JP2008059802A - Manufacturing method of panel unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve production efficiency of a panel unit by shortening time spent in a sealing process of two glass substrates. <P>SOLUTION: A frit glass 28 is partially heated by a laser beam 42 and is softened into fluid to seal between a front glass substrate 12 and a rear glass substrate 14. And, in order to prevent thermal breakage from a glass edge due to occurrence of thermal strain by the laser beam 42, a panel unit 34 is heated ut to a specific pre-heating temperature before being sealed by the frit glass 28. The pre-heating temperature is lower than a sealing temperature of the frit glass 28 and the temperature difference is set up at 150°C or more and 250°C or less. For example, when a sealing temperature of the frit glass 28 is 450°C, the pre-heating temperature is set up at 200 to 300°C. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a panel body, and more particularly to a method for manufacturing a panel body such as a panel for a plasma display manufactured by sealing a front glass substrate and a back glass substrate.

  A plasma display panel (hereinafter referred to as “PDP”), which is a self-luminous and direct-view display, is used as a display for thin large-screen TVs. It consists of two glass substrates consisting of a front glass substrate and a rear glass substrate. It is formed by sealing with a sealing material and enclosing a discharge gas inside. This front glass substrate is formed with a transparent dielectric and a MgO protective layer on the display electrodes for discharging, and the rear glass substrate has striped barrier ribs (ribs) for separating red, green and blue phosphors. The phosphors are applied in order. A PDP having such a surface discharge reflection type stripe structure is commercially available as a mass production type color PDP panel.

  Here, an example of a method for manufacturing a PDP panel disclosed in Reference 1 or the like is shown in the flowchart of FIG.

  In the manufacturing process of the front glass substrate shown in FIG. 7A, first, when the front glass substrate is received (A-1), a display electrode which is a transparent electrode is formed on the front glass substrate (A-2). Next, a thin bus electrode is formed on the display electrode (A-3). A silver paste is used for the bus electrode, and it is formed by using a printing or photolithography process. Next, a transparent glass dielectric layer is formed on the display electrode and the bus electrode (A-4). Further, the front glass substrate is heated to about 250 ° C., and an MgO protective layer is formed on the dielectric layer by a vacuum deposition method (A-5). Thus, a front glass substrate for PDP is manufactured.

  In the manufacturing process of the rear glass substrate shown in FIG. 7B, first, when the rear glass substrate is received (B-1), striped address electrodes are formed on the rear glass substrate (B-2), Striped partition walls are formed on (B-3). In the phosphor layer forming step, red, green and blue pastes are sequentially applied by screen printing and dried, and then fired in air (B-4). Finally, frit glass (a glass paste having a sealing temperature of 400 to 500 ° C.), which is a sealing material for sealing, is applied to the edge of the back glass substrate, and the binder is removed at a temperature around 400 ° C. Form (B-5). Thus, a rear glass substrate for PDP is manufactured. The frit glass may be applied to the front glass substrate or may be applied to both glass substrates.

  The glass substrate assembly and gas filling process shown in FIG. 7C is performed by first separating the rear glass substrate and the front glass substrate with the partition walls by overlapping the display electrodes and the address electrodes so as to face each other. Assembling into a panel body having a partitioned discharge space (C-1). Next, the entire panel body is heated to about 450 ° C. in a heating furnace to soften and flow the frit glass, and the back glass substrate and the front glass substrate are sealed with the softened and flown frit glass. At the same time, a chip tube set in advance in a hole formed on the rear glass substrate is connected by frit glass. Thereafter, the panel body is baked in an atmosphere of about 350 ° C. for about 6 hours while vacuuming the air inside the discharge space from the tip tube, and then the discharge gas is sealed in the discharge space (C-2). Thereafter, the panel body is aged for a predetermined time (C-3), and the process proceeds to a module assembly process and a set assembly (C-4). The above is the assembly process of the conventional PDP.

  By the way, in the conventional sealing method described in Reference 1, the heating furnace is heated to about 450 ° C. for about 4 hours, the panel body is heated for about 1 hour, and the panel body is gradually cooled. Since it takes about 4 hours, it took about a day for sealing, and it took a very long time.

