JP2008122920A - 感光性樹脂組成物及び感光性フィルム - Google Patents
感光性樹脂組成物及び感光性フィルム Download PDFInfo
- Publication number
- JP2008122920A JP2008122920A JP2007193712A JP2007193712A JP2008122920A JP 2008122920 A JP2008122920 A JP 2008122920A JP 2007193712 A JP2007193712 A JP 2007193712A JP 2007193712 A JP2007193712 A JP 2007193712A JP 2008122920 A JP2008122920 A JP 2008122920A
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- Prior art keywords
- photosensitive
- resin composition
- photosensitive resin
- bis
- manufactured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000011342 resin composition Substances 0.000 title claims abstract description 47
- 230000035945 sensitivity Effects 0.000 claims abstract description 40
- 230000003595 spectral effect Effects 0.000 claims abstract description 25
- 239000000178 monomer Substances 0.000 claims abstract description 10
- 239000003999 initiator Substances 0.000 claims abstract description 9
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 8
- -1 maleimide compound Chemical class 0.000 claims description 43
- 239000000049 pigment Substances 0.000 claims description 10
- 229920001187 thermosetting polymer Polymers 0.000 claims description 7
- 238000010521 absorption reaction Methods 0.000 claims description 6
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 claims description 3
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 17
- 238000011161 development Methods 0.000 abstract description 7
- 150000001875 compounds Chemical class 0.000 description 15
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 14
- 239000003822 epoxy resin Substances 0.000 description 13
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 13
- 229920000647 polyepoxide Polymers 0.000 description 13
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 239000004593 Epoxy Substances 0.000 description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 9
- 229920003192 poly(bis maleimide) Polymers 0.000 description 9
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 150000008065 acid anhydrides Chemical class 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920006395 saturated elastomer Polymers 0.000 description 5
- GOLORTLGFDVFDW-UHFFFAOYSA-N 3-(1h-benzimidazol-2-yl)-7-(diethylamino)chromen-2-one Chemical compound C1=CC=C2NC(C3=CC4=CC=C(C=C4OC3=O)N(CC)CC)=NC2=C1 GOLORTLGFDVFDW-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 4
