JP2008085271A - Method of setting frequency of ultrasonic vibration given to cutting blade and cutting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of setting frequency of ultrasonic vibration given to a cutting blade and a cutting device, in which the cutting blade vibrates in effective amplitude. <P>SOLUTION: The method sets the frequency of AC power applied to an ultrasonic vibration means arranged in a rotating spindle having a cutting tool fitted with the cutting blade. The method has a first amplitude detecting process of applying the AC power of the frequency resonating in reverse phase mode to the ultrasonic vibration means to detect the amplitude of the cutting blade, a second amplitude detecting process of applying the AC power of the frequency resonating in same phase mode to the ultrasonic vibration means to detect the amplitude of the cutting blade, and a frequency selecting process of selecting the frequency having larger amplitude in the amplitudes of the cutting blade detected by the first amplitude detecting process and the second amplitude detecting process, as the frequency of AC power applied to the ultrasonic vibration means. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a cutting apparatus for cutting a workpiece such as a semiconductor wafer or an optical device wafer while applying ultrasonic vibration to a cutting blade, and a frequency setting method for ultrasonic vibration applied to the cutting blade.

  In the semiconductor device manufacturing process, a plurality of regions are partitioned by dividing lines called streets arranged in a lattice pattern on the surface of a substantially wafer-shaped semiconductor wafer, and devices such as ICs, LSIs, etc. are partitioned in the partitioned regions. Form. Then, the semiconductor wafer is cut along the streets to divide the region in which the device is formed to manufacture individual semiconductor chips. In addition, optical device wafers with gallium nitride compound semiconductors laminated on the surface of sapphire substrates are divided into individual light emitting diodes, laser diodes, CCDs and other optical devices by cutting along the streets. It's being used.

  The above-described cutting along the wafer street is usually performed by a cutting device called a dicer. This cutting apparatus includes a chuck table for holding a workpiece such as a wafer, a cutting means for cutting the workpiece held on the chuck table, and a cutting for relatively moving the chuck table and the cutting means. And feeding means. The cutting means includes a cutting tool having a rotating spindle and a cutting blade mounted on the spindle, and a spindle unit having a drive mechanism for driving the rotating spindle to rotate. In such a cutting apparatus, the cutting tool and the work piece held on the chuck table are relatively cut and fed while rotating the cutting tool at a rotational speed of 20000 to 40000 rpm.

  However, brittle hard materials such as silicon, sapphire, silicon nitride, glass, and lithium tantalate are used for the wafer on which the device is formed. There is a problem of lowering. Also, a wafer with high Mohs hardness such as sapphire is very difficult if not impossible to cut with a cutting blade.

In order to solve the above-described problem, an ultrasonic vibrator is disposed on a rotating spindle on which a cutting tool equipped with a cutting blade is mounted, and an AC voltage is applied to the ultrasonic vibrator to thereby apply an ultrasonic voltage to the cutting blade. There has been proposed a cutting method in which cutting is performed while applying sonic vibration. A cutting tool used in this cutting method includes a vibration transmission member attached to a rotary spindle, and a cutting blade attached to the vibration transmission member, and transmits ultrasonic vibration that vibrates in the axial direction of the rotary spindle. Is converted into radial vibration, and radial ultrasonic vibration is applied to the cutting blade.
(For example, refer to Patent Document 1.)
Japanese Patent No. 3469516

  The frequency of ultrasonic vibration applied to the cutting blade varies depending on the type and size of the cutting blade. The frequency of ultrasonic vibration applied to the cutting blade is set to a frequency at which resonance first occurs. However, in the experiments of the present inventors, when ultrasonic vibration is applied to the cutting blade, the same phase mode in which the cutting blade repeatedly expands and contracts in the radial direction and the reverse in which the expansion and contraction are alternately repeated with a phase of 90 degrees. It was found that it vibrates in phase mode. It was also found that the frequency of ultrasonic vibration that generates the in-phase mode is different from the frequency of ultrasonic vibration that generates the anti-phase mode. In addition, the amplitude in the same phase mode depending on the type of bond material (resin bond, metal bond, vitrified bond, electroforming) for bonding the abrasive grains forming the cutting blade, the thickness and diameter of the blade, the weight of the cutting tool, etc. It has also been found that there are cutting blades with a large amplitude and cutting blades with a large amplitude in the antiphase mode. Therefore, in setting the frequency of the ultrasonic vibration applied to the cutting blade, it is desirable to set a frequency at which the amplitude is increased in consideration of these factors.

