JP2000138030A - Glass envelope, its manufacture, and its device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mutually seal glass members by a low energy, by heating an entire vessel up to a value less than a sealing temperature of a sealing material, locally heating the sealing material up to a desired sealing temperature, and setting temperature distribution in a sealing part by the sealing material so as to compensate it in a given range. SOLUTION: A locally heating heater 5 is formed between seal materials (frit glasses 4, 8) and glass members (a rear plate 1, and a face plate 2), and a sealed part (sealing material) is locally heated up to a sealing temperature using the locally heating heater 5. The other part is assist-heated up to a value less than the sealing temperature for preventing break of a glass, and the sealing material is heated and melted with thermal conduction from the glass members. In this case, a projecting portion from a glass outer frame 3 of the face plate 2 and the rear plate 1 is downsized by corners. More specifically, the corners are rounded or cut off. Thus, leak of heat from the outer frame 3 can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin glass display device applied to a color television or a computer terminal, in which a plurality of glass members are sealed using a sealing material, and the inside of the glass member is depressurized. The present invention relates to an envelope, a method and an apparatus for manufacturing the envelope.

[0002]

2. Description of the Related Art Conventionally, when manufacturing a glass envelope having a space inside, frit glass as a sealing material is applied or placed between glass members and sealed with an electric furnace or the like. Put it in a means, or put it on a hot plate heater (it may be sandwiched by a hot plate heater from above and below), heat the entire glass envelope to the sealing temperature, and melt the sealed part between the glass members Seal with glass.

[0003] In particular, when this glass envelope is used as a vacuum container of an image display device, an electron-emitting device is conventionally used in the glass envelope. The electron-emitting devices are roughly classified into two types: a thermionic electron-emitting device and a cold cathode electron-emitting device. The cold cathode electron-emitting device includes a field emission type (hereinafter, referred to as an “FE type”), a metal / insulating layer /
There are a metal type (hereinafter, referred to as "MIM type") and a surface conduction electron-emitting device. Examples of the FE type include W. P.
Dyke & W. W. Dolan, "Field e
mission ", Advance in Elect
oron Physics, 8, 89 (1956) or C.I. A. Spindt, “PHYSICAL Pr
operations of thin-film figure
ld emission cathodes with
molybdenium cones ", J. App.
i. Phys. , 47, 5248 (1976).

[0004] Examples of the MIM type include C.I. A. Mea
d, “Operation of Tunnel-Emi
session Devices ", J. Apply. Ph.
ys. , 32, 646 (1961).

[0005] Examples of the surface conduction electron-emitting device type are disclosed in M.S. I. Elinson, Redio Eng. E
electron Phys. , 10, 1290, (19
65). The surface conduction electron-emitting device utilizes a phenomenon in which electron emission occurs when a current flows through a small-area thin film formed on a substrate in parallel with the film surface. Examples of the surface conduction electron-emitting device include a device using an SnO ₂ thin film by Elinson and the like and a device using an Au thin film [G. Dittmer: "T
Hin Solid Films ", 9, 317 (19
72)], a thin film of In ₂ O ₃ / SnO ₂ [M.
Hartwell and C.M. G. FIG. Fonstad:
“IEEE Trans. ED Conf.” 519
(1975)], and a method using a carbon thin film [Hisashi Araki et al .: Vacuum, Vol. 26, No. 1, page 22, (198
3)] has been reported.

A flat panel image display device that emits a phosphor by an electron beam generated from these cold cathode electron-emitting devices has been developed. The surface conduction electron-emitting device emits electrons by passing a current through a conductive thin film having a high resistance part in a part thereof. For example, Japanese Patent Application Laid-Open No. 2352
No. 55 discloses this in the publication.

In an image display device using electrons, a face plate, a rear plate, and an outer frame are sealed to each other with a sealing material, and the inside is decompressed to form a glass envelope. In the container, an electron source for generating electrons, a driving circuit thereof, an image forming member having a phosphor or the like that emits light by collision of the electrons, an accelerating electrode for accelerating the electrons toward the image forming member, and It is necessary to configure a high voltage power supply and the like.

[0008]

However, the conventional method for manufacturing a glass envelope has the following problems.

As described above, when manufacturing a glass envelope, frit glass, which is a sealing material, is applied or placed between glass members and placed in a sealing means such as an electric furnace, or The glass member is placed on a hot plate heater (it may be sandwiched between the hot plate heaters from above and below), and the entire glass envelope, including the portion other than the sealing portion, is heated to the sealing temperature. A sealing method is adopted through a molten frit glass. For this reason, there has been a problem that energy such as extra electric power is used for heating other than the sealing portion. In addition, there is a problem that it takes a long time since the entire glass envelope needs to be heated to the sealing temperature and cooled to room temperature.