- 239000012965 benzophenone Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 150000007519 polyprotic acids Polymers 0.000 description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- 239000004641 Diallyl-phthalate Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- ZYGHJZDHTFUPRJ-UHFFFAOYSA-N coumarin Chemical compound C1=CC=C2OC(=O)C=CC2=C1 ZYGHJZDHTFUPRJ-UHFFFAOYSA-N 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- CFJYNSNXFXLKNS-UHFFFAOYSA-N p-menthane Chemical compound CC(C)C1CCC(C)CC1 CFJYNSNXFXLKNS-UHFFFAOYSA-N 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 2
- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 description 2
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 2
- XAZPKEBWNIUCKF-UHFFFAOYSA-N 1-[4-[4-[2-[4-[4-(2,5-dioxopyrrol-1-yl)phenoxy]phenyl]propan-2-yl]phenoxy]phenyl]pyrrole-2,5-dione Chemical compound C=1C=C(OC=2C=CC(=CC=2)N2C(C=CC2=O)=O)C=CC=1C(C)(C)C(C=C1)=CC=C1OC(C=C1)=CC=C1N1C(=O)C=CC1=O XAZPKEBWNIUCKF-UHFFFAOYSA-N 0.000 description 2
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
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- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
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- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
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- 238000002360 preparation method Methods 0.000 description 2
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- 239000002904 solvent Substances 0.000 description 2
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Abstract
【解決手段】(a)カルボキシル基及びエチレン性不飽和基を有する感光性プレポリマーと、(b)エチレン性不飽和基を有する光重合性モノマーと、(c)光重合開始剤と、(d)増感剤と、を含有し、365nmにおける感度の405nmにおける感度に対する比が0.9〜1.4であるような分光感度を有する、感光性樹脂組成物。また、これを用いた感光性フィルム。
【選択図】なし
Description
分光感度比=365nmにおける感度/405nmにおける感度
メチルプロパン、4,4’−シクロヘキシリデン−ビス[1−(4−マレイミドフェノキシ)−2−(1,1−ジメチルエチル)ベンゼン]、4,4’−メチレン−ビス[1−(4−マレイミドフェノキシ)−2,6−ビス(1,1−ジメチルエチル)ベンゼン]、4,4’−メチレン−ビス[1−(4−マレイミドフェノキシ)−2,6−ジ−s−ブチルベンゼン]、4,4’−シクロヘキシリデン−ビス[1−(4−マレイミドフェノキシ)−2−シクロヘキシルベンゼン]、4,4’−メチレンビス[1−(マレイミドフェノキシ)−2−ノニルベンゼン]、4,4’−(1−メチルエチリデン)−ビス[1−(マレイミドフェノキシ)−2,6−ビス(1,1−ジメチルエチル)ベンゼン]、4,4’−(2−エチルヘキシリデン)−ビス[1−(マレイミドフェノキシ)−ベンゼン]、4,4’−(1−メチルヘプチリデン)−ビス[1−(マレイミドフェノキシ)−ベンゼン]、4,4’−シクロヘキシリデン−ビス[1−(マレイミドフェノキシ)−3−メチルベンゼン]、2,2−ビス[4−(4−マレイミドフェノキシ)フェニル]プロパン、2,2−ビス[4−(4−マレイミドフェノキシ)フェニル]ヘキサフルオロプロパン、2,2−ビス[3−メチル−4−(4−マレイミドフェノキシ)フェニル]プロパン、2,2−ビス[3−メチル−4−(4−マレイミドフェノキシ)フェニル]ヘキサフルオロプロパン、2,2−ビス[3,5−ジメチル−4−(4−マレイミドフェノキシ)フェニル]プロパン、2,2−ビス[3,5−ジメチル−4−(4−マレイミドフェノキシ)フェニル]ヘキサフルオロプロパン、2,2−ビス[3−エチル−4−(4−マレイミドフェノキシ)フェニル]プロパン、2,2−ビス[3−エチル−4−(4−マレイミドフェノキシ)フェニル]ヘキサフルオロプロパン、ビス[3−メチル−(4−マレイミドフェノキシ)フェニル]メタン、ビス[3,5−ジメチル−(4−マレイミドフェノキシ)フェニル]メタン、ビス[3−エチル−(4−マレイミドフェノキシ)フェニル]メタン、3,8−ビス[4−(4−マレイミドフェノキシ)フェニル]−トリシクロ−[5,2,1,02.6]デカン、4,8−ビス[4−(4−マレイミドフェノキシ)フェニル]−トリシクロ−[5,2,1,02.6]デカン、3,9−ビス[4−(4−マレイミドフェノキシ)フェニル]−トリシクロ−[5,2,1,02.6]デカン、4,9−ビス[4−(4−マレイミドフェノキシ)フェニル]−トリシクロ−[5,2,1,02.6]デカン、1,8−ビス[4−(4−マレイミドフェノキシ)フェニル]メンタン、1,8−ビス[3−メチル−4−(4−マレイミドフェノキシ)フェニル]メンタン、及び1,8−ビス[3,5−ジメチル−4−(4−マレイミドフェノキシ)フェニル]メンタンが挙げられる。これらは単独で又は2種以上を組み合わせて使用することができる。
