JP2008066449A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP2008066449A JP2008066449A JP2006241487A JP2006241487A JP2008066449A JP 2008066449 A JP2008066449 A JP 2008066449A JP 2006241487 A JP2006241487 A JP 2006241487A JP 2006241487 A JP2006241487 A JP 2006241487A JP 2008066449 A JP2008066449 A JP 2008066449A
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- heater electrode
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- 239000004065 semiconductor Substances 0.000 title claims description 34
- 238000009792 diffusion process Methods 0.000 claims abstract description 38
- 239000010410 layer Substances 0.000 claims description 32
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 27
- 239000011229 interlayer Substances 0.000 claims description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 8
- 238000005229 chemical vapour deposition Methods 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052721 tungsten Inorganic materials 0.000 claims description 5
- 239000010937 tungsten Substances 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- CYKMNKXPYXUVPR-UHFFFAOYSA-N [C].[Ti] Chemical compound [C].[Ti] CYKMNKXPYXUVPR-UHFFFAOYSA-N 0.000 claims description 3
- DXZIFGZIQQRESB-UHFFFAOYSA-N [C].[Ti].[Si] Chemical compound [C].[Ti].[Si] DXZIFGZIQQRESB-UHFFFAOYSA-N 0.000 claims description 3
- UGACIEPFGXRWCH-UHFFFAOYSA-N [Si].[Ti] Chemical compound [Si].[Ti] UGACIEPFGXRWCH-UHFFFAOYSA-N 0.000 claims description 3
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 claims description 3
- GPBUGPUPKAGMDK-UHFFFAOYSA-N azanylidynemolybdenum Chemical compound [Mo]#N GPBUGPUPKAGMDK-UHFFFAOYSA-N 0.000 claims description 3
- HWLDNSXPUQTBOD-UHFFFAOYSA-N platinum-iridium alloy Chemical compound [Ir].[Pt] HWLDNSXPUQTBOD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 230000015654 memory Effects 0.000 abstract description 48
- 230000020169 heat generation Effects 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 11
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 230000009466 transformation Effects 0.000 abstract 6
- 239000000463 material Substances 0.000 description 23
- 239000013078 crystal Substances 0.000 description 8
- 239000010936 titanium Substances 0.000 description 8
- 238000000151 deposition Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- AKUCEXGLFUSJCD-UHFFFAOYSA-N indium(3+);selenium(2-) Chemical compound [Se-2].[Se-2].[Se-2].[In+3].[In+3] AKUCEXGLFUSJCD-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011669 selenium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910005542 GaSb Inorganic materials 0.000 description 1