The present invention has been made on the basis of the above circumstances, and seals glass members with each other with a smaller amount of energy without heating the entire glass envelope to the sealing temperature as in the related art. An object of the present invention is to provide a glass envelope that can be realized, and a method and an apparatus for manufacturing the same.

[0011]

In order to achieve the above object, the present invention provides a method for manufacturing a glass envelope in which a plurality of glass members are sealed using a sealing material. Heating to a temperature lower than the sealing temperature of the sealing material, locally heating the sealing material to the sealing temperature, and setting so as to compensate the temperature distribution of the portion sealed by the sealing material within a predetermined range. It is characterized by.

Further, according to the present invention, in a manufacturing apparatus for a glass envelope in which a plurality of glass members are sealed using a sealing material, the entire glass envelope is heated to a temperature lower than a sealing temperature of the sealing material. A first heating unit for performing heating, a second heating unit for locally heating the sealing material to a sealing temperature, and a temperature compensating unit for setting a temperature distribution of a portion sealed by the sealing material to a predetermined range. It is characterized by having.

Further, according to the present invention, in a glass envelope in which a plurality of glass members are sealed with a sealing material, when the entire glass envelope is heated to a temperature lower than the sealing temperature of the sealing material. A heating wire for locally heating the sealing material to a sealing temperature to perform sealing, so as to compensate a temperature distribution of a portion sealed by the sealing material to a predetermined range, It is characterized in that the shape is set.

Further, in the glass envelope of the present invention,
When the entire glass envelope is heated to a temperature lower than the sealing temperature of the sealing material, the sealing device includes a heating wire for locally heating the sealing material to a sealing temperature to perform sealing, The electric resistance value distribution of the heating wiring may be set locally high so as to compensate the temperature distribution of the sealing portion of the material within a predetermined range.

With such a configuration, the loss of heat energy when sealing the glass envelope can be suppressed, and the temperature rise,
Not only can the time required for the descent be reduced, but also the variation in the temperature distribution in the sealed portion of the glass envelope can be reduced, and the thermal stress of the glass member during sealing can be reduced. For this reason, thermal distortion does not remain between the glass members, and as a glass envelope,
Good products can be obtained.

In this method of manufacturing a glass envelope, as an embodiment, the sealing portion is rectangular, and the compensation of the temperature distribution is a setting for preventing a temperature drop at the corner. Alternatively, it is preferable to compensate for variations in the temperature distribution of the sealing portion within a range of ± 10 ° C.

In the apparatus for manufacturing a glass envelope, as an embodiment thereof, the second heating means for local heating is an electric heater, and the temperature compensating means is provided on the glass outer frame. Depending on the shape, the dispersion of the temperature distribution of the sealing material as the sealing portion is to compensate for a predetermined range, or the temperature compensating means is irradiated with a lamp from the outside of the glass envelope. It is preferable to have a third heating means for heating a required portion of the envelope body.

In the case where the glass envelope is used for an image forming unit of an image display device, the image forming unit includes at least a glass face plate and a rear plate disposed to face the glass face plate. A glass outer frame between the glass face plate and the glass rear plate and sandwiched between peripheral portions thereof, and / or a glass outer plate between the glass face plate and the glass outer frame. A sealing material for sealing the both, and a local heating wire disposed along the sealing material, wherein the heating wire is used as a second heating means for locally heating the sealing material. Can be

In this case, as an embodiment thereof, the temperature compensating means compensates for a variation in the temperature distribution of the sealing material as a sealing portion within a predetermined range by the shapes of the glass face plate and the glass rear plate. That the square corners of the glass face plate and the glass rear plate have a shape having a required curvature, and the corners of the glass outer frame have a shape having a required curvature. That the temperature compensating means is
The electric resistance distribution of the second heating means or the electric heater for the local heating is set to be locally high, and further, the second heating means or the electric heater for the local heating is provided at the corner thereof. In the vicinity, it is preferable that the electric resistance value and the like be set high so that the temperature at the corner becomes high.

Further, when the glass envelope of the present invention is used for an image forming unit in an image display device, as an embodiment thereof, at least a glass face plate and a glass disposed so as to face the glass face plate A rear plate, a glass outer frame interposed between the glass face plate and the glass rear plate, and sandwiched between peripheral portions thereof, and a glass outer plate and / or a glass outer plate. In between, it is preferable to include a sealing material for sealing the both, and a local heating wiring disposed along the sealing material for heating the sealing material at the time of sealing.