  The present invention has been made in view of the above-mentioned facts, and its main technical problem is to provide a method for setting a frequency of ultrasonic vibration applied to a cutting blade and a cutting apparatus for vibrating the cutting blade with an effective amplitude. There is to do.

In order to solve the above main technical problem, according to the present invention, a method of setting the frequency of the AC power applied to the ultrasonic vibration means disposed on the rotary spindle to which the cutting tool to which the cutting blade is attached is attached. There,
A first amplitude detecting and measuring step of detecting an amplitude of a cutting blade by applying AC power having a frequency resonating in an antiphase mode to the ultrasonic vibration means;
A second amplitude detecting step of applying AC power of a frequency resonating in the same phase mode to the ultrasonic vibration means to detect the amplitude of the cutting blade;
Frequency selection for selecting, as the frequency of the AC power applied to the ultrasonic vibration means, the frequency at which a large amplitude is obtained from the amplitudes of the cutting blades detected by the first amplitude detection step and the second amplitude detection step. Including a process,
An AC power frequency setting method for applying ultrasonic vibration to a cutting tool is provided.

According to the invention, there is provided a chuck table for holding a workpiece, a rotary spindle for cutting the workpiece held on the chuck table, and a cutting blade attached to an end surface of the rotary spindle. A cutting means including a cutting tool and ultrasonic vibration means disposed on the rotary spindle; and a power supply means for applying AC power to the ultrasonic vibration means, the power supply means being an ultrasonic vibration means. In the cutting apparatus, comprising a frequency adjusting means for adjusting the frequency of the AC power applied to and a control means for controlling the frequency adjusting means,
Amplitude detecting means for detecting the amplitude of the cutting blade of the cutting tool attached to the rotary spindle and sending an amplitude signal to the control means;
The control means generates an amplitude signal obtained when the amplitude detecting means detects the amplitude of the cutting blade when AC power having a frequency resonating in the same phase mode is applied to the ultrasonic vibration means. Based on the frequency in the phase mode with the larger amplitude,
A cutting device is provided.

  The control means includes a memory for storing the selected frequency, and controls the frequency adjustment means based on the frequency stored in the memory.

  According to the present invention, the amplitude at which the cutting blade vibrates when AC power having a frequency that resonates in the opposite phase mode and the same phase mode is applied to the ultrasonic vibration means. Since the frequency at which a large amplitude is obtained is selected as the frequency of the AC power applied to the ultrasonic vibration means, the cutting resistance by the cutting blade can be effectively reduced, and the workpiece W is difficult to cut such as sapphire. Even so, it can be easily cut.

  Hereinafter, preferred embodiments of a frequency setting method for AC power and a cutting apparatus for applying ultrasonic vibration to a cutting tool according to the present invention will be described in more detail with reference to the accompanying drawings.

  FIG. 1 shows a perspective view of a cutting device constructed in accordance with the present invention. The cutting device in the illustrated embodiment includes a device housing 2 having a substantially rectangular parallelepiped shape. In the apparatus housing 2, a chuck table 3 for holding a workpiece is disposed so as to be movable in a direction indicated by an arrow X that is a cutting feed direction. The chuck table 3 includes a suction chuck support 31 and a suction chuck 32 disposed on the suction chuck support 31. A workpiece is illustrated on a holding surface which is the upper surface of the suction chuck 32. Suction holding is performed by operating a suction means that does not. The chuck table 3 is configured to be rotatable by a rotation mechanism (not shown). The chuck table 31 is provided with a clamp 33 for fixing a support frame that supports a wafer, which will be described later, via a protective tape as a workpiece. The chuck table 3 configured as described above can be moved in a cutting feed direction indicated by an arrow X by a cutting feed means (not shown).

  The cutting apparatus shown in FIG. 1 includes a spindle unit 4 as cutting means. The spindle unit 4 is mounted on a moving base (not shown) and is moved in an indexing direction indicated by an arrow Y perpendicular to the cutting feed direction indicated by the arrow X by indexing feeding means (not shown), and a cutting direction by a notch feeding means (not shown). It can be moved in the direction indicated by the arrow Z. The spindle unit 4 will be described with reference to FIG.

