JP2001326459A - Wiring circuit board and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To raise connection reliability between upper and lower conductor circuits and realize reduction in a cost of a connection means between upper and lower conductor circuits by raising dimensional stability in a manufacturing process, by preventing generation of bending, snapping and wrong sizes in a manufacturing process. SOLUTION: A conductor circuit formation copper foil 23 is formed on a projection formation copper layer 21 via an etching barrier layer 22 formed of another metal, projections 25 are formed by selectively etching the projection formation copper layer 21 by means of etchant which does not attack the etching barrier layer 22, the etching barrier layer 22 is removed by etchant which does not attack the copper foil 23 forming a conductor circuit by using the projections 25 as masks, and a layer insulation film 27 is formed on the surface on the projection formation side of the copper foil 23 as an interlayer connection means where the projections 25 are connected to a conductor circuit.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to, for example, IC, LS
The present invention relates to a printed circuit board for mounting electronic devices such as I, particularly a printed circuit board capable of realizing high-density mounting, and a method of manufacturing the same.

[0002]

2. Description of the Related Art FIGS. 23A to 23F and 24G.
FIGS. 1A to 1I are cross-sectional views illustrating a conventional method of manufacturing a printed circuit board for high-density mounting, in the order of steps (A) to (I).

(A) First, an insulating base 1 made of an insulating sheet having a thickness of about 25 to 100 μm is prepared.
As shown in (A), holes 2 for interlayer connection are formed in the insulating sheet 1 by punching, drilling, or laser processing. (B) Next, as shown in FIG. 23B, the hole 2 is made of a conductive paste (for example, silver or copper is used as a main material).
3 is filled by a printing method, for example. Thus, the insulating base 1 becomes a semi-cured sheet A in which the holes 2, 2, ... are filled with the conductive paste 3.

(C), (D) Next, as shown in FIG. 23 (C), metal foils 4 and 4 made of, for example, copper are made to face both surfaces of the sheet A, and as shown in FIG. Then, the metal foils 4 and 4 are laminated by a press and heat press. As a result, metal foils 4 and 4 are formed on both surfaces, and an insulating sheet 1 is present between the metal foils and conductive pastes 3, 3,.
Thus, a laminate is formed in which the metal foils 4 on both sides are electrically connected. (E) Next, resist films 5, 5 having the same pattern as the conductor circuits to be formed on the metal foils 4, 4 are formed.
FIG. 23E shows a state after the formation of the resist films 5 and 5.

(F) Next, the metal foils 4 and 4 are etched using the resist films 5 and 5 as masks to form conductor circuits 6 and 6 as shown in FIG.
As a result, a laminated body B is formed in which conductor circuits 6 and 6 are formed on both sides of which are separated by the insulating sheet 1 and are connected to each other by the conductive paste 3 in the holes 2. (G) Next, as shown in FIG.
Have holes 2, 2,... On both surfaces thereof.
··· overlaps the insulating sheets 1a, 1a and the metal foils 4a, 4a filled with the conductive pastes 3, 3,.
These are laminated by a pressure press. The laminate formed by this lamination is designated as C.

(H) Next, as shown in FIG.
A resist film 5 on the metal foils 4a, 4a on both sides of the laminate C;
5 is selectively formed. (I) Next, the metal foils 4a, 4a are patterned by selectively etching using the resist films 5, 5 as masks, and as shown in FIG.
6a is formed. As a result, the four-layer conductor circuits 6, 6,
The printed circuit board 7 having 6a, 6a is formed.

FIGS. 25A to 25G are diagrams for explaining another conventional example relating to a printed circuit board for high-density mounting.
It is sectional drawing which shows the manufacturing method of a printed circuit board in process order (A)-(G). (A) Metal foil made of, for example, copper (thickness of, for example, 18 μm)
10 was prepared, and as shown in FIG.
The conductive projections 11, 11,... Are formed by printing a conductive paste such as copper or silver on a metal plate through a metal plate, and are cured by heating. The thickness of the projections 11, 11,... Is, for example, about 100 to 300 μm.

(B) Next, as shown in FIG.
An insulating adhesive sheet 12 is adhered on the surface of the metal foil 10 on which the protrusions 11, 11,... Are formed. By using an adhesive sheet 12 that is appropriately thinner than the thicknesses of the protrusions 11, 11,..., The protrusions 11, 11,.
.. Are projected from the surface of the adhesive sheet 12. Forming projections 11, 11,... On the metal foil 10, and bonding the adhesive sheet 12 to the projections 11, 11,.
The laminated body A adhered so that the top of is protruded is completed.

(C), (D) Next, as shown in FIG. 25 (C), a metal foil 13 similar to the metal foil 10 is exposed above the surface of the adhesive sheet 12 of the adhesive sheet 10 and heated. As shown in FIG. 24 (D), the metal foil 1
3 are laminated on the adhesive sheet 12 and the projections 11, 11,.... B is the resulting laminate. (E) Next, for example, a patterned resist film is formed on the metal foils 10 and 13 on both sides of the laminate B, and the metal foils 10 and 13 are etched using the resist film as a mask to form the conductor circuits 14 and 13. 15 are formed. FIG.
FIG. 5E shows a state in which the resist film used as the mask after the formation of the conductor circuit is removed.

(F) Next, two laminates a produced by the same method as the laminate A shown in FIG. 25B are prepared, and the two laminates a, a are placed in FIG. ),
It faces both sides of the laminate B. (G) Next, the laminate B was laminated from both sides thereof to a laminate a,
Then, the printed circuit board 16 is sandwiched in the shape of a and pressed and laminated by the above-mentioned hot press method, thereby completing the printed circuit board 16 as shown in FIG.

[0011]

By the way, the prior art shown in FIGS. 23 and 24 firstly has two holes 2 in the insulating sheet 1.
Is filled with a conductive paste 3 containing an expensive metal such as silver as a main material and used for interlayer connection, leading to a problem that the cost is increased. In particular, as the density increases, the arrangement density of the holes 2 increases, so that a considerable cost increase occurs. Secondly, when the holes 2 are filled with the conductive paste 3, a small amount of the conductive material adheres to portions other than the holes 2, and there is a problem that the insulation resistance is reduced particularly under high humidity.

Third, holes 2, 2,...
Is formed, the sheet 1 is extended in the horizontal direction due to the applied pressure, and the holes 2, 2,... Are displaced. However, there is a problem that correction cannot be performed in some cases. Such a displacement of the hole 2 causes a poor interlayer connection and becomes a serious problem that cannot be overlooked, and is particularly fatal in the case of a high-density printed circuit board. Fourth, there is a problem that the reliability of bonding between the metal foils 4 and 4 made of copper or the like and the conductive paste 3 is insufficient. That is, the conductive paste 3 in which the holes 2 are filled is removed from the solvent so that the conductive paste 3 becomes semi-cured. However, the conductive paste after the semi-curing shrinks due to the removal of the solvent and the like, and the volume decreases. The upper and lower surfaces are often concave. As a result, the metal foils 4, 4
In this case, there is a problem that a bonding failure is likely to occur between them and the yield and reliability are reduced.

Next, the conventional example shown in FIG. 25 also has a problem. First, since the projections 11 are formed of a conductive paste, which is an expensive material, there is a problem that the cost is increased. Second, the formation of the projections 11 with the conductive paste uses a screen printing method, so that there is a limit in increasing the thickness of the conductive paste. As a result, screen printing is repeated a plurality of times to form the projections 11. Often needed. Then, when the number of times of printing increases as such,
Deformation of the shape of the projection 11 due to misalignment is likely to occur,
As a result, there is a problem that the reliability of the connection with the metal foil 4 later becomes low, and the alignment work at the time of screen printing is very difficult, troublesome, requires skill, and the alignment time becomes long. The problem arises. Such a tendency becomes more remarkable as the diameter of the projection 11 decreases. By the way, in the case of a projection having a diameter of 0.3 mm, printing needs to be performed twice, and in the case of a projection having a diameter of 0.2 mm, printing needs to be performed four times. This is rather cumbersome, hinders the improvement of productivity, and has a problem in dealing with high-density wiring circuit boards.

Third, there is a problem that the heights of the projections 11, 11,... Are likely to vary. That is, in screen printing, it is difficult to make the thickness of the formed film uniform, so naturally the heights of the projections 11, 11,. , The thickness of the metal foil 13
There is a possibility that the connection between the semiconductor device and the projections 11, 11,... May become defective, and the yield and reliability may be reduced. Fourth, in the manufacturing process, the metal foil 10 serving as the base of the printed circuit board is as thin as 18 μm, for example, and sufficient care should be taken so that wrinkling, deformation, bending, etc. do not occur on the metal foil 13 side during the screen printing. Required,
There is a possibility that the yield may be reduced due to a slight mistake. As a matter of course, this causes an increase in cost and is a problem that cannot be overlooked. On the other hand, if the thickness of the metal foil 10 is increased to increase the rigidity of the base, there is a problem that fine patterning of the conductive circuit is hindered.

Another problem common to the above-mentioned conventional examples is that there is a limit to high density, that is, a minute interlayer connection, and one conventional example has a problem in that the hole diameter is reduced and the filling of the conductive paste is difficult. Therefore, in another conventional example, as the diameter becomes smaller by bump printing, printing becomes more difficult, and a diameter of 200 μm or less could not be actually formed. In addition, when the bonding strength between the conductive paste and the copper foil is low and the pad is to be used as a pad-on-via, the pad-like pad strength is not sufficient and the area needs to be increased more than necessary.

The present invention has been made to solve such a problem, and it is intended to prevent bending, bending, deformation, and the like in a manufacturing process, and to improve dimensional stability in a manufacturing process, thereby improving the upper and lower conductors. An object of the present invention is to increase the reliability of connection between circuits and reduce the cost of connecting means between upper and lower conductor circuits.

[0017]

According to a first aspect of the present invention, there is provided a printed circuit board comprising a metal on a metal layer for forming a conductor circuit, which is to be a conductor circuit, via an etching barrier layer made of a metal different from the metal layer. A protrusion is selectively formed, an interlayer insulating layer is formed on a surface of the conductor circuit on a side where the protrusion is formed,
The above-mentioned protrusion forms an interlayer connection means between the metal layer which becomes the conductor circuit by penetrating the insulating layer and another.

According to a second aspect of the present invention, there is provided the wired circuit board according to the first aspect, wherein the surface of the projection is coated with a conductive paste material as a surface treating agent.

According to a third aspect of the present invention, there is provided a method for manufacturing a printed circuit board, comprising: forming an etching barrier layer made of another metal on a metal layer for forming projections; and forming a metal layer serving as a conductor circuit on the etching barrier layer. A step of preparing the formed layer, a step of selectively etching the metal layer for forming the projections with an etchant that does not attack the etching barrier layer, and a step of forming the projections. Using a mask as a mask to remove with an etchant that does not attack the metal layer forming the conductor circuit, and forming an insulating layer for interlayer insulation on the surface on the protrusion formation side of the metal layer forming the conductor circuit, and forming the protrusion on the surface. Forming interlayer connection means connected to the conductor circuit.

According to a fourth aspect of the present invention, there is provided a method for manufacturing a printed circuit board, comprising: forming an etching barrier layer made of another metal on a metal layer for forming projections; and forming a metal layer serving as a conductor circuit on the etching barrier layer. The formed metal is prepared, and the metal layer for forming the protrusions is selectively etched by an etchant that does not attack the etching barrier layer to form the protrusions, and the protrusion forming side of the metal layer forming the conductor circuit is formed. Forming an insulating layer for interlayer insulation on the surface of the substrate, using the protrusions as interlayer connection means connected to the conductor circuit, and etching the metal layer on the etching barrier layer to be the conductor circuit together with the etching barrier layer. A conductor circuit is formed by removing by selective etching using the mask layer as a mask.

According to a fifth aspect of the present invention, there is provided a method of manufacturing a wired circuit board according to the third aspect.
When forming the protrusions by selectively etching the layer made of the base metal, for example, using a metal layer formed by, for example, solder plating, silver plating, gold plating, or palladium plating as an etching mask, after forming the protrusions Also, the metal layer used as the etching mask is left, and the surface of the projection is entirely covered with the metal layer.

According to a sixth aspect of the present invention, there is provided a method of manufacturing a printed circuit board according to the first aspect of the present invention, wherein the surface of the printed circuit board on which the protrusions and the interlayer insulating film are formed is different from the conductive circuit. The metal foil is laminated and pressurized to be integrated,
Thereafter, a conductive circuit is formed on both surfaces by selectively etching the metal layer and the metal foil for forming the conductive circuit.

According to a seventh aspect of the present invention, there is provided a method for manufacturing a printed circuit board, comprising the steps of: The two metal layers located on both sides of the integrated body are selectively integrated by pressing and laminating them in a sandwich shape so that the side on which the protrusions and the interlayer insulating film are formed faces inside. A conductor circuit is formed on both surfaces by etching.

According to a eighth aspect of the present invention, there is provided a method of manufacturing a printed circuit board, comprising a base metal via an insulating layer having an opening in one main surface of a single-layer or multilayer conductive circuit. Two wiring circuit boards each having a projection electrically connected to the conductor circuit through an opening, and having an interlayer insulating film formed on the side of the insulating layer where the projection is formed, are formed with the projection and the interlayer insulating film. The layers are laminated directly or through a printed circuit board so that the cut side faces inward, and are integrated by pressing, or are integrated.

According to a tenth aspect of the present invention, an LSI chip or a package is mounted on both surfaces of the wired circuit board of the seventh aspect.

According to a eleventh aspect of the present invention, in the printed circuit board, a projection for connecting the upper and lower conductors made of the same metal as the metal layer is selectively formed on a metal layer forming the conductor circuit. An interlayer insulating layer is formed on the surface on which the is formed,
The connection protrusion between the upper and lower conductors penetrates the insulating layer to form interlayer connection means with the metal layer serving as the conductor circuit.

According to a twelfth aspect of the present invention, a projection made of the same metal as the metal layer is selectively formed on the metal layer forming the first conductor circuit, and the projection of the conductor circuit is formed. A second conductor circuit made of a metal layer is formed on the surface of the protrusion and the surface of the interlayer insulating layer, and the first and second conductive circuits are formed on the surface of the protrusion and the interlayer insulating layer. Are electrically connected via the protrusions.

According to a thirteenth aspect of the present invention, there is provided the printed circuit board according to the twelfth aspect.
In the printed circuit board of (1), a hole having a diameter smaller than the diameter at the top of the projection is formed in a portion of the metal layer forming the second conductor circuit corresponding to the projection for connection between the upper and lower conductors. I do.

According to a fourteenth aspect of the present invention, there is provided the printed circuit board according to the first aspect.
14. The printed circuit board according to 1, 12, or 13, wherein the protrusion is formed in a spear shape.

According to a fifteenth aspect of the present invention, there is provided the printed circuit board according to the first aspect.
14. The printed circuit board according to 1, 12, or 13, wherein the protrusion is formed in a conide shape (Mt. Fuji shape).

According to a sixteenth aspect of the present invention, there is provided the printed circuit board according to the first aspect.
14. The printed circuit board according to 1, 12, or 13, wherein the protrusion is formed in a drum shape.

According to a seventeenth aspect of the present invention, there is provided the printed circuit board according to the first aspect.
The printed circuit board according to any one of 1, 12, 13, 14, 15 and 16, wherein the surface of the projection is roughened or crushed.

[0033] The printed circuit board according to claim 18 is characterized in that:
The printed circuit board according to 1, 12, 13, 14, 15, 16 or 17, wherein the projection is made of copper and the surface thereof is subjected to electrolytic chromate treatment.

In the wiring circuit board according to the present invention, a step of preparing a metal layer forming a conductive circuit and a metal plate for forming a projection, and selectively forming a mask film on one surface thereof, Forming a metal layer to be a conductor circuit by half-etching the metal plate with the mask as a mask and a projection integrally formed selectively on the one surface of the metal layer; and forming the projection on the metal layer to be the conductor circuit. A step of forming an interlayer insulating layer on the surface on which is formed by the projections, a step of forming a metal layer on the surfaces of the insulating layer and the projections, and a step of forming a metal layer on both surfaces of the insulating layer. Forming a wiring film by selectively patterning the layers simultaneously or at different times.

According to a twentieth aspect of the present invention, there is provided the printed circuit board according to the twelfth aspect.
In the printed circuit board described above, an anisotropic conductive film is interposed between the upper and lower conductor connecting protrusions and the metal layer.

The method of manufacturing a printed circuit board according to claim 21 is
The method of manufacturing a printed circuit board according to claim 19, further comprising a step of interposing an anisotropic conductive film between the protrusion and the metal layer before laminating the metal layer.

According to a twenty-second aspect of the present invention, there is provided the printed circuit board, wherein a plurality of inter-conductor connecting projections made of a plurality of metals are arranged on respective intersections of a grid arranged at regular intervals on the surface of the metal layer. An interlayer insulating layer is provided on the surface on which the inter-conductor connection projections are formed in a state penetrated by the inter-conductor connection projections, and a metal layer is formed on the surface of the inter-layer insulation layer including the upper and lower conductor connection projections. It is characterized by being formed.

According to a twenty-third aspect of the present invention, there is provided the printed circuit board, wherein a plurality of metal-to-conductor connection projections are arranged on the surface of the metal layer, and an interlayer insulating projection is formed on the surface of the metal layer where the connection-to-conductor connection projections are formed. A wiring circuit board comprising a layer provided in a state penetrated by the projections, and a metal layer different from the metal layer formed on a surface of the interlayer insulating layer including the inter-conductor connection projections,
The upper and lower conductor connecting protrusions are arranged such that the upper and lower conductor connecting protrusions receive a uniform pressing force when pressed from both sides of the substrate.

According to a twenty-fourth aspect of the present invention, in the printed circuit board, a large number of metal-to-conductor connection protrusions are arranged on the surface of the metal layer, and an interlayer insulating protrusion is formed on the surface of the metal layer where the connection-to-conductor connection protrusions are formed. A wiring circuit board comprising a layer provided in a state penetrated by the projections, and a metal layer different from the metal layer formed on a surface of the interlayer insulating layer including the inter-conductor connection projections,
A dummy projection smaller in height than the upper and lower conductor connecting projections is arranged around the upper and lower conductor connecting projections or around a dense area where the upper and lower conductors are densely arranged.

According to a twenty-fifth aspect of the present invention, in the printed circuit board, a large number of metal-to-conductor connection projections are arranged on the surface of the metal layer, and an interlayer insulating film is formed on the surface of the metal layer where the connection-to-conductor connection projections are formed. A wiring circuit board comprising a layer provided in a state penetrated by the projections, and a metal layer different from the metal layer formed on a surface of the interlayer insulating layer including the inter-conductor connection projections,
The connection protrusion between the upper and lower conductors has a plurality of different heights.

In the printed circuit board according to the twenty-sixth aspect, a plurality of inter-conductor connection projections made of a metal are arranged on a surface of a metal layer, and an interlayer insulating is formed on a surface of the metal layer on which the inter-conductor connection projections are formed. A wiring circuit board comprising a layer provided in a state penetrated by the projections, and a metal layer different from the metal layer formed on a surface of the interlayer insulating layer including the inter-conductor connection projections,
The connection between the upper and lower conductors has a plurality of different diameters.

According to a twenty-seventh aspect of the present invention, there is provided the printed circuit board, wherein a large number of metal-to-conductor connection protrusions are arranged on the surface of the metal layer, and an interlayer insulating film is provided on the surface of the metal layer on which the connection-to-conductor connection protrusions are formed. A wiring circuit board comprising a layer provided in a state penetrated by the projections, and a metal layer different from the metal layer formed on a surface of the interlayer insulating layer including the inter-conductor connection projections,
It is characterized by having a spacer formed of the same material and at the same height as the projection for connecting the upper and lower conductors.

The method of manufacturing a printed circuit board according to claim 28 is
A plurality of inter-conductor connection protrusions made of a metal are arranged on the surface of the metal layer, and an interlayer insulating layer is provided on the surface of the metal layer where the inter-conductor connection protrusions are formed, in a state where the inter-layer insulation layer is penetrated by the protrusions, A metal layer different from the metal layer is formed on the surface of the interlayer insulating layer including the inter-conductor connection protrusions, and has a spacer formed of the same material and at the same height as the upper and lower inter-conductor connection protrusions. A method for manufacturing a printed circuit board, characterized in that a spacer is formed in the same step as the step for connecting the upper and lower conductors.

According to a twenty-ninth aspect of the present invention, in the printed circuit board, a large number of metal-to-conductor connection protrusions are arranged on the surface of the metal layer, and an interlayer insulating film is formed on the surface of the metal layer where the connection-to-conductor connection protrusions are formed. A layer is provided in a state penetrated by the projections, and a metal layer different from the metal layer is formed on the surface of the interlayer insulating layer including the inter-conductor connection projections. It is characterized by having recognition marks formed of the same material at the same height.

A method for manufacturing a printed circuit board according to claim 30 is characterized in that:
A plurality of inter-conductor connection protrusions made of a metal are arranged on the surface of the metal layer, and an interlayer insulating layer is provided on the surface of the metal layer where the inter-conductor connection protrusions are formed, in a state where the inter-layer insulation layer is penetrated by the protrusions, A recognition mark formed by forming a metal layer different from the metal layer on the surface of the interlayer insulating layer including the inter-conductor connection protrusions, and formed of the same material and at the same height as the upper and lower conductor connection protrusions Wherein the recognition mark is formed in the same step as the step of connecting the upper and lower conductor connecting protrusions.