The glass face plate includes:
It is preferable that a phosphor and an electron accelerating electrode are formed, and that an electron source be formed on the glass rear plate, and that the electron source be a surface conduction electron-emitting device.

In such a configuration, the temperature of the image area is kept lower than in the conventional case in which the entire envelope is heated at the sealing temperature without means for performing local heating. Thermal degradation of the electron-emitting device and the like arranged in the inside can be avoided.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a glass envelope of the present invention and a method and an apparatus for manufacturing the same will be described in detail with reference to FIGS. First, a simple configuration will be described as an example where the glass envelope of the present invention is applied to an image forming unit of an image display device. That is, the glass envelope here includes a glass face plate, a rear plate arranged opposite to the glass face plate, and a glass outer frame between the face plate and the rear plate and surrounding the peripheral portion. Consists of

Method for Local Heating and Sealing of Glass Enclosure Referring to FIG.
7 (first heating means) for heating the entire glass envelope (this heating is performed at a required temperature lower than the sealing temperature) to locally heat the sealed portion of the glass envelope. The configuration conditions will be described.

In FIG. 1, reference numeral 2 denotes a square (particularly, rectangular) glass face plate, and reference numeral 1 denotes a square (rectangular) which is disposed to face the glass face plate 2.
The glass rear plate 3 is located between the face plate 2 and the rear plate 1 and has a rectangular (rectangular) glass outer frame surrounding the periphery thereof, 4 is a frit glass as a sealing material, and 5 is a sealing material 4 locally. An electric heater (second heating means) for heating.

As shown in FIG. 1, for example, a heater for local heating is formed between the sealing material and the glass member (2, 1), and the sealing portion (sealing material) is sealed using the local heating heater. Local heating is performed to a temperature, and other portions are assist-heated to a temperature lower than the sealing temperature to prevent breakage of the glass, and the sealing material is heated and melted by heat conduction from the glass member.

Regarding the method of equalizing the temperature of the sealing portion As described above, when the assist heating by the first heating means and the local heating by the second heating means are performed, the temperature distribution of the sealing portion varies. Occurs. In the case of a normal glass envelope, the corner portions of the glass outer frame have different temperatures due to different heat dissipation as compared with the straight portions. That is, at the outer corner portion of the glass outer frame, the heat is easily released because the escape of heat is larger than the linear portion. On the other hand, at the inner corner portion of the glass outer frame, the temperature tends to increase. For this reason, the temperature difference becomes large near the corner, the thermal stress distortion becomes the largest, and it becomes easy to crack at the time of local heating sealing and at the time of subsequent cooling.

Therefore, in the present invention, a temperature compensation means for the sealing portion is used. The following means can be adopted as this embodiment.

(1) By specifying the corner shapes of the glass face plate 2 and the glass rear plate 1,
The escape of heat from the outer frame can be reduced. For example,
As shown in FIG. 1, the protruding portions of the glass face plate 2 and the glass rear plate 1 from the glass outer frame 3 may be small at the corners. As a specific shape, there are means such as rounding a corner or cutting off a corner.

(2) According to the shape of the corner of the glass outer frame 3,
The escape of heat from the outer frame can be reduced. For example,
As shown in FIG. 2, as a specific shape, there is a means for rounding the corner or cutting off the corner.

(3) The electric resistance at the corners of the local heating heater 5 can be increased, and the heating temperature at the corners can be made higher than at other points, for example, at a linear portion. That is, FIG.
As specifically shown in FIG. 5, the width of the heater 5 is reduced at the corners. It should be noted that it is possible to cope with the case where the thickness is reduced, but as described above, since the temperature is more likely to decrease at the outer corners, it is preferable to adopt a form in which heat is more easily generated outside.

(4) Further, a heater for temperature compensation can be separately provided at the location (corner).

(5) A heat source (for example, a lamp) is provided outside the glass envelope, and the temperature at the corner of the sealing portion can be compensated by radiant heat.

In this manner, for example, by suppressing the variation in the temperature distribution at the sealed portion to within ± 10 ° C., the tensile stress due to heat in the vicinity of the sealed portion is reduced to about 10M.
It is suppressed to Pa or less, and the glass member can be prevented from breaking in the local heating sealing step and the cooling step. In particular, in the production of the glass envelope according to the present invention, by performing local heating of the sealing portion and assist heating of other portions, as in the related art,
A glass envelope can be manufactured with less power, such as less power, than without heating the entire envelope at the sealing temperature without local heating means. Further, since the inside of the image area of the glass rear plate is maintained at a temperature around the heating temperature of the assist (first heating means), the electron-emitting device does not deteriorate due to heat. Further, as described above, since the temperature of the sealing portion is kept uniform, the occurrence of thermal stress in the glass member is reduced, and the distortion of the glass member in the sealing step and the subsequent heating step is reduced.