  The spindle unit 4 shown in FIG. 2 includes a spindle housing 41, a rotating spindle 42 that is rotatably disposed in the spindle housing 41, and a cutting tool 43 that is attached to the tip of the rotating spindle 42. . The spindle housing 41 is formed in a substantially cylindrical shape and includes a shaft hole 411 penetrating in the axial direction. A rotary spindle 42 that is inserted through a shaft hole 411 formed in the spindle housing 41 includes a tool mounting portion 422 provided with a screw hole 421 at a front end portion thereof, and a central portion thereof in a radial direction. A protruding thrust bearing flange 423 is provided. In this way, the rotary spindle 42 disposed through the shaft hole 411 formed in the spindle housing 41 is rotatably supported by high-pressure air supplied between the inner wall of the shaft hole 411.

  A cutting tool 43 mounted on a tool mounting portion 422 provided at the tip of the rotary spindle 42 includes a vibration transmission member 44 as a blade base, and an annular cutting blade 45 mounted on the vibration transmission member 44. It is made up of. The vibration transmitting member 44 is made of aluminum in the illustrated embodiment, and has a central large-diameter portion 441, a first small-diameter portion 442 formed so as to protrude coaxially from one end surface of the central large-diameter portion 441, The second small-diameter portion 443 is formed so as to protrude coaxially from the other end surface of the large-diameter portion 441. Note that the first small diameter portion 442 and the second small diameter portion 443 are formed to have the same dimensions. The thus formed vibration transmission member 44 is formed with a through hole 444 that penetrates the center of the shaft. In the illustrated embodiment, the cutting blade 45 attached to the vibration transmission member 44 is bonded to the end face of the vibration transmission member 44 on the first small diameter portion 442 side of the central large diameter portion 441 by metal plating such as nickel. An electroformed blade, a resin bond grindstone blade in which abrasive grains are bonded by resin bond, a metal bond grindstone blade in which abrasive grains are bonded by metal bond, and a vitrified bond grindstone blade in which abrasive grains are bonded by vitrified bond can be used.

  The cutting tool 43 in the illustrated embodiment is a view of the first end surface 442 a and the second small diameter portion 443 facing the right end surface, that is, the rotary spindle 42 in FIG. 2 of the first small diameter portion 442 constituting the vibration transmitting member 44. In FIG. 2, spacers 46 and 46 made of synthetic resin are mounted on the left end face, that is, a second end face 443a facing a fixing member to be described later. The cutting tool 43 configured in this way is screwed into a screw hole 421 provided in the tool mounting portion 422 of the rotary spindle 42 with a fastening bolt 46 as a fixing member disposed through the through hole 444. Thus, the rotary spindle 42 is mounted. At this time, spacers 46 and 46 made of synthetic resin are mounted on the first end surface 442a of the first small-diameter portion 442 and the second end surface 443a of the second small-diameter portion 443 constituting the vibration transmitting member 44, respectively. Therefore, it is easy to attach the vibration transmitting member 44 to the rotating spindle 42, and it is possible to reliably prevent forgetting to interpose the spacers 46 and 46.

  The spindle unit 4 in the illustrated embodiment includes an electric motor 5 for driving the rotary spindle 42 to rotate. The illustrated electric motor 5 is constituted by a permanent magnet motor. The permanent magnet type electric motor 5 is disposed in a spindle housing 41 on the outer peripheral side of the rotor 51 and a rotor 51 made of a permanent magnet mounted on a motor mounting portion 424 formed in an intermediate portion of the rotary spindle 42. The stator coil 52 is included. In the electric motor 5 configured in this manner, the rotor 51 is rotated by applying AC power to the stator coil 52 by power supply means described later, and the rotating spindle 42 to which the rotor 51 is mounted is rotated.

  The spindle unit 4 in the illustrated embodiment includes an ultrasonic transducer 6 that is disposed on the rotary spindle 42 and applies ultrasonic vibration to the cutting blade 45. The ultrasonic vibrator 6 includes an annular piezoelectric body 61 polarized in the axial direction of the rotary spindle 42 and two annular electrode plates 62 and 63 attached to both side polarization surfaces of the piezoelectric body 61. It has become. The piezoelectric body 61 is made of piezoelectric ceramics such as barium titanate, lead zirconate titanate, and lithium tantalate. The ultrasonic transducer 6 configured as described above is mounted on the rotary spindle 42, and generates ultrasonic vibration when AC power having a predetermined frequency is applied to the electrode plates 62 and 63 by power supply means described later. A plurality of ultrasonic transducers 6 may be arranged in the axial direction.

