-13 日亜化学工業株式会社 発光装置の製造方法
JP2023046654A (ja) * 2021-09-24 2023-04-05 スタンレー電気株式会社 発光装置及び発光装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3332809B2 (ja) * 1997-07-10 2002-10-07 三洋電機株式会社 光素子
JP3472450B2 (ja) * 1997-09-04 2003-12-02 シャープ株式会社 発光装置
JP3908383B2 (ja) * 1998-05-29 2007-04-25 ローム株式会社 半導体装置

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