When the glass envelope according to the present invention is used in an image forming apparatus, a phosphor and an electron accelerating electrode are formed on a face plate 2 thereof, and an electron source is formed on a rear plate 1. The image forming section of the display device is configured. The electron source is preferably a surface conduction electron-emitting device, but is not limited to this. The electron source can be applied to a glass envelope for an image forming apparatus using the above-described cold cathode or hot cathode. It is also preferably applied to a glass envelope for a plasma display.

Therefore, a method of manufacturing an image forming portion (glass envelope) of an image display device using a surface conduction electron-emitting device to which the present invention is preferably used will be described below. Is related to the sealing of a glass envelope, so the present invention is not limited to the production of an image forming section of an image display device using a surface conduction electron-emitting device, but also to the production of other glass envelopes. It goes without saying that the invention can be applied.

Here, with respect to the manufacture of an image display device having a surface conduction electron-emitting device in which the present invention is used,
The embodiment will be specifically described with reference to FIGS. In the present embodiment, electron emission elements and wiring are formed on the rear plate 1, and a phosphor,
A metal back is formed. First, the image display device of the present invention will be described with reference to FIG. 5, and then the method of manufacturing the image display device will be described.

FIG. 5 is a perspective view of the image display device according to the present invention, in which a part of the panel is cut away to show the internal structure. In the figure, reference numeral 55 denotes a rear plate, 56 denotes a support frame, and 57 denotes a face plate.
5 to 57 form a glass envelope for maintaining the inside of the display panel in a vacuum. When assembling the glass envelope, it is necessary to seal the members in order to maintain sufficient strength and airtightness for joining the members. At this time, the inside of the glass envelope is evacuated to a vacuum state through an exhaust pipe (not shown). This exhaust pipe introduces an activation gas in the activation step generated during the process step. Also used as a tube.

In the figure, N × M surface conduction type emission elements 52 are formed on the rear plate 55 (N, M
Is a positive integer of 2 or more and is appropriately set according to the target number of display pixels. In the N × M surface-conduction-type emission elements, M row-direction wirings 53 (also referred to as lower wirings) are used.
And the N column-directional wirings 54 (also referred to as upper wirings) to form a simple matrix wiring).

On the lower surface of the face plate 57,
A phosphor 58 is formed. In this embodiment, since colors are used for image display, three primary color phosphors of red, green, and blue used in the field of CRT are separately applied to the fluorescent film 58. A metal back 59 known in the field of CRTs is provided on the surface of the fluorescent film 58 on the rear plate side. The metal back 59 is formed by forming the fluorescent film 58 on the face plate substrate 57, smoothing the fluorescent film 58, and vacuum-depositing Al thereon.

Although not used in this embodiment, for the purpose of applying an acceleration voltage and improving the conductivity of the fluorescent film, a transparent material such as ITO, for example, is provided between the face plate substrate 57 and the fluorescent film 58. A conductive film may be provided.

Reference symbols Dx1 to Dxm and Dy1 to Dy1
yn and Hv are electric connection terminals of an airtight container provided for electrically connecting the display panel and an electric circuit (not shown) thereof. Terminals Dx1 to Dxm
Represents a row wiring 53 of the multi-electron beam source and a terminal Dy1
Dyn is electrically connected to the column wiring 54 of the multi-electron beam source, and the terminal Hv is electrically connected to the metal back 59 of the face plate.

Next, a description will be given with reference to FIG. FIG.
7A and 7B are schematic diagrams illustrating a configuration of a surface conduction electron-emitting device, wherein FIG. 6A is a plan view and FIG. 6B is a cross-sectional view.
6, reference numeral 61 denotes a substrate, 62 and 63 denote device electrodes, 64 denotes a conductive thin film, and 65 denotes an electron-emitting portion.

The electron-emitting portion 65 forms the conductive thin film 64 locally through the device electrodes 62 and 63, thereby locally destroying, deforming, or altering the conductive thin film 64, thereby forming an electrically high-resistance state. Is formed, and the atmosphere surrounding the element is changed to, for example, 1 ×
The pressure is set to 10 ⁻³ Pa or less, and then, for example, acetone as an activating gas composed of an organic substance is introduced into the atmosphere at 1 Pa.
By applying a voltage to the above-described device electrodes 62 and 63 and applying a current to the device (activation process), a film containing carbon as a main component is formed, and at the same time, the electron emission portion 6 is formed.
5 (see JP-A-7-23525 described in the prior art).
No. 5 publication).

