JP2008117951A - Electronic part mounting apparatus - Google Patents

Electronic part mounting apparatus Download PDF

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Publication number
JP2008117951A
JP2008117951A JP2006299930A JP2006299930A JP2008117951A JP 2008117951 A JP2008117951 A JP 2008117951A JP 2006299930 A JP2006299930 A JP 2006299930A JP 2006299930 A JP2006299930 A JP 2006299930A JP 2008117951 A JP2008117951 A JP 2008117951A
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orthogonal robot
electronic component
mounting apparatus
main body
unit
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JP4670795B2 (en
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Jun Yamauchi
純 山内
Naohito Koketsu
尚人 纐纈
Shuzo Yagi
周蔵 八木
Yoichi Tanaka
陽一 田中
Minoru Murakami
稔 村上
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic part mounting apparatus which achieves plug and play when in the model change of an orthogonal robot by making the orthogonal robot a block kit. <P>SOLUTION: An orthogonal robot unit 5 in which the orthogonal robot and a driver 13 to control the drive of the orthogonal robot 5 is formed into the block kit is made to be separable to the main body of the electronic part mounting apparatus, by a main controller 21 equipped in the main body, the model of the orthogonal robot is identified from the ID information memorized in a memory portion equipped in the orthogonal robot unit 5, a control command is transmitted to the driver 13 based on a control program corresponding to the model concerned. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、直交ロボットを備えた電子部品実装装置に関するものである。   The present invention relates to an electronic component mounting apparatus including an orthogonal robot.

実装分野においては、作業面に対し実装ヘッドを水平移動させる機構を備えた電子部品実装装置が広く用いられている。この水平移動機構としては、実装ヘッドを第1の方向に移動させる第1の直動装置と、第1の直動装置を第1の方向と直交する第2の方向に移動させる第2の直動装置とで構成された直交ロボットが広く用いられ、第1の直動装置と第2の直動装置のそれぞれの延長を直交する2辺とした矩形平面内で実装ヘッドが移動自在となっている(特許文献1参照)。
特許第2740682号公報
In the mounting field, electronic component mounting apparatuses having a mechanism for horizontally moving a mounting head with respect to a work surface are widely used. The horizontal movement mechanism includes a first linear motion device that moves the mounting head in a first direction and a second linear motion that moves the first linear motion device in a second direction orthogonal to the first direction. An orthogonal robot composed of a moving device is widely used, and the mounting head can move within a rectangular plane in which the extensions of the first linear moving device and the second linear moving device are two orthogonal sides. (See Patent Document 1).
Japanese Patent No. 2740682

近年、電子部品実装装置の機能向上を図るため、実装ヘッドや直交ロボット等をユーザーの使用形態に対応した機種に交換可能にしてカスタマイズに柔軟に対応することが求められている。特に近年の高密度実装化の流れを受け、従来の送りねじ機構を駆動機構とする直交ロボットからリニアモータ機構を駆動機構とする直交ロボットへの交換の要請が強い。しかしながら、従来の電子部品実装装置では、直交ロボットの交換を視野に入れた設計を行っていなかったため、直交ロボットの駆動をコントロールするドライバが直交ロボット本体とは別体となっており、交換時の機械的な変更のみならず電気的な設定の変更に手間がかかるとともに交換前の直交ロボットを単体でエージングすることができなかった。   In recent years, in order to improve the functions of an electronic component mounting apparatus, it is required that the mounting head, the orthogonal robot, and the like can be exchanged for a model corresponding to the user's usage mode and flexibly cope with customization. In particular, in response to the recent trend toward high-density mounting, there is a strong demand for replacement of a conventional orthogonal robot that uses a feed screw mechanism as a drive mechanism to an orthogonal robot that uses a linear motor mechanism as a drive mechanism. However, since the conventional electronic component mounting apparatus was not designed with a view to replacing the orthogonal robot, the driver for controlling the driving of the orthogonal robot is separate from the orthogonal robot main body. It took time to change not only the mechanical changes but also the electrical settings, and the orthogonal robot before the replacement could not be aged alone.