- 229910005537 GaSeTe Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 229910006913 SnSb Inorganic materials 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 150000004770 chalcogenides Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- VTGARNNDLOTBET-UHFFFAOYSA-N gallium antimonide Chemical compound [Sb]#[Ga] VTGARNNDLOTBET-UHFFFAOYSA-N 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- -1 nitrogen ions Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- DDJAGKOCVFYQOV-UHFFFAOYSA-N tellanylideneantimony Chemical compound [Te]=[Sb] DDJAGKOCVFYQOV-UHFFFAOYSA-N 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- MNWRORMXBIWXCI-UHFFFAOYSA-N tetrakis(dimethylamido)titanium Chemical compound CN(C)[Ti](N(C)C)(N(C)C)N(C)C MNWRORMXBIWXCI-UHFFFAOYSA-N 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/30—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/841—Electrodes
- H10N70/8413—Electrodes adapted for resistive heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8825—Selenides, e.g. GeSe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8828—Tellurides, e.g. GeSbTe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/884—Switching materials based on at least one element of group IIIA, IVA or VA, e.g. elemental or compound semiconductors
Landscapes
- Semiconductor Memories (AREA)
Abstract
【解決手段】 本発明の相変化メモリにおいて、セルトランジスタの拡散層と相変化膜との間をコンタクトプラグ、バッファプラグ、ヒータ電極の多段構成とする。コンタクトプラグ、バッファプラグ、ヒータ電極の順に比抵抗は高く、その径は小さくする。ヒータ電極は小さな径で、高抵抗であることから電流密度が大きく、発熱効率がよい。さらにバッファプラグをやや高抵抗とすることで、コンタクトプラグへの熱拡散を抑制できる。これにより発熱効率を向上させ、小さな書換え電流でデータの書換えを行うことができる。
【選択図】 図4
Description
2 相変化領域
3 相変化膜
4 上部電極
5 ゲート電極
6 ソース拡散層
7 GND配線
8 プラグ
9 プラグ
10 ドレイン拡散層
32 高抵抗部
Claims (8)
- セルトランジスタの1つの拡散層に接続されたコンタクトプラグと、相変化膜に接続されたヒータ電極とを備え、前記コンタクトプラグと前記相変化膜とを接続するバッファプラグをさらに備えたことを特徴とする半導体装置。
- 前記コンタクトプラグ、前記バッファプラグ及び前記ヒータ電極のそれぞれは、別々の層間絶縁膜中に形成され、中心位置がほぼ一致する位置に半導体基板の垂直方向に半導体基板側から前記コンタクトプラグ、前記バッファプラグ及び前記ヒータ電極の順に縦積みされたことを特徴とする請求項1に記載の半導体装置。
- 前記コンタクトプラグ、前記バッファプラグ及び前記ヒータ電極のそれぞれの直径は、縦積みされた前記コンタクトプラグ、前記バッファプラグ及び前記ヒータ電極の順に小さくなるように形成されたことを特徴とする請求項2に記載の半導体装置。
- 前記コンタクトプラグ、前記バッファプラグ及び前記ヒータ電極のそれぞれの比抵抗は、縦積みされた前記コンタクトプラグ、前記バッファプラグ及び前記ヒータ電極の順に高くなるように形成されたことを特徴とする請求項2に記載の半導体装置。
- 前記コンタクトプラグは、W(タングステン)を含むことを特徴とする請求項4に記載の半導体装置。
- 前記バッファプラグは、CVD法により形成されたTiN(チタンナイトライド)を含むことを特徴とする請求項4に記載の半導体装置。
- 前記ヒータ電極は、TiN(チタンナイトライド)、TiSiN(チタンシリコンナイトライド)、TiAlN(チタンアルミニュームナイトライド)、C(カーボン)、CN(カーボンナイトライド)、MoN(モリブデンナイトライド)、TaN(タンタルナイトライド)、PtIr(イリジューム白金)、TiCN(チタンカーボンナイトライド)、TiSiC(チタンシリコンカーボン)のうちいずれかを含むことを特徴とする請求項4に記載の半導体装置。
- 前記ヒータ電極は、その上面から酸素、窒素、カーボン、シリコンのいずれかを供給され、その上部をさらに高い比抵抗としたことを特徴とする請求項7に記載の半導体装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006241487A JP4437300B2 (ja) | 2006-09-06 | 2006-09-06 | 半導体装置 |
US11/847,750 US20080054246A1 (en) | 2006-09-06 | 2007-08-30 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006241487A JP4437300B2 (ja) | 2006-09-06 | 2006-09-06 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008066449A true JP2008066449A (ja) | 2008-03-21 |
JP4437300B2 JP4437300B2 (ja) | 2010-03-24 |
Family
ID=39150224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006241487A Expired - Fee Related JP4437300B2 (ja) | 2006-09-06 | 2006-09-06 | 半導体装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20080054246A1 (ja) |