An example of a method of manufacturing the glass envelope of the image display device according to the present invention will be specifically described.

Preparation of Rear Plate (1) A lower wiring is formed by screen printing on a blue glass rear plate having a silicon oxide film formed on the surface, and then an interlayer insulating film is formed between the lower wiring and the upper wiring. To form Further, an upper wiring was formed, and an element electrode connected to the lower wiring and the upper wiring was formed. (2) Next, after forming a conductive thin film made of PdO, patterning was performed to obtain a desired form. (3) A frit glass for fixing the outer frame was formed at a desired position. Through the above steps, a rear plate on which a surface conduction electron-emitting device having a simple matrix wiring, a sealing material for an outer frame, and the like were formed.

Preparation of Face Plate (1) A phosphor and a black conductor are formed on a blue glass substrate.
After performing a smoothness treatment on the inner surface of the phosphor film,
A metal back was formed. (2) Frit glass for fixing the outer frame was formed at a desired position. Through the above steps, a phosphor in which phosphors of the three primary colors are arranged in a stripe shape, a sealing material for an outer frame, and the like were formed on the face plate.

Preparation of glass envelope by local heating of sealed portion Using the aforementioned “method of local heating and sealing of glass envelope”,
A glass envelope was created. At this time, set the rear plate to X,
On the Y and θ adjustment stages, while holding on a hot plate and aligning the face plate, raise the temperature of the rear plate and the face plate to less than the sealing temperature. Heat to the sealing temperature with a heater.

The sealing temperature is determined by the material of the frit glass.
0 ° C. and held for 10 minutes. At this time, the assist heating was set to 300 ° C. In this way, the glass envelope as the image forming unit of the image display device is sealed.

(1) As described above, in the sealed glass envelope,
An exhaust pipe (not shown) of the face plate was connected to a vacuum exhaust device (not shown), and the inside of the glass envelope was evacuated to a vacuum. (2) When the pressure in the glass envelope becomes 0.1 Pa or less, the external terminals Dox1 to Doxm and Doy1 to Doy.
n, a voltage was applied to the electron-emitting device to perform a forming process on the conductive thin film. (3) Subsequently, the pressure in the glass envelope is 1 × 10 ⁻³ Pa
When the following conditions are satisfied, acetone as an activating gas is introduced into the glass envelope through the exhaust pipe at a pressure of 1 Pa.
A voltage was applied to the device through ox1 to Doxm and the terminals Doy1 to Doyn to activate the electron-emitting device.

Degassing Step Sealing in Airtight Container (1) After activating gas is sufficiently exhausted, baking degassing of the glass envelope is performed. The heating temperature was 300 ° C. and the time was 10 hours. (2) After the degassing step, a part of the exhaust pipe is heated and melted to perform sealing (chip-off). Thus, the image display device was completed.

[0052]

EXAMPLES Hereinafter, the present invention will be described in detail with reference to specific examples. However, the present invention is not limited to these examples. Of course, each element can be replaced or its design can be changed.

[Embodiment 1] In this embodiment, as a temperature compensating means, the shapes of the corners of the face plate and the rear plate are specified to compensate for the temperature drop at the corners of the sealing portion. This will be described with reference to FIG. That is, in the image forming apparatus of this embodiment, as described above, the face plate, the rear plate, the outer frame, the frit glass, and the heater for local heating were prepared. The face plate and the rear plate have rounded corners in advance. The radius of curvature was, for example, R = 5 mm. Further, a frit glass having a sealing temperature of 410 ° C. was used.

Frit glass is applied to the bonding surface of the face plate and the bonding surface of the glass outer frame, which are formed with a phosphor and a metal back and have conductivity.
The baking was performed under the condition of 0 minutes, and the face plate and the glass outer frame were bonded to each other.

Next, the glass outer frame integrated with the face plate is fixed to the rear plate. Here, as shown in FIG.
1 is a rear plate, 3 is a glass frame, 4 is frit glass, 6 and 7 are hot plate heaters for auxiliary heating, 5
Is a heater for local heating.

The entire glass envelope is heated to 300 ° C. by the hot plate heaters 6 and 7, and the temperature at which the frit glass 4 is melted at the sealed portion by the heater 5 for local heating (410 in this embodiment). (° C.) and keep this state for 10 minutes. Thereafter, the panel is slowly cooled down to room temperature. Throughout this process, the temperature of the rear plate in the image area is kept at 305 ° C. or lower.