そこで本発明は、直交ロボットをブロックキット化することで直交ロボットの機種交換の際のプラグ&プレイを実現した電子部品実装装置を提供することを目的とする。   Accordingly, an object of the present invention is to provide an electronic component mounting apparatus that realizes plug and play when changing the model of an orthogonal robot by making the orthogonal robot into a block kit.

請求項1記載の電子部品実装装置は、実装ヘッドを平面移動させる直交ロボットを本体部に備えた電子部品実装装置であって、前記直交ロボットと前記直交ロボットの駆動をコントロールするドライバとをブロックキット化した直交ロボットユニットを前記本体部に対して分離可能にした。   The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus includes an orthogonal robot that moves a mounting head in a plane on a main body, and includes a block kit that includes a driver for controlling the driving of the orthogonal robot and the orthogonal robot. The orthogonal robot unit made into a separable body can be separated from the main body.

請求項2記載の電子部品実装装置は、請求項1に記載の電子部品実装装置であって、前記直交ロボットユニットに前記直交ロボットのID情報を記憶する記憶部をさらに備え、前記本体部に前記ID情報から前記直交ロボットの機種を識別し、当該機種に対応する制御プログラムに基づいて前記ドライバに制御指令を送信するメインコントローラをさらに備えた。   The electronic component mounting apparatus according to claim 2 is the electronic component mounting apparatus according to claim 1, further comprising a storage unit that stores ID information of the orthogonal robot in the orthogonal robot unit, and the main body unit includes the storage unit. The apparatus further includes a main controller that identifies a model of the orthogonal robot from the ID information and transmits a control command to the driver based on a control program corresponding to the model.

本発明によれば、直交ロボットをブロックキット化することで直交ロボットの機種交換の際のプラグ&プレイを実現することができる。   According to the present invention, plug-and-play when changing the model of the orthogonal robot can be realized by making the orthogonal robot into a block kit.

本発明の実施の形態について図面を参照して説明する。図1は本実施の形態の電子部品実装装置の斜視図、図2は本実施の形態の電子部品実装装置の分解斜視図、図3は本実施の形態の電子部品実装装置の制御系の構成図である。   Embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of the electronic component mounting apparatus of the present embodiment, FIG. 2 is an exploded perspective view of the electronic component mounting apparatus of the present embodiment, and FIG. 3 is a configuration of a control system of the electronic component mounting apparatus of the present embodiment. FIG.

最初に、電子部品実装装置の構成および動作について説明する。図1において電子部品実装装置1は、基台2に設けられた基板搬送装置3、電子部品供給装置4、直交ロボットユニット5と、直交ロボットユニット5に設けられた撮像装置6、実装ヘッド7とで構成されている。基台2の上面は水平面をなす作業面2aとなっており、この作業面2a上で実装作業が行われる。基板搬送装置3は、基板8をX方向に搬送する機能を有するとともに作業面2a上の所定の位置に保持する機能を有し、実装前の基板8を電子部品実装装置1に搬入し、実装中は所定の位置で保持した状態を維持し、実装後は基板8の保持を解除して電子部品実装装置1から搬出する。なお、以下の説明において、基板8の搬送方向をX方向とし、これに水平面内で直交する方向をY方向とする。電子部品供給装置4は、内部に収納した複数の電子部品を所定の個数ずつ所定の姿勢で外部に供給する機能を有し、基板搬送装置3のY方向における両側方に複数個ずつ配置されている。   First, the configuration and operation of the electronic component mounting apparatus will be described. In FIG. 1, an electronic component mounting apparatus 1 includes a substrate transfer device 3, an electronic component supply device 4, an orthogonal robot unit 5 provided on a base 2, an imaging device 6 provided on the orthogonal robot unit 5, and a mounting head 7. It consists of The upper surface of the base 2 is a work surface 2a that forms a horizontal plane, and a mounting operation is performed on the work surface 2a. The substrate transport device 3 has a function of transporting the substrate 8 in the X direction and a function of holding the substrate 8 at a predetermined position on the work surface 2a. The substrate 8 before mounting is loaded into the electronic component mounting apparatus 1 and mounted. The inside is maintained in a predetermined position, and after mounting, the substrate 8 is released from the electronic component mounting apparatus 1 after being mounted. In the following description, the transport direction of the substrate 8 is the X direction, and the direction perpendicular to the substrate 8 in the horizontal plane is the Y direction. The electronic component supply device 4 has a function of supplying a predetermined number of electronic components accommodated therein in a predetermined posture to the outside, and a plurality of electronic component supply devices 4 are arranged on both sides in the Y direction of the substrate transfer device 3. Yes.