  On the other hand, although it is not a PDP sealing technique, a technique for sealing a glass substrate and a glass cap of a display element by locally heating a seal portion coated with frit glass with a laser beam to a sealing temperature is disclosed in Patent Literature. 1. If this technology is used, it is expected that the frit glass can be heated to a predetermined temperature by laser light to a predetermined temperature and sealed.

  On the other hand, the conventional PDP connects the display electrode and the address electrode to the drive circuit, so that the electrode terminal allowance 1A having a width of about 10 to 15 mm is provided at both ends of the front glass substrate 1 and the rear glass substrate 2 as shown in FIG. 2A is formed. With this PDP configuration, when the frit part 3 positioned inside the electrode terminal allowances 1A and 2A is irradiated with laser light to be heat sealed, the laser irradiation part and the non-irradiation part are increased as the temperature of the laser irradiation part rises. Therefore, the thermal stress generated in the planes of the front glass substrate 1 and the back glass substrate 2 gradually increases. In particular, as shown in FIG. 9, since the tensile thermal stress is concentrated on the glass edge portion 4, there arises a problem that the front glass substrate 1 or the rear glass substrate 2 is cracked from that point.

In Patent Document 2, in order to prevent the thermal cracking due to stress concentration, that is, in order to reduce the thermal stress generated at the time of laser irradiation, the entire glass envelope used in a flat image forming apparatus or the like is heated to a high temperature. A technique of irradiating a frit glass with a sealing temperature of 410 ° C. after preheating to (270 to 340 ° C.) with laser light is disclosed.
Latest Plasma Display Manufacturing Technology Press Journal JP 2003-123966 A JP 2000-149783 A

  However, the sealing method of Patent Document 2 that preheats the entire glass envelope used for a flat type image forming apparatus to a high temperature spends a long time for preheating the entire glass envelope to 270 to 340 ° C. However, it is difficult to generate a thermal crack in the glass envelope, but the production efficiency cannot be dramatically improved. Further, although power such as electric power can be reduced as compared with the prior art, further reduction has been required.

  The present invention has been made in view of such circumstances, and provides a method for manufacturing a panel body that can shorten the time spent for the sealing process of two glass substrates and increase the production efficiency of the panel body. For the purpose. Another object is to reduce power consumption.

  In order to achieve the above-mentioned object, the method invention according to claim 1 prepares a panel assembly by applying a sealing material to a peripheral portion between the first glass substrate and the second glass substrate, In the method for manufacturing a panel body, the first glass substrate and the second glass substrate are sealed to manufacture a panel body by locally heating the sealing material up to a sealing temperature by a heating means and causing it to soften and flow. The panel assembly is heated to a predetermined preheating temperature before sealing with the sealing material, the preheating temperature of the panel assembly is set lower than the sealing temperature of the sealing material by the heating means, and The temperature difference between the preheating temperature of the panel body and the sealing temperature of the sealing material is set to 150 ° C. or more and 250 ° C. or less.

  According to the first aspect of the present invention, the sealing material is softly flowed by locally heating the sealing material to the sealing temperature by the heating means, thereby sealing the two glass substrates. Since the heat energy can be concentrated locally, the time for the sealing process can be shortened. And in this invention, in order to prevent the thermal crack of the glass substrate resulting from the thermal stress generation | occurrence | production by a heating means, a panel body is heated to predetermined | prescribed preheating temperature before sealing with the said sealing material. The preheating temperature was lower than the sealing temperature of the sealing material, and the temperature difference was set to 150 ° C. or higher and 250 ° C. or lower. For example, when the sealing temperature of the sealing material is 450 ° C., the preheating temperature is set to 200 to 300 ° C. Thereby, this invention is compared with the sealing method of patent document 3 whose difference of the sealing temperature (410 degreeC) of a frit glass and the preheating temperature (270-340 degreeC) of a panel body is 70-140 degreeC. The time spent for the sealing process of the two glass substrates can be shortened, and thereby the production efficiency of the panel body can be increased. Further, the power load used for preheating is reduced, and the power consumption can be further reduced. The preheating temperature is more preferably 200 to 300 ° C.