According to a thirty-first aspect of the printed circuit board, a conductor circuit formed of a metal layer is formed on both upper and lower surfaces of the base made of an insulating resin, and the through holes for electrically connecting the wirings on both surfaces are formed on the base. And a circuit board serving as a core formed of an insulating resin, and a wiring circuit having a protrusion for connection between upper and lower conductors formed of a metal layer on both surfaces of the circuit board, respectively. The other circuit board formed with the insulating layer penetrated by the upper and lower conductor connecting projections on the surface of the above is connected to the wiring circuit composed of the metal layer with the top end of the upper and lower conductor connecting projections Wherein the upper and lower conductor connecting protrusions and the wiring circuit are connected via a conductive paste or a noble metal layer.

The method of manufacturing a printed circuit board according to claim 32 is
Wiring circuits made of a metal layer are formed on both upper and lower surfaces of a base made of an insulating resin, and through holes that electrically connect the wiring on both surfaces become cores formed in the insulating resin forming the base. A circuit board and a wiring circuit having a selectively formed upper and lower conductor connection protrusion formed of a metal layer on both surfaces of the circuit board. Another circuit board formed in a state penetrated by the projection was laminated with the top end of the projection for connection between the upper and lower conductors connected to the wiring circuit made of the metal layer via a conductive paste or a noble metal layer. In a method for manufacturing a wired circuit board, the circuit board serving as the core, and before laminating another circuit board on both surfaces thereof, a surface of a metal layer forming a wiring circuit of the circuit board serving as the core in advance, Conductive paste or Wherein the previously formed the noble metal layer.

According to a thirty-third aspect of the present invention, the upper and lower conductor connecting protrusions made of the same metal as the metal layer are selectively formed on the metal layer forming the conductor circuit. An inter-layer insulating layer is formed on the surface on the side where the inter-conductor connection projection is formed by being penetrated by the upper and lower inter-conductor connection projections, and a conductor circuit different from the conductor circuit is formed on the inter-layer insulation layer. Although the solder, conductive paste or noble metal film is formed on one surface of the metal layer corresponding to the projection for connection between the upper and lower conductors, the one surface is connected to the solder, conductive paste or noble metal film for connection between the upper and lower conductors. The projections are stacked so as to be connected.

According to a thirty-fourth aspect of the present invention, there is provided the printed circuit board according to the thirty-third aspect.
In the printed circuit board described above, a metal film forming the another conductor circuit has a large hole in a portion corresponding to the projection for connection between the upper and lower conductors.

The printed circuit board according to claim 35, wherein the upper and lower conductor connecting projections made of the same metal as the metal layer are selectively formed on the metal layer forming the conductor circuit. An inter-layer insulating layer is formed on the surface on the side where the inter-conductor connection projection is formed by being penetrated by the upper and lower inter-conductor connection projections, and a conductor circuit different from the conductor circuit is formed on the inter-layer insulation layer. Although the solder, conductive paste or noble metal film is formed on one surface of the metal layer corresponding to the projection for connection between the upper and lower conductors, the one surface is connected to the solder, conductive paste or noble metal film for connection between the upper and lower conductors. The projections are stacked so as to be connected.

The method of manufacturing a printed circuit board according to claim 36 is
Upper and lower conductor connection protrusions made of the same metal as the metal layer are selectively formed on the metal layer forming the conductor circuit, and the upper and lower conductor connection protrusions of the conductor circuit are formed on the surface of the conductor circuit. An interlayer insulating layer is formed in a state penetrated by the upper and lower conductor connecting projections, and the upper and lower conductor connecting protrusions are formed on one surface of a metal layer forming a conductor circuit different from the conductor circuit on the interlayer insulating layer. A wiring circuit board having a surface on which a solder, a conductive paste, or a noble metal film is formed corresponding to the protrusion, the one surface being laminated such that the connection protrusion between the upper and lower conductors is connected to the solder, the conductive paste, or the noble metal film In the manufacturing method, the upper and lower conductor connection projections made of the same metal as the metal layer are selectively formed on the metal layer to be the conductor circuit, but the interlayer insulation layer is formed on the upper and lower conductor connection projection formation side. Through the conductor times A solder, a conductive paste or a noble metal film is printed on a metal layer to be a conductor circuit different from the upper and lower conductor connecting protrusions, and the solder, the conductive paste or the noble metal film forming side is pressed and pressed. Accordingly, the upper and lower conductor connection projections are formed in a state in which they pierce the interlayer insulating layer and are connected to the corresponding solder, conductive paste or noble metal film.

According to a thirty-seventh aspect of the present invention, there is provided a printed circuit board comprising a metal layer having a projection for connection between upper and lower conductors, and a metal layer or a circuit board forming a conductor circuit or a conductor circuit laminated through an interlayer insulating film. In the printed circuit board, an anisotropic conductive film is used as the interlayer insulating film.

[0053]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the illustrated embodiments. 1 (A) to 1 (G) and FIG.
(H) to (K) show the first method of manufacturing the wired circuit board of the present invention.
FIG. 4 is a cross-sectional view showing the embodiment in the order of steps. (A) As shown in FIG. 1A, a base material (for example, glass epoxy prepreg) 20 is prepared. The base material 2
Reference numeral 0 denotes an etching barrier layer (for example, 2 μm in thickness) made of, for example, nickel formed on one main surface of a copper layer for projection formation (a metal layer for projection formation) 21 having a thickness of, for example, 100 μm by plating, for example. On the surface of the barrier layer 22, a copper foil for forming a conductor circuit (metal foil for forming a conductor circuit, thickness of, for example, 18 μm) 23 is formed.

(B) Next, as shown in FIG. 1B, a resist film 24 is selectively formed on the surface of the copper layer 21 for forming the protrusions. The resist film 24 is formed so as to cover a portion where a projection is to be formed. (C) Next, by etching the copper layer 21 using the resist film 24 as a mask, the protrusions 25, 25,
.. Are formed. This etching is performed by wet etching, and an etching solution to be used is an etching solution which cannot attack the etching barrier layer 22 made of nickel but can attack the copper layer 21.

(D) Next, the resist film 24 used as an etching mask in the above etching is removed.
FIG. 1D shows a state after the etching mask is removed. (E) Next, as shown in FIG. 1E, the etching barrier layer 22 is etched using the protrusions 25, 25,... As a mask. In this etching, projection 2
Use an etchant (nickel stripper) that does not attack the metal (copper in the present embodiment) that forms 5, 25,... But does attack the metal (nickel in the present embodiment) that forms the etching barrier layer 22. .

(F) Next, as shown in FIG. 1 (E), the tops (upper portions) of the respective projections 25, 25,.
A thin conductive paste 26 is applied and cured. This step is not essential. However, due to this step, the protrusion 2
The reliability of connection between 5, 25,... And a copper foil to be formed later can be greatly increased.

(G) Next, the insulating agent sheet is applied to the copper layer 2
By pressing with a heat roller on the surface on which the projections 25, 25,... Are formed, an interlayer insulating layer 27 made of the insulating sheet is formed as shown in FIG. . In this case, the projections 25, 25,... Are formed as insulating sheets so that the upper portions of the projections 25, 25,.
(If the conductive paste 26 is applied, the height including the paste 26) is appropriately used. Otherwise, interlayer connection by the projections 25, 25,... Cannot be reliably performed. By this step, an interlayer insulating layer 27 is formed on the copper foil 23, and further,
The copper foil 23 and the etching barrier layers 22, 22, ...
Are connected to each other through the interlayer insulating layer 27 and project from the surface thereof.
Is configured. This step is performed at a temperature at which the epoxy resin softens, and is immediately returned to room temperature so that there is substantially no epoxy curing reaction.

(H), (I) Next, as shown in FIG. 2H, an interlayer insulating layer 27 of the laminate 28 is formed.
A copper foil (metal layer for forming a conductor) 29 having a thickness of, for example, about 18 μm faces the side on which the tops of the projections 25, 25... Protrude, and as shown in FIG. And laminate by thermocompression bonding. By this step, a laminated body 30 is formed in which the metal layers 23, 29 formed on both main surfaces of the interlayer insulating layer 27 are connected to each other by the above-mentioned protrusions 25, 25,.

(J), (K) Next, as shown in FIG. 2 (J), resist films 24, 24 serving as etching masks are formed on the surfaces of the metal layers 23, 29, and thereafter, the resist films 24, 24 are formed. 24, 24 as a mask, the metal layers 23, 29
Are etched to form conductor circuits 31 and 32. As a result, the conductor circuits 31 and 32 on both surfaces are
A wiring circuit board 33 as shown in FIG. This printed circuit board 33 is a first embodiment of the printed circuit board of the present invention.

According to the first embodiment, processing is performed based on the base material 20 including at least the copper layer 21 which is a thick (for example, 50 to 200 μm) projection forming metal layer capable of forming the projection 25. Since starting, there is an advantage that defects such as deformation hardly occur and dimensional stability is high. Further, since there is no positional deviation of the protrusion after the formation of the protrusion due to the dimensional stability, for example, FIG.
3. In the conventional example shown in FIG. 24, there is no such a problem that the conductive paste 3 (so-called through hole) in the hole 2 is displaced and the connection between the upper and lower conductor circuits 5, 5 cannot be established. Therefore, it is possible to obtain an ultra-high-density wiring circuit board 33 in which the projections 25 having a small diameter are arranged at high density and the interlayer connection between the conductor circuits is ensured.

Further, since the projections 25 are formed by the copper layer 21 made of, for example, copper, the material cost required for the formation can be reduced. Therefore, even if the arrangement density of the projections 25 is increased and the number of arrangements is increased, In addition, since an expensive conductive paste containing a noble metal such as silver as a main material is used as in the related art, the cost of the printed circuit board does not increase, which greatly contributes to a reduction in the price of the printed circuit board.

Since the projections 25 are formed by selectively etching the copper layer 21, the height of the projections 25 is
The thickness of the copper layer 21 can be manufactured with extremely high uniformity, so that the height of the projections 25 can be made uniform. Therefore, as in the conventional example shown in FIG. 25, the projections 11 are formed by printing with a conductive paste, so that the heights of the projections 11 become uneven, and there is a possibility that the connection between the upper and lower conductor circuits may be incomplete. In other words, the solvent component volatilizes during the curing process of the conductive paste 3 as in the conventional example shown in FIGS. 23 and 24, and the upper portion becomes a concave portion, and the connection between the upper and lower conductor circuits may be incomplete. No problem.
Therefore, even if the projections 25 become finer and higher in density, reliable connection between the upper and lower conductor circuits can be expected, and the yield and reliability can be improved.

FIGS. 3A to 3F show a second embodiment of a method of manufacturing a printed circuit board according to the present invention in the order of steps. (A) In the same manner as shown in FIGS.
5 is formed. FIG. 3A shows a state in which the projection 25 is formed.

(B) Next, as shown in FIG. 3 (B), the tops (upper portions) of the respective projections 25, 25,.
A thin conductive paste 26 is applied and cured. This step is not essential. However, due to this step, the protrusion 2
The reliability of connection between 5, 25,... And a copper foil to be formed later can be greatly increased. Note that, in the present embodiment, the etching barrier layer 22 is not removed using the projections 25, 25,... As a mask. As will become clear later, the etching barrier layer 22 is etched simultaneously with the metal layer 23 when the conductive layer is formed by patterning by selectively etching the metal layer 23 to remove unnecessary portions. Is performed. This is a major difference from the first embodiment shown in FIGS. .

(C) Next, as shown in FIG. 3C, an interlayer insulating film 27 is formed. Reference numeral 28 denotes a laminate after the completion of the forming step. (D) Next, as shown in FIG.
By laminating a copper foil (metal layer for forming a conductor) 29 on the main surface of the interlayer insulating layer 27 by thermocompression bonding, the metal layers 23 and 29 formed on both main surfaces of the interlayer insulating layer 27 are formed on the protrusions 25, 25.
The laminated body 30 connected between layers is constituted by (1).

(E) Next, as shown in FIG. 3 (E), resist films 24, 24 serving as etching masks are formed on the surfaces of the metal layers 23, 29.
Conductive circuits 31, 32 are formed by etching the metal layers 23, 29 using the masks 4 and 24 as masks.
Further, the etching also etches the etching barrier layer 22 made of nickel in contact with the metal layer 23 by the etching. Thereby, the conductor circuits 31, 3 on both sides are provided.
A printed circuit board 33 in which the layers 2 are interconnected by the protrusions 25, 25,... Is completed.

(F) Thereafter, as shown in FIG.
The resist films 24 used as the etching mask are removed. The printed circuit board 33 after the removal is a second embodiment of the printed circuit board of the present invention. In addition, the resist film 24 where the conductor circuits 31 and 32 are formed,
Naturally, etching using 24 as a mask is performed using an etchant capable of etching both nickel-based metal and copper-based metal. Then, the etching barrier layer 22 made of nickel is formed into the same resist film 24 together with the metal layer 23.
Is selectively removed by one-time selective etching using a mask as a mask, so that it is not necessary to selectively remove the etching barrier layer 22 using the protrusion 25 as a mask after the formation of the protrusion 25, and therefore the number of steps can be reduced. There is an advantage that you can.

According to the second embodiment shown in FIG. 3, not only the same advantages as in the first embodiment shown in FIGS. 1 and 2 can be obtained, but also the etching barrier layer 2 can be obtained.
2 can be selectively removed together with the metal layer 23 by a single selective etching using the same resist film 24 as a mask, so that there is an advantage that the number of steps can be reduced as compared with the first embodiment.

FIGS. 4A to 4C show a third embodiment of the method of manufacturing a printed circuit board according to the present invention in the order of steps. This embodiment is different from the first embodiment in that the laminated bodies 28 formed on the both sides of the printed circuit board 33 in the steps (A) to (G) of the first embodiment are formed. , 28 are laminated, and the metal layers 23, 23 of the respective laminates 28, 28 are patterned by selective etching to form conductor circuits, thereby obtaining four-layer conductor circuits.

(A) First, as shown in FIG. 4A, the surfaces of the printed circuit board 33 on which the laminates 28, 28 are formed with the projections 25 and the interlayer insulating layer 27 are formed on the both sides of the printed circuit board 33. Facing each other so as to face. Then, they are laminated and integrated by thermocompression bonding using a lamination press. (B) Next, as shown in FIG.
Resist films 24, 24 on the metal layers 23, 23
Are formed selectively.

(C) Conductive circuits 35 are formed by etching the metal layers 23 using the resist films 24 as a mask. Thus, the printed circuit board 36 is completed. This printed circuit board 36 is a second embodiment of the printed circuit board of the present invention. According to this embodiment, a printed circuit board 36 having four layers of conductor circuits can be obtained, and further higher density can be achieved.

FIGS. 5A to 5G and FIGS.
(I) is sectional drawing which shows 4th Embodiment of the manufacturing method of the printed circuit board of this invention in order of a process. (A) A base material 20 which is the same as the base material shown in FIG. 1 (A) is prepared, and then a resist film 24 is applied to the surface of the copper layer 21 which will become projections (25, 25,...) Later. Then, patterning is performed as shown in FIG. 5A by exposure and development. Specifically, the resist film 24 is patterned so that only the portions that become the projections (25, 25,...) Are opened, and the portions where the projections (25, 25,...) Are not formed are covered.

(B) Next, as shown in FIG. 5B, solder plating layers (thickness, for example, 20 μm) 37, 37,... Are formed by electrolytic plating using the resist film 24 as a mask. The solder plating layer is made of, for example, tin Sn / lead Pb or tin Sn / silver Ag / copper Cu. In addition, gold Au, silver Ag
Alternatively, a palladium Pd plating layer may be formed. (C) Next, as shown in FIG. 5C, the resist film 24 is peeled off. (D) Next, as shown in FIG. 5D, the metal layer 21 made of copper is selectively etched using the solder plating layers 37, 37,.
5, 25,... Are formed. (E) Next, as shown in FIG. 5E, the etching barrier layer 22 made of nickel is peeled off.

(F) Next, as shown in FIG. 5 (F), the solder plating layers 37, 37,
.. Cover the surfaces of the projections 25, 25,. (G) Next, the insulating sheet is attached to the projections 25, 25,.
By pressing with a heat roller on the surface on the side where... Are formed, an interlayer insulating layer 27 made of the insulating sheet is formed as shown in FIG. In this case, the projections 25, 2
Are appropriately thinner than the heights of the projections 25, 25,... Including the solder plating layer 36, so that the upper portions of the projections 5,. Otherwise, the tops of the projections 25, 25,... Do not protrude from the surface of the interlayer insulating layer 27, and the upper and lower conductor circuits cannot be reliably connected. The laminate formed in this step is designated as 28a.

(H) Next, as shown in FIG.
The interlayer insulating layer 27 of the laminate 28 is formed, and the protrusion 2
5, 25,... Have a thickness of 1
A copper foil 29 forming a metal layer for forming a conductor circuit of about 8 μm is exposed. (I) Thereafter, lamination is performed by thermocompression bonding using a laminating press, a resist film is selectively formed on the copper foil 29 and the metal layer 23, and the copper foil 29 and the metal layer are formed using the resist film as a mask. Conductive circuits 31 and 32 are formed by etching 23. Thereby, the printed circuit board 3
3a is done. This printed circuit board 33a is a third embodiment of the printed circuit board of the present invention.

This embodiment is different from the embodiment shown in FIGS. 1 and 2 in that the copper layer 21 is selectively etched to form the protrusions 2.
When forming 5, 25,..., The solder plating layer 36 is used instead of the resist film 24 as an etching mask, and then the solder plating layer 36 is left without being removed to form an interlayer insulating layer made of an insulating sheet. Are formed in such a manner that the protrusions 25, 25,... Therefore, according to the present embodiment, it is not necessary to apply the conductive paste 26 on the protrusions 25, 25,... As in the embodiment shown in FIGS. Only in this respect, the present embodiment is different from the embodiments of FIGS. 1 and 2 and there is no difference outside.

FIGS. 7A to 7H and FIGS. 8I to
(K) is sectional drawing which shows 5th Embodiment of the manufacturing method of the printed circuit board of this invention in order of a process. (A) First, a base metal (thickness, for example, 50 to 150 μm) 21a made of copper and forming a metal layer for forming a projection is prepared, and as shown in FIG. 7A, a photosensitive resin film is formed on one surface thereof. Apply 40.

(B) Next, as shown in FIG. 7B, the photosensitive resin film 40 is formed so as to have openings 41, 41,. These openings 41, 41,... Are formed at positions corresponding to positions where protrusions (25, 25,...) Will be formed later. (C) Next, as shown in FIG.
On the side of 1a where the photosensitive resin film 40 is formed, a wiring film 42 made of, for example, copper is formed. The wiring film 42 can be formed, for example, as follows.

First, a thin conductive layer made of, for example, Ni—P is formed by electroless plating, and a resist film having a negative pattern with respect to the wiring film 42 to be formed is formed on the surface thereof. The wiring film 42 is formed by, for example, electroplating copper, and then, using the wiring film 42 as a mask, Ni-
By removing the conductive layer made of P, a short-circuit state between the wiring films 42 is eliminated.

(D) Next, the surface of the base metal 21a on the side where the wiring film 42 is formed is covered with a photosensitive resin film 43.
Are applied, and then the photosensitive resin film 43 is exposed and developed to form openings 44 for forming terminals. FIG. 7D shows a state after the openings 44 are formed. (E) Next, as shown in FIG. 7E, projecting microballs 45, 45,... Are formed in the openings 44, 44,.

(F) Next, as shown in FIG. 7F, the projections 25, 2
.. Are formed. (G) Next, in the same manner as in the embodiment shown in FIGS. 1 and 2, as shown in FIG.
.. Are coated with conductive pastes 26, 26,.

(H) Next, in the same manner as in the embodiment shown in FIGS. 1 and 2, an interlayer insulating film 27 made of an insulating material sheet is formed as shown in FIG. The substrate after this formation is referred to as a substrate 46 for convenience. (I) Next, two substrates 46 and 46, which have been advanced to the step (H) of the present embodiment, and one printed circuit board 33 of the embodiment shown in FIGS. Is prepared, and FIG.
As shown in (I), the substrates 46, 46 are positioned on both sides of the printed circuit board 33 so as to face the side where the protrusions 25 and the interlayer insulating film 27 are formed.

(J) Then, the printed circuit board 33 and the substrates 46, 46 sandwiching the printed circuit board 33 in a sandwich shape are pressure-bonded to form the printed circuit board 4 as shown in FIG.
Get 7. This printed circuit board 47 is a fourth embodiment of the printed circuit board of the present invention. (K) Thereafter, as shown in FIG. 8 (K), LSI chips 48, 48,... Are mounted on both surfaces of the printed circuit board 47. In this case, the micro balls 45, 45,.
.. the conductor circuit of the laminate 47 and the LSI chip 4
8, 48,... Function as connection means.

According to such a printed circuit board 47, the LSI chips 48, 48,... Can be mounted at an extremely high integration density. The embodiment shown in FIG. 8 may have various modifications. First, the printed circuit boards 46, 4
As the number 6, the number of layers of the conductor circuit on the anti-projection formation side is one, but the number of layers is not necessarily one, but is two or more. Is also good. The increase in the number of layers can be achieved, for example, by selectively forming a photosensitive insulating resin, forming a thin conductive layer by electroless plating, forming a resist film having a negative pattern with respect to the pattern to be formed, and using the conductive layer as a base. This can be easily performed by performing a series of steps of forming a conductor circuit made of, for example, copper or the like by electrolytic plating using the resist film as a mask, and removing the conductor film using the conductor circuit as a mask.

