JP2008117121A - Method for arranging bonding pad and computer program therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for arranging bonding pads that uses an automatic arithmetic process to achieve a process for combining bonding pads that can be combined on the base surface of a virtual plane into one bonding pad, and a computer program therefor. <P>SOLUTION: The method for arranging bonding pads includes a step for grouping temporarily arranged pads into groups such that the pads that can be combined to each other belong in the same group; a step for rearranging the temporarily arranged pads while unchanging the order of arrangement of the pads on the line nearest to the center of a base so that the pads are arranged in the same line within each group; and a step for rearranging pads of the line to be rearranged into a preset order, and then rearranging the other pads that belong in the same group as the pads on the line to be rearranged, in such a way that while the order of arrangement of the bonding pads already rearranged is unchanged, the pads are arranged in the same line as the pads on the line to be rearranged. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a bonding pad arrangement method for automatically designing the arrangement of bonding pads on a substrate surface on a virtual plane, and a computer program for causing a computer to execute this bonding pad arrangement process.

  In semiconductor packages such as PBGA and EBGA, the electrode terminals of the semiconductor chip and the bonding pads of the substrate are wired with wires and are electrically connected to each other. In recent years, there is an example in which a plurality of semiconductor chips are mounted on one semiconductor package, and such a semiconductor package is also called a multichip module. In a multichip module, a plurality of semiconductor chips to be mounted are stacked (stacked) on each other (see, for example, Patent Document 1).

  FIG. 19 is a side view schematically illustrating a semiconductor package in which a plurality of semiconductor chips are arranged in an overlapping manner. In the illustrated example, two semiconductor chips 52 -A and 52 -B are arranged on a substrate 51 so as to be stacked in a stepped manner. Signal lines (wires) 55 are routed from the electrode terminals 53 of the semiconductor chips 52-A and 52-B to the bonding pads 54 on the substrate 51, respectively.

  FIG. 20 is a top view schematically illustrating a semiconductor package in which a plurality of semiconductor chips are stacked and arranged. Generally, when one semiconductor chip is arranged in a semiconductor package, one row of bonding pads is arranged on the substrate, but when a plurality of semiconductor chips are stacked (stacked) on the semiconductor package, each semiconductor chip is arranged. Corresponding to this, a plurality of rows of bonding pads are arranged along the side direction of the substrate. In the example shown in FIG. 20, three semiconductor chips 52 -A, 52 -B, and 52 -C are arranged on a substrate 51 so as to be stacked in a stepped manner. Signal lines (wires) 55 are routed from the electrode terminals of the semiconductor chips 52-A, 52-B and 52-C to the bonding pads on the substrate 51, respectively. Corresponding to each of the semiconductor chips 52-A, 52-B and 52-C, a plurality of bonding pad rows 54-A, 54-B and 54-C are arranged along the side direction of the substrate. Therefore, in general, in a multichip module, bonding pads are arranged in a substantially matrix on the substrate surface.

  In a semiconductor package in which a plurality of semiconductor chips are overlaid, a bonding pad that is a connection destination of a signal line from an electrode terminal of a semiconductor chip and a connection destination of a signal line from an electrode terminal of another semiconductor chip If the bonding pads coincide with each other, if the bonding pads that are the connection destinations of these signal lines are combined and combined into one bonding pad, the substrate surface can be used effectively, and the mounting of the substrate Increases efficiency. FIG. 21 is a top view schematically illustrating the synthesis of bonding pads in a semiconductor package in which a plurality of semiconductor chips are stacked. In the illustrated example, two semiconductor chips 52 -A and 52 -B are arranged on a substrate 51 so as to be stacked in a stepped manner. For example, the signal line 55-A from the electrode terminal 53-A of the semiconductor chip 52-A and the signal line 55-B from the electrode terminal 53-B of the semiconductor chip 52-2 are the same signal or signals related to each other. If so, the two bonding pads to which the signal lines 55-A and 55-B are connected are combined to be combined into one bonding pad 54 ′.

JP 2000-164696 A

  22 to 24 are explanatory views illustrating a conventional bonding pad synthesizing method in a semiconductor package in which a plurality of semiconductor chips are arranged in an overlapping manner. As shown in FIG. 22, as an example, bonding pads (indicated by squares in the figure) corresponding to three semiconductor chips (not shown) stacked on each other in the direction from the center of the substrate toward the outer edge of the substrate. The same applies hereinafter.) 3 rows (represented by A row, B row and C row in the figure), and along the side direction of the substrate, in the A row, bonding pads are in the order of A1, A2 and A3. Consider the case where the bonding pads are arranged in the order of B1, B2, B3, B4, B5 and B6 in the B row, and the bonding pads are arranged in the order of C1, C2, C3, C4 and C5 in the C row.

  The bonding pads are manually synthesized by the designer himself using a CAD system, trial and error, relying on his skill, experience and intuition on a virtual plane. As described above, a plurality of bonding pads can be combined into one bonding pad when the signal lines from the respective semiconductor chips relate to the same signal or signals related to each other. The designer refers to the design data and the display screen of the CAD system. First, as shown in FIG. 22, the bonding pads that can be synthesized among the bonding pads temporarily arranged on the substrate on the virtual plane are connected to the net 56. Connect with and group. Bonding pads virtually connected by the same net 56 belong to the same group.

  Next, the bonding pads connected by the same net are combined to synthesize one bonding pad. Here, since the arrangement order of the bonding pads in the side direction of the board on the substrate is determined in advance by the design data, the arrangement order of the bonding pads synthesized is the same as the arrangement order of the bonding pads before synthesis. There must be. The conventional method of manually combining bonding pads depends on the skill and experience of the designer, so the number of combined bonding pads, the position of bonding pads on the substrate, and the bonding pad layout area on the substrate (That is, the total area including the area of the bonding pad itself and the area of the clearance portion between the bonding pads) and the like can be different even if the design data is the same for different designers. For example, the total of 14 bonding pads in FIG. 22 becomes 9 as shown in FIG. 23 due to the bonding pad synthesis process, or 14 in an extreme case as shown in FIG. Will remain. In the example shown in FIG. 23, the arrangement area of the bonding pads on the substrate is reduced in the direction from the center of the substrate toward the outer edge of the substrate as compared with the case of FIG. On the other hand, in the example shown in FIG. 24, the direction from the center of the substrate to the outer edge of the substrate is not different from the case of FIG. 22, but the side direction of the substrate is increased rather than the case of FIG.

  In the conventional method in which the designer himself / herself uses a CAD system while viewing the display screen as described above, the bonding pad that has been stored on the substrate surface before the synthesis may not fit on the substrate surface after the synthesis. . In such a case, the designer must redesign the synthetic bonding pad using the CAD system, and the designer's previous work is wasted. The manual method requires a great deal of labor and time, but redesign is an additional burden on the designer.

  In manual wiring design with trial and error as described above, the man-hours increase as the required design contents become more complicated, and it takes a lot of labor and time to achieve optimal wiring, and the difficulty level is also high. Increase. Furthermore, if the designer manually performs the compositing operation each time, mistakes are likely to occur and the quality of the finished product varies greatly.

  Therefore, in view of the above problems, an object of the present invention is to perform a process of combining a bonding pad that can be synthesized among bonding pads arranged on a substrate surface on a virtual plane to synthesize one bonding pad by an automatic calculation process by a computer. An object of the present invention is to provide a bonding pad arrangement method to be realized and a computer program for causing a computer to execute the bonding pad arrangement process.