Incidentally, when the sealing portion is uniformly heated using the conventional face plate and rear plate having corner portions, heat escape is large at the outer frame outer corner, and the temperature is partially lowered. In addition, the escape of heat is reduced at the inner corner of the outer frame, and the temperature is partially increased, and the temperature difference is increased near the outer frame angle. Therefore, the thermal stress in this portion becomes large, and the glass member may be broken during heating or cooling.

In the case of the present embodiment, the corners of the face plate 2 and the rear plate 1 were rounded to have a required curvature, so that the escape of heat was reduced. In this embodiment, the corners of the face plate 2 and the rear plate 1 are rounded to a radius of curvature R = 5 mm. By uniformly heating the sealed portion using the face plate 2 and the rear plate 1 having such a shape, the variation range of the temperature distribution in the sealed portion is suppressed to ± 10 ° C. or less, and as a result, The tensile stress due to heat in the vicinity of the sealing portion was reduced to 10 MPa or less. Thereby, cracks at the time of heating and cooling were eliminated, and the yield of the product was improved.

[Embodiment 2] In this embodiment, the temperature distribution at the corner of the sealing portion is compensated by appropriately setting the shape of the corner of the glass outer frame. That is, in the embodiment of the present invention, the face plate, the rear plate, the outer frame, and the frit glass were prepared as described above. The outer frame has its corners previously rounded. In particular, in this embodiment, the radius of curvature is set to R = 3.8 mm, which is the same as the width of the outer frame. Further, a frit glass having a sealing temperature of 410 ° C. was used.

A phosphor and a metal back are formed, and frit glass is applied to the bonding surface of the conductive face plate and the bonding surface of the glass outer frame.
The face plate and the glass outer frame were bonded by firing under the conditions of minutes.

Next, a procedure for fixing the glass outer frame integrated with the face plate to the rear plate will be described. In FIG. 2, reference numeral 2 denotes a face plate, 1 denotes a rear plate, 3 denotes a glass outer frame, 4 denotes frit glass, 6 and 7 denote hot plate heaters for auxiliary heating, and 5 denotes a heater for local heating.

The entire glass envelope is heated to 300 ° C. by the hot plate heaters 6 and 7, and the temperature at which the frit glass 4 is melted at the sealed portion by the heater 5 for local heating (410 in this embodiment). C) for 10 minutes. Thereafter, the panel is slowly cooled down to room temperature. Note that the temperature in the image area of the rear plate is maintained at 305 ° C. or lower throughout this process.

As in the prior art, using an outer frame having corners,
When the sealing portion was uniformly heated, heat escaped greatly at the outer corners of the outer frame, and the temperature partially decreased. On the other hand, at the inner corners of the outer frame, the escape of heat was reduced, and conversely, the temperature was partially increased, and the temperature difference increased near the corners of the outer frame. Therefore, the thermal stress in this portion increases, and the glass member may be broken during heating or cooling.

However, in the case of the present embodiment, since the corners of the outer frame 3 are rounded to have a required curvature, the escape of heat is reduced at the outer corners of the outer frame, while At the corner,
The escape of heat increased and the temperature difference became smaller. By uniformly heating the sealed portion using the outer frame having such a shape, the variation range of the temperature distribution in the sealed portion is ±
As a result, the tensile stress due to heat in the vicinity of the sealing portion was reduced to 10 MPa or less. Thereby, cracks at the time of heating and cooling were eliminated, and the yield was improved.

[Embodiment 3] In this embodiment, the temperature distribution at the corners of the sealing portion is compensated by adjusting the electric resistance distribution of the heater. That is, in the present embodiment, as described above, the face plate, the rear plate, the outer frame, the frit glass, and the heater for local heating were prepared. As for the heater for local heating, as shown in FIG. 3, the width of the heater was reduced at the corners in advance. In particular, in the present embodiment, the width of the heater near the corner was set to about 1/2 of the width of the heater in the linear portion. The frit glass has a sealing temperature of 41.
The one at 0 ° C. was used.

A frit glass 8 is applied to the bonding surface of the face plate 2 and the bonding surface of the glass outer frame 3 which are formed with a phosphor and a metal back and have conductivity.
After baking for 10 minutes, the face plate 3 and the glass outer frame 8 were bonded to each other.

Next, a procedure for fixing the glass outer frame integrated with the face plate to the rear plate will be described. FIG.
, 2 is a face plate, 1 is a rear plate, 3 is a glass outer frame, 4 is frit glass, 6 and 7 are hot plate heaters for auxiliary heating, and 5 is a heater for local heating.