The spindle unit 4 in the illustrated embodiment includes power supply means 7 that applies AC power to the ultrasonic vibrator 6 and applies AC power to the electric motor 5.
The power supply means 7 includes a rotary transformer 8 disposed at the rear end of the spindle unit 4. The rotary transformer 8 includes a power receiving unit 81 disposed at the rear end of the rotary spindle 42 and a power feeding unit 82 disposed opposite to the power receiving unit 81 and disposed at the rear end portion of the spindle housing 41. is doing. The power receiving means 81 includes a rotor side core 811 attached to the rotary spindle 42 and a power receiving coil 812 wound around the rotor side core 811. One end of the power receiving coil 812 of the power receiving means 81 configured as described above is connected to the electrode plate 62 of the ultrasonic transducer 6, and the other end is connected to the electrode plate 63. The power supply means 82 includes a stator side core 821 disposed on the outer peripheral side of the power reception means 81 and a power supply coil 822 disposed on the stator side core 821. The power supply coil 822 of the power supply means 82 configured in this way is supplied with AC power via the electrical wirings 73 and 74.

  The power supply means 7 in the illustrated embodiment includes an AC power supply 91 for AC power supplied to the power supply coil 822 of the rotary transformer 8, a current adjustment means 92 as power adjustment means, and AC power supplied to the power supply means 82. Frequency adjusting means 93 for adjusting the frequency of the current, control means 94 for controlling the current adjusting means 92 and the frequency adjusting means 93, and input means 95 for inputting the type of the cutting tool 43 provided with the cutting blade 45 to the control means. It has. The power supply means 7 shown in FIG. 2 supplies AC power to the stator coil 52 of the electric motor 5 through the control circuit 96 and the electric wirings 521 and 522.

  The cutting device in the illustrated embodiment includes amplitude detecting means 97 for detecting the amplitude of ultrasonic vibration applied to the cutting blade 45 of the cutting tool 43 attached to the rotary spindle 42 described above. The amplitude detecting means 97 is formed between the detector main body 971, the light emitting means 972 and the light receiving means 973 disposed opposite to the detector main body 971, and the cutting blade 45 formed between the light emitting means 972 and the light receiving hand 973. And a blade receiving portion 974 for receiving the outer peripheral portion. The light emitting means 972 is connected to the light source 976 via the optical fiber 975, and emits light from the light source 976 toward the light receiving means 973. The light receiving unit 973 receives the light emitted by the light emitting unit 972 and sends the received light to the photoelectric conversion unit 978 via the optical fiber 977. The photoelectric conversion means 978 converts the optical signal received by the light receiving means 973 into a voltage signal and sends it to the control means 94. The detector main body 971 constituting the amplitude detecting means 97 is disposed on the cover member 30 disposed so as to surround the chuck table 3 as shown in FIG. As the amplitude detection means 97 configured as described above, a blade detection means for detecting the height position of the cutting blade 45 provided in the cutting apparatus can be used.

Here, the operation of the amplitude detecting means 97 will be described.
The detector main body 971 disposed on the cover member 30 is moved directly below the cutting blade 45. Next, as shown in FIG. 2, the cutting blade 45 is lowered to enter the blade receiving portion 974 of the detector main body 971. Then, the cutting blade 45 is positioned so that the lower end of the cutting blade 45 is positioned at the center of the light emitting means 972 and the light receiving means 973. Next, AC power is supplied from the power supply means 7 to the stator coil 52 of the electric motor 5. As a result, the electric motor 5 rotates and the rotary spindle 42 rotates, and the cutting blade 45 attached to the vibration transmission member 44 of the cutting tool 43 attached to the tip of the rotary spindle 42 is rotated.

  On the other hand, the power supply means 7 controls the current adjusting means 92 and the frequency adjusting means 93 by the control means 94 to control the AC power to a predetermined current value and adjust the frequency of the AC power to a predetermined frequency to The power is supplied to the power supply coil 822 of the power supply means 82 constituting the transformer 8. When AC power having a predetermined frequency is applied to the feeding coil 822 as described above, AC power having a predetermined frequency is interposed between the electrode plate 62 and the electrode plate 63 of the ultrasonic transducer 6 via the power receiving coil 812 of the rotating power receiving means 81. Is applied. As a result, the ultrasonic transducer 6 is repeatedly displaced in the radial direction and vibrates ultrasonically. This ultrasonic vibration is transmitted to the vibration transmission member 44 of the cutting tool 43 via the rotary spindle 42, and the vibration transmission member 44 ultrasonically vibrates in the radial direction. Accordingly, the cutting blade 45 attached to the vibration transmitting member 44 vibrates ultrasonically in the radial direction.