In order to achieve the above object, according to the present invention, a bonding pad arrangement method in which an arithmetic processing unit automatically designs the arrangement of bonding pads on a substrate surface on a virtual plane,
A grouping step for grouping bonding pads temporarily arranged on a substrate surface on a virtual plane so that bonding pads that can be bonded to each other belong to the same group;
The row closest to the substrate center among the rows along the side direction of the substrate so that the temporarily arranged bonding pads are arranged in the same row along the direction from the substrate center to the substrate outer edge in each group. An initial step for rearranging the bonding pads positioned above, with the order fixed;
After the completion of the processing of the initial step, the bonding pads located on the column to be rearranged along the side direction of the substrate are rearranged in a preset order with respect to the side direction of the substrate. For bonding pads that belong to the same group as the bonding pads located above and are located on a row other than the row to be rearranged, the arrangement order of the bonding pads located on the row closest to the center of the substrate and The bonding pads that have already been rearranged so as to be in the preset order are fixed in order, and the bonding pads located on the row to be rearranged and along the direction from the substrate center to the outer edge of the substrate. A rearrangement step for rearranging to be arranged in the same column;
With
The arithmetic processing unit sequentially sets all columns after the column adjacent to the substrate outer edge side with respect to the column closest to the substrate center portion among the columns along the side direction of the substrate as columns to be rearranged, and the rearrangement step The process in is repeated.

  In this rearrangement step, the bonding pads are not arranged on the line along the direction from the substrate center part to which the bonding pads belonging to a group different from the group to which the bonding pad belongs belong to the substrate outer edge part.

According to the present invention, there is provided a computer program for causing a computer to execute a bonding pad arrangement process for automatically designing the arrangement of bonding pads on a substrate surface on a virtual plane.
A grouping step for grouping bonding pads temporarily arranged on a substrate surface on a virtual plane so that bonding pads that can be bonded to each other belong to the same group;
The row closest to the substrate center among the rows along the side direction of the substrate so that the temporarily arranged bonding pads are arranged in the same row along the direction from the substrate center to the substrate outer edge in each group. An initial step for rearranging the bonding pads positioned above, with the order fixed;
After the completion of the processing of the initial step, the bonding pads located on the column to be rearranged along the side direction of the substrate are rearranged in a preset order with respect to the side direction of the substrate. For bonding pads that belong to the same group as the bonding pads located above and are located on a row other than the row to be rearranged, the arrangement order of the bonding pads located on the row closest to the center of the substrate and The bonding pads that have already been rearranged so as to be in the preset order are fixed in order, and the bonding pads located on the row to be rearranged and along the direction from the substrate center to the outer edge of the substrate. A rearrangement step for rearranging to be arranged in the same column;
With
The processing of the rearrangement step is performed by sequentially setting all columns after the column adjacent to the substrate outer edge side with respect to the column closest to the substrate center among the columns along the side direction of the substrate as the columns to be rearranged, and the computer Is repeatedly executed.

More specifically, according to the present invention, a computer program for causing a computer to execute a bonding pad arrangement process for automatically designing the arrangement of bonding pads on a substrate surface on a virtual plane,
Of the bonding pads temporarily arranged on the substrate surface on the virtual plane, a net generation step for connecting bonding pads that can be bonded to each other with a net,
The bonding pads connected by the same net are positioned on the row closest to the substrate center among the rows along the side of the substrate so that they are arranged on the same row along the direction from the substrate center to the substrate outer edge. An initial step of rearranging the temporarily arranged bonding pads, with the arrangement order of the bonding pads to be fixed fixed;
After the completion of the processing of the initial step, the bonding pads located on the column to be rearranged along the side direction of the substrate are rearranged in a preset order with respect to the side direction of the substrate. With respect to bonding pads that are connected to the bonding pads that are located above and that are located on a row other than the row to be rearranged, the bonding pads that are located on the row closest to the center of the substrate. While the arrangement order of the bonding pads already rearranged so as to be in the arrangement order and the preset order is fixed, the bonding pads located on the row to be rearranged and heading from the substrate center to the outer edge of the substrate A rearrangement step for rearranging to be arranged in the same row along the direction;
With
The processing of the rearrangement step is performed by sequentially setting all columns after the column adjacent to the substrate outer edge side with respect to the column closest to the substrate center among the columns along the side direction of the substrate as the columns to be rearranged, and the computer Is repeatedly executed.

  In the rearrangement step, the bonding pads are not arranged on the line along the direction from the center of the substrate to which the bonding pad connected by a net different from the net connected to the bonding pad belongs to the outer edge of the substrate. .

  In addition, the computer program synthesizes one bonding pad by combining only bonding pads connected by a net along the direction from the center of the substrate toward the outer edge of the substrate after the completion of the rearranging step. Preferably further steps are provided.

  It should be obvious to those skilled in the art that a computer program that causes a computer to execute the above-described processing is stored in a recording medium.

  According to the present invention, in a bonding pad arrangement design of a semiconductor package in which a plurality of semiconductor chips are arranged, one bonding pad is synthesized by combining synthesizable bonding pads among bonding pads arranged on a substrate surface. Processing can be realized by automatic calculation processing by a computer.

  According to the present invention, since the process of synthesizing the bonding pads is realized by automatic calculation processing by a computer, the bonding pads can be combined without being influenced by the skill, experience, intuition, etc. of the designer as in the past. Thus, one bonding pad can be synthesized and placed on the substrate. The automatic calculation processing of the bonding pad arrangement process eliminates human error as in the prior art and eliminates variations in the quality of the finished product. Further, since the man-hours in the bonding pad layout design can be reduced, the working time of the designer is greatly shortened and the burden is also reduced. As a result, the manufacturing cost of the semiconductor package can also be reduced.

  A plurality of semiconductor chips arranged in the vicinity of the central portion on the substrate surface are generally rectangular. As shown in FIG. 20 or 21, chip pads are arranged in a row in the vicinity of the outline (that is, the outer edge portion) of each semiconductor chip, and the vicinity of the outline (ie, the outer edge portion) of the substrate surface corresponding to the chip pads arranged in the row. Bonding pads are arranged in a row. As described with reference to FIGS. 19 to 21, since a row of bonding pads along the side direction of the substrate is provided corresponding to each semiconductor chip superimposed on each other, the four rectangular sides of the semiconductor chip are provided. Correspondingly, bonding pads are arranged in a substantially matrix on each of the four sides of the outer edge of the substrate. The chip pads arranged in the same row are connected to a row of bonding pads corresponding to the chip pads arranged in the same row via signal lines (wires). That is, signal lines (wires) are routed from the center of the substrate toward the outer edge of the substrate on each of the four sides of the outer edge of the substrate.

  In the embodiments of the present invention described below, the present invention is applied to bonding pads arranged on each of the four sides of the outer edge portion of the substrate as described above. However, the bonding pad placement process is performed independently for each of the four sides of the outer edge portion of the substrate. Executed. In executing the bonding pad arrangement process according to the embodiment of the present invention, in the bonding pad row corresponding to each semiconductor chip, the bonding pads are temporarily arranged at the minimum pitch based on the design data. And Each temporarily placed bonding pad is assigned an identification number based on design data.

  FIG. 1 is a flowchart illustrating an operation flow of a bonding pad arrangement method according to an embodiment of the present invention.

  First, the arithmetic processing device (for example, a computer or a CAD system) is a bonding pad that can be bonded (may be bonded) to the bonding pads temporarily arranged on the substrate surface on the virtual plane in step S101. It is determined whether or not. As described above, in a semiconductor package in which a plurality of semiconductor chips are overlaid, a bonding pad to which a signal line is connected from an electrode terminal of a certain semiconductor chip and an electrode terminal of another semiconductor chip. When the bonding pads to which the signal lines are connected coincide with each other, the signal lines from the electrode terminals of the respective semiconductor chips are related to the same signal or signals related to each other, and the respective connection destinations of these respective signal lines Each bonding pad can be combined into a single bonding pad. That is, in step S101, by referring to existing design data, among the bonding pads temporarily arranged on the substrate surface on the virtual plane, the bonding pads to which the same signal line is connected can be bonded to each other. Judged to be a pad. If it is determined in step S101 that the bonding pads can be bonded to each other, the process proceeds to step S102, and if not, the process ends.