表1に示す各成分を、表に示す固形分の配合比(質量基準)で混合し、感光性樹脂組成物溶液を得た。表中、樹脂(1)は、メタクリル酸、メタクリル酸メチル及びアクリル酸ブチルの共重合体であるカルボキシル基含有アクリルポリマーである。樹脂(1)の重量平均分子量は100000であり、酸価は110mgKOH/gである。
(a)成分
・酸変性したエポキシアクリレート化合物:日本化薬社製「ZFR−1516」(サンプル名)
(b)成分
・ジペンタエリスリトールヘキサアクリレート:日本化薬社製「DPHA」(商品名)
・ビスフェノールAポリオキシエチレンジメタクリレート:日立化成工業社製「FA−321M」(商品名)
(c)成分
・2−メチル−1−[4−(メチルチオ)フェニル]−2−モルフォリノプロパン−1−オン:チバ・スペシャルティ・ケミカルズ社製「I−907」(商品名)
・1,7−ビス(9−アクリジニルヘプタン):ADEKA社製「N−1717」(商品名)
・ビス(2,4,6−トリメチルベンゾイル)フェニルフォスフィンオキサイド:チバ・スペシャルティ・ケミカルズ社製「I−819」(商品名)
・2−ベンジル−2−ジメチルアミノ−1−(4−モルフェリノフェニル)−ブタノン−1:チバ・スペシャルティ・ケミカルズ社製「I−369」(商品名)
(d)成分
・2,4−ジエチルチオキサントン:日本化薬社製「DETX」(商品名)
・1−フェニル−2−(O−エトキシカルボニル)オキシイミノプロパン−1−オン:WARD BLEKINSOP社製「PDO」(商品名)
・1,3−ジフェニルプロパントリオン−2−(O−エトキシカルボニル)オキシム:「TKOE」(商品名)
・9−フェニルアクリジン:新日鐵化学社製「9−PA」(商品名)
・7−ジエチルアミノ−4−メチルクマリン:アクロス社製「C1」(商品名)
・N,N’−ジエチルアミノベンゾフェノン:保土谷化学工業(株)製「EAB」(商品名)
(e)成分
・ビスマレイミド:大和化成社製「BMI−4000」(商品名)
その他
硬化剤:ジシアンジアミド
希釈剤:メチルエチルケトン
得られた感光性樹脂組成物溶液を、支持体上に均一に塗布し、熱風対流式乾燥機を用いて100℃で10分間乾燥して、感光層を形成した。厚さ16μmのポリエチレンテレフタレートフィルム(帝人社製「G2−16」、商品名)を支持体として用いた。形成された感光層の厚さは25μmであった。
上記で得られた感光性フィルムから支持体を剥離し、支持体と接していた側の感光層の表面(塗膜表面)に指を軽く押し付け、塗膜表面の指に対する張り付き度合いを調べる試験を行なった。以下の基準で塗膜性を評価した。評価結果を表2に示す。
「A」:指に対する張り付きが認められないか、又はほとんど認められない。
「B」:指に対する張り付きが認められる。
ガラス布基材にエポキシ樹脂を含浸して形成された絶縁層と、その両面に積層された厚さ18μmの銅箔とを有する両面銅張積層板(日立化成工業(株)製「MCL−E−679FG」、商品名)の両面を、研磨機によって研磨した。研磨機として、#600相当のブラシを持つ三啓(株)製の研磨機を用いた。研磨された両面銅張積層板の両方の表面を水洗し、空気流で乾燥した。
作製した感光性フィルムを、上述のラミネータにより研磨された銅張積層板に熱圧着後、キセノンランプを光源としてプリズムにより320nm〜600nmの波長域で分光した光を2〜30分間露光し、その後1%炭酸ナトリウム水溶液で現像した。得られたレジストパターンから分光感光曲線を読み取り、i線露光域の365nm及びh線露光域の405nmにおけるピーク強度(S365、S405)を求めた。求めたピーク強度から分光感度比S365/S405を算出した。結果を表2に示す。表中、「A」は分光感度比が0.9〜1.4の範囲内にあったことを意味する。
上記で得られた永久マスクレジストパターンの断面を観察し、その形状を以下の基準で評価した。結果を表2に示す。
「A」:ストレートからテーパ形状であるもの
「B」:オーバーハング、アンダーカットの発生が認められるもの
上述の配線基板において露出している銅箔上に、市販の無電解ニッケル/金めっき液を用いて、ニッケルめっき厚5μm、金めっき厚0.1μmとなるようにめっき層を形成させた。その後、永久マスクレジストパターンの外観を観察し、以下の基準で評価した。結果を表2に示す。
「A」:永久マスクレジストパターンに白化が認められないもの
「B」:永久マスクレジストパターンに白化が認められるもの
作製した感光性フィルムを室温(23℃)で20日間放置した後、これを用いて上述の「解像性」の評価の際と同様の操作で永久マスクレジストパターンを形成した。形成された永久マスクレジストパターンを実体顕微鏡で観察し、以下の基準で保管安定性を判定した。結果を表2に示す。
「A」:未露光部分に樹脂残りがないもの
「B」:未露光部分に樹脂残りがあるもの
Claims (7)
- (a)カルボキシル基及びエチレン性不飽和基を有する感光性プレポリマーと、
(b)エチレン性不飽和基を有する光重合性モノマーと、
(c)光重合開始剤と、
(d)増感剤と、を含有し、
365nmにおける感度の405nmにおける感度に対する比が0.9〜1.4であるような分光感度を有する、感光性樹脂組成物。 - 前記増感剤が、370〜400nmの極大吸収波長を有するチオキサントン系化合物を含む、請求項1記載の感光性樹脂組成物。
- (e)熱硬化性成分を更に含有する、請求項1記載の感光性樹脂組成物。
- 前記熱硬化性成分が、2以上のマレイミド基を有するマレイミド化合物を含む、請求項3記載の感光性樹脂組成物。
- (f)顔料を更に含有する、請求項1記載の感光性樹脂組成物。
- 前記顔料が紫外領域に吸収を有する、請求項5記載の感光性樹脂組成物。
- 支持体と、該支持体上に形成された請求項1〜6のいずれか一項に記載の感光性樹脂組成物からなる感光層と、を備える感光性フィルム。
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