Further, the printed circuit boards 46, 46 are laminated and integrated via the printed circuit board 33 to be integrated.
However, it is not essential to do so. For example, the printed circuit boards 46 may be directly laminated and integrated, or conversely, the printed circuit boards 46 The number of printed circuit boards to be interposed is not limited to one, but may be plural. What is mounted on the printed circuit board does not necessarily have to be the bare LSI chip 48, but may be an LSI housed in a package.

FIGS. 9A to 9E are sectional views showing a seventh embodiment of the printed circuit board according to the present invention in the order of steps. (A) First, as shown in FIG. 9A, a base material 51 having a single layer structure made of a metal plate such as copper is prepared, and a resist film 52 is selectively formed on one surface thereof.

(B) Next, as shown in FIG. 9B, the base material 51 is half-etched from the surface thereof using the resist film 52 as a mask to form the projection 53 for connecting the upper and lower conductors. . Note that half-etching does not literally mean half-thickness etching, but rather etching while leaving a portion that will become a circuit layer. (C) Next, as shown in FIG. 9 (C), if necessary, a conductive paste, a solder, a noble metal such as gold, or an anisotropic conductive film is used to improve the connectivity, or A film 54 for improving the reliability of the connectivity is coated. The film 54 is not indispensable, but may be provided when it is necessary to improve the connectivity or the reliability.

(D) Next, as shown in FIG. 9D, a metal foil 56 made of copper or the like is laminated on the one surface of the base member 51 via an interlayer insulating film 55. (E) Next, as shown in FIG.
A conductive circuit is formed by selectively etching the other surface portion of the first and the surface of the metal foil. Thus, a printed circuit board substantially the same as that shown in FIG. 1K is completed. Therefore, this printed circuit board is not shown in FIG.
8 and the printed circuit board 47 of the embodiment shown in FIG. 8 can be used in place of the printed circuit board 33. That is, the present wiring circuit board can be used in place of all parts where the wiring circuit board 33 is used.

Further, the printed circuit board before the metal foil 56 such as copper is formed is replaced with the printed circuit board 28 of the embodiment shown in FIG. 4 and the printed circuit board 46 of the embodiment shown in FIG. Can be used. Further, the wiring circuit board in a state before the formation of the metal foil 56 can be multi-layered in the same manner as the wiring circuit board 46 shown in FIG. 8 to further increase the integration density.

According to such a method of manufacturing a printed circuit board, it is not necessary to use a multilayered structure having an etching barrier layer as a base material, and a step of removing the etching barrier layer is required. Can be reduced in manufacturing cost.

After the formation of the projection 53, the tip of the projection 53 may be roughened so that a large number of needle-like spines are formed, thereby improving the connection with the conductor circuit made of the metal foil 56. Roughening can be performed by spray etching or CZ processing.
Further, it can be roughened by crushed copper plating. Further, the entire surface of the copper including the projections 53 is subjected to electrolytic chromate treatment to form an electrolytic chromate film, thereby improving the antioxidant properties of the projections 53 and the copper surface and preventing the copper foil from being deteriorated due to oxidation. May be.

The protrusion 53 for connection between the upper and lower conductors of the printed circuit board shown in FIG. 9 has a conide shape (Mt. Fuji shape).
However, this is not essential, and a drum shape may be used as shown in FIG.
3a shows a drum-shaped projection. ). By changing the etching conditions, the shape of the protrusion changes, and a drum-shaped protrusion 53a can be formed. Since the projection 53a has a wide top surface, there are advantages in that soldering, conductive paste processing, and the like can be easily performed, and that the connection with the conductor circuit can be easily improved.

As shown in FIG. 10B, a spear-shaped projection 57 may be formed. Since the spear-shaped projection 57 has a sharp point, it is easy to improve the penetrating property of the interlayer insulating film 55, particularly to the prepreg containing glass cloth, and it is easy to bite into the conductor circuit. There is an advantage that the property can be increased. Such a spear-shaped projection 57 can be formed by etching the resist mask with a smaller diameter than the projection to be formed. Alternatively, a conide-shaped or drum-shaped projection is formed by selective etching (of course, half-etching) using a resist film or the like as a mask, then the mask is removed, and etching is again performed (of course, half-etching). be able to.

FIG. 11 shows a projection 53 of the printed circuit board of the present invention.
57 or 25 (see FIGS. 1 to 8 for the projection 25)
FIG. 7 is a perspective view showing a main part of an embodiment characterized in that is disposed on each intersection of a lattice. In the present embodiment,
The projections, for example, 57 are arranged on the respective intersections of a grid consisting of lines provided vertically and horizontally (ideally) at predetermined intervals, and other points are different from those of the other embodiments. There is no.

According to such a printed circuit board, regardless of the type of the printed circuit board, mass production is performed before the conductive circuits on both surfaces are formed by selective etching, and thereafter, Depending on the model, conductor patterns of different patterns can be formed, so only specific protrusions are used for interlayer connection, and others are not constituted by circuits, or slightly over-etched As a result, unnecessary projections can be removed by etching, and the productivity of other types of printed circuit boards can be increased.

FIG. 12 shows an embodiment in which the projections 57 and the like are arranged such that the pressing force when the metal layer 56 and the like are stacked via the interlayer insulating film 55 is uniform for each projection. According to such an embodiment, since the in-plane uniformity of the press pressure at the time of lamination can be improved, the uniformity of the degree of crushing of the projection 57 can be improved,
Further, the uniformity of the plate pressure of the wiring board can be improved, and the reliability of the printed circuit board can be increased.

FIG. 13 shows a projection for connecting the upper and lower conductors, for example, 57
In the case where the arrangement density of the first and second conductors is not constant, a dummy projection 58 shorter than the upper and lower conductor connection projections 57 is arranged around the dense area and the dense area when there is a dense area. It is sectional drawing which shows the principal part of embodiment which made uniform the diameter and height of the connection projection 57. That is, in the dense area, the peripheral portion and the central portion have different etching rates due to the different flow of the liquid after the spraying of the etching liquid, and the peripheral portion having a faster liquid flow has a higher etching rate and a smaller diameter in the peripheral portion. And it tends to be low. Therefore, the surrounding area is surrounded by dummy projections 58 that do not directly participate in the circuit (ie, do not constitute the circuit), thereby lowering the etching rate for the upper and lower conductor connection projections 57 in the peripheral portion, thereby reducing the peripheral upper and lower conductor connection. In the present embodiment, the projection 57 for connection is also made to have the same diameter and the same height as the projection 57 for connection between the upper and lower conductors at the center. It is also effective to make the resist diameter serving as a mask smaller than the other protrusions 57 so that the dummy protrusions 58 disappear after etching.

If the distance between the projections for connecting the upper and lower conductors is large, there is a difference in the etching rate between the peripheral portion and the center of the projection. Therefore, a dummy protrusion 58 may be arranged around each of the upper and lower conductor connection protrusions 57. FIG.
(A) to (D) are plan views showing such different examples.

FIGS. 14A and 14B show a ring-shaped dummy projection 5 around each upper and lower conductor connection projection 57.
8A, in which (A) shows that the adjacent dummy projections 58 are separated, and (B) shows that the adjacent dummy projections 58 partially overlap each other. It is.

FIGS. 14C and 14D show a case where a plurality of dummy protrusions 58 are arranged around each upper and lower conductor connecting protrusion 57, and FIG. A plurality of dummy projections 58 are provided only on one surrounding circular line.
Are arranged, and those shown in FIG.
, Dummy protrusions 58 are arranged at predetermined intervals in a region outside the circular line 58a surrounding the dummy protrusions 58a.

FIG. 15 shows a projection for connecting the upper and lower conductors, for example, 5
FIG. 3 is a cross-sectional view showing an embodiment in which different heights 53h and 53l are mixed as 3, and the upper and lower conductor connection projections having different heights, for example, 53 are mixed on a joint surface having a step. This is because the upper and lower conductor connection projections, for example, 53 can be joined. In FIG. 15, reference numeral 60 denotes a core substrate having a stepped joint surface. The core substrate 60 is formed by filling the through-holes of the double-sided wiring board with the copper paste 100 by a normal method, and curing the same.
The heights of the copper paste 100 and the copper wiring portion 54 are different. Then, on both surfaces of the core substrate 60, a printed circuit board using the protrusions 53 as a means for connecting the upper and lower conductors is laminated. The high protrusion 53h is connected to the copper paste 110, and the low protrusion 53l is connected to the copper wiring portion 54.

The formation of the projections 53h and 53l having different heights makes the diameter of each mask portion of a mask made of a resist film used when selectively etching the surface of the base material 51 different from each other. This is possible by enlarging the diameter of the mask portion covering the portion to be formed and decreasing the diameter of the mask portion covering the portion where the low protrusion 53b is to be formed.

In the printed circuit board shown in FIG. 15, the copper wiring film 54 of the core substrate 60 is not formed with a film of conductive paste, solder, noble metal, or the like. (Or 57) are directly connected. The present invention can be implemented in such a form. This applies to the form having the high protrusions 53a and the low protrusions 53b and the form in which the heights of the protrusions 53 (or 57) are uniform.

In the type in which a projection made of copper, for example, 53 (or 57) is directly connected to the copper wiring film 54 without a coating of a conductive paste, solder, or a noble metal, a broken line in FIG. As shown by, a hole 54a smaller than the diameter at the top of the projection, for example, 53 (or 57) may be formed in the wiring film 54. By doing so, the protrusion 53 (or 5
When 7) is connected to the copper wiring film 54, the top of the projection 53 (or 57) abuts the hole 54a and breaks it, and the connection between the projection 53 and the metal film 54 can be further strengthened. is there. Of course, the formation of the hole 54a can be achieved by the protrusions 53h and 53h having different heights as shown in FIG.
It is very effective whether the embodiment has the projections 53 of uniform height, regardless of whether the embodiment has the l.

FIGS. 16A and 16B show a step of forming a spacer 61 having the same material and the same height as the upper and lower conductor connection projections, for example, 57, in the step of forming the projections. The distance between the conductor circuit made of the base material 51 and the core substrate or the like (not shown in FIG. 16) laminated on the printed circuit board is kept constant as predetermined, and the thickness of the insulating layer is set at a predetermined position, and FIG. 3A is a perspective view showing a main part before a conductor circuit is formed according to the embodiment in which the impedance controllability of the circuit board is enhanced.
(B) is a sectional view.

That is, a projection is formed by selective etching of the copper base material 51 and is used for connection between the upper and lower conductors. However, the insulating sheet does not originally have a good thickness tolerance, and the temperature and pressure at the time of lamination are different. Therefore, it is difficult to stabilize the thickness of the insulating layer because the finished thickness varies.
Therefore, the distance between the copper foil and the core substrate laminated thereon is not constant, and it is difficult to control the impedance. Therefore, the spacer 61 is formed at an appropriate place in the same process as the projection, and the spacer is pressed against the pre-stripe until the spacer 61 hits the core substrate, and the remaining insulating material is extruded to the periphery to keep the distance between the upper and lower copper patterns constant. In this embodiment, the impedance controllability is improved. The spacer 61 may be formed in any pattern as long as it does not hinder the formation of the conductor circuit, for example, by forming a pattern in a lattice shape or a frame shape. The spacer 61 can be used as a ground line for an electrostatic shield.

FIG. 17 shows a large diameter upper and lower conductor connecting projection 53x mixed with a large diameter 53x and a small diameter 53y as the upper and lower conductor connecting projection 53x for connecting the upper and lower conductors through which a large current flows. FIG. 13 is a cross-sectional view showing a main part of an embodiment in which a projection 53y for connection between upper and lower conductors having a small diameter is used for connection between upper and lower conductors for passing a small current.

According to the present embodiment, even if a small current or a large current is passed through the upper and lower conductor connecting projections having the same size, a significant voltage drop occurs in the upper and lower conductor connecting projections through which a large current flows. Eliminates the risk of heat generation, and allows small currents and large currents to pass through relatively large upper and lower conductor connection projections of the same size. There is no danger of hindering improvement.

FIGS. 18A to 18C show projections 53, for example.
57A shows a main part of an embodiment in which a positioning mark or a model recognition mark 63 is formed at the same time as 57 and the like. FIG. (B) is a pattern diagram of a positioning mark, which is an example 63a of a mark, and (C) is a pattern diagram of a positioning mark, which is another example 63b of a mark. is there.

In this embodiment, projections, for example, 53, 57
Since the mark 63 is formed at the same time when the mark 63 is formed, the mark 63 is made of the same material as the protrusions, for example, 53, 57, and has the same height. According to the present embodiment, the mark 6
Since 3 is formed simultaneously with the projections, for example, 53, 57, etc.
There is an advantage that there is no special process for forming the mark 63, and the mark 63 and each projection are formed in the same process, so that the positional relationship between the mark 63 and each projection can be minimized. it can.

FIGS. 19A to 19D are sectional views showing a ninth embodiment of the method of manufacturing a printed circuit board according to the present invention in the order of steps. (A) First, as shown in FIG.
Prepare Reference numeral 71 denotes an insulating substrate made of resin, and 72 denotes a conductor circuit formed on both surfaces thereof, which is made of copper. 73 is a through hole for connection between the upper and lower conductors. The printed circuit board having the protrusions 53 or 57 on both surfaces of the core substrate 20 is laminated.

(B) Next, at least portions of the conductor circuits 72 on the upper and lower surfaces of the core substrate 20 which are to be connected to the projections of the printed circuit board to be laminated, as shown in FIG. A layer 74 made of a conductive paste, solder, or a noble metal is formed. (C) Next, as shown in FIG. 19C, a printed circuit board 75 is formed on each of the upper and lower surfaces of the core
3 are laminated via the interlayer insulating film 55 such that the contact portions 3 are in contact with the corresponding portions of the conductor circuit 72.

(D) Next, as shown in FIG.
The base material 51 of each of the upper and lower wiring circuit boards 75 is patterned by selective etching to form a conductor circuit. As a result, it is possible to obtain a highly integrated wiring circuit board which is built up with the two wiring circuit boards 75 and the core substrate 20 and which has high reliability in connection between the protrusions and the conductor circuits.

The formation of the conductor circuit by selective etching of the base member 51 of each printed circuit board 75 may be performed before the printed circuit boards 75 are laminated on both surfaces of the core substrate 20.

FIGS. 20 (A) and 20 (B) show a hole 7 having a diameter larger than the diameter of the top of the projection 53 in a portion corresponding to the projection, for example, 53 or 57, of the conductor circuit 72 in the above embodiment.
2A shows an example in which 2a is formed, and FIG.
FIG. 3B is a cross-sectional view, and FIG. 3B is a plan view showing a shape of a portion connected to a protrusion of the conductor circuit 72. According to such an example,
Since the protrusion 53 can be partially inserted into the hole 72a via the layer 74 made of a conductive paste, solder, or a noble metal, the connection strength can be further increased, and the reliability can be increased.

FIG. 20C shows that after forming a layer 74 made of conductive paste, solder, or a noble metal, the surface is polished to form the layer 7.
4 is a cross-sectional view showing an example in which a portion on the conductor circuit 72 of No. 4 is removed so that a conductive paste, solder, or a noble metal 74 exists only in the hole 72a. In this case, for example, when the printed circuit boards 75 are stacked, the projections 53 or 57 are connected to the conductor circuit 72 in a state where the projections 53 or 57 pierce the conductive paste, the solder or the noble metal 74 in the holes 72a.

FIGS. 21A to 21C are sectional views showing a tenth embodiment of a method of manufacturing a printed circuit board according to the present invention in the order of steps. (A) As shown in FIG. 21 (A), a copper foil to be laminated on a surface of a side of a printed circuit board such as 53 or 57 via an interlayer insulating film 55 as shown in FIG. A part 56 in which a metal film 76 such as a conductive paste, a solder or a noble metal (for example, gold) for improving or securing the connectivity is previously formed on a portion is prepared.

(B) Next, as shown in FIG.
The surface of the copper foil 56 on the side where the metal film 76 is formed faces the surface of the base material 51 on the side where the protrusion 53 is formed via the interlayer insulating film 55. (C) Next, as shown in FIG.
The base material 51 having a protrusion, for example, 53 is laminated via an interlayer insulating film 55. Then, the protrusion, for example, 53 breaks through the interlayer insulating film 55 and comes into contact with the metal film 76.

Thereafter, although not shown, the base member 51 is not shown.
And copper foil 56 are simultaneously or selectively etched to form conductive circuits on both surfaces. According to such an embodiment, it is possible to improve the connectivity between the projections, for example, 53 and the conductor circuit made of the copper foil 56.

FIG. 22 is a sectional view showing an embodiment in which an anisotropic conductive film 55a is used as the interlayer insulating film 55 of the printed circuit board of the present invention. According to the present embodiment, since the anisotropic conductive film 55a in which metal particles are dispersed is used as the interlayer insulating film, the portion sandwiched between the projection 53 and the copper foil 56 is subjected to vertical addition at that portion. The conductive particles are interposed between the projection 53 and the copper foil 56 by the pressure, and the particles are pressed to improve the reliability of the connection such as piercing on both surfaces, and have conductivity. Hold. Therefore, the connectivity between the projection 53 and the copper foil 56 can be ensured by the anisotropic conductive film 55a, and the insulation required for the interlayer insulating film can also be ensured.

It is to be noted that the anisotropic conductive film may be formed only on the protrusion, for example, only on the protrusion 53, and the interlayer insulating film may be formed of a normal insulating resin. In that case, the electrical connection between the projection and, for example, the copper foil 56 is established by the anisotropic conductive film, and the insulation is ensured by the ordinary insulating resin.

[0122]

According to the printed circuit board of the first aspect, the projection made of the metal is selectively formed on the metal layer made of the conductor circuit via the etching barrier layer made of a metal different from the metal layer. The protrusions can be formed by selective etching of the metal layer while preventing the metal layer serving as a conductor circuit from being eroded by the etching barrier layer. Therefore, a printed circuit board can be obtained by using a base material having at least the height of the protrusion or a thickness greater than that. Therefore, the possibility that the base material is bent or deformed during the manufacturing process is reduced. Also, since the dimensions do not fluctuate in the manufacturing process and the positions of the projections do not shift in the horizontal direction, even if the projections are formed finely and the arrangement density is increased, the upper and lower conductors may be displaced due to the displacement of the projections. There is no danger of interlayer connection failure between circuits, and the yield and reliability are increased.

Further, since the projections can be formed by a metal layer and the metal layer can be formed by a relatively low-cost material such as copper, a conductive paste formed by filling a conventional hole or by printing can be used. The cost of the printed circuit board can be reduced as compared with the case where it is used as the connection means between the upper and lower conductor circuits. Further, as described above, since the protrusions are formed by selective etching of the metal layer, the height can be made uniform, and there is no possibility that a connection failure between the upper and lower conductor circuits due to the unevenness of the height will occur. Further, since the protrusion is integrated with the metal layer forming the conductor circuit, the mechanical strength of the protrusion forming portion can be increased as compared with the related art.

According to the second aspect of the present invention, since the conductive paste material is coated on the surface of the projection as a surface treating agent, the bonding property between the projection and the conductive circuit can be enhanced by the conductive paste.

According to a third aspect of the present invention, there is provided a method for manufacturing a printed circuit board, wherein an etching barrier layer is formed on a metal layer for forming projections, and a metal layer serving as a conductor circuit is formed on the etching barrier layer. Then, the metal layer for forming the protrusions is selectively etched with an etchant that does not attack the etching barrier layer to form the protrusions, and only the etching barrier layer is formed of the metal forming the conductor circuit using the protrusions as a mask. Remove with an etchant that does not attack the layer,
2. The printed circuit board according to claim 1, wherein an insulating layer for interlayer insulation is formed on the surface of the metal layer forming the conductor circuit on the side on which the protrusion is formed, and the protrusion is used as interlayer connection means connected to the conductor circuit. Thus, the same effects as those described for the wired circuit board of claim 1 can be obtained.

According to the method for manufacturing a printed circuit board according to the fourth aspect, the selective etching of the etching barrier layer using the projections as a mask in the method for manufacturing a printed circuit board according to the third aspect is not performed, and the metal forming the conductive circuit is formed. Since the etching barrier layer is etched together with the metal layer in the selective etching of the layer, a step only for removing an unnecessary portion of the etching barrier layer can be eliminated. Therefore, the number of manufacturing steps can be reduced.

According to the method of manufacturing a printed circuit board of claim 5, in the method of manufacturing a printed circuit board of claim 3 or 4, the layer made of the base metal is selectively etched to form the protrusion. At this time, a metal layer is used as an etching mask, and even after the formation of the projections, the metal layer used as the etching mask is left so as to cover the entire surface of the projection with the metal layer. The metal layer used as an etching mask can be used as a means for improving the connectivity between each of the protrusions and the conductor circuit without performing a troublesome operation of applying the conductive paste.

According to the method of manufacturing a printed circuit board of claim 6, the printed circuit board of claim 1 and a metal foil are laminated, and both the metal layer of the printed circuit board and the metal foil are selectively etched. Accordingly, it is possible to obtain a printed circuit board having conductor circuits on both sides insulated by an interlayer insulating film and electrically connecting the conductor circuits by protrusions penetrating the interlayer insulating film.

According to the method of manufacturing a printed circuit board of claim 7, the printed circuit board of claim 1 is laminated on both sides of the printed circuit board manufactured by the method of manufacturing a printed circuit board of claim 6, and The conductor circuit is formed on both sides by selectively etching the metal layers present on both sides of the integrated one on top of the integrated circuit, so that a printed circuit board having four layers of conductor circuits can be obtained. it can.

