JP2008053714A - 印刷回路基板及びその製造方法 - Google Patents
印刷回路基板及びその製造方法 Download PDFInfo
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- JP2008053714A JP2008053714A JP2007212058A JP2007212058A JP2008053714A JP 2008053714 A JP2008053714 A JP 2008053714A JP 2007212058 A JP2007212058 A JP 2007212058A JP 2007212058 A JP2007212058 A JP 2007212058A JP 2008053714 A JP2008053714 A JP 2008053714A
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- Japan
- Prior art keywords
- circuit board
- printed circuit
- wiring pattern
- clad
- cladding
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/136—Integrated optical circuits characterised by the manufacturing method by etching
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
Abstract
【解決手段】本発明の印刷回路基板は、光信号と電気信号とを共に伝送するように光導波路が形成された印刷回路基板であって、クラッド20と、クラッド20に内蔵されて光信号を伝送するコア25と、クラッド20に内蔵されて電気信号を伝送する配線パターン30とを含み、クラッド20が絶縁層としての機能を行って配線パターン30をクラッド20に内蔵させたことを特徴とする。
【選択図】図3
Description
25 コア
30 配線パターン
40 ソルダレジスト
50 面発光レーザ(VCSEL)
60 絶縁層
Claims (6)
- 光導波路と配線が形成され、光信号と電気信号をともに伝送する印刷回路基板であって、
クラッドと、
前記クラッドに内蔵されて光信号を伝送するコアと、
前記クラッドに内蔵されて電気信号を伝送する配線パターンと
を含むことを特徴とする印刷回路基板。 - 前記配線パターンの一方の面が前記印刷回路基板の外部に露出していることを特徴とする請求項1に記載の印刷回路基板。
- 前記クラッドは、
前記配線パターンが内蔵された第1クラッドと、
前記コアが内蔵された第2クラッドと
を含むことを特徴とする請求項1または請求項2に記載の印刷回路基板。 - (a)キャリア部の一方の面に配線パターンを形成する段階と、
(b)前記キャリア部の前記配線パターンが形成された面に第1クラッドを積層する段階と、
(c)前記第1クラッドの前記配線パターンが形成された面の反対側の面にコアを形成する段階と、
(d)前記第1クラッドの前記コアが形成された面に第2クラッドを積層する段階と、
(e)前記配線パターンの一方の面が露出するように、前記キャリア部を除去する段階と
を含むことを特徴とする印刷回路基板の製造方法。 - (f)前記第1クラッドの前記配線パターンが形成された面にソルダレジストを形成する段階をさらに含むことを特徴とする請求項4に記載の印刷回路基板の製造方法。
- 前記キャリア部は、
キャリア層と、前記キャリア層の一方の面に積層されたエッチング防止層とを含み、
前記段階(a)は、
前記エッチング防止層に前記配線パターンを形成することを特徴とする請求項4または請求項5に記載の印刷回路基板の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060079003A KR100756374B1 (ko) | 2006-08-21 | 2006-08-21 | 인쇄회로기판 및 그 제조방법 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010088704A Division JP2010170150A (ja) | 2006-08-21 | 2010-04-07 | 印刷回路基板の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008053714A true JP2008053714A (ja) | 2008-03-06 |
Family
ID=38736809
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007212058A Pending JP2008053714A (ja) | 2006-08-21 | 2007-08-16 | 印刷回路基板及びその製造方法 |
JP2010088704A Pending JP2010170150A (ja) | 2006-08-21 | 2010-04-07 | 印刷回路基板の製造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010088704A Pending JP2010170150A (ja) | 2006-08-21 | 2010-04-07 | 印刷回路基板の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US7546002B2 (ja) |
JP (2) | JP2008053714A (ja) |
KR (1) | KR100756374B1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024162008A1 (ja) * | 2023-01-30 | 2024-08-08 | 京セラ株式会社 | 光電気配線基板および光電気配線基板の製造方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7831115B2 (en) * | 2008-03-20 | 2010-11-09 | Intel Corporation | Optical die structures and associated package substrates |
KR100972894B1 (ko) | 2008-05-26 | 2010-07-28 | 주식회사 두산 | 광회로기판의 제조방법 |
KR101074406B1 (ko) * | 2009-11-02 | 2011-10-17 | 삼성전기주식회사 | 광기판 및 그 제조방법 |