  According to a second aspect of the present invention, in the first aspect, the heating means is a laser, the sealing material is a frit glass capable of absorbing laser light of the laser, and a sealing temperature of the frit glass is 380. It is characterized by ˜550 ° C.

  According to the second aspect of the present invention, the frit portion is irradiated with the laser beam having a wavelength absorbed by the frit glass on the frit portion coated with black or gray frit glass at a sealing temperature of 380 to 550 ° C. Only heat and seal the two glass substrates. By using a laser as the heating means, energy can be concentrated locally, so that the sealing process can be shortened.

  A third aspect of the present invention is characterized in that in the first or second aspect, the panel body is a flat panel display panel body.

  According to the third aspect of the present invention, the first and second aspects of the present invention can be applied to flat displays such as a plasma display panel (PDP), a field emission display (FED), and a surface-conduction electron-emitter display (SED). It can be applied to panel bodies for panel displays.

  According to a fourth aspect of the present invention, in the third aspect, the width of the electrode terminal margin formed on the first glass substrate and the second glass substrate of the flat panel display panel body is 11 mm or less. It is characterized by.

  According to invention of Claim 4, when the width | variety of the power terminal cost was made small, the thermal stress concerning an edge part will become small and it discovered by experiment that it becomes difficult to produce a thermal crack. Therefore, in laser irradiation sealing, it is preferable to reduce the power terminal cost.For example, by substantially eliminating the power terminal cost, the flat panel display panel body becomes difficult to break, and the yield is improved and the preheating temperature is greatly increased. Can be lowered. In order to substantially eliminate the power terminal cost, for example, the connection of the display electrode, the address electrode and the driving circuit can be performed at the edge portion of the glass substrate.

  It has been demonstrated from experiments that when the tensile stress applied to the glass edge exceeds approximately 40 MPa as a value obtained by the simulation, thermal cracking starts from the glass edge, and the frit is based on this verification result. When the temperature difference between the glass sealing temperature and the preheating temperature is, for example, 150 ° C., if the width of the electrode terminal margin is set to more than 7 mm, thermal cracking occurs starting from the glass edge, and the temperature difference is, for example, 250 ° C. In this case, thermal cracking occurs when the width of the electrode terminal margin is set to more than 8 mm. That is, there is a correlation between the preheating temperature and the width dimension of the electrode terminal allowance, and as the width dimension of the electrode terminal allowance is reduced, the preheating temperature can be set lower, and the process time and power consumption can be reduced.

  According to a fifth aspect of the present invention, in the fourth aspect, the flat panel display panel body is a plasma display panel body, and the first glass substrate of the panel assembly is preheated by the first glass. It is characterized in that the retained heat of the first glass substrate heated when the MgO protective layer is formed on the substrate is used.

  According to the invention described in claim 5, in the case of PDP, a transparent glass dielectric layer is formed on the first glass substrate, and an MgO protective layer is formed thereon, which is necessary for the film formation. Laser irradiation is performed on the frit portion while maintaining a high temperature state (about 200 to 300 ° C.). Accordingly, the heat retained during the MgO film formation can be used for preheating the PDP panel body, so that energy saving can be achieved. Further, preferably, the heat obtained in the binder removal process of the frit glass on which the second glass substrate is also applied is used for preheating the PDP panel body.

  According to the method for manufacturing a panel body according to the present invention, the sealing material is softly flowed by locally heating the sealing material to the sealing temperature by the heating means, and the two glass substrates are sealed. Since the energy can be concentrated, the sealing process time can be shortened. And in this invention, in order to prevent the thermal crack of the glass substrate resulting from the thermal stress generation | occurrence | production by a heating means, a panel body is heated to predetermined | prescribed preheating temperature before sealing with the said sealing material. The preheating temperature is lower than the sealing temperature of the sealing material, and the temperature difference is set to 150 ° C. or more and 250 ° C. or less, so the time spent for the sealing process of the two glass substrates can be shortened, thereby The production efficiency of the panel body can be increased. In addition, by using the heat obtained in the immediately preceding process as it is, the time spent for the sealing process can be further shortened, which contributes to significant energy saving.

  Hereinafter, preferred embodiments of a method for manufacturing a panel body according to the present invention will be described with reference to the accompanying drawings.