According to the method of manufacturing the printed circuit board of claim 8 and the printed circuit board of claim 9, the single-layer or multi-layer conductor circuit is formed of a base metal via an insulating layer having an opening in one main surface. Two wiring circuit boards each having a projection electrically connected to the conductor circuit through the opening, and forming an interlayer insulating film on the side of the insulating layer where the projection is formed; Is directly or indirectly laminated via a printed circuit board so that the side on which the printed circuit board faces inward is integrated, so that the number of conductive circuit layers of the printed circuit board can be extremely increased, and the mounting density can be increased. be able to.

According to the tenth aspect of the present invention, since the LSI chip or the package is mounted on both sides of the wired circuit board of the eighth aspect, a wired circuit board on which the LSI chip or the package is mounted at a high density can be obtained. it can. Since the pad is integrated with the wiring film, the structure of the pad-on-via can be strengthened, and the size of the wiring circuit board can be easily reduced.

According to the eleventh aspect of the present invention, since the upper and lower conductor connecting projections made of the same metal as the metal layer are formed on the metal layer forming the conductor circuit, the metal layer and the metal layer and the metal layer are selectively formed thereon. Since a material having a single-layer structure can be used as a base material forming a projection to be formed, material costs can be reduced. Then, the projections can be formed by half-etching the base material, which eliminates the need for a step of removing the etching barrier layer, thereby reducing man-hours. Therefore, the cost of the printed circuit board can be reduced.

According to the printed circuit board of the twelfth aspect, similarly to the printed circuit board of the eleventh aspect, it is possible to use a single-layer structure as the base material forming the metal layer and the projections selectively formed thereon. As a result, material costs can be reduced, and man-hours can be reduced. Therefore,
The cost of the printed circuit board can be reduced.

According to the printed circuit board of the thirteenth aspect, since a hole smaller in diameter than the top of the protrusion is formed in a portion corresponding to the protrusion of the metal film, the protrusion is formed when the protrusion is connected to the metal film. The top of the hole hits the hole and breaks it,
The connection between the projection and the metal film can be further strengthened.
Therefore, the connection can be strengthened and the reliability of the connection can be improved.

According to the fourteenth aspect of the present invention, since the projection for connecting the upper and lower conductors is formed in a spear shape, the interlayer insulating film is effectively formed by the projection in a glass cloth-containing glass epoxy prepreg that is generally used. In addition, the metal layer can be reliably pierced, and further pierced into the metal layer to be laminated, so that the connection between the projection and the metal layer can be further ensured.

According to the fifteenth aspect of the present invention, since the connection between the upper and lower conductors is in a conide shape, the top can be made flat, there is no possibility that the height of the protrusions will be uneven, and the base material forming the conductor circuit will be described. The distance between the upper conductor and the metal layer forming the conductor circuit laminated with the interlayer insulating film interposed therebetween can be maintained at a constant value for connection between the upper and lower conductors.

According to the sixteenth aspect of the present invention, since the upper and lower conductor connecting protrusions are drum-shaped, the plane area of the top portion thereof can be made larger and the base material and the base material forming the conductive circuit more reliably.
The effect of ensuring a constant spacing between metal layers can be obtained more reliably.

According to the seventeenth aspect of the present invention, since the surface of the projection for connection between the upper and lower conductors is roughened or crushed, the connectivity between the top and the metal layer can be further improved.

According to the eighteenth aspect of the present invention, the projections for connecting the upper and lower conductors are made of copper, and the surfaces thereof are subjected to electrolytic chromate treatment. Therefore, it is possible to prevent the surface of the metal layer from being oxidized. Thus, the reliability of the electrical connection between the protrusion and the metal layer can be increased.

According to the method of manufacturing a printed circuit board of the present invention, a mask film is selectively formed on one surface of a metal plate (base material), and the metal plate is half-etched using the mask film as a mask. Forming a metal layer and a projection to be a conductor circuit, and laminating a metal layer via an interlayer insulation layer on the surface of the metal layer to be a conductor circuit on the side where the projection is formed; Since the wiring film is formed by selectively patterning the metal layers at the same time or at different times, the wired circuit board according to claim 12 can be obtained.

According to the twentieth aspect of the present invention, since the anisotropic conductive film is interposed between the upper and lower conductor connecting protrusions and the metal layer connected to the upper and lower conductor connecting protrusions, The connection with the metal layer can be reliably established through the metal particles in the anisotropic conductive film.

According to the method for manufacturing a printed circuit board of the present invention, the step of interposing an anisotropic conductive film between the projection and the metal layer is provided before the metal layer is laminated.
Can be obtained.

According to the printed circuit board of the present invention, a large number of inter-conductor connection projections made of metal are arranged on the intersections of the grid with a fixed interval on the surface of the metal layer. Regardless of whether or not the conductor circuit on both sides is mass-produced as a standard product until the stage before it is formed by selective etching, a conductor circuit having a different pattern is formed depending on the model. Therefore, the productivity of other types of printed circuit boards can be improved. At the same time, there is no need to change the mask depending on the product type, and the copper etching amount can be reduced.
It can handle small-volume production of other varieties to large-volume production of small varieties, greatly contributing to improved economic efficiency.

According to the printed circuit board of the present invention, the upper and lower conductor connecting projections are arranged such that the upper and lower conductor connecting projections receive a uniform pressing force when pressed from both sides of the substrate. In addition, the degree of crushing of each projection can be made uniform, and hence the connectivity can be made uniform, and the reliability can be increased.

According to the twenty-fourth aspect of the present invention, small dummy projections are arranged in the periphery of each of the upper and lower conductor connection dense areas in addition to the dense upper and lower conductor connection projections. The etching rate for the connection between the upper and lower conductors of the portion can be made as small as that for the connection between the upper and lower conductors in the center portion, and the etching rate for the connection between the upper and lower conductors can be made uniform. The diameter and height for connecting conductors can be made uniform.

According to the printed circuit board of the twenty-fifth aspect, since the inter-conductor connecting projections have a plurality of different heights, different surfaces having different bonding mechanisms, such as a stepped bonding surface or a copper paste and copper pattern surface. Can be stacked without any trouble.

According to the printed circuit board of the twenty-sixth aspect, since the projections for connecting conductors have a plurality of different diameters, the diameter of the projection through which a large current passes increases according to the passing current, and the diameter of the projection increases. The diameter of the projection through which the current passes can be reduced, and a large current flows through the projection with a small diameter, causing a voltage drop or generating Joule heat. There is no possibility that the problem of occupying the area will occur.

Since the printed circuit board according to the twenty-seventh aspect has a spacer formed of the same material and at the same height as the projection for connection between the upper and lower conductors, the spacing between the base material and the metal layer is made constant by the spacer, and the impedance is reduced. Controllability can be improved. Also, this spacer can be grounded and used for an electrostatic shield.

The method for manufacturing a printed circuit board according to claim 28 is characterized in that
Since the spacer is formed in the same step as the upper and lower conductor connecting projections, the spacer can secure the space between the base material and the metal layer. Thus, the printed circuit board according to claim 27 can be formed without increasing the number of steps. it can.

Since the printed circuit board according to the present invention has a recognition mark, alignment and model recognition can be performed using the recognition mark.

A method for manufacturing a printed circuit board according to claim 30 is as follows.
Since the recognition mark is formed in the same step as the step for connecting the upper and lower conductors, the printed circuit board according to claim 29 in which the recognition mark is formed without increasing the number of steps can be obtained.

According to the printed circuit board of the thirty-first aspect, through-holes for electrically connecting the conductive circuits on the upper and lower surfaces of the insulating base are formed, and the metal layers are formed on both surfaces of the core circuit board. Another circuit board formed with an insulating layer penetrated by the upper and lower conductor connecting protrusions on the surface on the protrusion forming side of the wiring circuit having the selectively formed upper and lower conductor connecting protrusions, In a printed circuit board laminated with the ends of the inter-conductor connection projections connected to the wiring circuit made of the metal layer, the upper and lower conductor connection projections and the wiring circuit are connected via a conductive paste, solder or a noble metal layer. Therefore, the electrical connection between the circuit boards and the reliability of the connection can be improved while achieving high integration by build-up.

According to the method for manufacturing a wired circuit board of claim 32, before laminating the circuit board serving as the core and another circuit board on both surfaces thereof, the wiring circuit of the circuit board serving as the core is formed in advance. 32. The printed circuit board according to claim 31, wherein a conductive paste or a noble metal layer is formed on the surface of the metal layer to be formed, so that the electrical connection between the circuit boards and the reliability of the connection are improved while achieving high integration by build-up. Can be obtained.

According to the printed circuit board of the present invention, the upper and lower conductor connecting projections made of the same metal are selectively formed on the metal layer to be the conductor circuit, and are laminated via the interlayer insulating film. Since a solder, a conductive paste, or a noble metal film which is in contact with the upper and lower conductor connection protrusions is provided on a metal layer different from the metal layer serving as another conductor circuit, the metal layer and the protrusions are connected with the solder, the conductive paste. Alternatively, they can be connected via a noble metal film, and the electrical connection therebetween can be improved.

According to the printed circuit board of the present invention, a hole larger than the diameter at the top of the projection is provided in a portion corresponding to the projection for connecting the upper and lower conductors of the metal layer forming the another conductor circuit. The tops of the projections are deeply buried in the solder, conductive paste, or noble metal film that fills the holes, thereby improving the connectivity.

According to the printed circuit board of the thirty-fifth aspect, the upper and lower conductor connecting protrusions made of the same metal are selectively formed on the metal layer forming the conductor circuit, and are laminated via an interlayer insulating film. Since the metal layer forming the conductor circuit is provided with a solder, a conductive paste or a noble metal film that comes into contact with the upper and lower conductor connecting protrusions, the metal layer and the protrusion can be connected via the solder, the conductive paste or the noble metal film. And electrical connection therebetween can be improved.

According to the method of manufacturing a printed circuit board of the present invention, the connection between the upper and lower conductors is selectively formed on the metal layer to be the conductor circuit and made of the same metal as the metal layer. On the connection protrusion forming side, a solder, a conductive paste, or a noble metal film was formed on a metal layer to be a conductor circuit different from the conductor circuit, corresponding to the connection protrusion between the upper and lower conductors via an interlayer insulating layer. Claim 3
4, 35 printed circuit boards can be obtained.

Since the anisotropic conductive film is used as the interlayer insulating film in the printed circuit board according to claim 37, even if the conductive film is interposed between the projection and the metal layer, the conductive property is obtained by the pressure applied to the interlayer insulating film. Since it is tinged, it is possible to reliably electrically connect the projection and the metal layer.

[Brief description of the drawings]

FIGS. 1A to 1G are cross-sectional views sequentially showing steps (A) to (G) of a first embodiment of a method for manufacturing a printed circuit board of the present invention.

FIGS. 2 (H) to 2 (K) are cross-sectional views sequentially showing steps (H) to (K) of the first embodiment.

FIGS. 3A to 3F are sectional views showing a second embodiment of the method of manufacturing a printed circuit board according to the present invention in the order of steps.

FIGS. 4A to 4C are cross-sectional views showing a third embodiment of the method of manufacturing a printed circuit board according to the present invention in the order of steps.

FIGS. 5A to 5G are sectional views sequentially showing steps (A) to (G) of a fourth embodiment of the method of manufacturing a wired circuit board according to the present invention.

FIGS. 6H and 6I are cross-sectional views sequentially showing steps (H) to (I) of the fifth embodiment.

FIGS. 7A to 7H are cross-sectional views sequentially showing steps (A) to (H) of a sixth embodiment of the method of manufacturing a wired circuit board according to the present invention.

FIGS. 8A to 8K are cross-sectional views sequentially showing steps (I) to (K) of a sixth embodiment of the method of manufacturing a printed circuit board according to the present invention.

FIGS. 9A to 9E are sectional views showing a seventh embodiment of the printed circuit board of the present invention in the order of steps.

FIGS. 10A and 10B are cross-sectional views showing different examples of the upper and lower conductor connection projections of the printed circuit board of the present invention.

FIG. 11 is a perspective view showing a main part of an embodiment in which protrusions of the printed circuit board of the present invention are arranged on respective intersections of a lattice.

FIG. 12 is a perspective view showing an embodiment in which the pressing force applied to each projection during lamination of the printed circuit board of the present invention is uniform for each projection.

FIG. 13 is a cross-sectional view showing an embodiment in which dummy projections for making the etching rate uniform are provided in order to make the height and diameter of the upper and lower conductor connecting protrusions of the printed circuit board of the present invention uniform. .

FIGS. 14A to 14D are plan views showing different embodiments in which dummy projections are provided.

FIG. 15 is a cross-sectional view showing an embodiment in which upper and lower conductor connection projections having different heights of the printed circuit board of the present invention are mixed to correspond to a joint surface having a step.

16A and 16B show an embodiment in which a spacer having the same material and height as the protrusions of the printed circuit board of the present invention is provided, FIG. 16A is a perspective view, and FIG. FIG.

FIG. 17 is a cross-sectional view showing an embodiment in which upper and lower conductor connection projections having different diameters of the wired circuit board of the present invention are mixed.

FIGS. 18A to 18C show an embodiment in which recognition marks made of the same material as the protrusions of the printed circuit board of the present invention are provided, wherein FIG. 18A is a perspective view and FIG. (C) is a plan view of another recognition mark having a different pattern from that of (B).

FIGS. 19A to 19D are sectional views showing an eighth embodiment of the method of manufacturing a printed circuit board according to the present invention in the order of steps.

FIGS. 20A to 20C show an example in which a hole larger than the diameter of the projection top is formed in a portion corresponding to the projection of the conductor circuit, and FIG. (B) is a plan view showing a shape of a portion connected to the projection of the conductor circuit,
(C) is to form a layer made of conductive paste, solder or precious metal, and then to polish the surface to remove a portion of the layer on the conductive circuit, so that the conductive paste, solder or precious metal is present only in the hole. It is sectional drawing which shows the example which performed.

FIGS. 21A to 21C are cross-sectional views illustrating a ninth embodiment of a method of manufacturing a printed circuit board according to the present invention in the order of steps.

FIG. 22 is a sectional view showing an embodiment using an anisotropic conductive film as an interlayer insulating film of the printed circuit board of the present invention.

FIGS. 23A to 23F are views for explaining one conventional example relating to a printed circuit board for high-density mounting, and show steps (A) to (F) of a method of manufacturing a printed circuit board in order; It is sectional drawing.

FIG. 24 is a cross-sectional view showing, in order, steps (G) to (I) of the method of manufacturing the conventional printed circuit board.

FIGS. 25A to 25G are diagrams for explaining another conventional example relating to a printed circuit board for high-density mounting, and show a method of manufacturing a printed circuit board in the order of steps (A) to (G). It is sectional drawing.

[Explanation of symbols]

20: base material, 21, 21a: metal layer (copper layer) for forming projections, 22: etching barrier layer, 23:
..Metal layer (copper foil) for forming conductor circuit, 25...
26: conductive paste, 27: interlayer insulating film, 2
8 ... laminated body, 29 ... metal layer (copper foil) for forming conductor circuit, 30 ... laminated body, 31, 32 ... conductor circuit, 33, 33a ... wiring circuit board, 35 ..Conductor circuit, 36 ... wiring circuit board, 37 ... projection forming mask / projection coating solder plating film, 40 ... insulating film, 4
DESCRIPTION OF SYMBOLS 1 ... Opening, 42 ... Conductor circuit, 43 ... Insulating film, 44 ... Opening, 45 ... Projecting terminal, 46, 4
7 ... printed circuit board, 48 ... LSI chip, 51
... Base material (metal layer made of copper), 53, 57 ...
.. Protrusions for connection between upper and lower conductors, 54... Conductive paste, solder or noble metal film, 55... Interlayer insulating film, 55a.
-Anisotropic conductive film forming an interlayer insulating film, 56 ... metal layer,
58: dummy projection, 61: spacer, 63 ...
. Recognition mark, 70... Core wiring circuit board, 72.
..Metal layer, 72a ... hole, 73 ... through hole, 74 ... conductive paste, solder or noble metal film.

────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] May 10, 2001 (2001.5.1
0)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Full text

[Correction method] Change

[Correction contents]

[Document Name] Statement

Patent application title: Printed circuit board and method of manufacturing the same

[Claims]

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to, for example, IC, LS
The present invention relates to a printed circuit board for mounting electronic devices such as I, particularly a printed circuit board capable of realizing high-density mounting, and a method of manufacturing the same.

[0002]

2. Description of the Related Art FIGS. 21A to 21F and FIG. 22G.
FIGS. 1A to 1I are cross-sectional views illustrating a conventional method of manufacturing a printed circuit board for high-density mounting, in the order of steps (A) to (I).

(A) First, an insulating base 1 made of an insulating sheet having a thickness of about 25 to 100 μm is prepared.
As shown in (A), holes 2 for interlayer connection are formed in the insulating sheet 1 by punching, drilling, or laser processing. (B) Next, as shown in FIG. 21B, the hole 2 is made of a conductive paste (for example, silver or copper is used as a main material).
3 is filled by a printing method, for example. Thus, the insulating base 1 becomes a semi-cured sheet A in which the holes 2, 2, ... are filled with the conductive paste 3.

(C), (D) Next, as shown in FIG. 21 (C), metal foils 4 and 4 made of, for example, copper are made to face both surfaces of the sheet A, and as shown in FIG. Then, the metal foils 4 and 4 are laminated by a press and heat press. As a result, metal foils 4 and 4 are formed on both surfaces, and an insulating sheet 1 is present between the metal foils and conductive pastes 3, 3,.
Thus, a laminate is formed in which the metal foils 4 on both sides are electrically connected. (E) Next, resist films 5, 5 having the same pattern as the conductor circuits to be formed on the metal foils 4, 4 are formed.
FIG. 21E shows a state after the formation of the resist films 5 and 5.

(F) Next, the metal foils 4 and 4 are etched using the resist films 5 and 5 as masks to form conductor circuits 6 and 6 as shown in FIG.
As a result, a laminated body B is formed in which conductor circuits 6 and 6 are formed on both sides of which are separated by the insulating sheet 1 and are connected to each other by the conductive paste 3 in the holes 2. (G) Next, as shown in FIG.
Have holes 2, 2,... On both surfaces thereof.
··· overlaps the insulating sheets 1a, 1a and the metal foils 4a, 4a filled with the conductive pastes 3, 3,.
These are laminated by a pressure press. The laminate formed by this lamination is designated as C.

(H) Next, as shown in FIG.
A resist film 5 on the metal foils 4a, 4a on both sides of the laminate C;
5 is selectively formed. (I) Next, the metal foils 4a and 4a are patterned by selectively etching the metal foils 4a and 4a using the resist films 5 and 5 as a mask, and as shown in FIG.
6a is formed. As a result, the four-layer conductor circuits 6, 6,
The printed circuit board 7 having 6a, 6a is formed.

FIGS. 23A to 23G are diagrams for explaining another conventional example relating to a printed circuit board for high-density mounting.
It is sectional drawing which shows the manufacturing method of a printed circuit board in process order (A)-(G). (A) Metal foil made of, for example, copper (thickness of, for example, 18 μm)
10 was prepared, and as shown in FIG.
The conductive projections 11, 11,... Are formed by printing a conductive paste such as copper or silver on a metal plate through a metal plate, and are cured by heating. The thickness of the projections 11, 11,... Is, for example, about 100 to 300 μm.

(B) Next, as shown in FIG.
An insulating adhesive sheet 12 is adhered on the surface of the metal foil 10 on which the protrusions 11, 11,... Are formed. By using an adhesive sheet 12 that is appropriately thinner than the thicknesses of the protrusions 11, 11,..., The protrusions 11, 11,.
.. Are projected from the surface of the adhesive sheet 12. Forming projections 11, 11,... On the metal foil 10, and bonding the adhesive sheet 12 to the projections 11, 11,.
The laminated body A adhered so that the top of is protruded is completed.

(C), (D) Next, as shown in FIG. 23 (C), a metal foil 13 similar to the metal foil 10 is exposed above the surface of the adhesive sheet 12 of the adhesive sheet 10 and heated. As shown in FIG. 22D, the metal foil 1
3 are laminated on the adhesive sheet 12 and the projections 11, 11,.... B is the resulting laminate. (E) Next, for example, a patterned resist film is formed on the metal foils 10 and 13 on both sides of the laminate B, and the metal foils 10 and 13 are etched using the resist film as a mask to form the conductor circuits 14 and 13. 15 are formed. FIG.
3E shows a state in which the resist film used as the mask after the formation of the conductor circuit is removed.

(F) Next, two laminates a made by the same method as the laminate A shown in FIG. 23B are prepared, and the two laminates a, a are placed in FIG. ),
It faces both sides of the laminate B. (G) Next, the laminate B was laminated from both sides thereof to a laminate a,
23A, sandwiched in a sandwich, and pressurized and laminated by the above-mentioned hot press method, and a printed circuit board 16 as shown in FIG. 23 (G) is completed.

[0011]

By the way, the prior art shown in FIGS. 21 and 22 firstly has two holes 2 in the insulating sheet 1.
Is filled with a conductive paste 3 containing an expensive metal such as silver as a main material and used for interlayer connection, leading to a problem that the cost is increased. In particular, as the density increases, the arrangement density of the holes 2 increases, so that a considerable cost increase occurs. Secondly, when the holes 2 are filled with the conductive paste 3, a small amount of the conductive material adheres to portions other than the holes 2, and there is a problem that the insulation resistance is reduced particularly under high humidity.