  The ultrasonic vibration acting on the cutting blade 45 mounted on the vibration transmission member 44 having the above-described configuration generates two resonances depending on the frequency of the AC power applied between the electrode plate 62 and the electrode plate 63 of the ultrasonic transducer 6. To do. One of the resonances is an in-phase mode in which the cutting blade 45 repeats expansion and contraction in the radial direction, and the other one of the resonances is an anti-phase mode in which the cutting blades 45 alternately expand and contract with a 90 degree phase. It is. It has been found that the in-phase mode and the anti-phase mode are generated at a lower frequency in the anti-phase mode than in the in-phase mode. The magnitude of the amplitude when the cutting blade 45 vibrates in the in-phase mode and the amplitude when the cutting blade 45 vibrates in the anti-phase mode is the kind of bond material for bonding the abrasive grains forming the cutting blade as described above. (Resin bond, metal bond, vitrified bond, electroforming), blade thickness and diameter, cutting tool weight, and the like. Therefore, for each cutting tool 43 attached to the rotary spindle 42, the amplitude of the cutting blade 45 when oscillating in the in-phase mode and the amplitude of the cutting blade 45 when oscillating in the anti-phase mode are measured. It is desirable to set the frequency of the AC power corresponding to the phase mode.

Here, the measurement of the amplitude of the cutting blade 45 when oscillating in the in-phase mode and the amplitude of the cutting blade 45 when oscillating in the anti-phase mode will be described with reference to FIG.
As described above, in the state where the electric motor 5 is driven, the rotary spindle 42 is rotated and the cutting blade 45 is rotated, AC power having a frequency of, for example, 10 kHz is applied to the ultrasonic vibrator 6. Then, the frequency of the AC power to be applied is gradually increased. As a result, resonance occurs in an antiphase mode near 52 kHz, for example. At this time, a voltage signal corresponding to the amount of light received by the light receiving means 973 that receives the light emitted from the light emitting means 972 is sent from the photoelectric conversion means 978 to the control means 94. The control means 94 obtains the maximum value and the minimum value based on the signal sent from the photoelectric conversion means 978, and detects the amplitude of the cutting blade 45 from the maximum value and the minimum value. And the control means 94 stores the frequency when the amplitude of the cutting blade 45 is the largest in the memory 941 of the control means 94 as the frequency in the antiphase mode (first amplitude detection step). Next, when the frequency of the AC power to be applied is gradually increased, the amplitude of the cutting blade 45 becomes smaller, and resonance occurs in the same phase mode near 55 kHz, for example. At this time, a voltage signal corresponding to the amount of light received by the light receiving means 973 that receives the light emitted from the light emitting means 972 is sent from the photoelectric conversion means 978 to the control means 94. The control means 94 obtains the maximum value and the minimum value based on the signal sent from the photoelectric conversion means 978, and detects the amplitude of the cutting blade 45 from the maximum value and the minimum value. And the control means 94 stores the frequency when the amplitude of the cutting blade 45 is the largest in the memory 941 of the control means 94 as a frequency in the same phase mode (second amplitude detection step). Then, the control means 94 compares the amplitude of the cutting blade 45 in the anti-phase mode with the amplitude of the cutting blade 45 in the in-phase mode, selects the frequency in the phase mode with the larger amplitude, and stores it in the memory 941 ( Frequency selection process).

Here, an experimental example conducted by the present inventors will be described.
FIG. 3 shows the amplitude of the blade in the anti-phase mode and the amplitude of the blade in the in-phase mode for the cutting tool (A) equipped with the metal bond cutting blade and the cutting tool (B) equipped with the resin bond cutting blade. The result is shown. The cutting tool (A) equipped with the metal bond cutting blade has an outer diameter of 80 mm, an inner diameter of 42 mm, and a thickness of 0.3 mm. The resin bond cutting blade has an outer diameter of 80 mm, an inner diameter of 42 mm, and a thickness of 0.1 mm. The AC power applied to the ultrasonic transducer 6 was 55 V in voltage and 600 mA in current. As shown in FIG. 3, the cutting tool (A) equipped with a metal bond cutting blade has an amplitude in the antiphase mode of 8.24 μm and an amplitude in the inphase mode of 3.8 μm. The amplitude is larger. On the other hand, a cutting tool (B) equipped with a resin bond cutting blade
The amplitude in the anti-phase mode is 6.48 μm and the amplitude in the in-phase mode is 8.32 μm, and the in-phase mode has a larger amplitude. Therefore, when using a cutting tool (A) equipped with a metal bond cutting blade, select the frequency of the antiphase mode, and a cutting tool (B) equipped with a resin bond cutting blade.
When using, it is desirable to select the frequency of the in-phase mode.