JP (1) | JP4437300B2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010010816A1 (ja) * | 2008-07-22 | 2010-01-28 | 東京エレクトロン株式会社 | 窒化チタン膜の改質方法及び改質装置 |
JP2012531740A (ja) * | 2009-06-23 | 2012-12-10 | マイクロン テクノロジー, インク. | 封入相変化セル構造および方法 |
CN104103613A (zh) * | 2013-04-12 | 2014-10-15 | 索尼公司 | 具有非易失性存储器的集成电路系统及其制造方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4965576B2 (ja) * | 2007-02-14 | 2012-07-04 | パナソニック株式会社 | 半導体装置及びその製造方法 |
KR20100002654A (ko) * | 2008-06-30 | 2010-01-07 | 주식회사 하이닉스반도체 | 상변화 메모리 소자 및 그 제조 방법 |
CN102832342A (zh) * | 2012-09-14 | 2012-12-19 | 中国科学院上海微系统与信息技术研究所 | 含有TiSiN材料层的相变存储单元及其制备方法 |
CN105552217A (zh) * | 2014-10-30 | 2016-05-04 | 中芯国际集成电路制造(上海)有限公司 | 相变存储器及其形成方法 |
US10147876B1 (en) * | 2017-08-31 | 2018-12-04 | Sandisk Technologies Llc | Phase change memory electrode with multiple thermal interfaces |
CN110335941B (zh) * | 2019-07-03 | 2023-08-18 | 芯盟科技有限公司 | 相变存储器的结构及其形成方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100437458B1 (ko) * | 2002-05-07 | 2004-06-23 | 삼성전자주식회사 | 상변화 기억 셀들 및 그 제조방법들 |
US7482616B2 (en) * | 2004-05-27 | 2009-01-27 | Samsung Electronics Co., Ltd. | Semiconductor devices having phase change memory cells, electronic systems employing the same and methods of fabricating the same |
US20070037316A1 (en) * | 2005-08-09 | 2007-02-15 | Micron Technology, Inc. | Memory cell contact using spacers |
-
2006
- 2006-09-06 JP JP2006241487A patent/JP4437300B2/ja not_active Expired - Fee Related
-
2007
- 2007-08-30 US US11/847,750 patent/US20080054246A1/en not_active Abandoned
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010010816A1 (ja) * | 2008-07-22 | 2010-01-28 | 東京エレクトロン株式会社 | 窒化チタン膜の改質方法及び改質装置 |
JP2010027928A (ja) * | 2008-07-22 | 2010-02-04 | Tokyo Electron Ltd | 窒化チタン膜の改質方法及び改質装置 |
JP4636133B2 (ja) * | 2008-07-22 | 2011-02-23 | 東京エレクトロン株式会社 | 窒化チタン膜の改質方法及び改質装置 |
KR101095318B1 (ko) * | 2008-07-22 | 2011-12-16 | 도쿄엘렉트론가부시키가이샤 | 질화 티탄막의 개질 방법 및 개질 장치 |
TWI392026B (zh) * | 2008-07-22 | 2013-04-01 | Tokyo Electron Ltd | Modification method and modification device of titanium nitride film |
US8409961B2 (en) | 2008-07-22 | 2013-04-02 | Tokyo Electron Limited | Alteration method and alteration apparatus for titanium nitride |
JP2012531740A (ja) * | 2009-06-23 | 2012-12-10 | マイクロン テクノロジー, インク. | 封入相変化セル構造および方法 |
US8698209B2 (en) | 2009-06-23 | 2014-04-15 | Micron Technology, Inc. | Encapsulated phase change cell structures and methods |
US9064793B2 (en) | 2009-06-23 | 2015-06-23 | Micron Technology, Inc. | Encapsulated phase change cell structures and methods |
CN104103613A (zh) * | 2013-04-12 | 2014-10-15 | 索尼公司 | 具有非易失性存储器的集成电路系统及其制造方法 |
JP2014207451A (ja) * | 2013-04-12 | 2014-10-30 | ソニー株式会社 | 不揮発性メモリを備えた集積回路システム及びその製造方法 |
Also Published As
Publication number | Publication date |
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US20080054246A1 (en) | 2008-03-06 |
JP4437300B2 (ja) | 2010-03-24 |
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