JP2008147611A5 - - Google Patents

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Publication number
JP2008147611A5
JP2008147611A5 JP2007106386A JP2007106386A JP2008147611A5 JP 2008147611 A5 JP2008147611 A5 JP 2008147611A5 JP 2007106386 A JP2007106386 A JP 2007106386A JP 2007106386 A JP2007106386 A JP 2007106386A JP 2008147611 A5 JP2008147611 A5 JP 2008147611A5
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JP
Japan
Prior art keywords
emitting device
light emitting
metal member
light
height
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Application number
JP2007106386A
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Japanese (ja)
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JP2008147611A (en
JP5023781B2 (en
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Priority to JP2007106386A priority Critical patent/JP5023781B2/en
Priority claimed from JP2007106386A external-priority patent/JP5023781B2/en
Publication of JP2008147611A publication Critical patent/JP2008147611A/en
Publication of JP2008147611A5 publication Critical patent/JP2008147611A5/ja
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Publication of JP5023781B2 publication Critical patent/JP5023781B2/en
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Claims (6)

発光素子と、その発光素子が載置された基台と、前記発光素子の電極とワイヤにより接続された金属部材と、少なくとも前記基台または前記金属部材を固定する樹脂部とを有する発光装置であって、
前記金属部材は、前記樹脂部内で屈曲されて高低差を有しており、その一部が前記樹脂部から突出された方向と前記ワイヤの接続方向とは、略垂直であることを特徴とする発光装置。 A light-emitting device comprising: a light-emitting element; a base on which the light-emitting element is placed; a metal member connected to the electrode of the light-emitting element by a wire; and at least a resin part that fixes the base or the metal member. There,
The metal member is bent in the resin portion to have a height difference, and a direction in which a part of the metal member protrudes from the resin portion and a connection direction of the wire are substantially perpendicular. Light emitting device. 前記金属部材は、前記樹脂部からの突出方向が前記ワイヤの接続方向と略垂直とされた第一の突出部と、金属部材の一部が短冊状に延長されて前記発光素子の側に配置された金属片と、を有しており、前記金属片は、発光装置の底面からの高さが前記第一の突出部よりも高くなるように屈曲されており、さらに前記発光素子の電極と接続するワイヤが、前記樹脂部から露出された金属片の上面に接続されている請求項１に記載の発光装置。 The metal member is arranged on the light emitting element side with a first protrusion portion in which the protrusion direction from the resin portion is substantially perpendicular to the connection direction of the wire, and a part of the metal member is extended in a strip shape. The metal piece is bent so that the height from the bottom surface of the light emitting device is higher than that of the first protrusion, and the electrode of the light emitting element wires that connect the light emitting device according to claim 1, which is connected to the upper surface of the exposed metal pieces from the resin portion. 前記金属部材は、前記第一の突出部が設けられた側面とは異なる側面から突出された第二の突出部を有しており、
発光装置の底面からの前記第二の突出部の高さは、前記第一の突出部の高さよりも高い請求項２に記載の発光装置。 The metal member has a second protruding portion that protrudes from a side surface different from the side surface on which the first protruding portion is provided,
Height of the second projecting portion from the bottom surface of the light emitting device, light emitting device according to a high claim 2 than the height of the first projecting portion. 発光装置の底面からの前記金属片の高さは、前記第二の突出部の高さよりも高い請求項３に記載の発光装置。 The light emitting device according to claim 3 , wherein a height of the metal piece from a bottom surface of the light emitting device is higher than a height of the second protrusion. 前記基台は、その側面の一部から突出された第三の突出部を有し、その第三の突出部は、前記樹脂部内にて前記第一の突出部が突出された側面まで延長され、さらにその側面から先端部が露出されている請求項２から４のいずれか一項に記載の発光装置。 The base has a third protruding portion protruding from a part of the side surface, and the third protruding portion is extended to the side surface where the first protruding portion protrudes in the resin portion. Furthermore, the front-end | tip part is exposed from the side surface, The light-emitting device as described in any one of Claim 2 to 4 . 前記金属片の延長方向は、前記第一の金属部材の突出方向と略同じである請求項２から５のいずれか一項に記載の発光装置。 The light emitting device according to any one of claims 2 to 5 , wherein an extending direction of the metal piece is substantially the same as a protruding direction of the first metal member.
JP2007106386A 2006-11-13 2007-04-13 Light emitting device Active JP5023781B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007106386A JP5023781B2 (en) 2006-11-13 2007-04-13 Light emitting device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006306996 2006-11-13
JP2006306996 2006-11-13
JP2007106386A JP5023781B2 (en) 2006-11-13 2007-04-13 Light emitting device

Publications (3)

Publication Number Publication Date
JP2008147611A JP2008147611A (en) 2008-06-26
JP2008147611A5 true JP2008147611A5 (en) 2010-05-20
JP5023781B2 JP5023781B2 (en) 2012-09-12

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007106386A Active JP5023781B2 (en) 2006-11-13 2007-04-13 Light emitting device

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JP (1) JP5023781B2 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5217800B2 (en) 2008-09-03 2013-06-19 日亜化学工業株式会社 Light emitting device, resin package, resin molded body, and manufacturing method thereof
US7923739B2 (en) * 2009-06-05 2011-04-12 Cree, Inc. Solid state lighting device
US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
JP5691681B2 (en) * 2010-03-15 2015-04-01 日亜化学工業株式会社 Light emitting device
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
TW201251140A (en) 2011-01-31 2012-12-16 Cree Inc High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
JP5941249B2 (en) * 2011-02-02 2016-06-29 日亜化学工業株式会社 Light emitting device
CN103348496A (en) 2011-02-07 2013-10-09 克利公司 Components and methods for light emitting diode (LED) lighting
JP2013004905A (en) * 2011-06-21 2013-01-07 Mitsubishi Chemicals Corp Semiconductor light-emitting device package and semiconductor light-emitting device
KR101957884B1 (en) * 2012-05-14 2019-03-13 엘지이노텍 주식회사 Light emitting device, manufactured method of the light emitting deviceand lighting apparatus
JP5732619B2 (en) * 2012-06-27 2015-06-10 パナソニックＩｐマネジメント株式会社 LIGHT EMITTING DEVICE AND LIGHTING DEVICE USING THE SAME
CN103904207A (en) * 2014-04-04 2014-07-02 利亚德光电股份有限公司 Wafer circuit
DE102017100165A1 (en) 2017-01-05 2018-07-05 Jabil Optics Germany GmbH Light-emitting device and light-emitting system
KR102261288B1 (en) * 2017-03-14 2021-06-04 현대자동차 주식회사 Light emitting diode package for automobile exterior
JP6669217B2 (en) * 2018-08-30 2020-03-18 日亜化学工業株式会社 Package and light emitting device using the same
JP7054008B2 (en) * 2019-08-27 2022-04-13 日亜化学工業株式会社 Manufacturing method of light emitting device
JP2023046654A (en) * 2021-09-24 2023-04-05 スタンレー電気株式会社 Light-emitting device and manufacturing method of light-emitting device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3332809B2 (en) * 1997-07-10 2002-10-07 三洋電機株式会社 Optical element
JP3472450B2 (en) * 1997-09-04 2003-12-02 シャープ株式会社 Light emitting device
JP3908383B2 (en) * 1998-05-29 2007-04-25 ローム株式会社 Semiconductor device

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