  FIG. 1 is an enlarged cross-sectional view of a main part showing an assembly structure of a PDP 10 which is a panel body of the embodiment, FIG. 2 is a structural view showing a sealing device 50 of the PDP 10, and FIG. 3 is a flowchart showing a manufacturing process of the PDP 10. It is. The flowchart of FIG. 3 will be described below with reference to FIGS.

  The process (A ｀) shown in the flowchart of FIG. 3 is a manufacturing process of the front glass substrate (first glass substrate) 12, and the process (B ｀) is a manufacturing process of the rear glass substrate (second glass substrate) 14. (C ｀) shows the final stage processes such as assembly of the front glass substrate 12 and the back glass substrate 14 and gas filling.

  In the manufacturing process of the front glass substrate 12 shown in FIG. 3 (A ｀), first, the front glass substrate 12 is received (A｀-1), and, for example, indium tin oxide (ITO) is deposited on the front glass substrate 12 by vapor deposition. Then, the striped display electrode 16 is formed by using a photolithography process (A｀-2). Next, since the display electrode 16 has high resistance, a thin bus electrode 18 is formed on the display electrode 16 to prevent a voltage drop (A｀-3). A silver paste is used for the bus electrode 18, and the bus electrode 18 is formed by using printing or a photolithography process. Next, a low melting glass powder paste is applied onto the display electrode 16 and the bus electrode 18 by printing or sheet lamination, and then heated to about 600 ° C. to form a transparent glass dielectric layer 20 (A （ -4). Furthermore, it heats to about 200-250 degreeC in a vacuum chamber, and forms the MgO protective layer 30 on the dielectric material layer 20 with a vacuum evaporation method (A｀-5). Thus, the front glass substrate 12 for the PDP 10 is manufactured.

  Next, the manufacturing process of the back glass substrate 14 shown in FIG. 3 (B ｀) first receives the back glass substrate 14 (B｀-1), screen-prints silver paste on the back glass substrate 14, and then fires it. Thus, a stripe-shaped address electrode 22 is formed (B （-2), and a stripe-shaped partition wall 24 is formed so as to cover a part of the address electrode 22 (B｀-3). That is, a rib-like partition wall 24 is formed by repeatedly applying a rib paste obtained by adding a binder and a solvent to low melting glass particles at a predetermined pitch by a screen printing method. In the formation process of the phosphor layer 26, pastes each containing red, green, and blue phosphors are applied to the barrier ribs in sequence by screen printing, dried, and then fired in air to form the phosphor layer 26. (B｀-4). Finally, black or gray frit glass 28 (see FIG. 2), which is a sealing seal, is applied to the edge of the back glass substrate 14, and the binder is removed at a temperature around 400 ° C. to form a seal portion ( B｀-5). Thereby, the rear glass substrate 14 for the PDP 10 is manufactured.

The frit glass 28 may be applied to the front glass substrate 12 or may be applied to both glass substrates 12 and 14. The frit glass 28 preferably has a sealing temperature of 380 to 550 ° C., particularly 400 to 500 ° C., and preferably has a thermal expansion coefficient after firing of 60 to 90 × 10 ⁻⁷ / ° C. This material is composed of 1) PbO—B ₂ O ₃ , PbO—ZnO—B ₂ O ₃ , PbO—B ₂ O ₃ —ZnO—SiO ₂ glass powder capable of absorbing laser light, titanium Mixed with appropriate amount of filler materials such as lead acid, lead titanate solid solution, zircon, zirconium silicate, willemite, cordierite, tin oxide, β-eucryptite, 2) Bi ₂ O ₃ -B ₂ O ₃ glass powder 3) An appropriate amount of filler material such as zircon, cordierite, aluminum titanate, and willemite mixed in 3) An appropriate amount of filler material such as silica glass, cordierite, zirconium phosphate, and tin oxide in SnO-P ₂ O ₅ glass powder A mixture may be mentioned. This is applied as a paste kneaded in a solvent (vehicle) containing a known binder.