直交ロボットユニット5は、撮像装置6および実装ヘッド7を作業面2aおよび電子部品供給装置4の上方で作業面2aと平行に平面移動させ、撮像装置6および実装ヘッド7を任意の位置に位置決めする機能を有している。実装ヘッド7には電子部品を吸着するノズル9が設けられており、ノズル9は電子部品供給装置4から供給される電子部品を吸着して基板8に設定された実装箇所に実装する。電子部品の実装に際しては、撮像装置6により基板8の実装箇所を撮像し、ノズル9と実装箇所の位置関係を認識することで、両者の正確な位置合わせを実現している。   The orthogonal robot unit 5 moves the imaging device 6 and the mounting head 7 in a plane parallel to the work surface 2a above the work surface 2a and the electronic component supply device 4, and positions the imaging device 6 and the mounting head 7 at arbitrary positions. It has a function. The mounting head 7 is provided with a nozzle 9 that sucks an electronic component. The nozzle 9 sucks the electronic component supplied from the electronic component supply device 4 and mounts it on a mounting location set on the substrate 8. When mounting the electronic components, the mounting position of the substrate 8 is imaged by the imaging device 6 and the positional relationship between the nozzle 9 and the mounting position is recognized, thereby realizing an accurate alignment of both.

図2において、直交ロボットユニット5は、第1の直動装置10、第2の直動装置11、支持ブロック12、XYドライバ13で構成され、電子部品実装装置1の本体部に対して分離可能に独立したユニットを形成している。なお、本体部とは、電子部品実装装置1を構成する各要素のうち直交ロボットユニット5を除いた部分をいう。第1の直動装置10は、Y方向に延伸された第1のガイド14と、このガイド14に沿って摺動するガイドブロック15を備えた第1のスライダ16を備え、第1のスライダ16をY方向に移動させる機能を有する。同様に、第2の直動装置11は、X方向に延伸された第2のガイド17と、このガイド17に沿って摺動するガイドブロック18を備えた第2のスライダ19を備え、第2のスライダ19をX方向に移動させる機能を有する。第1のスライダ16には第2の直動装置11の一端が支持されている。   In FIG. 2, the orthogonal robot unit 5 includes a first linear motion device 10, a second linear motion device 11, a support block 12, and an XY driver 13, and can be separated from the main body of the electronic component mounting device 1. Independent units are formed. The main body refers to a portion excluding the orthogonal robot unit 5 among the elements constituting the electronic component mounting apparatus 1. The first linear motion device 10 includes a first slider 14 including a first guide 14 that extends in the Y direction and a guide block 15 that slides along the guide 14. Has a function of moving the lens in the Y direction. Similarly, the second linear motion device 11 includes a second guide 17 that includes a second guide 17 that extends in the X direction, and a guide block 18 that slides along the guide 17. The slider 19 has a function of moving in the X direction. One end of the second linear motion device 11 is supported on the first slider 16.

第1のスライダ16および第2のスライダ19をそれぞれY方向およびX方向に移動させる移動手段としては、送りねじ機構やリニアモータ機構(ともに図示せず)が用いられ、これらの機構の駆動をXYドライバ13によりコントロールすることで、第2のスライダ19に装着された撮像装置6および実装ヘッド7を作業面2aおよび電子部品供給装置4の上方の任意の位置に位置決めすることができる。   As the moving means for moving the first slider 16 and the second slider 19 in the Y direction and the X direction, respectively, a feed screw mechanism or a linear motor mechanism (both not shown) are used. By controlling with the driver 13, the imaging device 6 and the mounting head 7 mounted on the second slider 19 can be positioned at arbitrary positions above the work surface 2 a and the electronic component supply device 4.