Third, holes 2, 2,...
Is formed, the sheet 1 is extended in the horizontal direction due to the applied pressure, and the holes 2, 2,... Are displaced. However, there is a problem that correction cannot be performed in some cases. Such a displacement of the hole 2 causes a poor interlayer connection and becomes a serious problem that cannot be overlooked, and is particularly fatal in the case of a high-density printed circuit board. Fourth, there is a problem that the reliability of bonding between the metal foils 4 and 4 made of copper or the like and the conductive paste 3 is insufficient. That is, the conductive paste 3 in which the holes 2 are filled is removed from the solvent so that the conductive paste 3 becomes semi-cured. However, the conductive paste after the semi-curing shrinks due to the removal of the solvent and the like, and the volume decreases. The upper and lower surfaces are often concave. As a result, the metal foils 4, 4
In this case, there is a problem that a bonding failure is likely to occur between them and the yield and reliability are reduced.

Next, the conventional example shown in FIG. 23 also has a problem. First, since the projections 11 are formed of a conductive paste, which is an expensive material, there is a problem that the cost is increased. Second, the formation of the projections 11 with the conductive paste uses a screen printing method, so that there is a limit in increasing the thickness of the conductive paste. As a result, screen printing is repeated a plurality of times to form the projections 11. Often needed. Then, when the number of times of printing increases as such,
Deformation of the shape of the projection 11 due to misalignment is likely to occur,
As a result, there is a problem that the reliability of the connection with the metal foil 4 later becomes low, and the alignment work at the time of screen printing is very difficult, troublesome, requires skill, and the alignment time becomes long. The problem arises. Such a tendency becomes more remarkable as the diameter of the projection 11 decreases. By the way, in the case of a projection having a diameter of 0.3 mm, printing needs to be performed twice, and in the case of a projection having a diameter of 0.2 mm, printing needs to be performed four times. This is rather cumbersome, hinders the improvement of productivity, and has a problem in dealing with high-density wiring circuit boards.

Third, there is a problem that the heights of the projections 11, 11,... Are likely to vary. That is, in screen printing, it is difficult to make the thickness of the formed film uniform, so naturally the heights of the projections 11, 11,. , The thickness of the metal foil 13
There is a possibility that the connection between the semiconductor device and the projections 11, 11,... May become defective, and the yield and reliability may be reduced. Fourth, in the manufacturing process, the metal foil 10 serving as the base of the printed circuit board is as thin as 18 μm, for example, and sufficient care should be taken so that wrinkling, deformation, bending, etc. do not occur on the metal foil 13 side during the screen printing. Required,
There is a possibility that the yield may be reduced due to a slight mistake. As a matter of course, this causes an increase in cost and is a problem that cannot be overlooked. On the other hand, if the thickness of the metal foil 10 is increased to increase the rigidity of the base, there is a problem that fine patterning of the conductive circuit is hindered.

Another problem common to the above-mentioned conventional examples is that there is a limit to high density, that is, a minute interlayer connection, and one conventional example has a problem in that the hole diameter is reduced and the filling of the conductive paste is difficult. Therefore, in another conventional example, as the diameter becomes smaller by bump printing, printing becomes more difficult, and a diameter of 200 μm or less could not be actually formed. In addition, when the bonding strength between the conductive paste and the copper foil is low and the pad is to be used as a pad-on-via, the pad-like pad strength is not sufficient and the area needs to be increased more than necessary.

The present invention has been made to solve such a problem, and it is intended to prevent bending, bending, deformation, and the like in a manufacturing process, and to improve dimensional stability in a manufacturing process, thereby improving the upper and lower conductors. An object of the present invention is to increase the reliability of connection between circuits and reduce the cost of connecting means between upper and lower conductor circuits.

[0017]

According to a first aspect of the present invention, there is provided a printed circuit board comprising a metal on a metal layer for forming a conductor circuit, which is to be a conductor circuit, via an etching barrier layer made of a metal different from the metal layer. A protrusion is selectively formed, an interlayer insulating layer is formed on a surface of the conductor circuit on a side where the protrusion is formed,
The above-mentioned protrusion forms an interlayer connection means between the metal layer which becomes the conductor circuit by penetrating the insulating layer and another.

According to a second aspect of the present invention, there is provided the wired circuit board according to the first aspect, wherein the surface of the projection is coated with a conductive paste material as a surface treating agent.

According to a third aspect of the present invention, there is provided a method for manufacturing a printed circuit board, comprising: forming an etching barrier layer made of another metal on a metal layer for forming projections; and forming a metal layer serving as a conductor circuit on the etching barrier layer. A step of preparing the formed layer, a step of selectively etching the metal layer for forming the projections with an etchant that does not attack the etching barrier layer, and a step of forming the projections. Using a mask as a mask to remove with an etchant that does not attack the metal layer forming the conductor circuit, and forming an insulating layer for interlayer insulation on the surface on the protrusion formation side of the metal layer forming the conductor circuit, and forming the protrusion on the surface. Forming interlayer connection means connected to the conductor circuit.

According to a fourth aspect of the present invention, there is provided a method for manufacturing a printed circuit board, comprising: forming an etching barrier layer made of another metal on a metal layer for forming projections; and forming a metal layer serving as a conductor circuit on the etching barrier layer. The formed metal is prepared, and the metal layer for forming the protrusions is selectively etched by an etchant that does not attack the etching barrier layer to form the protrusions, and the protrusion forming side of the metal layer forming the conductor circuit is formed. Forming an insulating layer for interlayer insulation on the surface of the substrate, using the protrusions as interlayer connection means connected to the conductor circuit, and etching the metal layer on the etching barrier layer to be the conductor circuit together with the etching barrier layer. A conductor circuit is formed by removing by selective etching using the mask layer as a mask.

According to a fifth aspect of the present invention, there is provided a method of manufacturing a wired circuit board according to the third aspect.
When forming the protrusions by selectively etching the layer made of the base metal, for example, using a metal layer formed by, for example, solder plating, silver plating, gold plating, or palladium plating as an etching mask, after forming the protrusions Also, the metal layer used as the etching mask is left, and the surface of the projection is entirely covered with the metal layer.

According to a sixth aspect of the present invention, there is provided a method of manufacturing a printed circuit board according to the first aspect of the present invention, wherein the surface of the printed circuit board on which the protrusions and the interlayer insulating film are formed is different from the conductive circuit. The metal foil is laminated and pressurized to be integrated,
Thereafter, a conductive circuit is formed on both surfaces by selectively etching the metal layer and the metal foil for forming the conductive circuit.

According to a seventh aspect of the present invention, there is provided a method for manufacturing a printed circuit board, comprising the steps of: The two metal layers located on both sides of the integrated body are selectively integrated by pressing and laminating them in a sandwich shape so that the side on which the protrusions and the interlayer insulating film are formed faces inside. A conductor circuit is formed on both surfaces by etching.

According to a eighth aspect of the present invention, there is provided a method of manufacturing a printed circuit board, comprising a base metal via an insulating layer having an opening in one main surface of a single-layer or multilayer conductive circuit. Two wiring circuit boards each having a projection electrically connected to the conductor circuit through an opening, and having an interlayer insulating film formed on the side of the insulating layer where the projection is formed, are formed with the projection and the interlayer insulating film. The layers are laminated directly or through a printed circuit board so that the cut side faces inward, and are integrated by pressing, or are integrated.

According to a tenth aspect of the present invention, an LSI chip or a package is mounted on both surfaces of the wired circuit board of the seventh aspect.

According to a eleventh aspect of the present invention, in the printed circuit board, a projection for connecting the upper and lower conductors made of the same metal as the metal layer is selectively formed on a metal layer forming the conductor circuit. An interlayer insulating layer is formed on the surface on which the is formed,
The connection protrusion between the upper and lower conductors penetrates the insulating layer to form interlayer connection means with the metal layer serving as the conductor circuit.

According to a twelfth aspect of the present invention, a projection made of the same metal as the metal layer is selectively formed on the metal layer forming the first conductor circuit, and the projection of the conductor circuit is formed. A second conductor circuit made of a metal layer is formed on the surface of the protrusion and the surface of the interlayer insulating layer, and the first and second conductive circuits are formed on the surface of the protrusion and the interlayer insulating layer. Are electrically connected via the protrusions.

According to a thirteenth aspect of the present invention, there is provided the printed circuit board according to the twelfth aspect.
In the printed circuit board of (1), a hole having a diameter smaller than the diameter at the top of the projection is formed in a portion of the metal layer forming the second conductor circuit corresponding to the projection for connection between the upper and lower conductors. I do.

According to a fourteenth aspect of the present invention, there is provided the printed circuit board according to the first aspect.
14. The printed circuit board according to 1, 12, or 13, wherein the protrusion is formed in a spear shape.

According to a fifteenth aspect of the present invention, there is provided the printed circuit board according to the first aspect.
14. The printed circuit board according to 1, 12, or 13, wherein the protrusion is formed in a conide shape (Mt. Fuji shape).

According to a sixteenth aspect of the present invention, there is provided the printed circuit board according to the first aspect.
14. The printed circuit board according to 1, 12, or 13, wherein the protrusion is formed in a drum shape.

According to a seventeenth aspect of the present invention, there is provided the printed circuit board according to the first aspect.
The printed circuit board according to any one of 1, 12, 13, 14, 15 and 16, wherein the surface of the projection is roughened or crushed.

[0033] The printed circuit board according to claim 18 is characterized in that:
The printed circuit board according to 1, 12, 13, 14, 15, 16 or 17, wherein the projection is made of copper and the surface thereof is subjected to electrolytic chromate treatment.

In the wiring circuit board according to the present invention, a step of preparing a metal layer forming a conductive circuit and a metal plate for forming a projection, and selectively forming a mask film on one surface thereof, Forming a metal layer to be a conductor circuit by half-etching the metal plate with the mask as a mask and a projection integrally formed selectively on the one surface of the metal layer; and forming the projection on the metal layer to be the conductor circuit. A step of forming an interlayer insulating layer on the surface on which is formed by the projections, a step of forming a metal layer on the surfaces of the insulating layer and the projections, and a step of forming a metal layer on both surfaces of the insulating layer. Forming a wiring film by selectively patterning the layers simultaneously or at different times.

According to a twentieth aspect of the present invention, there is provided the printed circuit board according to the twelfth aspect.
In the printed circuit board described above, an anisotropic conductive film is interposed between the upper and lower conductor connecting protrusions and the metal layer.

The method of manufacturing a printed circuit board according to claim 21 is
The method of manufacturing a printed circuit board according to claim 19, further comprising a step of interposing an anisotropic conductive film between the protrusion and the metal layer before laminating the metal layer.

According to a twenty-second aspect of the present invention, there is provided the printed circuit board, wherein a plurality of inter-conductor connecting projections made of a plurality of metals are arranged on respective intersections of a grid arranged at regular intervals on the surface of the metal layer. An interlayer insulating layer is provided on the surface on which the inter-conductor connection projections are formed in a state penetrated by the inter-conductor connection projections, and a metal layer is formed on the surface of the inter-layer insulation layer including the upper and lower conductor connection projections. It is characterized by being formed.

According to a twenty-third aspect of the present invention, there is provided the printed circuit board, wherein a plurality of metal-to-conductor connection projections are arranged on the surface of the metal layer, and an interlayer insulating projection is formed on the surface of the metal layer where the connection-to-conductor connection projections are formed. A wiring circuit board comprising a layer provided in a state penetrated by the projections, and a metal layer different from the metal layer formed on a surface of the interlayer insulating layer including the inter-conductor connection projections,
The upper and lower conductor connecting protrusions are arranged such that the upper and lower conductor connecting protrusions receive a uniform pressing force when pressed from both sides of the substrate.

According to a twenty-fourth aspect of the present invention, in the printed circuit board, a large number of metal-to-conductor connection protrusions are arranged on the surface of the metal layer, and an interlayer insulating protrusion is formed on the surface of the metal layer where the connection-to-conductor connection protrusions are formed. A wiring circuit board comprising a layer provided in a state penetrated by the projections, and a metal layer different from the metal layer formed on a surface of the interlayer insulating layer including the inter-conductor connection projections,
A dummy projection smaller in height than the upper and lower conductor connecting projections is arranged around the upper and lower conductor connecting projections or around a dense area where the upper and lower conductors are densely arranged.

According to a twenty-fifth aspect of the present invention, in the printed circuit board, a large number of metal-to-conductor connection projections are arranged on the surface of the metal layer, and an interlayer insulating film is formed on the surface of the metal layer where the connection-to-conductor connection projections are formed. A wiring circuit board comprising a layer provided in a state penetrated by the projections, and a metal layer different from the metal layer formed on a surface of the interlayer insulating layer including the inter-conductor connection projections,
The connection protrusion between the upper and lower conductors has a plurality of different heights.

In the printed circuit board according to the twenty-sixth aspect, a plurality of inter-conductor connection projections made of a metal are arranged on a surface of a metal layer, and an interlayer insulating is formed on a surface of the metal layer on which the inter-conductor connection projections are formed. A wiring circuit board comprising a layer provided in a state penetrated by the projections, and a metal layer different from the metal layer formed on a surface of the interlayer insulating layer including the inter-conductor connection projections,
The connection between the upper and lower conductors has a plurality of different diameters.

According to a twenty-seventh aspect of the present invention, there is provided the printed circuit board, wherein a large number of metal-to-conductor connection protrusions are arranged on the surface of the metal layer, and an interlayer insulating film is provided on the surface of the metal layer on which the connection-to-conductor connection protrusions are formed. A wiring circuit board comprising a layer provided in a state penetrated by the projections, and a metal layer different from the metal layer formed on a surface of the interlayer insulating layer including the inter-conductor connection projections,
It is characterized by having a spacer formed of the same material and at the same height as the projection for connecting the upper and lower conductors.

The method of manufacturing a printed circuit board according to claim 28 is
A plurality of inter-conductor connection protrusions made of a metal are arranged on the surface of the metal layer, and an interlayer insulating layer is provided on the surface of the metal layer where the inter-conductor connection protrusions are formed, in a state where the inter-layer insulation layer is penetrated by the protrusions, A metal layer different from the metal layer is formed on the surface of the interlayer insulating layer including the inter-conductor connection protrusions, and has a spacer formed of the same material and at the same height as the upper and lower inter-conductor connection protrusions. A method for manufacturing a printed circuit board, characterized in that a spacer is formed in the same step as the step for connecting the upper and lower conductors.

According to a twenty-ninth aspect of the present invention, in the printed circuit board, a large number of metal-to-conductor connection protrusions are arranged on the surface of the metal layer, and an interlayer insulating film is formed on the surface of the metal layer where the connection-to-conductor connection protrusions are formed. A layer is provided in a state penetrated by the projections, and a metal layer different from the metal layer is formed on the surface of the interlayer insulating layer including the inter-conductor connection projections. It is characterized by having recognition marks formed of the same material at the same height.

A method for manufacturing a printed circuit board according to claim 30 is characterized in that:
A plurality of inter-conductor connection protrusions made of a metal are arranged on the surface of the metal layer, and an interlayer insulating layer is provided on the surface of the metal layer where the inter-conductor connection protrusions are formed, in a state where the inter-layer insulation layer is penetrated by the protrusions, A recognition mark formed by forming a metal layer different from the metal layer on the surface of the interlayer insulating layer including the inter-conductor connection protrusions, and formed of the same material and at the same height as the upper and lower conductor connection protrusions Wherein the recognition mark is formed in the same step as the step of connecting the upper and lower conductor connecting protrusions.

According to a thirty-first aspect of the printed circuit board, a conductor circuit formed of a metal layer is formed on both upper and lower surfaces of the base made of an insulating resin, and the through holes for electrically connecting the wirings on both surfaces are formed on the base. And a circuit board serving as a core formed of an insulating resin, and a wiring circuit having a protrusion for connection between upper and lower conductors formed of a metal layer on both surfaces of the circuit board, respectively. The other circuit board formed with the insulating layer penetrated by the upper and lower conductor connecting projections on the surface of the above is connected to the wiring circuit composed of the metal layer with the top end of the upper and lower conductor connecting projections Wherein the upper and lower conductor connecting protrusions and the wiring circuit are connected via a conductive paste or a noble metal layer.

According to a thirty-second aspect of the present invention, in the printed circuit board, a connecting protrusion between the upper and lower conductors made of the same metal as the metal layer is selectively formed on the metal layer forming the conductive circuit. An inter-layer insulating layer is formed on the surface on the side where the inter-conductor connection projection is formed by being penetrated by the upper and lower inter-conductor connection projections, and a conductor circuit different from the conductor circuit is formed on the inter-layer insulation layer. Although the solder, conductive paste or noble metal film is formed on one surface of the metal layer corresponding to the projection for connection between the upper and lower conductors, the one surface is connected to the solder, conductive paste or noble metal film for connection between the upper and lower conductors. The projections are stacked so as to be connected.

A method for manufacturing a printed circuit board according to claim 33 is
Upper and lower conductor connection protrusions made of the same metal as the metal layer are selectively formed on the metal layer forming the conductor circuit, and the upper and lower conductor connection protrusions of the conductor circuit are formed on the surface of the conductor circuit. An interlayer insulating layer is formed in a state penetrated by the upper and lower conductor connecting projections, and the upper and lower conductor connecting protrusions are formed on one surface of a metal layer forming a conductor circuit different from the conductor circuit on the interlayer insulating layer. A wiring circuit board having a surface on which a solder, a conductive paste, or a noble metal film is formed corresponding to the protrusion, the one surface being laminated such that the connection protrusion between the upper and lower conductors is connected to the solder, the conductive paste, or the noble metal film In the manufacturing method, the upper and lower conductor connection projections made of the same metal as the metal layer are selectively formed on the metal layer to be the conductor circuit, but the interlayer insulation layer is formed on the upper and lower conductor connection projection formation side. Through the conductor times A solder, a conductive paste or a noble metal film is printed on a metal layer to be a conductor circuit different from the upper and lower conductor connecting protrusions, and the solder, the conductive paste or the noble metal film forming side is pressed and pressed. Accordingly, the upper and lower conductor connection projections are formed in a state in which they pierce the interlayer insulating layer and are connected to the corresponding solder, conductive paste or noble metal film.

According to a thirty-fourth aspect of the present invention, there is provided a printed circuit board comprising a metal layer having projections for connecting the upper and lower conductors formed thereon, and a metal layer or a circuit board forming a conductor circuit or a conductor circuit laminated via an interlayer insulating film. In the printed circuit board, an anisotropic conductive film is used as the interlayer insulating film.

[0050]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the illustrated embodiments. 1 (A) to 1 (G) and FIG.
(H) to (K) show the first method of manufacturing the wired circuit board of the present invention.
FIG. 4 is a cross-sectional view showing the embodiment in the order of steps. (A) As shown in FIG. 1A, a base material (for example, glass epoxy prepreg) 20 is prepared. The base material 2
Reference numeral 0 denotes an etching barrier layer (for example, 2 μm in thickness) made of, for example, nickel formed on one main surface of a copper layer for projection formation (a metal layer for projection formation) 21 having a thickness of, for example, 100 μm by plating, for example. On the surface of the barrier layer 22, a copper foil for forming a conductor circuit (metal foil for forming a conductor circuit, thickness of, for example, 18 μm) 23 is formed.

(B) Next, as shown in FIG. 1B, a resist film 24 is selectively formed on the surface of the copper layer 21 for forming the protrusions. The resist film 24 is formed so as to cover a portion where a projection is to be formed. (C) Next, by etching the copper layer 21 using the resist film 24 as a mask, the protrusions 25, 25,
.. Are formed. This etching is performed by wet etching, and an etching solution to be used is an etching solution which cannot attack the etching barrier layer 22 made of nickel but can attack the copper layer 21.

(D) Next, the resist film 24 used as an etching mask in the above etching is removed.
FIG. 1D shows a state after the etching mask is removed. (E) Next, as shown in FIG. 1E, the etching barrier layer 22 is etched using the protrusions 25, 25,... As a mask. In this etching, projection 2
Use an etchant (nickel stripper) that does not attack the metal (copper in the present embodiment) that forms 5, 25,... But does attack the metal (nickel in the present embodiment) that forms the etching barrier layer 22. .

(F) Next, as shown in FIG. 1 (E), the tops (upper portions) of the respective projections 25, 25,.
A thin conductive paste 26 is applied and cured. This step is not essential. However, due to this step, the protrusion 2
The reliability of connection between 5, 25,... And a copper foil to be formed later can be greatly increased.

(G) Next, the insulating material sheet is applied to the copper layer 2
By pressing with a heat roller on the surface on which the projections 25, 25,... Are formed, an interlayer insulating layer 27 made of the insulating sheet is formed as shown in FIG. . In this case, the projections 25, 25,... Are formed as insulating sheets so that the upper portions of the projections 25, 25,.
(If the conductive paste 26 is applied, the height including the paste 26) is appropriately used. Otherwise, interlayer connection by the projections 25, 25,... Cannot be reliably performed. By this step, an interlayer insulating layer 27 is formed on the copper foil 23, and further,
The copper foil 23 and the etching barrier layers 22, 22, ...
Are connected to each other through the interlayer insulating layer 27 and project from the surface thereof.
Is configured. This step is performed at a temperature at which the epoxy resin softens, and is immediately returned to room temperature so that there is substantially no epoxy curing reaction.

(H), (I) Next, as shown in FIG. 2H, an interlayer insulating layer 27 of the laminate 28 is formed.
A copper foil (metal layer for forming a conductor) 29 having a thickness of, for example, about 18 μm faces the side on which the tops of the projections 25, 25... Protrude, and as shown in FIG. And laminate by thermocompression bonding. By this step, a laminated body 30 is formed in which the metal layers 23, 29 formed on both main surfaces of the interlayer insulating layer 27 are connected to each other by the above-mentioned protrusions 25, 25,.