The front glass substrate 12 and the back glass substrate 14 are made of high strain point glass or soda lime glass, and preferably have a thermal expansion coefficient of 65 to 95 × 10 ⁻⁷ / ° C. In particular, it is more preferable to use high strain point glass because thermal deformation and thermal shrinkage that may occur in the manufacturing process of the PDP are reduced.

  Next, the glass substrate assembly and gas sealing process shown in FIG. 3 (C ｀) is performed by the front glass substrate 12 heated to about 250 ° C. in the MgO protective layer forming step and the back surface heated to about 250 ° C. by another heating means. The glass substrate 14 is brought into the chamber 52, and the back glass substrate 14 is overlapped with the display electrodes (transparent electrodes) 16 and the address electrodes 22 so as to face each other so as to be separated by the partition walls 24. The panel body 34 having the space 32 is assembled (C｀-1). When the sealing temperature of the frit glass 28 is 450 ° C., the panel body 34 is maintained at 200 to 250 ° C. or heated (preheated) to 300 ° C. by the heater 36 in the chamber 52. That is, at the time of sealing using the laser oscillator 38 that is performed thereafter, preheating is performed to a temperature that reduces the thermal stress applied to the edge portion of the panel body 34. After detecting that the panel body 34 is maintained at 200 to 250 ° C. or heated to 300 ° C. by the thermocouple 40, the frit portion (frit glass 28 is applied to the panel body 34 from the transparent window 46 of the chamber 52. The laser light is scanned and irradiated from the laser oscillator 38 along the portion), and the frit part is locally heated to a sealing temperature of about 450 ° C. As a result, the frit glass 28 softens and flows, and the back glass substrate 14 and the front glass substrate 12 are sealed by the softened and flown frit glass 28 (C｀-2).

  Preferably, if the chamber 52 is filled with a discharge gas having a predetermined pressure obtained by mixing neon gas and xenon gas before the above-described sealing, the discharge space 32 is filled with the neon gas and the discharge gas (C IV-2). Thereafter, the panel body 34 is aged for a predetermined time (C｀-3), and the process proceeds to the module assembly process and set assembly (C｀-4). Through the above steps, the PDP 10 of the embodiment is assembled. In addition, in the sealing apparatus 50 of FIG. 2, the code | symbol 44 is a support stand in which the panel body 34 is mounted.

  As the laser oscillator 38, in addition to the Nd: YAG laser (oscillation wavelength λ = 1064 nm), any laser having a wavelength that is relatively transmissive to the glass but absorbed by the black or gray frit glass 28 may be used. Any laser such as a semiconductor laser, a gallium arsenide aluminum semiconductor laser, an LD pumped solid laser, a fiber laser, or a carbon dioxide gas laser can be used.

  In the assembled PDP 10, cells that emit red, green, and blue colors are formed where the display electrodes 16 and the address electrodes 22 intersect. Then, an address discharge pulse is applied between the scan electrode of the display electrode 16 and the address electrode 22 by a drive circuit (not shown) connected via a panel drive circuit (not shown) of the PDP 10 to emit light. The wall charge is accumulated in the cell. Thereafter, a sustain discharge pulse is applied between the scan electrode and the sustain electrode of the display electrode 16 to perform a sustain discharge in the cell in which the wall charges are accumulated. Then, ultraviolet light is emitted along with the discharge of the cell, and is converted into visible light by the phosphor layer 26. By lighting the cell in this way, a color image is displayed on the PDP 10.

  FIG. 4 shows the relationship between the electrode terminal allowance and the thermal stress applied to the glass edge portion in the front glass substrate and the back glass substrate when locally heated to 450 ° C. which is the sealing temperature at which the frit is sealed by the laser. It is the table | surface and graph which were calculated | required.