第1の直動装置10および第2の直動装置11は、下部が水平面をなす支持ブロック12の上部に設置されている。基台2の側方には上部が水平面をなす架台20が設けられている。直交ロボットユニット5を電子部品実装装置1の本体部に装着する際には、支持ブロック12を架台20に載置すると、第1の直動装置10および第2の直動装置11が作業面2aより上方に位置するようになっている(図1参照)。また、支持ブロック12を架台20に載置すると、支持ブロック12に内蔵されたXYドライバ13と基台2に内蔵された本体制御部21が電気的に接続され、直交ロボットユニット5を含む電子部品実装装置1全体の動作制御を本体制御部21が司るように構成されている。   The 1st linear motion apparatus 10 and the 2nd linear motion apparatus 11 are installed in the upper part of the support block 12 in which the lower part makes a horizontal surface. On the side of the base 2 is provided a gantry 20 whose upper part forms a horizontal plane. When the orthogonal robot unit 5 is mounted on the main body of the electronic component mounting apparatus 1, when the support block 12 is placed on the mount 20, the first linear motion device 10 and the second linear motion device 11 are moved to the work surface 2a. It is located further upward (see FIG. 1). Further, when the support block 12 is placed on the gantry 20, the XY driver 13 built in the support block 12 and the main body control unit 21 built in the base 2 are electrically connected, and the electronic component including the orthogonal robot unit 5 is connected. The main body control unit 21 is configured to control the operation of the entire mounting apparatus 1.

次に、電子部品実装装置の制御系の構成について説明する。図3において、本体制御部21は、基板搬送装置3、電子部品供給装置4、撮像装置6、実装ヘッド7および直交ロボットユニット5を含む電子部品実装装置1全体の動作制御を司るメインコートローラの
役割を担っている。記憶部22には制御プログラム、電子部品供給装置4の機種や個数、各電子部品供給装置4に収納された電子部品の品種等に関するデータ等が記憶されており、本体制御部21は制御プログラムやこれらのデータに基づいて電子部品実装装置1全体の動作制御を行う。入出力部23は、オペレータと電子部品実装装置1の間で各種情報の授受を仲介する。
Next, the configuration of the control system of the electronic component mounting apparatus will be described. In FIG. 3, the main body control unit 21 is a main coat roller that controls the operation of the entire electronic component mounting apparatus 1 including the substrate transfer device 3, the electronic component supply device 4, the imaging device 6, the mounting head 7, and the orthogonal robot unit 5. Have a role. The storage unit 22 stores a control program, the model and number of electronic component supply devices 4, data on the types of electronic components stored in each electronic component supply device 4, and the like. Based on these data, operation control of the entire electronic component mounting apparatus 1 is performed. The input / output unit 23 mediates exchange of various information between the operator and the electronic component mounting apparatus 1.

直交ロボットユニット5には、本体制御部21と電気的に接続される中継部24が設けられ、中継部24はそれぞれ実装ヘッド7、XYドライバ13、記憶部25と接続されている。記憶部25には、第1の直動装置10および第2の直動装置11で構成される直交ロボットの機種や第2のスライダ19に装着される実装ヘッド7の機種を識別するためのID情報が記憶されている。例えば、直交ロボットには移動スパンや移動手段が異なる多機種のものがあり、実装ヘッド7にはノズル9の数や配列が異なる多機種のものがあり、任意の機種のものを本体部に選択的に装着することができる。直交ロボットユニット5と本体部との電気的な接続は、本体制御部21と中継部24との間に介されたコネクタ26のみで行われているので、直交ロボットユニット5を本体部に着脱する際の接離が容易である。   The orthogonal robot unit 5 includes a relay unit 24 that is electrically connected to the main body control unit 21, and the relay unit 24 is connected to the mounting head 7, the XY driver 13, and the storage unit 25, respectively. The storage unit 25 has an ID for identifying the model of the orthogonal robot composed of the first linear motion device 10 and the second linear motion device 11 and the model of the mounting head 7 mounted on the second slider 19. Information is stored. For example, there are many types of orthogonal robots with different moving spans and moving means, and there are many types of mounting heads 7 with different numbers and arrangements of nozzles 9, and any model is selected as the main body. Can be installed. Since the orthogonal robot unit 5 and the main body are electrically connected only by the connector 26 interposed between the main body control unit 21 and the relay unit 24, the orthogonal robot unit 5 is attached to and detached from the main body. Easy contact and separation.