  Next, in step S102, the arithmetic processing unit determines that the bonding pads temporarily arranged on the substrate surface are determined to be bonded to each other in step S101 so that the bonding pads belong to the same group. Divide. Specifically, the arithmetic processing unit connects, via a net, bonding pads determined to be able to be bonded to each other among bonding pads temporarily arranged on the substrate surface on a virtual plane. Bonding pads virtually connected by the same net belong to the same group.

  Next, in step S103, the arithmetic processing unit arranges the bonding pads temporarily arranged on the substrate surface on the virtual plane in the same row along the direction from the center of the substrate toward the outer edge of the substrate in each group. The arrangement order of the bonding pads located on the line closest to the center of the substrate among the lines along the side direction of the substrate is rearranged while being fixed. Specifically, the arithmetic processing unit is configured so that the bonding pads connected by the same net on the virtual plane are arranged in the same row along the direction from the center of the substrate toward the outer edge of the substrate. The bonding pads temporarily arranged are rearranged while the arrangement order of the bonding pads located on the row closest to the center of the substrate is fixed. The process in step S103 is an initial process for the rearrangement process in the next step S104.

  Next, after the completion of the initial processing in step S103, the arithmetic processing unit, in step S104, for the bonding pads located on the column to be rearranged along the side direction of the substrate, in the order set in advance in the side direction of the substrate. For the bonding pads that are rearranged and belong to the same group as the bonding pads that are located on the column to be rearranged and that are located on a column other than the row to be rearranged, the row closest to the center of the substrate Bonding pads and substrates positioned on the rearranged row, with the arrangement order of bonding pads positioned above and the arrangement order of bonding pads already rearranged so as to be in a preset order fixed. Rearrange to align on the same line along the direction from the center to the outer edge of the board . Specifically, after completion of the initial processing in step S103, the arithmetic processing unit preliminarily stores the bonding pads located on the rearranged columns along the side direction of the substrate on the virtual plane in the side direction of the substrate. Sorting in the set order, and bonding pads located on columns other than the sorting target column connected to the bonding pads located on the sorting target column by the same net The arrangement order of the bonding pads located on the line closest to the center of the substrate and the arrangement order of the bonding pads that have been rearranged so as to be in the preset order are fixed on the line to be rearranged. Lined up in the same row along the direction from the center of the substrate to the outer edge of the substrate. Obtain.

  In step S105, the arithmetic processing unit performs the reordering process in step S104 on all columns after the column adjacent to the substrate outer edge side with respect to the column closest to the substrate center portion among the columns along the side direction of the substrate. It is determined whether it has been executed. That is, the rearrangement process in step S104 is performed by sequentially rearranging all columns after the column adjacent to the substrate outer edge side with respect to the column closest to the substrate center among the columns along the side direction of the substrate. And repeatedly executed.

  In step S106, the arithmetic processing unit is a net that intersects with other nets with respect to the bonding pads that have undergone the rearrangement process in steps S104 and S105, and is directed from the substrate center toward the substrate outer edge. It is determined whether or not there is a net along a direction other than. In step S106, an intersection is generated with a bonding pad that is determined to have a net along a direction other than the direction from the center of the substrate to the outer edge of the substrate that causes an intersection with another net, that is, another net. For the bonding pads connected by a net along a direction other than the direction from the center of the substrate toward the outer edge of the substrate, the combining process in step S107 is executed. On the other hand, for the bonding pads determined to have no net along the direction other than the direction from the center of the substrate where the intersection occurs to the outer edge of the substrate in step S106, the synthesis processing in step S108 is executed.

  In step S107, the arithmetic processing unit performs processing on the bonding pads connected by the net along the direction other than the direction from the central part of the substrate to the outer edge of the substrate that intersects with another net on the virtual plane. Only bonding pads arranged in the same row along the direction from the central portion toward the outer edge of the substrate are combined to synthesize one bonding pad.

  In step S108, the arithmetic processing unit is connected to each other with respect to the bonding pads determined to have no net along a direction other than the direction from the center of the substrate where the intersection occurs to the outer edge of the substrate on the virtual plane. Bonded bonding pads are combined to synthesize one bonding pad.

  By the processing of the above steps S107 and S108 by the arithmetic processing unit, only bonding pads connected by a net along the direction from the center of the substrate to the outer edge of the substrate are combined on the substrate surface on the virtual plane. Two bonding pads are synthesized.

  Each of the above steps S101 to S108 in the bonding pad arrangement process according to the embodiment of the present invention is realized as a process on a computer program executed by an arithmetic processing unit such as a computer or a CAD system. Before performing the process of step S101, the shape, coordinates (position), size and orientation of the bonding pad, wiring from the electrode terminal of the semiconductor chip to the bonding pad, and the coordinates of each via as necessary, Data relating to the shape, size, orientation, etc. is input in advance to the arithmetic processing unit that executes the bonding pad placement processing of this embodiment. The arithmetic processing unit starts processing from step S101 using the input data.

  Some specific examples of bonding pad synthesis are given below. As described above, a plurality of bonding pads can be combined into one bonding pad when the signal lines from the semiconductor chips are related to the same signal or signals related to each other. It is related to the processing on the virtual plane as described above, and it is assumed that a net is generated in advance by computer processing based on the design data, and the bonding pads are already grouped. The grouping process may be performed manually by the designer while viewing the display screen of the computer or CAD system.

  2 to 6 are diagrams illustrating a first specific example of the bonding pad arrangement process according to the embodiment of the present invention. In this specific example, as shown in FIG. 2, bonding pads (indicated by squares in the figure, the same applies hereinafter) are temporarily arranged in 3 rows and 5 columns on one side, for example, of the four sides of the outer edge of the substrate. Think about the case.

  As shown in FIG. 2, three semiconductor chips are arranged to overlap each other at the center of the substrate (not shown), and correspond to each semiconductor chip in a direction from the center of the substrate toward the outer edge of the substrate. Correspondingly, three rows of bonding pads are arranged (that is, row A, row B and row C). Identification numbers A1 to A5, B1 to B5, and C1 to C5 are assigned to the temporarily arranged bonding pads, respectively. As shown in FIG. 2, in the side direction of the substrate, the bonding pads are arranged in the order of A1, A2, A3, A4, and A5 in the A row, and the bonding pads are in the order of B1, B2, B3, B4, and B5 in the B row. In the C row, bonding pads are arranged in the order of C1, C2, C3, C4 and C5.

  In the example shown in FIG. 2, the bonding pads A1 and B1 can be combined into one bonding pad, the bonding pads B2 and C2 can be combined into one bonding pad, and the bonding pads A3 and B3 can be combined into one bonding pad. The bonding pads A4, B4 and C3 can be combined into one bonding pad, the bonding pads B5 and C4 can be combined into one bonding pad, and the bonding pads A5 and C5 can be combined into one bonding pad. Assuming that the pads can be synthesized, the bonding pads that can be coupled to each other are connected by the net 56 and already grouped.

  1, the bonding pads temporarily arranged as shown in FIG. 2 are connected in the same row along the direction from the center of the substrate toward the outer edge of the substrate. Rearrange the bonding pads A 1, A 2, A 3, A 4, and A 5 that are positioned on the A row, which is the row closest to the center of the substrate, out of the rows along the side direction of the substrate, while keeping the arrangement order fixed. As shown in FIG. That is, each group of bonding pads arranged in the order of “A1, A2, A3, A4, A5” in the side direction of the substrate in the row direction of the substrate in the row A is in the direction from the substrate center to the substrate outer edge, “A1, B1”, “A2”, “A3, B3”, “A4, B4, C3”, “A5, C5”, “B2, C2”, “B5, C4”, “C1”, etc. Sorted into a column.