Here, the front glass substrate and the rear glass substrate have a thickness of 2.8 mm (high strain point glass: thermal expansion coefficient 83 × 10 ⁻⁷ / ° C., strain point 570 ° C., trade name: PD200, manufactured by Asahi Glass Co., Ltd.). Further, the temperature raising time from the preheating temperature to reaching the sealing temperature was 3 minutes. Moreover, as a sample of the panel body 34, the thing of the preheating temperature of 100 degreeC, 150 degreeC, 200 degreeC, 250 degreeC, 300 degreeC, 350 degreeC was used. In the graph of FIG. 4, the vertical axis represents the thermal stress (MPa) applied to the glass edge portion, and the horizontal axis represents the width dimension (mm) of the electrode terminal allowance of the panel body 34. In the vertical axis, plus indicates tensile stress and minus indicates compressive stress. On the other hand, when laser heating is performed under the conditions of the width dimension of the electrode terminal allowance and the preheating temperature at which the tensile stress value applied to the glass edge portion obtained in the simulation exceeds approximately 40 MPa, thermal cracking starts from the glass edge portion during laser irradiation. Has been experimentally demonstrated.

  Based on this verification result and the simulation result shown in FIG. 4, the relationship between the width dimension of the electrode terminal allowance and the preheating temperature is verified.

  In the graph of FIG. 4, in the case of the panel body 34 having a preheating temperature of 100 ° C., since the preheating temperature is low, the thermal cracking starting from the glass edge is prevented by setting the width dimension of the electrode terminal margin to about 6 mm or less. I understand that I can do it. Further, in the case of the panel body 34 having a preheating temperature of 150 ° C., since the preheating temperature is also low, it is possible to prevent thermal cracking starting from the glass edge by setting the width dimension of the electrode terminal margin to about 7 mm or less. I understand. Furthermore, in the case of the panel body 34 having a preheating temperature of 200 ° C., it can be seen that thermal cracking starting from the glass edge can be prevented by setting the width dimension of the electrode terminal margin to about 8.5 mm or less. And in the case of the panel body 34 whose preheating temperature is 250 degreeC, it turns out that the thermal crack which started from the glass edge can be prevented by setting the width dimension of an electrode terminal margin to about 10.5 mm or less. Moreover, in the case of the panel body 34 with a preheating temperature of 300 ° C., it can be seen that thermal cracking starting from the glass edge can be prevented by setting the width dimension of the electrode terminal margin to about 14 mm or less. Finally, in the case of the PDP 10 having a preheating temperature of 350 ° C., the panel body 34 is preheated to a high temperature, so that thermal cracking starting from the glass edge is essential even if the width dimension of the electrode terminal margin is set to about 30 mm or more. Does not occur.

  However, if the preheating temperature of the panel body 34 is set high, the heat energy spent for preheating increases, and the time spent for preheating becomes long, which is not preferable.

  Therefore, in the sealing device 50 shown in FIG. 2 of the embodiment, the high temperature state (about 200 to 250 ° C.) at the time of forming the MgO protective layer formed on the front glass substrate 12 is maintained, and if necessary Is heating and irradiating the frit glass 28 with a laser. That is, the heat (retained heat) generated by heating the front glass substrate 12 during the MgO film formation is used for preheating the panel body 34. For this reason, it is preferable to set the preheating temperature to 200 to 300 ° C. from the viewpoint of reducing the thermal energy spent for preheating the panel body 34, and more preferably 200 to 250 ° C.

  FIG. 5 shows the relationship between the width dimension (mm) of the electrode terminal allowance at which the tensile stress at the glass edge becomes 40 MPa and the temperature difference (ΔT) between the sealing temperature of the frit glass 28 and the preheating temperature by simulation. It is a table | surface and a graph. Here, the front glass substrate and the back glass substrate were PD200 of the same thickness of 2.8 mm, and the temperature rising time from the preheating temperature to reaching the sealing temperature was 3 minutes. The frit glass 28 has a sealing temperature of 450 ° C., and a portion of the panel body corresponding to the frit glass 28 is heated to the sealing temperature. Moreover, as a sample of the panel body 34, the thing of the preheating temperature of 100 degreeC, 150 degreeC, 200 degreeC, 250 degreeC, and 300 degreeC was used.

Since the preheating temperature of the panel body 34 is preferably 200 to 300 ° C. from the viewpoint of reducing thermal energy as described above, the temperature difference (ΔT) between the sealing temperature of the frit glass 28 and the preheating temperature is 150 to 250 ° C. 5 and a polynomial approximated from the data values (y = 0.00019ΔT ² −0.1347ΔT + 30.183, where y is an electrode cost of 40 MPa), the electrode terminal allowance width dimension (B: FIG. 6) is preferably set to 14.4 mm or less when the temperature difference ΔT is 150 ° C., and is preferably set to 8.4 mm or less when the temperature difference ΔT is 250 ° C.