本体制御部21は、本体部に装着された直交ロボットユニット5の記憶部25に記憶されたID情報から直交ロボットや実装ヘッド7の機種を識別し、当該機種に対応する制御プログラムに基づいて実装ヘッド7やXYドライバ13を始め各要素に制御指令を送信し、電子部品実装装置1の最適な動作制御を行う。なお、直交ロボットや実装ヘッド7の機種毎に対応する制御プログラムが予め記憶部22に記憶されており、本体制御部21は、直交ロボットユニット5の記憶部25に記憶されたID情報を照合して対応する制御プラグラムを選択的に使用する。   The main body control unit 21 identifies the model of the orthogonal robot and the mounting head 7 from the ID information stored in the storage unit 25 of the orthogonal robot unit 5 mounted on the main body unit, and is mounted based on a control program corresponding to the model. A control command is transmitted to each element including the head 7 and the XY driver 13, and optimal operation control of the electronic component mounting apparatus 1 is performed. A control program corresponding to each model of the orthogonal robot and the mounting head 7 is stored in the storage unit 22 in advance, and the main body control unit 21 collates the ID information stored in the storage unit 25 of the orthogonal robot unit 5. The corresponding control program is selectively used.

直交ロボットユニット5は、それ自体にXYドライバ13を内蔵し、ブロックキット化されているので、電子部品実装装置1の本体部から分離した状態であっても、PC等のコントローラに接続して通電することで駆動させることができる。そのため、機種交換前の直交ロボットを単体で駆動させてエージングすることが可能となり、十分にエージングされて即時使用可能になった直交ロボットユニット5を用いた実装動作を行うことができる。また、機種交換時の電気的な設定の変更についても、コネクタ26を接続するだけでよく、交換後の直交ロボットに関するID情報が自動的に照合されるので、短時間かつ容易に交換作業を行うことができる。   Since the orthogonal robot unit 5 has a built-in XY driver 13 and is a block kit, it is connected to a controller such as a PC and energized even when separated from the main body of the electronic component mounting apparatus 1. By doing so, it can be driven. Therefore, the orthogonal robot before the model exchange can be driven and aged alone, and the mounting operation using the orthogonal robot unit 5 that has been sufficiently aged and can be used immediately can be performed. Also, the electrical settings can be changed at the time of model replacement by simply connecting the connector 26, and the ID information regarding the orthogonal robot after the replacement is automatically verified, so that the replacement work can be performed in a short time and easily. be able to.

このように、本実施の形態の電子部品実装装置によれば、直交ロボットをブロックキット化することで直交ロボットの機種交換の際のプラグ&プレイを実現することができ、ユーザーの使用形態に対応したカスタマイズに柔軟に対応することができる。   As described above, according to the electronic component mounting apparatus of the present embodiment, it is possible to realize plug and play when changing the model of the orthogonal robot by making the orthogonal robot into a block kit, which corresponds to the usage form of the user. It is possible to respond flexibly to customized customization.

本発明によれば、直交ロボットをブロックキット化することで直交ロボットの機種交換の際のプラグ&プレイを実現することができるという利点を有し、電子部品の実装分野において有用である。   According to the present invention, the orthogonal robot is formed into a block kit, which has the advantage that plug and play when changing the model of the orthogonal robot can be realized, and is useful in the field of mounting electronic components.