(J), (K) Next, as shown in FIG. 2 (J), resist films 24, 24 serving as etching masks are formed on the surfaces of the metal layers 23, 29, and thereafter, the resist films 24, 24 are formed. 24, 24 as a mask, the metal layers 23, 29
Are etched to form conductor circuits 31 and 32. As a result, the conductor circuits 31 and 32 on both surfaces are
A wiring circuit board 33 as shown in FIG. This printed circuit board 33 is a first embodiment of the printed circuit board of the present invention.

According to the first embodiment, processing is performed based on the base material 20 including at least the copper layer 21 which is a thick (for example, 50 to 200 μm) projection forming metal layer capable of forming the projection 25. Since starting, there is an advantage that defects such as deformation hardly occur and dimensional stability is high. Further, since there is no positional deviation of the protrusion after the formation of the protrusion due to the dimensional stability, for example, FIG.
1, there is no problem in that the conductive paste 3 (so-called through hole) in the hole 2 in the conventional example shown in FIG. Therefore, it is possible to obtain an ultra-high-density wiring circuit board 33 in which the projections 25 having a small diameter are arranged at high density and the interlayer connection between the conductor circuits is ensured.

Further, since the projections 25 are formed by the copper layer 21 made of, for example, copper, the material cost required for the formation is low, and therefore, even if the arrangement density of the projections 25 is increased and the number of the projections 25 is increased. In addition, since an expensive conductive paste containing a noble metal such as silver as a main material is used as in the related art, the cost of the printed circuit board does not increase, which greatly contributes to a reduction in the price of the printed circuit board.

Since the projections 25 are formed by selectively etching the copper layer 21, the height of the projections 25 is
The thickness of the copper layer 21 can be manufactured with extremely high uniformity, so that the height of the projections 25 can be made uniform. Therefore, as in the conventional example shown in FIG. 23, since the projections 11 are formed by printing with a conductive paste, the heights of the projections 11 become uneven, and there is a possibility that the connection between the upper and lower conductor circuits may be incomplete. In other words, the solvent component volatilizes during the process of curing the conductive paste 3 as in the conventional example shown in FIGS. 21 and 22, and the upper portion becomes a concave portion, and the connection between the upper and lower conductor circuits may be incomplete. No problem.
Therefore, even if the projections 25 become finer and higher in density, reliable connection between the upper and lower conductor circuits can be expected, and the yield and reliability can be improved.

FIGS. 3A to 3F show a second embodiment of the method of manufacturing a printed circuit board according to the present invention in the order of steps. (A) In the same manner as shown in FIGS.
5 is formed. FIG. 3A shows a state in which the projection 25 is formed.

(B) Next, as shown in FIG. 3 (B), the tops (upper parts) of the respective projections 25, 25,.
A thin conductive paste 26 is applied and cured. This step is not essential. However, due to this step, the protrusion 2
The reliability of connection between 5, 25,... And a copper foil to be formed later can be greatly increased. Note that, in the present embodiment, the etching barrier layer 22 is not removed using the projections 25, 25,... As a mask. As will become clear later, the etching barrier layer 22 is etched simultaneously with the metal layer 23 when the conductive layer is formed by patterning by selectively etching the metal layer 23 to remove unnecessary portions. Is performed. This is a major difference from the first embodiment shown in FIGS.

(C) Next, as shown in FIG. 3C, an interlayer insulating film 27 is formed. Reference numeral 28 denotes a laminate after the completion of the forming step. (D) Next, as shown in FIG.
By laminating a copper foil (metal layer for forming a conductor) 29 on the main surface of the interlayer insulating layer 27 by thermocompression bonding, the metal layers 23 and 29 formed on both main surfaces of the interlayer insulating layer 27 are formed on the protrusions 25, 25.
The laminated body 30 connected between layers is constituted by (1).

(E) Next, as shown in FIG. 3 (E), resist films 24, 24 serving as etching masks are formed on the surfaces of the metal layers 23, 29.
Conductive circuits 31, 32 are formed by etching the metal layers 23, 29 using the masks 4 and 24 as masks.
Further, the etching also etches the etching barrier layer 22 made of nickel in contact with the metal layer 23 by the etching. Thereby, the conductor circuits 31, 3 on both sides are provided.
A printed circuit board 33 in which the layers 2 are interconnected by the protrusions 25, 25,... Is completed.

(F) Thereafter, as shown in FIG.
The resist films 24 used as the etching mask are removed. The printed circuit board 33 after the removal is a second embodiment of the printed circuit board of the present invention. In addition, the resist film 24 where the conductor circuits 31 and 32 are formed,
Naturally, etching using 24 as a mask is performed using an etchant capable of etching both nickel-based metal and copper-based metal. Then, the etching barrier layer 22 made of nickel is formed into the same resist film 24 together with the metal layer 23.
Is selectively removed by one-time selective etching using a mask as a mask, so that it is not necessary to selectively remove the etching barrier layer 22 using the protrusion 25 as a mask after the formation of the protrusion 25, and therefore the number of steps can be reduced. There is an advantage that you can.

According to the second embodiment shown in FIG. 3, not only the same advantages as in the first embodiment shown in FIGS. 1 and 2 can be obtained, but also the etching barrier layer 2 can be obtained.
2 can be selectively removed together with the metal layer 23 by a single selective etching using the same resist film 24 as a mask, so that there is an advantage that the number of steps can be reduced as compared with the first embodiment.

FIGS. 4A to 4C show a third embodiment of the method of manufacturing a printed circuit board according to the present invention in the order of steps. This embodiment is different from the first embodiment in that the laminated bodies 28 formed on the both sides of the printed circuit board 33 in the steps (A) to (G) of the first embodiment are formed. , 28 are laminated, and the metal layers 23, 23 of the respective laminates 28, 28 are patterned by selective etching to form conductor circuits, thereby obtaining four-layer conductor circuits.

(A) First, as shown in FIG. 4 (A), the surfaces of the printed circuit board 33 on which the protrusions 25 and the interlayer insulating layer 27 are formed on both sides of the laminates 28, 28 are placed on the printed circuit board 33 side. Facing each other so as to face. Then, they are laminated and integrated by thermocompression bonding using a lamination press. (B) Next, as shown in FIG.
Resist films 24, 24 on the metal layers 23, 23
Are formed selectively.

(C) Conductive circuits 35, 35 are formed by etching the metal layers 23, using the resist films 24, 24 as a mask. Thus, the printed circuit board 36 is completed. This printed circuit board 36 is a second embodiment of the printed circuit board of the present invention. According to this embodiment, a printed circuit board 36 having four layers of conductor circuits can be obtained, and further higher density can be achieved.

FIGS. 5A to 5G and FIGS.
(I) is sectional drawing which shows 4th Embodiment of the manufacturing method of the printed circuit board of this invention in order of a process. (A) A base material 20 which is the same as the base material shown in FIG. 1 (A) is prepared, and then a resist film 24 is applied to the surface of the copper layer 21 which will become projections (25, 25,...) Later. Then, patterning is performed as shown in FIG. 5A by exposure and development. Specifically, the resist film 24 is patterned so that only the portions that become the projections (25, 25,...) Are opened, and the portions where the projections (25, 25,...) Are not formed are covered. (B) Next, as shown in FIG. 5B, solder plating layers (thickness, for example, 20 μm) 37, 37,... Are formed by electrolytic plating using the resist film 24 as a mask. The solder plating layer is, for example, tin Sn / lead Pb or tin Sn / silver Ag
/ Copper Cu or the like. In some cases, a plating layer of gold Au, silver Ag, or palladium Pd may be formed. (C) Next, as shown in FIG. 5C, the resist film 24 is peeled off. (D) Next, as shown in FIG. 5D, the metal layer 21 made of copper is selectively etched using the solder plating layers 37, 37,.
5, 25,... Are formed. (E) Next, as shown in FIG. 5E, the etching barrier layer 22 made of nickel is peeled off.

(F) Next, as shown in FIG. 5 (F), the solder plating layers 37, 37,
.. Cover the surfaces of the projections 25, 25,. (G) Next, the insulating sheet is attached to the projections 25, 25,.
By pressing with a heat roller on the surface on the side where... Are formed, an interlayer insulating layer 27 made of the insulating sheet is formed as shown in FIG. In this case, the projections 25, 2
Are appropriately thinner than the heights of the projections 25, 25,... Including the solder plating layer 36, so that the upper portions of the projections 5,. Otherwise, the tops of the projections 25, 25,... Do not protrude from the surface of the interlayer insulating layer 27, and the upper and lower conductor circuits cannot be reliably connected. The laminate formed in this step is designated as 28a.

(H) Next, as shown in FIG.
The interlayer insulating layer 27 of the laminate 28 is formed, and the protrusion 2
5, 25,... Have a thickness of 1
A copper foil 29 forming a metal layer for forming a conductor circuit of about 8 μm is exposed. (I) Thereafter, lamination is performed by thermocompression bonding using a laminating press, a resist film is selectively formed on the copper foil 29 and the metal layer 23, and the copper foil 29 and the metal layer are formed using the resist film as a mask. Conductive circuits 31 and 32 are formed by etching 23. Thereby, the printed circuit board 3
3a is done. This printed circuit board 33a is a third embodiment of the printed circuit board of the present invention.

This embodiment is different from the embodiment shown in FIGS. 1 and 2 in that the copper layer 21 is selectively etched to form the protrusions 2.
When forming 5, 25,..., The solder plating layer 36 is used instead of the resist film 24 as an etching mask, and then the solder plating layer 36 is left without being removed to form an interlayer insulating layer made of an insulating sheet. Are formed in such a manner that the protrusions 25, 25,... Therefore, according to the present embodiment, it is not necessary to apply the conductive paste 26 on the protrusions 25, 25,... As in the embodiment shown in FIGS. Only in this respect, the present embodiment is different from the embodiments of FIGS. 1 and 2 and there is no difference outside.

FIGS. 7A to 7E are sectional views showing a sixth embodiment of the printed circuit board of the present invention in the order of steps. (A) First, as shown in FIG. 7A, a base material 51 having a single-layer structure made of a metal plate such as copper is prepared, and a resist film 52 is selectively formed on one surface thereof.

(B) Next, as shown in FIG. 7 (B), the base material 51 is half-etched from the surface thereof using the resist film 52 as a mask to form projections 53 for connecting the upper and lower conductors. . Note that half-etching does not literally mean half-thickness etching, but rather etching while leaving a portion that will become a circuit layer. (C) Next, as shown in FIG. 7 (C), if necessary, a conductive paste, solder, a noble metal such as gold, or an anisotropic conductive film may be used to improve the connectivity, or A film 54 for improving the reliability of the connectivity is coated. The film 54 is not indispensable, but may be provided when it is necessary to improve the connectivity or the reliability.

(D) Next, as shown in FIG. 7D, a metal foil 56 made of copper or the like is laminated on the one surface of the base member 51 via an interlayer insulating film 55. (E) Next, as shown in FIG.
A conductive circuit is formed by selectively etching the other surface portion of the first and the surface of the metal foil. Thus, a printed circuit board substantially the same as that shown in FIG. 1K is completed. Therefore, this printed circuit board is not shown in FIG.
The printed circuit board 3 according to the embodiment shown in FIG.
3 can be used instead. That is, the printed circuit board 3
The printed circuit board can be used in place of all the parts where 3 is used.

The printed circuit board before the formation of the metal foil 56 of copper or the like can be used in place of the printed circuit board 28 of the embodiment shown in FIG. Further, the wiring circuit board in a state before the formation of the metal foil 56 can be multi-layered in the same manner as the wiring circuit board 46 shown in FIG. 8 to further increase the integration density.

According to such a method of manufacturing a printed circuit board, it is not necessary to use a multilayered structure having an etching barrier layer as a base material, and a step of removing the etching barrier layer is required. Can be reduced in manufacturing cost.

After the formation of the projection 53, the tip of the projection 53 may be roughened so that a large number of needle-like spines are formed, thereby improving the connection with the conductor circuit made of the metal foil 56. Roughening can be performed by spray etching or CZ processing.
Further, it can be roughened by crushed copper plating. Further, the entire surface of the copper including the projections 53 is subjected to electrolytic chromate treatment to form an electrolytic chromate film, thereby improving the antioxidant properties of the projections 53 and the copper surface and preventing the copper foil from being deteriorated due to oxidation. May be.

The projection 53 for connecting the upper and lower conductors of the printed circuit board shown in FIG. 7 has a conide shape (Mt. Fuji shape).
However, this is not indispensable, and a drum shape may be used as shown in FIG.
a shows a drum-shaped projection. ). By changing the etching conditions, the shape of the protrusion changes, and a drum-shaped protrusion 53a can be formed. Since the projection 53a has a wide top surface, it is easy to perform soldering, conductive paste processing, and the like.
There is an advantage that it is easy to improve the connectivity with the conductor circuit.

As shown in FIG. 8B, a spear-shaped projection 57 may be formed. Since the spear-shaped projection 57 has a sharp point, it is easy to improve the penetrating property of the interlayer insulating film 55, particularly to the prepreg containing glass cloth, and it is easy to bite into the conductor circuit. There is an advantage that the property can be increased. Such a spear-shaped projection 57 can be formed by etching the resist mask with a smaller diameter than the projection to be formed. Alternatively, a conide-shaped or drum-shaped projection is formed by selective etching (of course, half-etching) using a resist film or the like as a mask, then the mask is removed, and etching is again performed (of course, half-etching). be able to.

FIG. 9 shows the projections 53, 5 on the printed circuit board of the present invention.
FIG. 7 is a perspective view showing a main part of an embodiment characterized in that 7 or 25 (see FIGS. 1 to 6 for the projection 25) is arranged on each intersection of the lattice. In the present embodiment, projections, for example, 57 are arranged on each intersection of a grid of lines arranged vertically and horizontally (ideally) at predetermined intervals, and other projections are arranged at other points. There is no difference from the embodiment.

According to such a printed circuit board, regardless of the type of the printed circuit board, mass production is performed before the conductor circuits on both surfaces are formed by selective etching, and thereafter, Depending on the model, conductor patterns of different patterns can be formed, so only specific protrusions are used for interlayer connection, and others are not constituted by circuits, or slightly over-etched As a result, unnecessary projections can be removed by etching, and the productivity of other types of printed circuit boards can be increased.

FIG. 10 shows an embodiment in which the protrusions 57 and the like are arranged so that the pressing force when the metal layer such as 56 is laminated via the interlayer insulating film 55 becomes uniform for each protrusion. According to such an embodiment, since the in-plane uniformity of the press pressure at the time of lamination can be improved, the uniformity of the degree of crushing of the projection 57 can be improved,
Further, the uniformity of the plate pressure of the wiring board can be improved, and the reliability of the printed circuit board can be increased.

FIG. 11 shows a projection for connecting the upper and lower conductors, for example, 57
In the case where the arrangement density of the first and second conductors is not constant, a dummy projection 58 shorter than the upper and lower conductor connection projections 57 is arranged around the dense area and the dense area when there is a dense area. It is sectional drawing which shows the principal part of embodiment which made uniform the diameter and height of the connection projection 57. That is, in the dense area, the peripheral portion and the central portion have different etching rates due to the different flow of the liquid after the spraying of the etching liquid, and the peripheral portion having a faster liquid flow has a higher etching rate and a smaller diameter in the peripheral portion. And it tends to be low. Therefore, the surrounding area is surrounded by dummy projections 58 that do not directly participate in the circuit (ie, do not constitute the circuit), thereby lowering the etching rate for the upper and lower conductor connection projections 57 in the peripheral portion, thereby reducing the peripheral upper and lower conductor connection. In the present embodiment, the projection 57 for connection is also made to have the same diameter and the same height as the projection 57 for connection between the upper and lower conductors at the center. It is also effective to make the resist diameter serving as a mask smaller than the other protrusions 57 so that the dummy protrusions 58 disappear after etching.

If the distance between the upper and lower conductor connection projections is large, the etching rate is different between the periphery and the center of the projection, which causes adverse effects. Therefore, a dummy protrusion 58 may be arranged around each of the upper and lower conductor connection protrusions 57. FIG.
(A) to (D) are plan views showing such different examples.

FIGS. 12A and 12B show a ring-shaped dummy projection 5 around each upper and lower conductor connection projection 57.
8A, in which (A) shows that the adjacent dummy projections 58 are separated, and (B) shows that the adjacent dummy projections 58 partially overlap each other. It is.

FIGS. 12C and 12D show a case where a plurality of dummy projections 58 are arranged around each of the upper and lower conductor connecting projections 57, and FIG. A plurality of dummy projections 58 are provided only on one surrounding circular line.
Are arranged, and those shown in FIG.
, Dummy protrusions 58 are arranged at predetermined intervals in a region outside the circular line 58a surrounding the dummy protrusions 58a.

FIG. 13 shows a projection for connecting the upper and lower conductors, for example, 5
FIG. 3 is a cross-sectional view showing an embodiment in which different heights 53h and 53l are mixed as 3, and the upper and lower conductor connection projections having different heights, for example, 53 are mixed on a joint surface having a step. This is because the upper and lower conductor connection projections, for example, 53 can be joined. In FIG. 13, reference numeral 60 denotes a core substrate having a stepped joint surface. The core substrate 60 is formed by filling the through-holes of the double-sided wiring board with the copper paste 100 by a normal method, and curing the same.
The heights of the copper paste 100 and the copper wiring portion 54 are different. Then, on both surfaces of the core substrate 60, a printed circuit board using the protrusions 53 as a means for connecting the upper and lower conductors is laminated. The high protrusion 53h is connected to the copper paste 110, and the low protrusion 53l is connected to the copper wiring portion 54.

The formation of the projections 53h and 53l having different heights makes the diameter of each mask portion of a mask made of a resist film used when selectively etching the surface of the base material 51 different, thereby forming the high projections 53a. This is possible by enlarging the diameter of the mask portion covering the portion to be formed and decreasing the diameter of the mask portion covering the portion where the low protrusion 53b is to be formed.

In the printed circuit board shown in FIG. 13, the copper wiring film 54 of the core substrate 60 is not formed with a coating of conductive paste, solder, noble metal, or the like. (Or 57) are directly connected. The present invention can be implemented in such a form. This applies to the form having the high protrusions 53a and the low protrusions 53b and the form in which the heights of the protrusions 53 (or 57) are uniform.

In the case of a type in which a projection made of copper, for example, 53 (or 57) is directly connected to the copper wiring film 54 without a coating of a conductive paste, solder, or a noble metal, a broken line in FIG. As shown by, a hole 54a smaller than the diameter at the top of the projection, for example, 53 (or 57) may be formed in the wiring film 54. By doing so, the protrusion 53 (or 5
When 7) is connected to the copper wiring film 54, the top of the projection 53 (or 57) abuts the hole 54a and breaks it, and the connection between the projection 53 and the metal film 54 can be further strengthened. is there. Of course, the formation of the hole 54a can be achieved by the projections 53h and 53h having different heights as shown in FIG.
It is very effective whether the embodiment has the projections 53 of uniform height, regardless of whether the embodiment has the l.

FIGS. 12A and 12B show a process for forming a spacer 61 having the same material and the same height as the upper and lower conductor connection protrusions, for example, 57, in the process of forming the protrusions. The distance between the conductor circuit composed of the base material 51 and the core substrate or the like (not shown in FIG. 12) laminated on the printed circuit board is kept constant as predetermined, and the thickness of the insulating layer is set at a predetermined position, and FIG. 3A is a perspective view showing a main part before a conductor circuit is formed according to an embodiment in which the impedance controllability of a circuit board is enhanced.
(B) is a sectional view.

That is, projections are formed by selective etching of the copper base material 51 and are used for connection between the upper and lower conductors. However, the insulating sheet does not originally have a good thickness tolerance, and the temperature and pressure during lamination are not good. Therefore, it is difficult to stabilize the thickness of the insulating layer because the finished thickness varies.
Therefore, the distance between the copper foil and the core substrate laminated thereon is not constant, and it is difficult to control the impedance. Therefore, the spacer 61 is formed at an appropriate place in the same process as the projection, and the spacer is pressed against the pre-stripe until the spacer 61 hits the core substrate, and the remaining insulating material is extruded to the periphery to keep the distance between the upper and lower copper patterns constant. In this embodiment, the impedance controllability is improved. The spacer 61 may be formed in any pattern as long as it does not hinder the formation of the conductor circuit, for example, by forming a pattern in a lattice shape or a frame shape. The spacer 61 can be used as a ground line for an electrostatic shield.

FIG. 15 shows a large diameter 53x and a small diameter 53y mixed as upper and lower conductor connection projections, and a large diameter upper and lower conductor connection projection 53x for upper and lower conductor connection through which a large current flows. FIG. 13 is a cross-sectional view showing a main part of an embodiment in which a projection 53y for connection between upper and lower conductors having a small diameter is used for connection between upper and lower conductors for passing a small current.

According to the present embodiment, even when a small current or a large current is passed through the upper and lower conductor connecting projections having the same size, a not negligible voltage drop occurs at the upper and lower conductor connecting protrusions through which a large current flows. Eliminates the risk of heat generation, and allows small currents and large currents to pass through relatively large upper and lower conductor connection projections of the same size. There is no danger of hindering improvement.

FIGS. 16A to 16C show a projection 53, for example.
57A shows a main part of an embodiment in which a positioning mark or a model recognition mark 63 is formed at the same time as 57 and the like. FIG. (B) is a pattern diagram of a positioning mark, which is an example 63a of a mark, and (C) is a pattern diagram of a positioning mark, which is another example 63b of a mark. is there.