  Next, among the columns A to C along the side direction of the substrate, the column B adjacent to the substrate outer edge side with respect to the column A closest to the center of the substrate is set as the column to be rearranged. The process of step S104 is executed. That is, in this process, the bonding pads arranged in the order of “B1, B3, B4, B2, B5” along the side direction of the substrate in the stage of FIG. 3 are previously stored in the side direction of the substrate as shown in FIG. The order is rearranged in the order of “B1, B2, B3, B4, B5”. In addition, on the columns other than the B column to be rearranged among the A columns to the C columns along the side direction of the substrate connected to the bonding pads located on the B row to be rearranged by the same net. The bonding pads that are positioned are rearranged so that the bonding pads are aligned on the same row along the direction from the center of the substrate toward the outer edge of the substrate. At this time, the arrangement order of the bonding pads on the A row, which is the row closest to the center of the substrate, remains fixed. Further, the bonding pads are not arranged on a line along the direction from the center of the substrate to the outer edge of the substrate to which the bonding pads connected by a net different from the net connected to the bonding pad belongs.

  More specifically, as shown in FIG. 4, the group of bonding pads “B2, C2” is such that the bonding pad B2 is located between the bonding pad B1 and the bonding pad B3, and that The order of the bonding pads is rearranged while being fixed. As a result, as shown in FIG. 4, the bonding pads shown in FIG. 3 are arranged in the order of “A1, A2, A3, A4, A5” in the substrate side direction of the bonding pads located on the A row. While being fixed, each group of bonding pads is moved in the direction from the center of the substrate toward the outer edge of the substrate, “A1, B1”, “A2”, “B2, C2”, “A3, B3”, “A4, B4”. , C3 "," A5, C5 "," B5, C4 "," C1 ", etc.

  Next, among the columns A to C along the side direction of the substrate, the column C adjacent to the substrate outer edge side with respect to the column B is set as a column to be rearranged, and the process of step S104 in FIG. 1 is performed. Execute. That is, in this process, the bonding pads arranged in the order of “C2, C3, C5, C4, C1” along the side direction of the substrate in the stage of FIG. 4 are previously set in the side direction of the substrate as shown in FIG. The order is rearranged in the order of “C1, C2, C3, C4, C5”. At this time, the arrangement order of the bonding pads on the A row which is the row closest to the center of the substrate and the B row which has already been rearranged so as to be in a preset order is kept fixed. Further, the bonding pads are not arranged on a line along the direction from the center of the substrate to the outer edge of the substrate to which the bonding pads connected by a net different from the net connected to the bonding pad belongs.

  More specifically, as shown in FIG. 5, the bonding pad C1 is located on the opposite side of the bonding pad C3 across the bonding pad C2, and the group of bonding pads “B5, C4” is B which has already been rearranged so that the bonding pad C4 is positioned between the bonding pad C3 and the bonding pad C5, and the A row is the row closest to the center of the substrate and the preset order. The order of the bonding pads on the row is rearranged while being fixed. As a result, as shown in FIG. 5, the bonding pads shown in FIG. 4 are arranged in the order of “A1, A2, A3, A4, A5” in the substrate side direction of the bonding pads located on the A row and Each group of bonding pads goes from the center of the substrate toward the outer edge of the substrate while the arrangement order of “B1, B2, B3, B4, B5” in the side direction of the substrate of the bonding pads located on the B row is fixed. In the direction, “A1, B1”, “A2”, “C1”, “B2, C2”, “A3, B3”, “A4, B4, C3”, “B5, C4”, “A5, C5”, etc. Sorted into each column like In the processing up to this point, the rearrangement processing in step S104 in FIG. 1 is performed for all the columns after the column adjacent to the substrate outer edge side with respect to the column closest to the substrate center portion among the columns along the side direction of the substrate. Complete.

  As shown in FIG. 5, the bonding pads that have undergone the rearrangement process do not have nets that intersect with other nets 56. Therefore, as shown in FIG. 6, the bonding pad A1 and the bonding pad B1 connected by the net 56-1 are combined and combined as one bonding pad, and the bonding pad B2 connected by the net 56-2 is combined. The bonding pad C2 is combined and combined as one bonding pad, and the bonding pad A3 and bonding pad B3 connected by the net 56-3 are combined and combined as one bonding pad, and the net 56-4 is combined. Bonding pad A4, bonding pad B4, and bonding pad C3 connected in the above are combined to form one bonding pad, and bonding pad B5 and bonding pad C4 connected by net 56-5 are combined. One of the synthesized as a bonding pad, the bonding pad A5 and the bonding pad C5 which are connected by the net 56-6 is synthesized as a single bonding pad bonded. At this time, as shown in FIG. 6, since there is a gap between the bonding pad A5 and the bonding pad C5, an auxiliary pad indicated by hatching in the figure is inserted between them to synthesize one bonding pad. To do.

  By the processing of steps S107 and S108 performed by the arithmetic processing unit, only bonding pads connected by a net along the direction from the center of the substrate to the outer edge of the substrate are combined to synthesize one bonding pad.

  As a result of the above processing, 15 bonding pads in the stage of FIG. 2 are bonded to bonding pads “A1, B1”, bonding pads A2, bonding pads C1, bonding pads “B2, C2”, bonding as shown in FIG. A total of eight bonding pads, that is, the pads “A3, B3”, the bonding pads “A4, B4, C3”, the bonding pads “B5, C4”, and the bonding pads “A5, C5” are collected.

  FIGS. 7-11 is a figure explaining the 2nd specific example of the bonding pad arrangement | positioning process by the Example of this invention. In this specific example, 12 bonding pads (indicated by squares in the figure, the same applies hereinafter) are temporarily arranged on one side of the four sides of the outer edge portion of the substrate as shown in FIG. Think about the case.

  As shown in FIG. 7, three semiconductor chips are arranged to overlap each other at the center of the substrate (not shown), and correspond to each semiconductor chip in a direction from the substrate center to the outer edge of the substrate. Correspondingly, three rows of bonding pads are arranged (that is, row A, row B and row C). Identification numbers A1 to A5, B1 to B3, and C1 to C4 are assigned to the temporarily arranged bonding pads, respectively. As shown in FIG. 7, in the side direction of the substrate, bonding pads are arranged in the order of A1, A2, A3, A4 and A5 in the A row, bonding pads are arranged in the order of B1, B2 and B3 in the B row, and C In the row, the bonding pads are arranged in the order of C1, C2, C3 and C4.

  In the example shown in FIG. 7, the bonding pads A1 and C4 can be combined into one bonding pad, the bonding pads A2 and B2 can be combined into one bonding pad, and the bonding pads A3, B1, and C2 are combined into one. Assuming that the bonding pads A4 and C1 can be combined into one bonding pad, and the bonding pads A5, B3 and C3 can be combined into one bonding pad, respectively, Thus, bonding pads that can be coupled to each other are connected and already grouped.

  7, the bonding pads temporarily arranged as shown in FIG. 7 are connected in the same row along the direction from the center of the substrate toward the outer edge of the substrate for bonding pads connected by the same net 56. The arrangement order of bonding pads A1, A2, A3, A4, and A5 located on the A row that is the row closest to the center of the substrate among the rows along the side direction of the substrate is arranged so as to be fixed. If it changes, it will become as shown in FIG. That is, each group of bonding pads arranged in the order of “A1, A2, A3, A4, A5” in the side direction of the substrate in the row direction of the substrate in the row A is in the direction from the substrate center to the substrate outer edge, They are rearranged into columns such as “A1, C4”, “A2, B2”, “A3, B1, C2”, “A4, C1”, “A5, B3, C3”.

  Next, among the columns A to C along the side direction of the substrate, the column B adjacent to the substrate outer edge side with respect to the column A closest to the center of the substrate is set as the column to be rearranged. The process of step S104 is executed. That is, in this process, the bonding pads arranged in the order of “B2, B1, B3” along the side direction of the substrate in the stage of FIG. 8 are set in the order set in advance in the side direction of the substrate as shown in FIG. These are rearranged in the order of “B1, B2, B3”. In addition, on the columns other than the B column to be rearranged among the A columns to the C columns along the side direction of the substrate connected to the bonding pads located on the B row to be rearranged by the same net. The bonding pads that are positioned are rearranged so that the bonding pads are aligned on the same row along the direction from the center of the substrate toward the outer edge of the substrate. At this time, the arrangement order of the bonding pads on the A row, which is the row closest to the center of the substrate, remains fixed. Further, the bonding pads are not arranged on a line along the direction from the center of the substrate to the outer edge of the substrate to which the bonding pads connected by a net different from the net connected to the bonding pad belongs.