本実施の形態の電子部品実装装置の斜視図The perspective view of the electronic component mounting apparatus of this Embodiment 本実施の形態の電子部品実装装置の分解斜視図The exploded perspective view of the electronic component mounting apparatus of this Embodiment 本実施の形態の電子部品実装装置の制御系の構成図Configuration diagram of control system of electronic component mounting apparatus according to the present embodiment

符号の説明Explanation of symbols

1 電子部品実装装置
2a 作業面
5 直交ロボットユニット
7 実装ヘッド
8 基板
10 第1の直動装置
11 第2の直動装置
13 XYドライバ
21 本体制御部
25 記憶部
DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2a Work surface 5 Orthogonal robot unit 7 Mounting head 8 Board | substrate 10 1st linear motion apparatus 11 2nd linear motion apparatus 13 XY driver 21 Main body control part 25 Memory | storage part

Claims (2)

実装ヘッドを平面移動させる直交ロボットを本体部に備えた電子部品実装装置であって、
前記直交ロボットと前記直交ロボットの駆動をコントロールするドライバとをブロックキット化した直交ロボットユニットを前記本体部に対して分離可能にした電子部品実装装置。
An electronic component mounting apparatus having a main body unit with an orthogonal robot that moves a mounting head in a plane
An electronic component mounting apparatus in which an orthogonal robot unit in which the orthogonal robot and a driver for controlling driving of the orthogonal robot are made into a block kit is separable from the main body.
前記直交ロボットユニットに前記直交ロボットのID情報を記憶する記憶部をさらに備え、前記本体部に前記ID情報から前記直交ロボットの機種を識別し、当該機種に対応する制御プログラムに基づいて前記ドライバに制御指令を送信するメインコントローラをさらに備えた請求項1に記載の電子部品実装装置。   The orthogonal robot unit further includes a storage unit that stores ID information of the orthogonal robot, the main body unit identifies the model of the orthogonal robot from the ID information, and the driver is based on a control program corresponding to the model. The electronic component mounting apparatus according to claim 1, further comprising a main controller that transmits a control command.
JP2006299930A 2006-11-06 2006-11-06 Electronic component mounting equipment Active JP4670795B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010166062A (en) * 2007-05-03 2010-07-29 Siemens Electronics Assembly Systems Gmbh & Co Kg Automatic mounting apparatus for mounting electrical and/or optical component on substrate
WO2020110286A1 (en) * 2018-11-30 2020-06-04 株式会社Fuji Unit management device and unit management method

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JPH0551586U (en) * 1991-12-13 1993-07-09 株式会社東芝 robot
JP2003110292A (en) * 2001-09-28 2003-04-11 Matsushita Electric Ind Co Ltd Component mounting head, and device and method for mounting electronic component
JP2004281717A (en) * 2003-03-17 2004-10-07 Fuji Mach Mfg Co Ltd Working system for substrate and component control program used therefor

Patent Citations (3)

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JPH0551586U (en) * 1991-12-13 1993-07-09 株式会社東芝 robot
JP2003110292A (en) * 2001-09-28 2003-04-11 Matsushita Electric Ind Co Ltd Component mounting head, and device and method for mounting electronic component
JP2004281717A (en) * 2003-03-17 2004-10-07 Fuji Mach Mfg Co Ltd Working system for substrate and component control program used therefor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010166062A (en) * 2007-05-03 2010-07-29 Siemens Electronics Assembly Systems Gmbh & Co Kg Automatic mounting apparatus for mounting electrical and/or optical component on substrate
JP2010526447A (en) * 2007-05-03 2010-07-29 ジーメンス エレクトロニクス アセンブリー システムズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフト Automatic mounting device for mounting electrical and / or optical components on a substrate
JP4814395B2 (en) * 2007-05-03 2011-11-16 エーエスエム アセンブリー システムズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフト Automatic mounting device for mounting electrical and / or optical components on a substrate
WO2020110286A1 (en) * 2018-11-30 2020-06-04 株式会社Fuji Unit management device and unit management method
JPWO2020110286A1 (en) * 2018-11-30 2021-09-27 株式会社Fuji Unit management device and unit management method

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