  If the type of cutting tool to be used is known in advance, for each cutting tool, the amplitude of the blade in the anti-phase mode and the amplitude of the blade in the same phase mode are detected as described above, and the amplitude is large. The above frequency in the other phase mode may be selected and stored in the memory 941 of the control means 94.

  Referring back to FIG. 1, the description of the cutting apparatus in the illustrated embodiment is for imaging the surface of the workpiece held on the chuck table 3 and detecting the region to be cut by the grindstone blade 45. The alignment means 12 is provided. The alignment unit 12 includes an imaging unit including an optical unit such as a microscope or a CCD camera. In addition, the cutting apparatus includes a display unit 13 that displays an image or the like captured by the alignment unit 12.

  In the cassette mounting area 14a of the apparatus housing 2, a cassette mounting table 14 for mounting a cassette for storing a workpiece is disposed. The cassette mounting table 14 is configured to be movable in the vertical direction by lifting means (not shown). On the cassette mounting table 14, a cassette 15 for storing a semiconductor wafer W as a workpiece is placed. The semiconductor wafer W accommodated in the cassette 15 has a grid-like street formed on the surface of the wafer, and devices such as capacitors, LEDs and circuits are formed in a plurality of rectangular areas partitioned by the grid-like street. ing. The semiconductor wafer W thus formed is accommodated in the cassette 15 with the back surface adhered to the front surface of the protective tape T mounted on the annular support frame F.

  Further, the cutting device in the illustrated embodiment is a semiconductor wafer W accommodated in a cassette 15 placed on a cassette placement table 14 (a state in which the wafer is supported on an annular frame F via a protective tape T). The unloading means 17 for unloading the semiconductor wafer W onto the temporary table 16, the transport means 18 for transporting the semiconductor wafer W unloaded onto the temporary table 16 onto the chuck table 3, and the semiconductor wafer W cut on the chuck table 3. Cleaning means 19 for cleaning the semiconductor wafer W, and cleaning transport means 20 for transporting the semiconductor wafer W cut on the chuck table 3 to the cleaning means 19.

The operation of the cutting apparatus configured as described above will be briefly described mainly with reference to FIG.
When performing the cutting operation, as described above, the blade amplitude in the antiphase mode and the blade amplitude in the same phase mode are detected for the cutting tool 43 attached to the tip of the rotary spindle 42, and the phase with the larger amplitude is detected. The frequency in the mode is selected and stored in the memory 941 of the control means 94. Further, as described above, the cutting tool 43 is detected in advance as described above for the blade amplitude in the anti-phase mode and the blade amplitude in the same phase mode, and the control frequency is selected by selecting the frequency in the phase mode with the larger amplitude. 94, the code No. of the corresponding cutting tool is input from the input means 95.

  If the frequency in the phase mode with the larger amplitude is selected for the cutting tool 43 attached to the tip of the rotary spindle 42 as described above, the cutting apparatus performs the cutting operation. That is, the semiconductor wafer W accommodated in a predetermined position of the cassette 15 placed on the cassette placement table 14 is positioned at the carry-out position when the cassette placement table 14 moves up and down by a lifting means (not shown). Next, the unloading means 17 moves forward and backward to unload the semiconductor wafer W positioned at the unloading position onto the temporary placement table 16. The semiconductor wafer W carried out to the temporary placement table 16 is transferred onto the chuck table 3 by the turning operation of the transfer means 18. When the semiconductor wafer W is placed on the chuck table 3, suction means (not shown) is operated to suck and hold the workpiece W on the chuck table 3. Further, the support frame F that supports the workpiece W via the protective tape T is fixed by the clamp 33. In this way, the chuck table 3 holding the semiconductor wafer W is moved to just below the alignment means 12. When the chuck table 3 is positioned immediately below the alignment means 12, the street formed on the semiconductor wafer W is detected by the alignment means 12, and the spindle unit 4 is moved and adjusted in the direction of the arrow Y, which is the indexing direction. A precision alignment operation with the cutting blade 45 of the tool 43 is performed.