  More specifically, as shown in FIG. 9, the bonding pad B2 is positioned between the bonding pad B1 and the bonding pad B3, and the arrangement order of the bonding pads in the A row is fixed. Rearranged. As a result, as shown in FIG. 9, the bonding pads shown in FIG. 8 are arranged in the order of “A1, A2, A3, A4, A5” in the side direction of the substrate of the bonding pads located on the A row. While being fixed, each group of bonding pads is “A1, C4”, “A2”, “A3, B1, C2,” “B2,” “A4, C1” in the direction from the center of the substrate toward the outer edge of the substrate. "," A5, B3, C3 ".

  Next, among the columns A to C along the side direction of the substrate, the column C adjacent to the substrate outer edge side with respect to the column B is set as a column to be rearranged, and the process of step S104 in FIG. 1 is performed. Execute. That is, in this process, the bonding pads arranged in the order of “C4, C2, C1, C3” along the side direction of the substrate in the stage of FIG. 9 are set in advance in the side direction of the substrate as shown in FIG. They are rearranged in the order of “C1, C2, C3, C4”. At this time, the arrangement order of the bonding pads on the A row which is the row closest to the center of the substrate and the B row which has already been rearranged so as to be in a preset order is kept fixed. Further, the bonding pads are not arranged on a line along the direction from the center of the substrate to the outer edge of the substrate to which the bonding pads connected by a net different from the net connected to the bonding pad belongs.

  More specifically, as shown in FIG. 10, the bonding pad C4 is bonded with the bonding pad C3 sandwiched so that the bonding pad C1 is located on the opposite side of the bonding pad C3 with the bonding pad C2 interposed therebetween. Arrangement order of bonding pads on the row A that is located on the side opposite to the pad C2 and that has been rearranged so as to be in the preset order and the row A closest to the center of the substrate Can be rearranged while fixed. As a result, as shown in FIG. 10, the bonding pads shown in FIG. 9 are arranged in the order of “A1, A2, A3, A4, A5” in the side direction of the substrate of the bonding pads located on the A row, In addition, while the arrangement order of “B1, B2, B3” in the side direction of the substrate of the bonding pads located on the B row is fixed, each group of bonding pads is in a direction from the substrate center to the substrate outer edge, “A1”, “A2”, “A3, B1”, “B2” “A4, C1”, “C2”, “A5, B3, C3”, “C4”, and the like are rearranged. In the processing up to this point, the rearrangement processing in step S104 in FIG. 1 is performed for all the columns after the column adjacent to the substrate outer edge side with respect to the column closest to the substrate center portion among the columns along the side direction of the substrate. Complete.

  As shown in FIG. 10, in the bonding pads that have been rearranged, the nets 56-1, 56-2, and 56-3-2 along directions other than the direction from the center of the substrate toward the outer edge of the substrate This is a net that causes an intersection with other nets. Therefore, for these bonding pads, the synthesis process in step S107 is executed. That is, since the net 56-1 along the direction other than the direction from the center of the substrate intersecting with other nets toward the outer edge of the substrate connects the bonding pad A1 and the bonding pad C4, the bonding pad A1 and the bonding pad are bonded. The pad C4 is not bonded and remains a separate bonding pad. Further, since the net 56-2 along the direction other than the direction from the center of the substrate crossing the other net to the outer edge of the substrate connects the bonding pad A2 and the bonding pad B2, the bonding pad A2 and the bonding pad A2 are bonded. The pad B2 is not bonded and remains a separate bonding pad. Further, since the net 56-3-2 along the direction other than the direction from the center of the substrate intersecting with the other net toward the outer edge of the substrate connects the bonding pad B1 and the bonding pad C2, the bonding pad B1. And the bonding pad C2 are not bonded but are separate bonding pads.

  On the other hand, by executing the synthesizing process in step S108, the bonding pad A3 and the bonding pad B1 connected by the net 56-3-1 are combined and combined as one bonding pad, and connected by the net 56-4. Bonded bonding pad A4 and bonding pad C1 are combined to form one bonding pad, and bonding pad A5, bonding pad B3, and bonding pad C3 connected by net 56-5 are combined to form one bonding pad. Synthesize as a bonding pad.

  By the processing of steps S107 and S108 performed by the arithmetic processing unit, only bonding pads connected by a net along the direction from the center of the substrate to the outer edge of the substrate are combined to synthesize one bonding pad.

  As a result of the above processing, there are twelve bonding pads in the stage of FIG. 7, as shown in FIG. 11, bonding pad A1, bonding pad A2, bonding pad “A3, B1”, bonding pad B2, bonding pad “A4, C1 ”, bonding pad C2, bonding pads“ A5, B3, C3 ”, and bonding pad C4 are combined into a total of eight bonding pads. At this time, as shown in FIG. 11, since there is a gap between the bonding pad A4 and the bonding pad C1, an auxiliary pad indicated by a slanted line in the figure is inserted and one bonding pad is inserted between them. Synthesizing.

  12-17 is a figure explaining the 3rd specific example of the bonding pad arrangement | positioning process by the Example of this invention. In this specific example, 20 bonding pads (indicated by squares in the figure, the same applies hereinafter) are temporarily arranged on one of the four sides of the outer edge portion of the substrate as shown in FIG. Think about the case.

  As shown in FIG. 12, five semiconductor chips are arranged so as to overlap with the center of the substrate (not shown), and correspond to each semiconductor chip in a direction from the substrate center to the outer edge of the substrate. Correspondingly, five rows of bonding pads are arranged (that is, row A, row B, row C, row D and row E). Identification numbers A1, A2, B1 to B5, C1 to C5, D1 to D6, and E1 to E3 are assigned to the temporarily arranged bonding pads, respectively. As shown in FIG. 12, in the side direction of the substrate, the bonding pads are arranged in the order of A1 and A2 in the A row, the bonding pads are arranged in the order of B1, B2, B3, B4 and B5 in the B row, and in the C row. Bonding pads are arranged in the order of C1, C2, C3 and C4, bonding pads are arranged in the order of D1, D2, D3, D4, D5 and D6 in the D row, and bonding pads are arranged in the order of E1, E2 and E3 in the E row. Are lined up.

  In the example shown in FIG. 12, the bonding pads A1 and D2 can be combined into one bonding pad, the bonding pads A2, B1, C1 and E2 can be combined into one bonding pad, and the bonding pads B2, C4. And D5 can be combined into one bonding pad, bonding pads B3 and E1 can be combined into one bonding pad, bonding pads B4 and D1 can be combined into one bonding pad, bonding pads B5 and D6 Can be combined into one bonding pad, bonding pads C2 and D4 can be combined into one bonding pad, and bonding pads C3, D3 and E3 can be combined into one bonding pad. , By the net 56, respectively, it is connected that the bonding pads to each other capable of binding to each other, are already grouped.

  The bonding pads temporarily arranged as shown in FIG. 12 by the processing in step S103 of FIG. 1 are connected in the same row along the direction from the center of the substrate toward the outer edge of the substrate for bonding pads connected by the same net 56. As shown in FIG. 13, when the arrangement order of the bonding pads A1 and A2 located on the A row, which is the row closest to the center of the substrate among the rows along the side direction of the substrate, is rearranged, the arrangement is fixed. As shown. That is, each group of bonding pads in which the bonding pads positioned on the A row are arranged in the order of “A1, A2” in the side direction of the substrate is divided into “A1, D2”, “A2, B1, C1, E2”, “B2, C4, D5”, “B3, E1”, “B4, D1”, “B5, D6”, “C2, D4”, “C3, D4, E3”, And so on.