In this embodiment, projections, for example, 53, 57
Since the mark 63 is formed at the same time when the mark 63 is formed, the mark 63 is made of the same material as the protrusions, for example, 53, 57, and has the same height. According to the present embodiment, the mark 6
Since 3 is formed simultaneously with the projections, for example, 53, 57, etc.
There is an advantage that there is no special process for forming the mark 63, and the mark 63 and each projection are formed in the same process, so that the positional relationship between the mark 63 and each projection can be minimized. it can.

FIGS. 17A to 17D are sectional views showing an eighth embodiment of the method of manufacturing a printed circuit board according to the present invention in the order of steps. (A) First, as shown in FIG.
Prepare Reference numeral 71 denotes an insulating substrate made of resin, and 72 denotes a conductor circuit formed on both surfaces thereof, which is made of copper. 73 is a through hole for connection between the upper and lower conductors. The printed circuit board having the protrusions 53 or 57 on both surfaces of the core substrate 20 is laminated.

(B) Next, at least portions of the conductor circuits 72 on the upper and lower surfaces of the core substrate 20 which are to be connected to the projections of the printed circuit board to be laminated, as shown in FIG. A layer 74 made of a conductive paste, solder, or a noble metal is formed. (C) Next, as shown in FIG. 17C, a printed circuit board 75 is provided on each of the upper and lower surfaces of the core substrate 20 with each protrusion, for example, 5.
3 are laminated via the interlayer insulating film 55 such that the contact portions 3 are in contact with the corresponding portions of the conductor circuit 72.

(D) Next, as shown in FIG.
The base material 51 of each of the upper and lower wiring circuit boards 75 is patterned by selective etching to form a conductor circuit. As a result, it is possible to obtain a highly integrated wiring circuit board which is built up with the two wiring circuit boards 75 and the core substrate 20 and which has high reliability in connection between the protrusions and the conductor circuits.

The formation of the conductor circuit by selective etching of the base material 51 of each printed circuit board 75 may be performed before the wiring circuit board 75 is laminated on both surfaces of the core substrate 20.

FIGS. 18A and 18B show a hole 7 having a diameter larger than the diameter of the top of the projection 53 in a portion corresponding to the projection, for example, 53 or 57, of the conductor circuit 72 in the above embodiment.
2A shows an example in which 2a is formed, and FIG.
FIG. 3B is a cross-sectional view, and FIG. 3B is a plan view showing a shape of a portion connected to a protrusion of the conductor circuit 72. According to such an example,
Since the protrusion 53 can be partially inserted into the hole 72a via the layer 74 made of a conductive paste, solder, or a noble metal, the connection strength can be further increased, and the reliability can be increased.

FIG. 18C shows that after forming a layer 74 made of a conductive paste, solder or a noble metal, the surface is polished to form the layer 7.
4 is a cross-sectional view showing an example in which a portion on the conductor circuit 72 of No. 4 is removed so that a conductive paste, solder, or a noble metal 74 exists only in the hole 72a. In this case, for example, when the printed circuit boards 75 are stacked, the projections 53 or 57 are connected to the conductor circuit 72 in a state where the projections 53 or 57 pierce the conductive paste, the solder or the noble metal 74 in the holes 72a.

FIGS. 19A to 19C are sectional views showing a tenth embodiment of the method of manufacturing a printed circuit board according to the present invention in the order of steps. (A) As shown in FIG. 19 (A), a copper foil to be laminated via a interlayer insulating film 55 on a surface of a printed circuit board having a protrusion, for example, 53 or 57, should be connected to the protrusion. A part 56 in which a metal film 76 such as a conductive paste, a solder or a noble metal (for example, gold) for improving or securing the connectivity is previously formed on a portion is prepared.

(B) Next, as shown in FIG.
The surface of the copper foil 56 on the side where the metal film 76 is formed faces the surface of the base material 51 on the side where the protrusion 53 is formed via the interlayer insulating film 55. (C) Next, as shown in FIG.
The base material 51 having a protrusion, for example, 53 is laminated via an interlayer insulating film 55. Then, the protrusion, for example, 53 breaks through the interlayer insulating film 55 and comes into contact with the metal film 76.

Thereafter, although not shown, the base member 51 is not shown.
And copper foil 56 are simultaneously or selectively etched to form conductive circuits on both surfaces. According to such an embodiment, it is possible to improve the connectivity between the projections, for example, 53 and the conductor circuit made of the copper foil 56.

FIG. 20 is a sectional view showing an embodiment in which an anisotropic conductive film 55a is used as the interlayer insulating film 55 of the printed circuit board of the present invention. According to the present embodiment, since the anisotropic conductive film 55a in which metal particles are dispersed is used as the interlayer insulating film, the portion sandwiched between the projection 53 and the copper foil 56 is subjected to vertical addition at that portion. The conductive particles are interposed between the projection 53 and the copper foil 56 by the pressure, and the particles are pressed to improve the reliability of the connection such as piercing on both surfaces, and have conductivity. Hold. Therefore, the connectivity between the projection 53 and the copper foil 56 can be ensured by the anisotropic conductive film 55a, and the insulation required for the interlayer insulating film can also be ensured.

Incidentally, the anisotropic conductive film may be formed only on the projection, for example, only on the projection 53, and the interlayer insulating film may be formed of a normal insulating resin. In that case, the electrical connection between the projection and, for example, the copper foil 56 is established by the anisotropic conductive film, and the insulation is ensured by the ordinary insulating resin.

[0109]

According to the printed circuit board of the first aspect, the projection made of the metal is selectively formed on the metal layer made of the conductor circuit via the etching barrier layer made of a metal different from the metal layer. The protrusions can be formed by selective etching of the metal layer while preventing the metal layer serving as a conductor circuit from being eroded by the etching barrier layer. Therefore, a printed circuit board can be obtained by using a base material having at least the height of the protrusion or a thickness greater than that. Therefore, the possibility that the base material is bent or deformed during the manufacturing process is reduced. Also, since the dimensions do not fluctuate in the manufacturing process and the positions of the projections do not shift in the horizontal direction, even if the projections are formed finely and the arrangement density is increased, the upper and lower conductors may be displaced due to the displacement of the projections. There is no danger of interlayer connection failure between circuits, and the yield and reliability are increased.

Further, since the projections can be formed by a metal layer and the metal layer can be formed by a relatively low-cost material such as copper, a conductive paste formed by filling a conventional hole or by printing can be used. The cost of the printed circuit board can be reduced as compared with the case where it is used as the connection means between the upper and lower conductor circuits. Further, as described above, since the protrusions are formed by selective etching of the metal layer, the height can be made uniform, and there is no possibility that a connection failure between the upper and lower conductor circuits due to the unevenness of the height will occur. Further, since the protrusion is integrated with the metal layer forming the conductor circuit, the mechanical strength of the protrusion forming portion can be increased as compared with the related art.

According to the second aspect of the present invention, since the conductive paste material is coated on the surface of the protrusion as a surface treatment agent, the bonding property between the protrusion and the conductive circuit can be enhanced by the conductive paste.

According to a third aspect of the present invention, there is provided a method of manufacturing a printed circuit board, wherein an etching barrier layer is formed on a metal layer for forming projections, and a metal layer serving as a conductor circuit is formed on the etching barrier layer. Then, the metal layer for forming the protrusions is selectively etched with an etchant that does not attack the etching barrier layer to form the protrusions, and only the etching barrier layer is formed of the metal forming the conductor circuit using the protrusions as a mask. Remove with an etchant that does not attack the layer,
2. The printed circuit board according to claim 1, wherein an insulating layer for interlayer insulation is formed on the surface of the metal layer forming the conductor circuit on the side on which the protrusion is formed, and the protrusion is used as interlayer connection means connected to the conductor circuit. Thus, the same effects as those described for the wired circuit board of claim 1 can be obtained.

According to the method of manufacturing a printed circuit board of the present invention, the metal forming the conductive circuit can be obtained without performing the selective etching of the etching barrier layer using the projections as a mask in the method of manufacturing the printed circuit board of the present invention. Since the etching barrier layer is etched together with the metal layer in the selective etching of the layer, a step only for removing an unnecessary portion of the etching barrier layer can be eliminated. Therefore, the number of manufacturing steps can be reduced.

According to the method of manufacturing a printed circuit board of claim 5, in the method of manufacturing a printed circuit board of claim 3 or 4, the layer made of the base metal is selectively etched to form the protrusion. At this time, a metal layer is used as an etching mask, and even after the formation of the projections, the metal layer used as the etching mask is left so as to cover the entire surface of the projection with the metal layer. The metal layer used as an etching mask can be used as a means for improving the connectivity between each of the protrusions and the conductor circuit without performing a troublesome operation of applying the conductive paste.

According to the method of manufacturing a printed circuit board of claim 6, the printed circuit board of claim 1 and a metal foil are laminated, and both the metal layer of the printed circuit board and the metal foil are selectively etched. Accordingly, it is possible to obtain a printed circuit board having conductor circuits on both sides insulated by an interlayer insulating film and electrically connecting the conductor circuits by protrusions penetrating the interlayer insulating film.

According to the method of manufacturing a printed circuit board of claim 7, the printed circuit board of claim 1 is laminated on both sides of the printed circuit board manufactured by the method of manufacturing a printed circuit board of claim 6. The conductor circuit is formed on both sides by selectively etching the metal layers present on both sides of the integrated one on top of the integrated circuit, so that a printed circuit board having four layers of conductor circuits can be obtained. it can.

According to the method of manufacturing a printed circuit board of claim 8 and the method of manufacturing a printed circuit board of claim 9, the single-layer or multi-layer conductive circuit is formed of a base metal via an insulating layer having an opening on one main surface. Two wiring circuit boards each having a projection electrically connected to the conductor circuit through the opening, and forming an interlayer insulating film on the side of the insulating layer where the projection is formed; Is directly or indirectly laminated via a printed circuit board so that the side on which the printed circuit board faces inward is integrated, so that the number of conductive circuit layers of the printed circuit board can be extremely increased, and the mounting density can be increased. be able to.

According to the tenth aspect of the present invention, since the LSI chip or the package is mounted on both sides of the wired circuit board of the eighth aspect, it is possible to obtain a wired circuit board on which the LSI chip or the package is mounted at a high density. it can. Since the pad is integrated with the wiring film, the structure of the pad-on-via can be strengthened, and the size of the wiring circuit board can be easily reduced.

According to the eleventh aspect of the present invention, since the upper and lower conductor connection projections made of the same metal as the metal layer are formed on the metal layer forming the conductor circuit, the metal layer and the metal layer can be selectively formed thereon. Since a material having a single-layer structure can be used as a base material forming a projection to be formed, material costs can be reduced. Then, the projections can be formed by half-etching the base material, which eliminates the need for a step of removing the etching barrier layer, thereby reducing man-hours. Therefore, the cost of the printed circuit board can be reduced.

According to the printed circuit board of the twelfth aspect, similarly to the printed circuit board of the eleventh aspect, it is possible to use a metal layer and a base material constituting a projection selectively formed thereon with a single layer structure. As a result, material costs can be reduced, and man-hours can be reduced. Therefore,
The cost of the printed circuit board can be reduced.

According to the printed circuit board of the thirteenth aspect, since a hole having a diameter smaller than the top of the projection is formed in a portion corresponding to the projection of the metal film, the projection is formed when the projection is connected to the metal film. The top of the hole hits the hole and breaks it,
The connection between the projection and the metal film can be further strengthened.
Therefore, the connection can be strengthened and the reliability of the connection can be improved.

According to the fourteenth aspect of the present invention, since the projection for connecting the upper and lower conductors is formed in a spear shape, the interlayer insulating film is effectively formed by the projection in a glass cloth containing glass epoxy prepreg which is generally used. In addition, the metal layer can be reliably pierced, and further pierced into the metal layer to be laminated, so that the connection between the projection and the metal layer can be further ensured.

According to the fifteenth aspect of the present invention, since the connection between the upper and lower conductors is in a conide shape, the top can be made flat, there is no possibility that the height of the projections will be nonuniform, and the base material forming the conductor circuit will be described. The distance between the upper conductor and the metal layer forming the conductor circuit laminated with the interlayer insulating film interposed therebetween can be maintained at a constant value for connection between the upper and lower conductors.

According to the sixteenth aspect of the present invention, since the protrusion for connecting the upper and lower conductors is in the shape of a drum, the plane area of the top can be made larger and the base material and the base material which form the conductor circuit more reliably.
The effect of ensuring a constant spacing between metal layers can be obtained more reliably.

According to the seventeenth aspect of the present invention, since the upper and lower conductor connection projections are roughened or crushed, the connectivity between the top and the metal layer can be further improved.

According to the printed circuit board of the eighteenth aspect, the projection for connecting the upper and lower conductors is made of copper, and the surface thereof is subjected to electrolytic chromate treatment, so that the surface of the metal layer can be prevented from being oxidized. Thus, the reliability of the electrical connection between the protrusion and the metal layer can be increased.

According to the nineteenth aspect of the present invention, a mask film is selectively formed on one surface of a metal plate (base material), and the metal plate is half-etched using the mask film as a mask. Forming a metal layer and a projection to be a conductor circuit, and laminating a metal layer via an interlayer insulation layer on the surface of the metal layer to be a conductor circuit on the side where the projection is formed; Since the wiring film is formed by selectively patterning the metal layers at the same time or at different times, the wired circuit board according to claim 12 can be obtained.

According to the twentieth aspect of the present invention, since the anisotropic conductive film is interposed between the upper and lower conductor connecting protrusions and the metal layer connected to the upper and lower conductor connecting protrusions, The connection with the metal layer can be reliably established through the metal particles in the anisotropic conductive film.

According to the method of manufacturing a printed circuit board of the present invention, the step of interposing an anisotropic conductive film between the projection and the metal layer is provided before the metal layer is laminated.
Can be obtained.

According to the printed circuit board of the present invention, a large number of inter-conductor connection projections made of metal are arranged on the intersections of the grid with a fixed interval on the surface of the metal layer. Regardless of whether or not the conductor circuit on both sides is mass-produced as a standard product until the stage before it is formed by selective etching, a conductor circuit having a different pattern is formed depending on the model. Therefore, the productivity of other types of printed circuit boards can be improved. At the same time, there is no need to change the mask depending on the product type, and the copper etching amount can be reduced.
It can handle small-volume production of other varieties to large-volume production of small varieties, greatly contributing to improved economic efficiency.

According to the twenty-third aspect of the present invention, each of the upper and lower conductor connecting projections is arranged such that each of the upper and lower conductor connecting projections receives a uniform pressing force when pressed from both sides of the substrate. In addition, the degree of crushing of each projection can be made uniform, and hence the connectivity can be made uniform, and the reliability can be increased.

According to the twenty-fourth aspect of the present invention, small dummy projections are arranged in the peripheral portion of each of the densely connected areas between the upper and lower conductors in addition to the densely arranged projections for the connection between the upper and lower conductors. The etching rate for the connection between the upper and lower conductors of the portion can be made as small as that for the connection between the upper and lower conductors in the center portion, and the etching rate for the connection between the upper and lower conductors can be made uniform. The diameter and height for connecting conductors can be made uniform.

According to the printed circuit board of the twenty-fifth aspect, since the inter-conductor connection projections have a plurality of different heights, different surfaces having different bonding mechanisms, such as a stepped bonding surface or a copper paste and copper pattern surface. Can be stacked without any trouble.

According to the twenty-sixth aspect of the present invention, the projections for connecting conductors have a plurality of different diameters, so that the projections through which a large current passes have a large diameter and a small diameter depending on the current passing therethrough. The diameter of the projection through which the current passes can be reduced, and a large current flows through the projection with a small diameter, causing a voltage drop or generating Joule heat. There is no possibility that the problem of occupying the area will occur.

Since the printed circuit board according to the present invention has a spacer formed of the same material and at the same height as the upper and lower conductor connecting projections, the spacer makes the distance between the base material and the metal layer constant, thereby reducing the impedance. Controllability can be improved. Also, this spacer can be grounded and used for an electrostatic shield.

The method for manufacturing a printed circuit board according to claim 28 is characterized in that
Since the spacer is formed in the same step as the upper and lower conductor connecting projections, the spacer can secure the space between the base material and the metal layer. Thus, the printed circuit board according to claim 27 can be formed without increasing the number of steps. it can.

Since the printed circuit board according to the present invention has the recognition mark, the alignment and the recognition of the model can be performed by the recognition mark.

A method for manufacturing a printed circuit board according to claim 30 is characterized in that:
Since the recognition mark is formed in the same step as the step for connecting the upper and lower conductors, the printed circuit board according to claim 29 in which the recognition mark is formed without increasing the number of steps can be obtained.

According to the printed circuit board of the thirty-first aspect, through-holes for electrically connecting the conductive circuits on the upper and lower surfaces of the insulating base are formed, and both surfaces of the core circuit board are formed of metal layers. Another circuit board formed with an insulating layer penetrated by the upper and lower conductor connecting protrusions on the surface on the protrusion forming side of the wiring circuit having the selectively formed upper and lower conductor connecting protrusions, In a printed circuit board laminated with the ends of the inter-conductor connection projections connected to the wiring circuit made of the metal layer, the upper and lower conductor connection projections and the wiring circuit are connected via a conductive paste, solder or a noble metal layer. Therefore, the electrical connection between the circuit boards and the reliability of the connection can be improved while achieving high integration by build-up.

According to the printed circuit board of the present invention, the metal layer forming the conductor circuit is selectively laminated with the upper and lower conductor connection projections made of the same metal as the metal layer via the interlayer insulating film. Since the metal layer forming the conductor circuit is provided with a solder, a conductive paste or a noble metal film that comes into contact with the upper and lower conductor connecting protrusions, the metal layer and the protrusion can be connected via the solder, the conductive paste or the noble metal film. And electrical connection therebetween can be improved.

According to the method of manufacturing a printed circuit board of the present invention, the upper and lower conductors are selectively formed on the metal layer to be the conductor circuit and the upper and lower conductor connection protrusions made of the same metal as the metal layer are selectively formed. On the connection protrusion forming side, a solder, a conductive paste, or a noble metal film was formed on a metal layer to be a conductor circuit different from the conductor circuit, corresponding to the connection protrusion between the upper and lower conductors via an interlayer insulating layer. Claim 3
4, 35 printed circuit boards can be obtained.

In the printed circuit board according to the thirty-fourth aspect, since an anisotropic conductive film is used as an interlayer insulating film, even if the conductive film is interposed between the protrusion and the metal layer, the conductive property is maintained by the pressure applied to the interlayer insulating film. Since it is tinged, it is possible to reliably electrically connect the projection and the metal layer.

[Brief description of the drawings]

FIGS. 1A to 1G are cross-sectional views sequentially showing steps (A) to (G) of a first embodiment of a method for manufacturing a printed circuit board of the present invention.

FIGS. 2 (H) to 2 (K) are cross-sectional views sequentially showing steps (H) to (K) of the first embodiment.

FIGS. 3A to 3F are sectional views showing a second embodiment of the method of manufacturing a printed circuit board according to the present invention in the order of steps.

FIGS. 4A to 4C are cross-sectional views showing a third embodiment of the method of manufacturing a printed circuit board according to the present invention in the order of steps.

FIGS. 5A to 5G are sectional views sequentially showing steps (A) to (G) of a fourth embodiment of the method of manufacturing a wired circuit board according to the present invention.

FIGS. 6H and 6I are cross-sectional views sequentially showing steps (H) to (I) of the fifth embodiment.

FIGS. 7A to 7E are sectional views showing a sixth embodiment of the printed circuit board of the present invention in the order of steps.

FIGS. 8A and 8B are cross-sectional views showing another example of the upper and lower conductor connecting projections of the printed circuit board of the present invention.

FIG. 9 is a perspective view showing a main part of the embodiment in which protrusions of the printed circuit board of the present invention are arranged on each intersection of the lattice.

FIG. 10 is a perspective view showing an embodiment in which the pressure applied to each projection during lamination of the printed circuit board of the present invention is arranged so as to be uniform for each projection.

FIG. 11 is a cross-sectional view showing an embodiment in which dummy projections for making the etching rate uniform are provided in order to make the height and diameter of the upper and lower conductor connecting protrusions of the printed circuit board of the present invention uniform. .

12 (A) to 12 (D) are plan views showing different embodiments provided with dummy projections.

FIG. 13 is a sectional view showing an embodiment in which upper and lower conductor connection projections having different heights of the printed circuit board of the present invention are mixed to correspond to a junction surface having a step.

14A and 14B show an embodiment in which a spacer having the same material and height as the protrusions of the printed circuit board of the present invention is provided, wherein FIG. 14A is a perspective view, and FIG. FIG.

FIG. 15 is a cross-sectional view showing an embodiment in which upper and lower conductor connection projections having different diameters of the wired circuit board of the present invention are mixed.

16A to 16C show an embodiment in which recognition marks made of the same material as the protrusions of the printed circuit board of the present invention are provided, wherein FIG. 16A is a perspective view, and FIG. (C) is a plan view of another recognition mark having a different pattern from that of (B).

17A to 17D are sectional views showing a seventh embodiment of the method of manufacturing a printed circuit board according to the present invention in the order of steps.

18A to 18C show an example in which a hole larger than the diameter of the top of the projection is formed in a portion corresponding to the projection of the conductor circuit, and FIG. (B) is a plan view showing a shape of a portion connected to the projection of the conductor circuit,
(C) is to form a layer made of conductive paste, solder or precious metal, and then to polish the surface to remove a portion of the layer on the conductive circuit, so that the conductive paste, solder or precious metal is present only in the hole. It is sectional drawing which shows the example which performed.