  Thereafter, while the cutting blade 45 is cut and fed by a predetermined amount in the direction indicated by the arrow Z and rotated in the predetermined direction, the chuck table 3 that sucks and holds the semiconductor wafer W is moved in the direction indicated by the arrow X (cutting blade 45). The semiconductor wafer W held on the chuck table 3 is cut along a predetermined street by the cutting blade 45 by moving at a predetermined cutting feed speed in a direction perpendicular to the rotation axis of the magnetic head. In this cutting step, AC power having a frequency selected as described above is applied to the ultrasonic transducer 6 by the power supply means 7. As a result, as described above, the ultrasonic transducer 6 is ultrasonically vibrated by being repeatedly displaced in the radial direction. This ultrasonic vibration is transmitted to the vibration transmission member 44 of the cutting tool 43 via the rotary spindle 42, and the vibration transmission member 44 ultrasonically vibrates in the radial direction. Accordingly, the cutting blade 45 attached to the vibration transmitting member 44 vibrates ultrasonically in the radial direction. Since the ultrasonic vibration acting on the cutting blade 45 is set to a frequency at which the amplitude becomes the largest as described above, the cutting resistance by the cutting blade 45 can be effectively reduced. Even difficult-to-cut materials can be easily cut.

The perspective view of the cutting device comprised according to this invention. Sectional drawing of the spindle unit with which the cutting apparatus shown in FIG. 1 is equipped. For the cutting tool (A) equipped with a metal bond cutting blade and the cutting tool (B) equipped with a resin bond cutting blade, the result of measuring the amplitude of the blade in the antiphase mode and the amplitude of the blade in the same phase mode is shown. Figure.

Explanation of symbols

2: Device housing 3: Chuck table mechanism 30: Chuck table 4: Spindle unit 41: Spindle housing 42: Rotating spindle 43: Cutting tool 44: Vibration transmitting member 45: Grinding wheel blade 5: Electric motor 6: Ultrasonic vibrator 7: Power supply means 8: Rotary transformer 81: Power reception means 82: Power supply means 91: AC power supply 92: Current adjustment means 93: Frequency adjustment means 94: Control means 95: Input means 97: Amplitude detection means 12: Alignment means 13: Display means 34: Cassette mounting table 15: Cassette 16: Temporary table 17: Unloading means 18: Conveying means 19: Cleaning means

Claims (3)

A method of setting the frequency of alternating current power applied to ultrasonic vibration means disposed on a rotating spindle to which a cutting tool equipped with a cutting blade is attached,
A first amplitude detecting and measuring step of detecting an amplitude of a cutting blade by applying AC power having a frequency resonating in an antiphase mode to the ultrasonic vibration means;
A second amplitude detecting step of applying AC power of a frequency resonating in the same phase mode to the ultrasonic vibration means to detect the amplitude of the cutting blade;
Frequency selection for selecting, as the frequency of the AC power applied to the ultrasonic vibration means, the frequency at which a large amplitude is obtained from the amplitudes of the cutting blades detected by the first amplitude detection step and the second amplitude detection step. Including a process,
An AC power frequency setting method for applying ultrasonic vibration to a cutting tool. A chuck table for holding a workpiece, a rotary spindle for cutting the workpiece held on the chuck table, a cutting tool provided with a cutting blade attached to an end surface of the rotary spindle, and the rotary spindle A cutting means provided with the ultrasonic vibration means provided, and a power supply means for applying AC power to the ultrasonic vibration means, and the power supply means sets the frequency of the AC power applied to the ultrasonic vibration means. In a cutting apparatus comprising a frequency adjusting means for adjusting and a control means for controlling the frequency adjusting means,
Amplitude detecting means for detecting the amplitude of the cutting blade of the cutting tool attached to the rotary spindle and sending an amplitude signal to the control means;
The control means generates an amplitude signal obtained when the amplitude detecting means detects the amplitude of the cutting blade when AC power having a frequency resonating in the same phase mode is applied to the ultrasonic vibration means. Based on the frequency in the phase mode with the larger amplitude,
The cutting device characterized by the above-mentioned.   3. The cutting apparatus according to claim 2, wherein the control means includes a memory for storing the selected frequency, and controls the frequency adjusting means based on the frequency stored in the memory.

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