  Furthermore, since the preheating temperature of the panel body 34 is more preferably 200 to 250 ° C., the temperature difference (ΔT) between the sealing temperature and the preheating temperature of the frit glass 28 is 200 to 250 ° C., and the table and data shown in FIG. From the graph of the polynomial approximated from the value (where y = 0.00019ΔT2−0.1347ΔT + 30.183), the electrode terminal margin width dimension (B: see FIG. 6) shows that the temperature difference ΔT is It can be seen that it is preferably set to 10.4 mm or less when the temperature is 200 ° C., and is preferably set to 8.4 mm or less when the temperature difference ΔT is 250 ° C.

FIG. 6 is a plan view of the prototype panel body 61 when the sealing test is performed in the embodiment as if it were a PDP panel body. The fritted glass 28 has a peripheral size of 75 mm × 75 mm, a width of 5 mm, and a height of 0.3 mm on a glass substrate 63 (PD200 same as the above) that is regarded as a rear glass substrate having a size of 76 mm × 90 mm and a thickness of 2.8 mm. (Product name: LS-0206, coefficient of thermal expansion after firing 72 × 10 ⁻⁷ / ° C., manufactured by Nippon Electric Glass Co., Ltd.) was applied, and the binder was removed at 400 ° C. Then, it installed in the sealing apparatus 50 of FIG. 2, and the glass substrate 62 (PD200 same as the above) overlapped on the front glass substrate with a size of 76 mm × 90 mm and a thickness of 2.8 mm was overlaid. Note that the width B assimilated to the electrode terminal allowance in this configuration is 7.5 mm. The sealing temperature of the frit glass 28 is 450 ° C. After maintaining the glass substrates 62 and 63 at 250 ° C. with a heater, a laser beam with an output of 90 W is irradiated through the glass substrate for 6 minutes per side of 62 and 63 by an Nd: YAG laser oscillator (oscillation wavelength λ = 1064 nm). did. As a result of setting the preheating temperature to 250 ° C. and the width B estimated as the electrode terminal margin to 7.5 mm, the glass substrates 62 and 63 are not broken even when locally heated to the sealing temperature with laser light, and the frit glass 28 is softened and flowed. And was able to seal in an extremely short time.

  On the other hand, the frit is set so that the outer peripheral dimensions are 75 mm × 75 mm, the width is 5 mm, and the height is 0.3 mm on the glass substrate 63 (PD200) as a back glass substrate having a size of 76 mm × 100 mm and a thickness of 2.8 mm. Glass 28 (LS-0206) was applied, and the binder was removed at 400 ° C. Then, it installed in the sealing apparatus 50 of FIG. 2, and overlap | superposed the glass substrate 62 (PD200 same as the above) on the front glass substrate with a size of 76 mm x 100 mm and a thickness of 2.8 mm. Note that the width B assimilated to the electrode terminal allowance in this configuration is 12.5 mm. Moreover, the sealing temperature of frit glass is 450 degreeC. After the glass substrates 62 and 63 were maintained at 250 ° C. with a heater, an attempt was made to irradiate laser light with an output of 90 W per side for 6 minutes with an Nd: YAG laser oscillator (oscillation wavelength λ = 1064 nm). However, as a result of setting the preheating temperature to 250 ° C. and the width B assumed to be the electrode terminal allowance to 12.5 mm, the glass assumed to be the front glass substrate along the laser irradiation direction during the lapse of about 1 minute 30 seconds during the laser irradiation. The substrate 62 was thermally cracked and could not be sealed. When the fracture starting point due to the thermal cracking was examined, it was the edge portion of the glass substrate 62 that was regarded as a front glass substrate.

  As described above, since the preheating temperature of the panel body 34 is set so that the temperature difference with the sealing temperature of the frit glass 28 is 150 ° C. or more and 250 ° C. or less, the temperature difference is 70 to 140 ° C. Compared with the sealing method of Patent Document 3, the time spent for the sealing process of the front glass substrate 12 and the rear glass substrate 14 can be shortened, and thereby the production efficiency of the PDP 10 can be increased.