  Next, among columns A to E along the side of the substrate, column B adjacent to the substrate outer edge side with respect to column A closest to the center of the substrate is set as a column to be rearranged. The process of step S104 is executed. In the stage of FIG. 13, with respect to the row B, the bonding pads are arranged in the order of “B1, B2, B3, B4, B5” along the side direction of the substrate, and the side direction of the substrate as shown in FIG. Since the order is the same as that set in advance, it is not necessary to rearrange the bonding pads located on these B rows. At this time, the arrangement order of the bonding pads on the A row, which is the row closest to the center of the substrate, remains fixed.

  Next, among the columns A to E along the side direction of the substrate, the column C adjacent to the substrate outer edge side with respect to the column B is set as a column to be rearranged, and the process of step S104 in FIG. 1 is performed. Execute. That is, in this process, the bonding pads arranged in the order of “C1, C4, C2, C3” along the side direction of the substrate in the stage of FIG. 13 are set in advance in the side direction of the substrate as shown in FIG. They are rearranged in the order of “C1, C2, C3, C4”. Further, on the columns other than the C column to be rearranged among the A columns to the E columns along the side direction of the substrate connected to the bonding pads located on the C column to be rearranged by the same net. The bonding pads that are positioned are also rearranged so that they are aligned on the same row along the direction from the center of the substrate toward the outer edge of the substrate. At this time, the arrangement order of the bonding pads on the A row which is the row closest to the center of the substrate and the B row which has already been rearranged so as to be in a preset order is kept fixed. Further, the bonding pads are not arranged on a line along the direction from the center of the substrate to the outer edge of the substrate to which the bonding pads connected by a net different from the net connected to the bonding pad belongs.

  More specifically, as shown in FIG. 14, the group of bonding pads “C2, D4” and the group of bonding pads “C3, D3, E3” are the bonding pads C2 and C3 are the bonding pads C1 and C4. In addition, the arrangement order of the bonding pads in row A that is the row closest to the center of the substrate and row B that has already been rearranged to be in a preset order remains fixed. Are rearranged. As a result, as shown in FIG. 14, the bonding pads shown in FIG. 13 are arranged in the order of “A1, A2” in the substrate side direction of the bonding pads located on the A row and on the B row. The bonding pads are arranged in the direction from the center of the substrate toward the outer edge of the substrate in the direction of “A1” while the arrangement order of “B1, B2, B3, B4, B5” in the substrate side direction of the bonding pads to be fixed is fixed. , D2 "," A2, B1, C1, E2 "," C2, D4 "," C3, D3, E3 "," B2, C4, D5 "," B3, E1 "," B4, D1 "," B5 , D6 ", and so on.

  Next, among the columns A to E along the side direction of the substrate, the column D further adjacent to the substrate outer edge side with respect to the column C is set as a column to be rearranged, and the process of step S104 in FIG. 1 is performed. Execute. That is, in this process, bonding pads arranged in the order of “D2, D4, D3, D5, D1, D6” along the side direction of the substrate in the stage of FIG. 14 are changed to the side direction of the substrate as shown in FIG. Are rearranged in the order of “D1, D2, D3, D4, D5, D6” which is a preset order. In addition, on the columns other than the D column to be rearranged among the A columns to the E columns along the side direction of the substrate connected to the bonding pads located on the D column to be rearranged by the same net. The bonding pads that are positioned are also rearranged so that they are aligned on the same row along the direction from the center of the substrate toward the outer edge of the substrate. At this time, the arrangement order of the bonding pads on the B row and the C row that have already been rearranged so as to be in the preset order and the A row that is the row closest to the center of the substrate remains fixed. . Further, the bonding pads are not arranged on a line along the direction from the center of the substrate to the outer edge of the substrate to which the bonding pads connected by a net different from the net connected to the bonding pad belongs.

  More specifically, as shown in FIG. 15, the bonding pad D2 is positioned between the bonding pad D1 and the bonding pad D3, and the bonding pad “D3, E3” group includes bonding pads. D3 is positioned between bonding pad D2 and bonding pad D4, bonding pad D4 is positioned between bonding pad D3 and bonding pad D5, and bonding pad D5 is bonding pad. Bonding pads of the B row and the C row that have been rearranged so as to be positioned between the D4 and the bonding pad D6, and the A row that is the row closest to the center of the substrate, and the preset order. The order of the items is rearranged while being fixed. As a result, as shown in FIG. 15, the bonding pads shown in FIG. 14 are arranged in the order of “A1, A2” in the side direction of the substrate of the bonding pads located on the A row and on the B row. Arrangement order of “B1, B2, B3, B4, B5” in the side direction of the bonding pad substrate and arrangement order of “C1, C2, C3, C4” in the side direction of the bonding pad substrate located on the C row Are fixed, and each group of bonding pads is moved in the direction from the center of the substrate toward the outer edge of the substrate, “A1,” “A2, B1, C1, E2,” “C2,” “C3,” “B2, C4 "," B3, E1 "," B4, D1 "," D2 "," D3, E3 "," D4 "," D5 "," B5, D6 ", and so on.

  Next, among the columns A to E along the side direction of the substrate, the column E that is further adjacent to the substrate outer edge side with respect to the column D is set as a column to be rearranged, and the process of step S104 in FIG. Execute. That is, in this process, the bonding pads arranged in the order of “E2, E1, E3” along the side direction of the substrate in the stage of FIG. 15 are set in the order set in advance in the side direction of the substrate as shown in FIG. These are rearranged in the order of “E1, E2, E3”. At this time, the bonding order of the bonding pads on the B column to the D column that have already been rearranged so as to be in the predetermined order and the A column that is the column closest to the center of the substrate remains fixed. . Further, the bonding pads are not arranged on a line along the direction from the center of the substrate to the outer edge of the substrate to which the bonding pads connected by a net different from the net connected to the bonding pad belongs.

  More specifically, as shown in FIG. 16, the bonding pad E1 is a row that is located on the opposite side of the bonding pad E3 across the bonding pad E2 and that is closest to the center of the substrate. The bonding pads are rearranged in a fixed order with respect to the arrangement order of the bonding pads in the B to D columns that have already been rearranged so as to be in a predetermined order. As a result, as shown in FIG. 16, the bonding pads shown in FIG. 15 are arranged in the order of “A1, A2” in the substrate side direction of the bonding pads located on the A row and on the B row. “B1, B2, B3, B4, B5” in the side direction of the bonding pad substrate, “C1, C2, C3, C4” in the side direction of the bonding pad substrate located on the C row, In addition, the arrangement order of “D1, D2, D3, D4, D5, D6” in the side direction of the substrate of the bonding pads located on the D row is fixed, and each group of bonding pads is arranged from the substrate center to the substrate outer edge. "A1," "A2, B1, C1," "C2," "C3," "B2, C4," "B3, E1," "B4, D1," "D2," "D3." "," D "," D5 "," B5, D6 "," E2 ", are sorted in each column, such as" E3 ". In the processing up to this point, the rearrangement processing in step S104 in FIG. 1 is performed for all the columns after the column adjacent to the substrate outer edge side with respect to the column closest to the substrate center portion among the columns along the side direction of the substrate. Complete.

