JP2008098498A5 - - Google Patents
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- Publication number
- JP2008098498A5 JP2008098498A5 JP2006280113A JP2006280113A JP2008098498A5 JP 2008098498 A5 JP2008098498 A5 JP 2008098498A5 JP 2006280113 A JP2006280113 A JP 2006280113A JP 2006280113 A JP2006280113 A JP 2006280113A JP 2008098498 A5 JP2008098498 A5 JP 2008098498A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electrode pad
- insulating film
- hole
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 13
- 239000004065 semiconductor Substances 0.000 claims 6
- 239000004020 conductor Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006280113A JP5103861B2 (ja) | 2006-10-13 | 2006-10-13 | 半導体装置、半導体装置の製造方法、回路基板および電子機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006280113A JP5103861B2 (ja) | 2006-10-13 | 2006-10-13 | 半導体装置、半導体装置の製造方法、回路基板および電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008098498A JP2008098498A (ja) | 2008-04-24 |
| JP2008098498A5 true JP2008098498A5 (enExample) | 2009-11-19 |
| JP5103861B2 JP5103861B2 (ja) | 2012-12-19 |
Family
ID=39381010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006280113A Active JP5103861B2 (ja) | 2006-10-13 | 2006-10-13 | 半導体装置、半導体装置の製造方法、回路基板および電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5103861B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5539624B2 (ja) * | 2008-04-28 | 2014-07-02 | ラピスセミコンダクタ株式会社 | 薄膜抵抗素子、及び薄膜抵抗素子の製造方法 |
| US7786600B2 (en) * | 2008-06-30 | 2010-08-31 | Hynix Semiconductor Inc. | Circuit substrate having circuit wire formed of conductive polarization particles, method of manufacturing the circuit substrate and semiconductor package having the circuit wire |
| EP2463896B1 (en) * | 2010-12-07 | 2020-04-15 | IMEC vzw | Method for forming through-substrate vias surrounded by isolation trenches with an airgap and corresponding device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3983996B2 (ja) * | 2001-04-23 | 2007-09-26 | 株式会社ルネサステクノロジ | 半導体集積回路装置 |
| JP2004095849A (ja) * | 2002-08-30 | 2004-03-25 | Fujikura Ltd | 貫通電極付き半導体基板の製造方法、貫通電極付き半導体デバイスの製造方法 |
| JP2005093486A (ja) * | 2003-09-12 | 2005-04-07 | Seiko Epson Corp | 半導体装置の製造方法及び半導体装置 |
| JP3821125B2 (ja) * | 2003-12-18 | 2006-09-13 | セイコーエプソン株式会社 | 半導体装置の製造方法、半導体装置、回路基板、電子機器 |
| JP4873517B2 (ja) * | 2004-10-28 | 2012-02-08 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置及びその製造方法 |
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2006
- 2006-10-13 JP JP2006280113A patent/JP5103861B2/ja active Active