JP2008108055A5 - - Google Patents

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Publication number
JP2008108055A5
JP2008108055A5 JP2006290090A JP2006290090A JP2008108055A5 JP 2008108055 A5 JP2008108055 A5 JP 2008108055A5 JP 2006290090 A JP2006290090 A JP 2006290090A JP 2006290090 A JP2006290090 A JP 2006290090A JP 2008108055 A5 JP2008108055 A5 JP 2008108055A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006290090A
Other versions
JP2008108055A (ja
JP5003097B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006290090A priority Critical patent/JP5003097B2/ja
Priority claimed from JP2006290090A external-priority patent/JP5003097B2/ja
Priority to US11/898,241 priority patent/US7900180B2/en
Publication of JP2008108055A publication Critical patent/JP2008108055A/ja
Publication of JP2008108055A5 publication Critical patent/JP2008108055A5/ja
Application granted granted Critical
Publication of JP5003097B2 publication Critical patent/JP5003097B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006290090A 2006-10-25 2006-10-25 半導体チップ Expired - Fee Related JP5003097B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006290090A JP5003097B2 (ja) 2006-10-25 2006-10-25 半導体チップ
US11/898,241 US7900180B2 (en) 2006-10-25 2007-09-11 Semiconductor chip using specification interface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006290090A JP5003097B2 (ja) 2006-10-25 2006-10-25 半導体チップ

Publications (3)

Publication Number Publication Date
JP2008108055A JP2008108055A (ja) 2008-05-08
JP2008108055A5 true JP2008108055A5 (ja) 2009-11-12
JP5003097B2 JP5003097B2 (ja) 2012-08-15

Family

ID=39331786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006290090A Expired - Fee Related JP5003097B2 (ja) 2006-10-25 2006-10-25 半導体チップ

Country Status (2)

Country Link
US (1) US7900180B2 (ja)
JP (1) JP5003097B2 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1806847B1 (en) * 2004-10-28 2010-02-17 IP Flex Inc. Data processing device having reconfigurable logic circuit
US20080244238A1 (en) * 2006-09-01 2008-10-02 Bogdan Mitu Stream processing accelerator
KR20120065809A (ko) * 2010-12-13 2012-06-21 한국전자통신연구원 멀티 코어 중앙처리장치를 위한 광네트워크 구조
US20210018952A1 (en) * 2017-06-02 2021-01-21 Ultramemory Inc. Semiconductor module

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6015748A (ja) * 1983-07-08 1985-01-26 Hitachi Ltd 相互リンク形リング構成方式
JPS62168260A (ja) * 1986-01-20 1987-07-24 Mitsubishi Electric Corp ワンチツプマイクロコンピユ−タ
JPH06250992A (ja) * 1993-02-23 1994-09-09 Nippon Telegr & Teleph Corp <Ntt> 情報処理装置
JPH06274459A (ja) * 1993-03-17 1994-09-30 Hitachi Ltd 半導体集積回路装置
US5724502A (en) * 1995-08-07 1998-03-03 International Business Machines Corporation Test mode matrix circuit for an embedded microprocessor core
JP2002169787A (ja) * 2000-11-30 2002-06-14 Matsushita Electric Ind Co Ltd 複数のプロセッサ部を含む半導体装置
JP2003036248A (ja) * 2001-07-25 2003-02-07 Nec Software Tohoku Ltd シングルチップマイクロプロセッサに用いる小規模プロセッサ
US7542867B2 (en) * 2001-08-14 2009-06-02 National Instruments Corporation Measurement system with modular measurement modules that convey interface information
JP4796346B2 (ja) * 2004-07-28 2011-10-19 ルネサスエレクトロニクス株式会社 マイクロコンピュータ
EP1806847B1 (en) 2004-10-28 2010-02-17 IP Flex Inc. Data processing device having reconfigurable logic circuit
US20060212677A1 (en) * 2005-03-15 2006-09-21 Intel Corporation Multicore processor having active and inactive execution cores

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