FIGS. 19A to 19C are cross-sectional views illustrating an eighth embodiment of the method of manufacturing a printed circuit board according to the present invention in the order of steps.

FIG. 20 is a sectional view showing an embodiment using an anisotropic conductive film as an interlayer insulating film of the printed circuit board of the present invention.

FIGS. 21A to 21F are views for explaining one conventional example relating to a printed circuit board for high-density mounting, and show steps (A) to (F) of a method of manufacturing a printed circuit board in order; It is sectional drawing.

FIG. 22 is a cross-sectional view showing, in order, steps (G) to (I) of the method of manufacturing the conventional printed circuit board.

FIGS. 23A to 23G are views for explaining another conventional example relating to a printed circuit board for high-density mounting, and show a method of manufacturing a printed circuit board in the order of steps (A) to (G). It is sectional drawing.

[Description of Signs] 20: base material, 21, 21a: metal layer (copper layer) for forming projections, 22: etching barrier layer, 23
..Metal layer (copper foil) for forming conductor circuit, 25...
26: conductive paste, 27: interlayer insulating film, 2
8 ... laminated body, 29 ... metal layer (copper foil) for conductor circuit formation, 30 ... laminated body, 31, 32 ... conductor circuit,
33, 33a: Wiring circuit board, 35: Conductor circuit, 36: Wiring circuit board, 37: Projection forming mask / projection coating solder plating film, 40: Insulating film, 41
... Opening, 42 ... Conductor circuit, 43 ... Insulating film,
44 ... opening, 45 ... projecting terminal, 46, 47
..Wiring circuit boards, 48 ... LSI chips, 51 ..
-Base material (metal layer made of copper), 53, 57: Projection for connection between upper and lower conductors, 54: Conductor paste, solder or noble metal film, 55: Interlayer insulation film, 55a: Interlayer insulation Anisotropic conductive film forming film, 56... Metal layer, 58
... Dummy projection, 61 ... Spacer, 63 ... Recognition mark, 70 ... Core printed circuit board, 72 ...
Metal layer, 72a ... hole, 73 ... through hole, 7
4 ... conductive paste, solder or noble metal film.

[Procedure amendment 2]

[Document name to be amended] Drawing

[Correction target item name] Fig. 7

[Correction method] Change

[Correction contents]

FIG. 7

[Procedure amendment 3]

[Document name to be amended] Drawing

[Correction target item name] Fig. 8

[Correction method] Change

[Correction contents]

FIG. 8

[Procedure amendment 4]

[Document name to be amended] Drawing

[Correction target item name] Fig. 9

[Correction method] Change

[Correction contents]

FIG. 9

[Procedure amendment 5]

[Document name to be amended] Drawing

[Correction target item name] FIG.

[Correction method] Change

[Correction contents]

FIG. 10

[Procedure amendment 6]

[Document name to be amended] Drawing

[Correction target item name] FIG.

[Correction method] Change

[Correction contents]

FIG. 11

[Procedure amendment 7]

[Document name to be amended] Drawing

[Correction target item name] FIG.

[Correction method] Change

[Correction contents]

FIG.

[Procedure amendment 8]

[Document name to be amended] Drawing

[Correction target item name] FIG.

[Correction method] Change

[Correction contents]

FIG. 13

[Procedure amendment 9]

[Document name to be amended] Drawing

[Correction target item name] FIG.

[Correction method] Change

[Correction contents]

FIG. 14

[Procedure amendment 10]

[Document name to be amended] Drawing

[Correction target item name] FIG.

[Correction method] Change

[Correction contents]

FIG.

[Procedure amendment 11]

[Document name to be amended] Drawing

[Correction target item name] FIG.

[Correction method] Change

[Correction contents]

FIG. 16

[Procedure amendment 12]

[Document name to be amended] Drawing

[Correction target item name] FIG.

[Correction method] Change

[Correction contents]

FIG.

[Procedure amendment 13]

[Document name to be amended] Drawing

[Correction target item name] FIG.

[Correction method] Change

[Correction contents]

FIG.

[Procedure amendment 14]

[Document name to be amended] Drawing

[Correction target item name] FIG.

[Correction method] Change

[Correction contents]

FIG.

[Procedure amendment 15]

[Document name to be amended] Drawing

[Correction target item name] FIG.

[Correction method] Change

[Correction contents]

FIG.

[Procedure amendment 16]

[Document name to be amended] Drawing

[Correction target item name] FIG.

[Correction method] Change

[Correction contents]

FIG. 21

[Procedure amendment 17]

[Document name to be amended] Drawing

[Correction target item name] FIG.

[Correction method] Change

[Correction contents]

FIG.

[Procedure amendment 18]

[Document name to be amended] Drawing

[Correction target item name] FIG.

[Correction method] Change

[Correction contents]

FIG. 23

[Procedure amendment 19]

[Document name to be amended] Drawing

[Correction target item name] FIG.

[Correction method] Deleted

[Procedure amendment 20]

[Document name to be amended] Drawing

[Correction target item name] Fig. 25

[Correction method] Deleted

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 1/11 H05K 3/06 A 3/06 K 3/38 B 3/38 3/40 K 3/40 H01L 23/12 FF term (Reference) 5E317 AA24 BB02 BB11 CC22 CC25 CC53 CC60 CD23 CD25 GG11 GG14 5E338 AA02 AA03 AA16 AA18 CC01 CD03 DD12 DD22 DD32 EE41 5E339 AB02 AD03 AD05 BC01 BC02 BD03 BD05 BE13 BE15 CD05 AB15A15A BB22 BB24 BB34 BB54 BB67 BB72 DD01 DD75 EE54 EE55 GG01 5E346 AA12 AA15 AA22 AA35 AA43 AA60 BB01 BB16 CC08 CC32 CC40 DD03 DD12 DD32 DD34 EE02 EE06 EE17 EE19 FF24 GG22 GG25 GG27 HGG GG25 H

Claims (37)

[Claims] 1. A projection made of a metal is selectively formed on a metal layer to be a conductor circuit via an etching barrier layer made of a metal different from the metal layer, and the projection of the conductor circuit is formed. A wiring circuit board, characterized in that an interlayer insulating layer is formed on the surface on the side of the substrate, and the protrusions penetrate the insulating layer and constitute a means for interlayer connection between the metal layer serving as the conductor circuit and the other. . 2. The printed circuit board according to claim 1, wherein the surface of the projection is coated with a conductive paste material as a surface treatment agent. 3. A step of forming an etching barrier layer made of another metal on a metal layer for forming projections and forming a metal layer to be a conductor circuit on the etching barrier layer; Forming a projection by selectively etching the metal layer for forming the projection with an etchant that does not attack the etching barrier layer; and forming the conductor circuit using only the etching barrier layer as a mask and the projection. Removing with an etchant that does not invade the conductive circuit; and an interlayer connecting means for forming an insulating layer for interlayer insulation on the surface of the metal layer forming the conductive circuit on the side of the protrusion and connecting the protrusion to the conductive circuit. A method for manufacturing a printed circuit board, comprising: 4. A step of forming an etching barrier layer made of another metal on a metal layer for forming projections and forming a metal layer to be a conductor circuit on the etching barrier layer; Forming a projection by selectively etching the metal layer for forming a projection with an etchant that does not attack the etching barrier layer; and forming an interlayer insulating layer on the surface of the metal layer forming the conductor circuit on the side where the projection is formed. Forming an insulating layer of the above and forming the protrusions as interlayer connection means connected to the conductor circuit; and forming a metal layer on the etching barrier layer to be the conductor circuit together with the etching barrier layer using an etching mask layer as a mask. Forming a conductive circuit by removing the conductive circuit by selective etching. 5. A metal layer used as an etching mask when the projections are formed by selectively etching the metal layer for forming the projections, and the metal layer used as the etching mask even after the formation of the projections. 5. A state in which the surface of the protrusion is entirely covered with the metal layer by leaving the metal layer.
The manufacturing method of the printed circuit board according to the above. 6. A conductive circuit forming metal foil for forming a conductor circuit different from the conductor circuit on a surface of the printed circuit board according to claim 1 on which the protrusions and the interlayer insulating film are formed. It is characterized by laminating and integrating by heating under pressure, and thereafter, by selectively etching the metal layer for forming the conductor circuit and the metal foil for forming the conductor circuit, conductor circuits are formed on both surfaces. Manufacturing method of printed circuit board. 7. An etching barrier layer made of a metal different from the metal layer on the first printed circuit board manufactured by the method for manufacturing a printed circuit board according to claim 6, and a metal layer for forming a conductor circuit. A protrusion made of a metal is selectively formed, and an interlayer insulating layer is formed on the surface of the conductor circuit on the side where the protrusion is formed, and the protrusion penetrates the insulating layer to form the conductor circuit. Preparing two second printed circuit boards forming an interlayer connection means between a metal layer and another, and mounting the two second printed circuit boards on both surfaces of the first printed circuit board, The printed circuit board is stacked and laminated in a sandwich shape such that the surface on the side where the protrusions and the interlayer insulating film are formed face inward, integrated by pressing and heating, and located on both surfaces of the integrated body. Selectively etch two conductor circuit forming metal layers Method of manufacturing a printed circuit board and forming a conductor circuit on both sides by Rukoto. 8. A single-layer or multi-layer conductor circuit comprising a conductor-forming metal layer via an insulating layer having an opening on one main surface thereof, and a projection electrically connected to the conductor circuit through the opening. The two wiring circuit boards each having an interlayer insulating film formed on the side of the insulating layer on which the protrusion is formed, directly or via the wiring circuit board so that the side on which the protrusion and the interlayer insulating film are formed faces inward. A printed circuit board characterized by being laminated and pressed to be integrated. 9. A projection formed of a metal layer for forming a conductor circuit via an insulating layer having an opening on one main surface of a single-layer or multilayer conductor circuit and electrically connected to the conductor circuit through the opening. Then, two printed circuit boards having an interlayer insulating film formed on the side of the insulating layer on which the protrusions are formed are prepared, and the two printed circuit boards are arranged such that the side on which the protrusions and the interlayer insulating film are formed has an inner side. A method for manufacturing a printed circuit board, comprising: stacking and integrating the printed circuit board directly or through another printed circuit board so as to face the printed circuit board. 10. A printed circuit board comprising: an LSI chip or a package mounted on both sides of the printed circuit board according to claim 8. 11. An upper and lower conductor connection protrusion made of the same metal as the metal layer is selectively formed on a metal layer forming a conductor circuit, and a surface of the conductor circuit on a side on which the protrusion is formed. A wiring circuit board, wherein the upper and lower conductor connecting projections penetrate the insulating layer to form an interlayer connecting means with the metal layer which becomes the conductor circuit. . 12. A projection for connecting upper and lower conductors made of the same metal as the metal layer on a metal layer forming the first conductor circuit.
An interlayer insulating layer is formed selectively on the surface of the conductor circuit on the side where the protrusion is formed, in a state where the interlayer insulating layer is penetrated by the protrusion, and the surface of the protrusion and the interlayer insulating layer is formed of a metal layer. A printed circuit board, wherein two conductor circuits are formed, and the first and second conductor circuits are electrically connected via the protrusions. 13. A metal layer forming the second conductor circuit, wherein a hole having a diameter smaller than the diameter at the top of the projection is formed in a portion corresponding to the projection for connection between the upper and lower conductors. The printed circuit board according to claim 12. 14. The printed circuit board according to claim 11, wherein the projection is formed in a spear shape. 15. The printed circuit board according to claim 11, wherein the projection is formed in a conide shape. 16. The printed circuit board according to claim 11, wherein the projection is formed in a drum shape. 17. The method according to claim 11, wherein the surface of the projection is roughened or crushed.
17. The printed circuit board according to 4, 15, or 16. 18. The projection according to claim 11, wherein the projection is made of copper, and its surface is subjected to electrolytic chromate treatment.
The printed circuit board according to 12, 13, 14, 15, 16 or 17. 19. A step of preparing a metal layer for forming a conductive layer and a metal plate for forming a projection, selectively forming a mask film on one surface thereof, and using the mask film as a mask to form the metal plate. Forming a metal layer to be a conductor circuit by half-etching and a projection selectively formed integrally on the one surface of the metal layer; and a surface of the metal layer to be the conductor circuit on a side on which the projection is formed. Laminating a metal layer with an interlayer insulating layer interposed therebetween; and forming a wiring film by selectively patterning the metal layers on both surfaces of the insulating layer simultaneously or at different times. Manufacturing method of a printed circuit board. 20. The printed circuit board according to claim 12, wherein an anisotropic conductive layer is interposed between the upper and lower conductor connecting projections and the metal layer connected thereto. Method. 21. The method according to claim 19, further comprising a step of interposing an anisotropic conductive film between the protrusion and the metal layer before laminating the metal layer. . 22. A plurality of inter-conductor connection projections made of a plurality of metals are arranged on the surface of a metal layer at respective intersections of a grid arranged at regular intervals, and the inter-conductor connection projections of the metal layer are An interlayer insulating layer is provided on the formed surface in a state of being penetrated by the inter-conductor connection projections, and a metal layer is formed on a surface of the inter-layer insulation layer including the upper and lower conductor connection projections. Printed circuit board. 23. A plurality of inter-conductor connection projections made of a plurality of metals are arranged on a surface of a metal layer, and an interlayer insulating layer is penetrated by the projections on the surface of the metal layer on which the inter-conductor connection projections are formed. A wiring circuit board formed by forming a metal layer different from the metal layer on the surface of the interlayer insulating layer including the inter-conductor connection protrusions, wherein the upper and lower conductor connection protrusions are provided. A wiring circuit board, wherein the connection projections between the upper and lower conductors are arranged to receive a uniform pressing force when pressure is applied from both sides of the board. 24. A plurality of inter-conductor connection protrusions made of metal are arranged on a surface of a metal layer, and an interlayer insulating layer is penetrated by the protrusions on the surface of the metal layer on which the inter-conductor connection protrusions are formed. A wiring circuit board having a metal layer different from the metal layer formed on the surface of the interlayer insulating layer including the inter-conductor connection projections, wherein the periphery of the upper and lower conductor connection projections is provided. Alternatively, a printed circuit board characterized by arranging a dummy projection smaller in height than a connection projection between upper and lower conductors around a dense area where the upper and lower conductors are densely arranged. 25. An inter-conductor connection projection made of a large number of metals is arranged on the surface of a metal layer, and an interlayer insulating layer is penetrated by the projection on the surface of the metal layer on which the inter-conductor connection projection is formed. A wiring circuit board formed by forming a metal layer different from the metal layer on the surface of the interlayer insulating layer including the inter-conductor connection projections, wherein a plurality of upper and lower inter-conductor connection projections are provided. Printed circuit board characterized by having different heights 26. An inter-conductor connection projection made of a large number of metals is disposed on a surface of a metal layer, and an interlayer insulating layer is penetrated by the projection on a surface of the metal layer on which the inter-conductor connection projection is formed. A wiring circuit board formed by forming a metal layer different from the metal layer on the surface of the interlayer insulating layer including the inter-conductor connection projections, wherein a plurality of upper and lower inter-conductor connection projections are provided. Printed circuit board characterized by having different diameters 27. An inter-conductor connection projection made of a large number of metals is arranged on the surface of a metal layer, and an interlayer insulating layer is penetrated by the projection on the surface of the metal layer on which the inter-conductor connection projection is formed. A wiring circuit board formed by forming a metal layer different from the metal layer on the surface of the interlayer insulating layer including the inter-conductor connection protrusions, the same material as the upper and lower conductor connection protrusions Printed circuit board having spacers formed at the same height 28. A plurality of inter-conductor connection projections made of a plurality of metals are arranged on a surface of a metal layer, and an interlayer insulating layer is penetrated by the projections on the surface of the metal layer on which the inter-conductor connection projections are formed. A metal layer different from the metal layer is formed on the surface of the interlayer insulating layer including the inter-conductor connection protrusions, and is formed of the same material and at the same height as the upper and lower conductor connection protrusions A method for manufacturing a printed circuit board having a spacer formed, wherein the spacer is formed in the same step as the step of connecting the upper and lower conductors. 29. A plurality of inter-conductor connection protrusions made of metal are arranged on a surface of a metal layer, and an interlayer insulating layer is penetrated by the protrusions on the surface of the metal layer on which the inter-conductor connection protrusions are formed. A metal layer different from the metal layer is formed on the surface of the interlayer insulating layer including the inter-conductor connection projections. The same material and the same height as the upper and lower inter-conductor connection projections are used. A printed circuit board having a recognition mark formed thereon. 30. A plurality of inter-conductor connection projections made of a metal are arranged on a surface of a metal layer, and an interlayer insulating layer is penetrated by the projections on the surface of the metal layer on which the inter-conductor connection projections are formed. A metal layer different from the metal layer is formed on the surface of the interlayer insulating layer including the inter-conductor connection projections, and is made of the same material and has the same height as the upper and lower inter-conductor connection projections. What is claimed is: 1. A method for manufacturing a printed circuit board having a formed recognition mark, wherein the recognition mark is formed in the same step as the step for connecting the upper and lower conductors. 31. A wiring circuit made of a metal layer is formed on both upper and lower surfaces of a base made of an insulating resin, and through holes for electrically connecting wires on both surfaces are formed in the insulating resin forming the base. A circuit board serving as a core, and an insulating layer formed on a surface on the protrusion forming side of a wiring circuit having upper and lower conductor connection protrusions formed of a metal layer on both surfaces of the circuit board, respectively. Another circuit board formed in a state penetrated by the upper and lower conductor connection projections,
A wiring circuit board laminated in a state where tips of the upper and lower conductor connecting projections are connected to a wiring circuit made of the metal layer, wherein the upper and lower conductor connecting projections and the wiring circuit are made of a conductive paste or a noble metal layer. A printed circuit board, wherein the printed circuit board is connected to the printed circuit board. 32. Wiring circuits made of a metal layer are formed on both upper and lower surfaces of a base made of an insulating resin, and through holes for electrically connecting wirings on both surfaces are formed in the insulating resin forming the base. A circuit board serving as a core, and an insulating layer formed on a surface on a protrusion forming side of a wiring circuit having upper and lower conductor connection protrusions formed of a metal layer on both surfaces of the circuit board, respectively. Another circuit board formed in a state penetrated by the upper and lower conductor connecting projections was connected to the wiring circuit made of the metal layer via a conductive paste or a noble metal layer at the tip of the upper and lower conductor connecting projections. A method for manufacturing a wired circuit board laminated in a state, wherein a metal forming a wiring circuit of the circuit board serving as the core in advance before laminating another circuit board on both surfaces of the circuit board serving as the core On the surface of the layer Method of manufacturing a printed circuit board, characterized in that previously formed the conductive paste or a noble metal layer. 33. An upper and lower conductor connection projection made of the same metal as the metal layer is selectively formed on a metal layer forming a conductor circuit, and the upper and lower conductor connection projection of the conductor circuit is formed. An interlayer insulating layer is formed in a state penetrated by the upper and lower conductor connecting protrusions on the surface on the side of the metal layer, and on one surface of a metal layer forming a conductor circuit different from the conductor circuit on the interlayer insulating layer. Although the solder, conductive paste or noble metal film is formed corresponding to the upper and lower conductor connecting projections, the one surface is connected to the solder, conductive paste or noble metal film by the upper and lower conductor connecting protrusions. A printed circuit board characterized by being laminated. 34. The printed circuit board according to claim 33, wherein the metal film forming the another conductor circuit has a large hole at a portion corresponding to the protrusion between the upper and lower conductors. 35. An upper and lower conductor connection projection made of the same metal as the metal layer is selectively formed on a metal layer forming a conductor circuit, and the upper and lower conductor connection projection of the conductor circuit is formed. An interlayer insulating layer is formed in a state penetrated by the upper and lower conductor connecting protrusions on the surface on the side of the metal layer, and on one surface of a metal layer forming a conductor circuit different from the conductor circuit on the interlayer insulating layer. Although the solder, conductive paste or noble metal film is formed corresponding to the upper and lower conductor connecting projections, the one surface is connected to the solder, conductive paste or noble metal film by the upper and lower conductor connecting protrusions. A printed circuit board characterized by being laminated. 36. A connecting protrusion between upper and lower conductors made of the same metal as the metal layer is selectively formed on a metal layer forming a conductive circuit, and the connecting protrusion between upper and lower conductors of the conductive circuit is formed. An interlayer insulating layer is formed on the surface of the metal layer forming a conductor circuit different from the conductor circuit on the interlayer insulation layer. Although the solder, conductive paste or noble metal film is formed in correspondence with the upper and lower conductor connection projections, the one surface is
In a method for manufacturing a printed circuit board, wherein the solder, conductive paste, or noble metal film is laminated so that the above-mentioned protrusion for connection between upper and lower conductors is connected, the same metal as the metal layer is formed on a metal layer to be a conductor circuit The upper and lower conductors are selectively formed on the side of the upper and lower conductor connection projections formed on the metal layer to be a conductor circuit different from the conductor circuit via an interlayer insulating layer. The solder, conductive paste or noble metal film forming side is printed in correspondence with the inter-connecting projections, and the solder, the conductive paste or the noble metal film forming side is pressed and pressed, so that each of the upper and lower conductor connecting projections becomes the interlayer insulating layer. And forming a state of being connected to the corresponding solder, conductive paste or noble metal film, and laminating the same. 37. A printed circuit board in which a conductor circuit is formed or formed as a conductor circuit via an interlayer insulating film on a metal layer having projections for connecting the upper and lower conductors formed thereon, or a printed circuit board in which a circuit board is laminated. A printed circuit board characterized by using an anisotropic conductive film as an insulating film.