US7949211B1 (en) | 2010-02-26 | 2011-05-24 | Corning Incorporated | Modular active board subassemblies and printed wiring boards comprising the same |
KR20120070732A (ko) * | 2010-12-22 | 2012-07-02 | 삼성전기주식회사 | 광도파로용 인쇄회로기판의 제조 방법 |
CN103454733B (zh) * | 2012-05-31 | 2016-09-28 | 鸿富锦精密工业(深圳)有限公司 | 光学印刷电路板 |
US10754113B1 (en) | 2019-08-16 | 2020-08-25 | Eagle Technology, Llc | Opto-electronic device including active circuit component on circuit attachment area of optical fiber and related methods |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004086185A (ja) * | 2002-06-28 | 2004-03-18 | Matsushita Electric Ind Co Ltd | 受発光素子内蔵光電気混載配線モジュールとその製造方法及びその実装体 |
JP2006039231A (ja) * | 2004-07-27 | 2006-02-09 | Matsushita Electric Works Ltd | 光電気配線混載基板の製造方法 |
JP2006156439A (ja) * | 2004-11-25 | 2006-06-15 | Nitto Denko Corp | 光電気混載基板の製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6845184B1 (en) * | 1998-10-09 | 2005-01-18 | Fujitsu Limited | Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making |
US6259840B1 (en) * | 1999-03-31 | 2001-07-10 | International Business Machines Corporation | Printed circuit board having fluid-linked optical pathways for coupling surface mounted optoelectric semiconductor devices |
JP4409137B2 (ja) * | 1999-06-03 | 2010-02-03 | 東洋鋼鈑株式会社 | プリント配線板の製造方法 |
JP3694630B2 (ja) | 2000-02-21 | 2005-09-14 | 京セラ株式会社 | 光電気回路基板 |
JP3559528B2 (ja) | 2001-01-29 | 2004-09-02 | 京セラ株式会社 | 光電気回路基板 |
US7039288B2 (en) * | 2001-03-21 | 2006-05-02 | Intel Corporation | Fabrication of optical waveguides for reduction of minimum waveguide spacing |
JP2004103750A (ja) * | 2002-09-09 | 2004-04-02 | Sony Corp | 導電突起付き基板及びその製造方法、半導体装置及びその製造方法 |
KR20050040589A (ko) * | 2003-10-29 | 2005-05-03 | 삼성전기주식회사 | 광도파로가 형성된 인쇄회로 기판 및 그 제조 방법 |
-
2006
- 2006-08-21 KR KR1020060079003A patent/KR100756374B1/ko not_active IP Right Cessation
-
2007
- 2007-08-14 US US11/889,477 patent/US7546002B2/en not_active Expired - Fee Related
- 2007-08-16 JP JP2007212058A patent/JP2008053714A/ja active Pending
-
2009
- 2009-05-15 US US12/453,616 patent/US7697800B2/en not_active Expired - Fee Related
-
2010
- 2010-04-07 JP JP2010088704A patent/JP2010170150A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004086185A (ja) * | 2002-06-28 | 2004-03-18 | Matsushita Electric Ind Co Ltd | 受発光素子内蔵光電気混載配線モジュールとその製造方法及びその実装体 |
JP2006039231A (ja) * | 2004-07-27 | 2006-02-09 | Matsushita Electric Works Ltd | 光電気配線混載基板の製造方法 |
JP2006156439A (ja) * | 2004-11-25 | 2006-06-15 | Nitto Denko Corp | 光電気混載基板の製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024162008A1 (ja) * | 2023-01-30 | 2024-08-08 | 京セラ株式会社 | 光電気配線基板および光電気配線基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2010170150A (ja) | 2010-08-05 |
US7697800B2 (en) | 2010-04-13 |
KR100756374B1 (ko) | 2007-09-10 |
US20080044129A1 (en) | 2008-02-21 |
US20090223044A1 (en) | 2009-09-10 |
US7546002B2 (en) | 2009-06-09 |
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