The entire glass envelope is heated to 300 ° C. by the hot plate heaters 6 and 7, and the temperature at which the frit glass 4 is melted at the sealing portion by the heater 5 for local heating (410 ° C. in this embodiment). ) For 10 minutes. Thereafter, the panel is slowly cooled down to room temperature. The temperature in the image area of the rear plate is kept at 305 ° C. or lower throughout this process.

Incidentally, with a conventional heater having a uniform width,
When the sealed portion was heated, heat escaped greatly at the outer corners of the outer frame, and the temperature was partially reduced. On the other hand, the escape of heat is reduced at the inner corner of the outer frame, the temperature is partially increased, and the temperature difference is increased near the outer frame angle. During cooling, the glass member was sometimes broken.

In the case of the present embodiment, the resistance of the heater for local heating was increased at the corners of the sealing portion, thereby reducing the temperature drop at the corners. By heating the sealed portion using the heater having such a shape, the variation range of the temperature distribution in the sealed portion is suppressed to ± 10 ° C. or less, and as a result, the tensile force near the sealed portion due to heat is obtained. The stress was reduced to 10 MPa or less. Thereby, cracks at the time of heating and cooling were eliminated, and the yield was improved.

[Embodiment 4] In this embodiment, as a temperature compensating means, the radiation heat of the lamp is used from outside the glass envelope.
This is to compensate for the temperature drop at the corner of the sealing portion. This embodiment will be described with reference to FIG. In the present embodiment, as described above, the face plate, the rear plate, the outer frame, the frit glass, and the heater for local heating were prepared. Also,
A frit glass having a sealing temperature of 410 ° C. was used.

A frit glass 8 is applied to the adhesive surface of the face plate 2 and the adhesive surface of the glass outer frame 3 which are formed with a phosphor and a metal back and have conductivity.
By firing at 10 ° C. for 10 minutes, the face plate 3 and the glass outer frame 8 were bonded.

Next, a procedure for fixing the glass outer frame 3 integrated with the face plate 2 to the rear plate 1 will be described. In FIG. 4, reference numeral 2 denotes a face plate, 1 denotes a rear plate, 3 denotes a glass outer frame, 4 denotes frit glass,
Reference numerals 6 and 7 denote hot plate heaters for auxiliary heating, 5 a heater for local heating, and 8 an infrared lamp for temperature compensation at the sealing portion angle.

The entire glass envelope is heated to 300 ° C. by the hot plate heaters 6 and 7, and the temperature at which the frit glass 4 is melted at the sealed portion by the heater 5 for local heating, in this embodiment, 410 ° C. Hold for 10 minutes.
At this time, an infrared lamp provided outside the glass envelope was irradiated to the corner of the sealed portion. Thereafter, the panel is slowly cooled down to room temperature. The temperature in the image area of the rear plate is kept at 305 ° C. or lower throughout this process.

When the sealing portion was uniformly heated, heat escaped greatly at the outer corners of the outer frame, and the temperature was partially lowered. On the other hand, heat escape becomes smaller at the inner corner of the outer frame,
Conversely, the temperature partially increases, and the temperature difference increases near the corners of the outer frame, and therefore, the thermal stress in this portion increases, and the glass member may be broken during heating or cooling. Was.

In the case of the present embodiment, by irradiating the corner portion of the sealed portion with an infrared lamp, the temperature drop at the corner portion of the sealed portion was reduced, and the thermal stress was reduced. The variation range of the temperature distribution in the sealing part is suppressed to ± 10 ° C or less,
As a result, the tensile stress due to heat in the vicinity of the sealing portion is 10MP.
a. Thereby, cracks at the time of heating and cooling were eliminated, and the yield was improved. This allows
Cracks during heating and cooling were eliminated, and the yield was improved.

[0077]

As described above, according to the manufacturing method using local heating of the present invention, compared with the conventional sealing step in which the entire glass envelope is heated to the sealing temperature, the heating is performed more easily. This has the effect of reducing power consumption. Further, since the temperature for heating the entire envelope can be lowered, the time required for the sealing process can be reduced.

Further, according to the method of manufacturing an image display device using the glass envelope of the present invention, the temperature of the sealed portion is kept uniform, so that the vicinity of the corner of the outer frame where the thermal stress becomes the largest is obtained. Of the panel can be reduced, the possibility of cracking of the panel during sealing and cooling can be reduced, and the yield has improved.

