JP2008141156A5 - - Google Patents

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Publication number
JP2008141156A5
JP2008141156A5 JP2007143859A JP2007143859A JP2008141156A5 JP 2008141156 A5 JP2008141156 A5 JP 2008141156A5 JP 2007143859 A JP2007143859 A JP 2007143859A JP 2007143859 A JP2007143859 A JP 2007143859A JP 2008141156 A5 JP2008141156 A5 JP 2008141156A5
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JP
Japan
Prior art keywords
protruding portion
circuit device
resin layer
protrusion
insulating resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007143859A
Other languages
Japanese (ja)
Other versions
JP2008141156A (en
JP5258208B2 (en
Filing date
Publication date
Priority claimed from PCT/JP2006/323972 external-priority patent/WO2007063954A1/en
Application filed filed Critical
Priority to JP2007143859A priority Critical patent/JP5258208B2/en
Priority claimed from JP2007143859A external-priority patent/JP5258208B2/en
Publication of JP2008141156A publication Critical patent/JP2008141156A/en
Publication of JP2008141156A5 publication Critical patent/JP2008141156A5/ja
Application granted granted Critical
Publication of JP5258208B2 publication Critical patent/JP5258208B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (6)

回路素子と、Circuit elements;
突起部が設けられた放熱部材と、A heat dissipating member provided with a protrusion,
前記放熱部材と前記回路素子との間に設けられた絶縁樹脂層と、An insulating resin layer provided between the heat dissipation member and the circuit element;
を備え、With
前記放熱部材を前記絶縁樹脂層に圧着することにより、前記突起部は前記絶縁樹脂層を貫通し、前記突起部と前記回路素子とが熱的に接続されており、前記突起部は、前記放熱部材と同一材料からなり前記放熱部材と一体的に設けられていることを特徴とする回路装置。By crimping the heat radiating member to the insulating resin layer, the protruding portion penetrates the insulating resin layer, and the protruding portion and the circuit element are thermally connected. A circuit device comprising the same material as the member and provided integrally with the heat dissipation member. 前記突起部は、The protrusion is
前記回路素子の素子電極の接触面と平行な上面部と、An upper surface portion parallel to the contact surface of the element electrode of the circuit element;
前記上面部に近づくにつれて径が細くなるように形成された側面部と、A side surface formed so that the diameter becomes narrower as it approaches the upper surface,
を有することを特徴とする請求項１に記載の回路装置。The circuit device according to claim 1, comprising: 前記上面部に近づくにつれて前記突起部の径が細くなる度合いが、上端部において前記上端部以外に比べてより大きいことを特徴とする請求項２に記載の回路装置。The circuit device according to claim 2, wherein the degree of the diameter of the protruding portion becoming narrower as approaching the upper surface portion is larger at the upper end portion than at other than the upper end portion. 突起部の高さと放熱部材の厚さとの和より大きい厚さを有する金属板を準備する工程と、Preparing a metal plate having a thickness greater than the sum of the height of the protrusion and the thickness of the heat dissipation member;
前記金属板をエッチングすることにより、前記放熱部材と一体的に突起部を形成する突起部形成工程と、A protrusion forming step of forming a protrusion integrally with the heat dissipation member by etching the metal plate;
回路素子と前記金属板とを絶縁樹脂層を介して圧着し、前記突起部が前記絶縁樹脂層を貫通することにより、前記突起部と前記回路素子とを熱的に接続する圧着工程と、Crimping the circuit element and the metal plate through an insulating resin layer, and the protruding portion penetrating the insulating resin layer, thereby thermally connecting the protruding portion and the circuit element;
を備えることを特徴とする回路装置の製造方法。A method for manufacturing a circuit device, comprising: 前記突起部形成工程において、前記突起部の形状を上面部に近づくにつれて径が細くなるように形成することを特徴とする請求項４に記載の回路装置の製造方法。5. The method of manufacturing a circuit device according to claim 4, wherein, in the projecting portion forming step, the shape of the projecting portion is formed so that the diameter becomes narrower as it approaches the upper surface portion. 前記突起部形成工程において、前記上面部に近づくにつれて前記突起部の径が細くなるIn the protruding portion forming step, the diameter of the protruding portion becomes narrower as it approaches the upper surface portion.
度合いが、上端部において前記上端部以外に比べてより大きくなるように形成することを特徴とする請求項５に記載の回路装置の製造方法。6. The method for manufacturing a circuit device according to claim 5, wherein the degree is formed so that the degree is larger at the upper end portion than at the upper end portion.
JP2007143859A 2006-11-30 2007-05-30 Circuit device and manufacturing method thereof Expired - Fee Related JP5258208B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007143859A JP5258208B2 (en) 2006-11-30 2007-05-30 Circuit device and manufacturing method thereof

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2006/323972 WO2007063954A1 (en) 2005-11-30 2006-11-30 Circuit device and method for manufacturing circuit device
WOPCT/JP2006/323972 2006-11-30
JP2007143859A JP5258208B2 (en) 2006-11-30 2007-05-30 Circuit device and manufacturing method thereof

Publications (3)

Publication Number Publication Date
JP2008141156A JP2008141156A (en) 2008-06-19
JP2008141156A5 true JP2008141156A5 (en) 2010-07-08
JP5258208B2 JP5258208B2 (en) 2013-08-07

Family

ID=39602274

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007143859A Expired - Fee Related JP5258208B2 (en) 2006-11-30 2007-05-30 Circuit device and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JP5258208B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6400446B2 (en) * 2014-11-28 2018-10-03 Ｔｏｗａ株式会社 Method for manufacturing plate-like member with protruding electrode, plate-like member with protruding electrode, method for manufacturing electronic component, and electronic component

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5823943B2 (en) * 1975-07-16 1983-05-18 松下電器産業株式会社 Method for forming through electrodes in insulators
JP3474936B2 (en) * 1994-10-07 2003-12-08 株式会社東芝 Printed wiring board for mounting and manufacturing method thereof
JP2000068641A (en) * 1998-08-20 2000-03-03 Mitsubishi Gas Chem Co Inc Manufacture of printed wiring board
JP2000340615A (en) * 1999-05-28 2000-12-08 Sumitomo Metal Mining Co Ltd Semiconductor device, wiring material for the same, and their manufacture
JP2001326459A (en) * 2000-05-16 2001-11-22 North:Kk Wiring circuit board and its manufacturing method
JP4691759B2 (en) * 2000-07-11 2011-06-01 日立化成工業株式会社 Board connection method

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