  As shown in FIG. 16, in the bonding pads for which rearrangement processing has been completed, nets 56-1, 56-2-2, 56-3, 56- along the direction other than the direction from the center of the substrate toward the outer edge of the substrate. 4 and 56-5-2 are nets that cause an intersection with other nets. Therefore, for these bonding pads, the synthesis process in step S107 is executed. That is, the net 56-1 along the direction other than the direction from the center of the substrate intersecting with the other net toward the outer edge of the substrate connects the bonding pad A1 and the bonding pad D2, and therefore the bonding pad A1 and the bonding pad are bonded. The pad D2 is not bonded and remains a separate bonding pad. Further, since the net 56-2-2 along the direction other than the direction from the center of the substrate crossing the other net toward the outer edge of the substrate connects the bonding pad C1 and the bonding pad E2, the bonding pad C1. And the bonding pad E2 are not bonded and remain as separate bonding pads. Further, since the net 56-3 along the direction other than the direction from the center of the substrate crossing the other net toward the outer edge of the substrate connects the bonding pad C2 and the bonding pad D4, the bonding pad C2 and the bonding pad C4 are bonded. The pad D4 is not bonded and is a separate bonding pad. Further, since the net 56-4 along the direction other than the direction from the center of the substrate crossing the other net toward the outer edge of the substrate connects the bonding pad C3 and the bonding pad E3, the bonding pad C3 and the bonding pad C3 are bonded. The pad E3 is not bonded and is a separate bonding pad. Further, the net 56-5-2 along the direction other than the direction from the center of the substrate crossing the other net toward the outer edge of the substrate connects the bonding pad C4 and the bonding pad D5. And the bonding pad D5 are not bonded but are separate bonding pads.

  On the other hand, by executing the synthesizing process in step S108, the bonding pad A2, the bonding pad B1, and the bonding pad C1 connected by the net 56-2-1 are combined and combined as one bonding pad. Bonding pad B2 and bonding pad C4 connected by -5-1 are combined to form one bonding pad, and bonding pad B3 and bonding pad E1 connected by net 56-6 are combined. The bonding pad B4 and the bonding pad D1, which are combined as one bonding pad and connected by the net 56-7, are combined and combined as one bonding pad, and the bonding pad B5 and the bond connected by the net 56-8 are combined. Combine to synthesize as a bonding pad for the Ngupaddo D6.

  By the processing of steps S107 and S108 performed by the arithmetic processing unit, only bonding pads connected by a net along the direction from the center of the substrate to the outer edge of the substrate are combined to synthesize one bonding pad.

  As a result of the above processing, the 20 bonding pads at the stage of FIG. 12 are bonded to the bonding pad A1, bonding pads “A2, B1, C1”, bonding pad C2, bonding pad C3, bonding pad “ B2, C4 ", bonding pad" B3, E1 ", bonding pad" B4, D1 ", bonding pad D2, bonding pad D3, bonding pad D4, bonding pad D5, bonding pad" B5, D6 ", bonding pad E2, and The total of 14 bonding pads of the bonding pad E3 is collected. At this time, as shown in FIG. 17, there are gaps between the bonding pad B3 and the bonding pad E1, between the bonding pad B4 and the bonding pad D1, and between the bonding pad B5 and the bonding pad D6. Therefore, an auxiliary pad indicated by slant lines in the figure is inserted between them to synthesize one bonding pad.

  The number of steps of the semiconductor chip in the first to third specific examples in the embodiment of the present invention described above is an example, and the bonding pad arrangement processing on the virtual plane of the substrate on which the semiconductor chip of the number of steps other than that illustrated is mounted. Even if the present invention is applied, it is possible to realize the bonding pad composition processing by the arithmetic processing unit.

  The bonding pad arrangement process according to each embodiment of the present invention described above is realized using an arithmetic processing unit such as a computer or a CAD system. FIG. 18 is a system configuration diagram for explaining the operation on the computer of the computer program for executing the bonding pad arrangement processing according to the present invention stored in the recording medium.

  A computer program for causing a computer to execute the bonding pad arrangement processing according to the present invention is stored in a recording medium (external recording medium such as a flexible disk or a CD-ROM) 10 as shown in FIG. It is installed in a computer having a configuration as described and operates as a CAD system.

  The CPU 11 controls the entire bonding pad arrangement process. A ROM 13, a RAM 14, an HD (hard disk device) 15, an input device 16 such as a mouse and a keyboard, an external recording medium drive device 17, and a display device 18 such as an LCD and a CRT are connected to the CPU 11 via a bus 12. A control program for the CPU 11 is stored in the ROM 13.

  A computer program (bonding pad placement processing program) for executing the bonding pad placement processing is installed (stored) in the HD 15 from the recording medium 10. The RAM 14 has a work area when the CPU 11 executes the bonding pad arrangement process and an area for storing a part of a computer program for executing the bonding pad arrangement process. The HD 15 stores input data, final data, OS (operating system), and the like in advance.

  First, when the computer is turned on, the CPU 11 reads the control program from the ROM 10 and further reads the OS from the HD 15 to start the OS. As a result, the computer is ready to install the bonding pad arrangement processing program from the recording medium 10.

  Next, the recording medium 10 is mounted on the external recording medium drive device 17, a control command is input from the input device 16 to the CPU 11, and a bonding pad arrangement processing program stored in the recording medium 10 is read and stored in the HD 15 or the like. That is, the bonding pad arrangement processing program is installed in the computer.

  Thereafter, the bonding pad arrangement processing program according to the present invention operates on the computer in accordance with an instruction from the operator. The result of the bonding pad arrangement process may be recorded in a predetermined data format. This data is data for combining bonding pads that can be combined to synthesize one bonding pad and placing it on the substrate. For example, it is stored in the HD 15 so that it can be used when necessary. Alternatively, it may be used for visually displaying the processing result on the display device 18.

  In the computer of FIG. 18, the bonding pad arrangement processing program stored in the recording medium 10 is installed in the HD 15. However, the present invention is not limited to this, and the program is installed in the computer via an information transmission medium such as a LAN. Alternatively, it may be stored in advance in the HD 15 built in the computer.

  INDUSTRIAL APPLICABILITY The present invention is used for bonding pad arrangement processing in which a plurality of bonding pads are combined and combined into one in a bonding pad arrangement design of a semiconductor package in which a plurality of semiconductor chips are arranged on a virtual plane. it can. According to the present invention, since bonding pad placement processing including bonding pad synthesis is realized by automatic calculation processing by a computer, bonding that can be coupled without depending on the skill, experience, intuition, etc. of the designer as in the past. The pads can be combined to synthesize one bonding pad and create data for placement on the substrate. The automatic calculation processing of the bonding pad arrangement process eliminates human error as in the prior art and eliminates variations in the quality of the finished product. Since the number of steps in the bonding pad layout design can be reduced, the working time of the designer is greatly shortened and the burden is also reduced. As a result, the manufacturing cost of the semiconductor package can also be reduced.

3 is a flowchart illustrating an operation flow of a bonding pad arrangement method according to an embodiment of the present invention. It is FIG. (1) explaining the 1st specific example of the bonding pad arrangement | positioning process by the Example of this invention. It is FIG. (2) explaining the 1st specific example of the bonding pad arrangement | positioning process by the Example of this invention. It is FIG. (3) explaining the 1st specific example of the bonding pad arrangement | positioning process by the Example of this invention. It is FIG. (4) explaining the 1st specific example of the bonding pad arrangement | positioning process by the Example of this invention. It is FIG. (5) explaining the 1st specific example of the bonding pad arrangement | positioning process by the Example of this invention. It is FIG. (1) explaining the 2nd specific example of the bonding pad arrangement | positioning process by the Example of this invention. It is FIG. (2) explaining the 2nd specific example of the bonding pad arrangement | positioning process by the Example of this invention. It is FIG. (3) explaining the 2nd specific example of the bonding pad arrangement | positioning process by the Example of this invention. It is FIG. (4) explaining the 2nd specific example of the bonding pad arrangement | positioning process by the Example of this invention. It is FIG. (5) explaining the 2nd specific example of the bonding pad arrangement | positioning process by the Example of this invention. It is FIG. (1) explaining the 3rd specific example of the bonding pad arrangement | positioning process by the Example of this invention. It is FIG. (2) explaining the 3rd specific example of the bonding pad arrangement | positioning process by the Example of this invention. It is FIG. (3) explaining the 3rd specific example of the bonding pad arrangement | positioning process by the Example of this invention. It is FIG. (4) explaining the 3rd specific example of the bonding pad arrangement | positioning process by the Example of this invention. It is FIG. (5) explaining the 3rd specific example of the bonding pad arrangement | positioning process by the Example of this invention. It is FIG. (6) explaining the 3rd specific example of the bonding pad arrangement | positioning process by the Example of this invention. It is a system configuration figure explaining operation on a computer of a computer program for performing bonding pad arrangement processing by the present invention stored in a recording medium. It is a side view which illustrates typically the semiconductor package in which a plurality of semiconductor chips were arranged in piles. FIG. 3 is a top view schematically illustrating a semiconductor package in which a plurality of semiconductor chips are stacked and arranged. It is a top view which illustrates typically the synthesis | combination of the bonding pad in the semiconductor package by which several semiconductor chips are piled up and arranged. It is explanatory drawing (the 1) which illustrates the synthesis | combining method of the conventional bonding pad in the semiconductor package by which several semiconductor chips are arrange | positioned. It is explanatory drawing (the 2) which illustrates the synthesis | combining method of the conventional bonding pad in the semiconductor package by which several semiconductor chips were piled up and arrange | positioned. It is explanatory drawing (the 3) which illustrates the synthesis | combining method of the conventional bonding pad in the semiconductor package by which several semiconductor chips are piled up and arrange | positioned.