[Brief description of the drawings]

FIG. 1 is a schematic view showing Example 1 of a method for manufacturing a glass envelope of the present invention.

FIG. 2 is a schematic view showing Example 2 of the method for manufacturing a glass envelope of the present invention.

FIG. 3 is a schematic view showing Example 3 of the method for manufacturing a glass envelope of the present invention.

FIG. 4 is a schematic diagram showing a fourth embodiment in which the glass envelope of the present invention is applied to an image forming apparatus.

FIG. 5 is a schematic diagram showing an example of an electron source having a simple matrix arrangement to which the present invention can be applied.

FIG. 6 is a schematic diagram showing an example of a surface conduction electron-emitting device to which the present invention can be applied.

[Explanation of symbols]

 Reference Signs List 1 rear plate 2 face plate 3 outer frame 4 frit glass 5 heater for local heating (second heating means) 6 hot plate (first heating means) 7 hot plate (first heating means) 8 frit glass 9 infrared lamp (Third heating means) 51 Glass substrate 52 Surface conduction electron-emitting device 53 Row wiring 54 Column wiring 55 Rear plate 56 Glass outer frame 57 Face plate 58 Phosphor 59 Metal back 61 Substrate 62 Element electrode 63 Element electrode 64 Conductive thin film 65 Electron emission part

 ──────────────────────────────────────────────────続 き Continued on the front page F-term (reference)

Claims (16)

[Claims] 1. A method for manufacturing a glass envelope in which a plurality of glass members are sealed using a sealing material, wherein the entire glass envelope is heated to a temperature lower than a sealing temperature of the sealing material. A method of locally heating the sealing material to a sealing temperature and setting so as to compensate a temperature distribution of a portion sealed by the sealing material within a predetermined range. 2. The glass envelope according to claim 1, wherein the sealed portion is rectangular, and the compensation of the temperature distribution is a setting for preventing a temperature drop at a corner thereof. Method of manufacturing the vessel. 3. Variations in the temperature distribution of the sealing portion
The method for manufacturing a glass envelope according to claim 1, wherein the compensation is performed within a range of ± 10 ° C. 4. The method for manufacturing a glass envelope according to claim 1, wherein the sealing material is frit glass. 5. The method for manufacturing a glass envelope according to claim 1, wherein the local heating is performed by energizing a wiring arranged along the sealing material. . 6. A manufacturing apparatus for a glass envelope configured by sealing a plurality of glass members using a sealing material, wherein the entire glass envelope is heated to a temperature lower than a sealing temperature of the sealing material. (1) heating means, means for supplying electric power for locally heating the sealing material to a sealing temperature, and temperature compensating means for setting a temperature distribution of a sealing portion sealed by the sealing material to a predetermined range. An apparatus for manufacturing a glass envelope, comprising: 7. The method according to claim 7, wherein the local heating is performed by energizing a wiring disposed along the sealing material.
The apparatus for manufacturing a glass envelope according to claim 6, wherein the means for supplying a pre-electromotive force is used by being electrically connected to the wiring. 8. The glass outside glass according to claim 1, wherein the glass face plate and the glass rear plate have a rectangular corner having a required curvature. Method of manufacturing enclosure. 9. The temperature compensating means compensates for a variation in temperature distribution of a sealing material as a sealing portion within a predetermined range depending on the shape of the glass outer frame. Alternatively, the apparatus for manufacturing a glass envelope according to 7. 10. The production of a glass envelope according to claim 1, wherein the glass outer frame has a corner having a required curvature. Method. 11. The method for manufacturing a glass envelope according to claim 5, wherein the temperature compensator is locally set to have a high electric resistance distribution with respect to a wiring for local heating. 12. The wiring for local heating has a high electrical resistance value set near the corner so that the temperature at the corner is high.
2. The method for producing a glass envelope according to item 1. 13. The glass heating apparatus according to claim 6, wherein the temperature compensating means is a third heating means for heating a required portion of the glass envelope body by irradiating a lamp from outside the glass envelope. Alternatively, the apparatus for manufacturing a glass envelope according to 7. 14. A glass envelope in which a plurality of glass members are sealed using a sealing material, wherein a heating wire is provided between the sealing material and the glass member, and a sealing portion using the sealing material is provided. Wherein the shape of the glass member is set so as to compensate the temperature distribution of the glass member within a predetermined range. 15. The glass envelope according to claim 14, wherein a phosphor and an electron accelerating electrode are formed in the glass envelope, and an electron source is formed in the glass envelope. 16. The glass envelope according to claim 15, wherein the electron source is a surface conduction electron-emitting device.