  In addition, if the width of the power terminal margin is reduced, the thermal stress applied to the glass edge portion is reduced and it is difficult to break. Therefore, in laser irradiation sealing, it is preferable to reduce the power terminal margin, for example, the power terminal substantially. By eliminating the allowance, the PDP 10 is difficult to break, the yield is improved, and the preheating temperature can be greatly reduced.

  The method of the present invention can be applied not only to PDP but also to flat panel displays such as FED and SED. The FED and SED are self-luminous types that emit light by causing electrons to collide with a phosphor as in the case of the CRT, and have a structure in which an electron emission portion corresponding to an electron gun of a cathode ray tube is provided by the number of pixels. For this reason, FED and SED have features such as high moving image followability, high contrast, and high gradation in addition to high luminance and high definition, and can realize high image quality and low power consumption.

The principal part expanded sectional view of PDP manufactured by the manufacturing method of the panel body which concerns on this invention Explanatory drawing showing the structure of the PDP sealing device Flow chart showing the manufacturing method of PDP Tables and graphs obtained by simulation of the relationship between the electrode terminal allowance and edge stress of the front glass substrate and rear glass substrate Tables and graphs showing the relationship between the width dimension of the electrode terminal allowance at which the tensile stress at the glass edge is 40 MPa and the temperature difference between the frit glass sealing temperature and the preheating temperature by simulation In the Example, the top view of the prototype panel body when performing the sealing test on the assumption that it is a PDP panel body A flowchart showing a conventional method of manufacturing a PDP The top view which shows the state which piled up the front glass substrate and back glass substrate of PDP Plan view of PDP explaining that thermal cracking occurs from edge by laser sealing

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Front glass substrate, 2 ... Back glass substrate, 1A, 2A ... Electrode terminal cost, 3 ... Frit part, 4 ... Glass edge part, 10 ... PDP, 12 ... Front glass substrate, 14 ... Back glass substrate, 16 ... Display Electrode, 18 ... bus electrode, 20 ... glass dielectric layer, 22 ... address electrode, 24 ... partition wall, 26 ... phosphor layer, 28 ... frit glass, 30 ... MgO protective layer, 32 ... discharge space, 34 ... panel body, 36 ... heater, 38 ... laser oscillator, 40 ... thermocouple, 42 ... laser beam, 44 ... support base, 46 ... transparent window, 50 ... sealing device, 52 ... chamber, 61 ... prototype panel body, 62 ... front glass substrate A glass substrate resembling a glass substrate, 63... A glass substrate resembling a rear glass substrate, and 64 a frit paste

Claims (5)

A sealing material is applied to the peripheral edge between the first glass substrate and the second glass substrate to prepare a panel assembly, and the sealing material is locally heated to a sealing temperature by a heating means to be softened and flowed. In the panel body manufacturing method for manufacturing the panel body by sealing the first glass substrate and the second glass substrate,
The panel assembly is heated to a predetermined preheating temperature before sealing with the sealing material,
The preheating temperature of the panel assembly is set lower than the sealing temperature of the sealing material, and the temperature difference between the preheating temperature of the panel assembly and the sealing temperature of the sealing material is 150 ° C. or higher and 250 ° C. or lower. A method for manufacturing a panel body, wherein   The heating means is a laser, and the sealing material is frit glass capable of absorbing laser light of the laser, and a sealing temperature of the frit glass is 380 to 550 ° C. The manufacturing method of the panel body as described.   The panel body manufacturing method according to claim 1, wherein the panel body is a flat panel display panel body.   The width | variety of the electrode terminal margin formed in the said 1st glass substrate and 2nd glass substrate of the said panel body for flat panel displays is 11 mm or less, The manufacture of the panel body of Claim 3 characterized by the above-mentioned. Method.   The flat panel display panel is a plasma display panel, and the preheating of the first glass substrate of the panel assembly is performed when the MgO protective layer is formed on the first glass substrate. The method for manufacturing a panel body according to claim 4, wherein the retained heat of one glass substrate is used.

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