Explanation of symbols

10 recording medium 11 CPU
12 bus 13 ROM
14 RAM
15 Hard Disk Device 16 Input Device 17 External Storage Medium Drive Device 18 Display Device

Claims (13)

A computer program for causing a computer to execute bonding pad arrangement processing for automatically designing the arrangement of bonding pads on a substrate surface on a virtual plane,
Of the bonding pads temporarily arranged on the substrate surface on the virtual plane, a net generation step for connecting bonding pads that can be bonded to each other with a net,
The bonding pads connected by the same net are positioned on the row closest to the substrate center among the rows along the side of the substrate so that they are arranged on the same row along the direction from the substrate center to the substrate outer edge. An initial step of rearranging the temporarily arranged bonding pads, with the arrangement order of the bonding pads to be fixed fixed;
After the completion of the processing of the initial step, the bonding pads located on the row to be rearranged along the side direction of the substrate are rearranged in a preset order with respect to the side direction of the substrate. For bonding pads that are connected to bonding pads that are located on the same row by the same net and are located on rows other than the row to be rearranged, the bonding pads that are located on the row closest to the center of the substrate. The bonding pads that have already been rearranged so that they are arranged in a predetermined order and the arrangement order of the bonding pads are fixed, and the bonding pads located on the row to be rearranged and the substrate center to the outer edge of the substrate A rearrangement step for rearranging to line up in the same row along the direction of heading;
With
In the rearrangement step, all the columns after the column adjacent to the substrate outer edge side with respect to the column closest to the center of the substrate among the columns along the side direction of the substrate are sequentially sorted. And a computer program that is repeatedly executed.   In the rearrangement step, the bonding pads are not arranged on a line along a direction from the center of the substrate to the outer edge of the substrate to which the bonding pad connected by a net different from the net connected to the bonding pad belongs. Item 5. The computer program according to Item 1.   The computer program product according to claim 1, further comprising a combining step of combining one bonding pad by combining bonding pads connected by a net after completion of the rearranging step. After completion of the processing of the rearrangement step, whether or not there is a net that intersects with another net and that is in a direction other than the direction from the center of the substrate toward the outer edge of the substrate. A net judging step for judging,
In the synthesis step, when it is determined in the net determination step that there is a net along a direction other than the direction from the substrate center to the substrate outer edge that causes the intersection, the bonding pads connected by the net The computer program according to claim 3, wherein only one bonding pad arranged in the same row along a direction from the center of the substrate toward the outer edge of the substrate is combined to synthesize one bonding pad.   The method further comprises a combining step of combining only bonding pads connected by a net along a direction from the center of the substrate toward the outer edge of the substrate after the completion of the rearranging step to synthesize one bonding pad. The computer program according to 1.   The computer program according to claim 1, wherein a plurality of semiconductor chips stacked on each other are arranged on the substrate surface, and a row of bonding pads is provided along the side direction of the substrate corresponding to each semiconductor chip. A computer program for causing a computer to execute bonding pad arrangement processing for automatically designing the arrangement of bonding pads on a substrate surface on a virtual plane,
A grouping step for grouping bonding pads temporarily arranged on a substrate surface on a virtual plane so that bonding pads that can be bonded to each other belong to the same group;
In each group, the temporarily arranged bonding pads are arranged in the same row along the direction from the center of the substrate toward the outer edge of the substrate. An initial step of rearranging the bonding pads positioned on the nearest row while fixing the arrangement order;
After the completion of the processing of the initial step, the bonding pads located on the row to be rearranged along the side direction of the substrate are rearranged in a preset order with respect to the side direction of the substrate. For bonding pads belonging to the same group as the bonding pads located on the row and located on a row other than the row to be rearranged, the arrangement order of the bonding pads located on the row closest to the center of the substrate In addition, the bonding pads that have already been rearranged so as to be in the preset order are fixed in order, and the bonding pads located on the row to be rearranged and in the direction from the substrate center to the outer edge of the substrate. A reordering step for reordering to be on the same line along
With
The arithmetic processing apparatus sequentially sets all columns after the column adjacent to the substrate outer edge side with respect to the column closest to the substrate center portion among the columns along the side direction of the substrate as the columns to be rearranged, A computer program for repeatedly executing the processing in the rearranging step.   8. The rearrangement step, wherein the bonding pads are not arranged on a line along a direction from the center of the substrate to which the bonding pads belonging to a group different from the group to which the bonding pads belong belongs to the outer edge of the substrate. Computer program.   After the completion of the rearranging step, a combining step of combining only bonding pads on the same row along the direction from the center of the substrate toward the outer edge of the substrate in the same group to synthesize one bonding pad is further performed. The computer program according to claim 7 provided.   8. The bonding pad arrangement according to claim 7, wherein a plurality of semiconductor chips superimposed on each other are arranged on the substrate surface, and a row of bonding pads is provided along the side direction of the substrate corresponding to each semiconductor chip. Method. An arithmetic processing unit is a bonding pad arrangement method for automatically designing the arrangement of bonding pads on a substrate surface on a virtual plane,
A grouping step for grouping bonding pads temporarily arranged on a substrate surface on a virtual plane so that bonding pads that can be bonded to each other belong to the same group;
In each group, the temporarily arranged bonding pads are arranged in the same row along the direction from the center of the substrate toward the outer edge of the substrate. An initial step of rearranging the bonding pads positioned on the nearest row while fixing the arrangement order;
After the completion of the processing of the initial step, the bonding pads located on the row to be rearranged along the side direction of the substrate are rearranged in a preset order with respect to the side direction of the substrate. For bonding pads belonging to the same group as the bonding pads located on the row and located on a row other than the row to be rearranged, the order of bonding pads located on the row closest to the center of the substrate is arranged. In addition, the bonding pads that have already been rearranged so as to be in the preset order are fixed in order, and the bonding pads located on the row to be rearranged and in the direction from the substrate center to the outer edge of the substrate. A reordering step for reordering to be on the same line along
With
The arithmetic processing apparatus sequentially sets all columns after the column adjacent to the substrate outer edge side with respect to the column closest to the substrate center portion among the columns along the side direction of the substrate as the columns to be rearranged, A bonding pad arranging method, wherein the processing in the rearranging step is repeatedly executed.   12. The rearranging step does not arrange bonding pads on a row along a direction from a substrate center part to which a bonding pad belonging to a group different from a group to which the bonding pad belongs belongs to a direction toward a substrate outer edge part. Bonding pad placement method.   12. The bonding pad arrangement according to claim 11, wherein a plurality of semiconductor chips stacked on each other are arranged on the substrate surface, and a row of bonding pads is provided along the side direction of the substrate corresponding to each of the semiconductor chips. Method.

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