JP2008032702A5 - - Google Patents

Download PDF

Info

Publication number
JP2008032702A5
JP2008032702A5 JP2007175160A JP2007175160A JP2008032702A5 JP 2008032702 A5 JP2008032702 A5 JP 2008032702A5 JP 2007175160 A JP2007175160 A JP 2007175160A JP 2007175160 A JP2007175160 A JP 2007175160A JP 2008032702 A5 JP2008032702 A5 JP 2008032702A5
Authority
JP
Japan
Prior art keywords
defect
layer
defect information
manufacturing process
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007175160A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008032702A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007175160A priority Critical patent/JP2008032702A/ja
Priority claimed from JP2007175160A external-priority patent/JP2008032702A/ja
Publication of JP2008032702A publication Critical patent/JP2008032702A/ja
Publication of JP2008032702A5 publication Critical patent/JP2008032702A5/ja
Pending legal-status Critical Current

Links

JP2007175160A 2006-07-03 2007-07-03 欠陥検査装置および欠陥検査方法 Pending JP2008032702A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007175160A JP2008032702A (ja) 2006-07-03 2007-07-03 欠陥検査装置および欠陥検査方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006183112 2006-07-03
JP2007175160A JP2008032702A (ja) 2006-07-03 2007-07-03 欠陥検査装置および欠陥検査方法

Publications (2)

Publication Number Publication Date
JP2008032702A JP2008032702A (ja) 2008-02-14
JP2008032702A5 true JP2008032702A5 (enrdf_load_stackoverflow) 2010-07-01

Family

ID=39122259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007175160A Pending JP2008032702A (ja) 2006-07-03 2007-07-03 欠陥検査装置および欠陥検査方法

Country Status (1)

Country Link
JP (1) JP2008032702A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2039513B1 (fr) * 2007-09-21 2010-12-29 Bobst S.A. Procédé pour déterminer la qualité de surface d'un support et machine de transformation du support associée
JP2014182219A (ja) * 2013-03-18 2014-09-29 Fujitsu Ltd 欠陥箇所予測装置、識別モデル生成装置、欠陥箇所予測プログラムおよび欠陥箇所予測方法
JP6123398B2 (ja) * 2013-03-18 2017-05-10 富士通株式会社 欠陥箇所予測装置、識別モデル生成装置、欠陥箇所予測プログラムおよび欠陥箇所予測方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2986410B2 (ja) * 1995-07-13 1999-12-06 松下電器産業株式会社 半導体ウェハの不良解析方法及びその装置
JP2000306964A (ja) * 1999-04-22 2000-11-02 Hitachi Ltd 検査データ処理方法および検査データ処理装置
JP3920003B2 (ja) * 2000-04-25 2007-05-30 株式会社ルネサステクノロジ 検査データ処理方法およびその装置
JP4649051B2 (ja) * 2001-03-21 2011-03-09 オリンパス株式会社 検査画面の表示方法及び基板検査システム

Similar Documents

Publication Publication Date Title
US8711348B2 (en) Method of inspecting wafer
CN104483811B (zh) 掩模检查装置和方法以及虚拟图产生装置和方法
JP2005262881A5 (enrdf_load_stackoverflow)
JP2009186338A5 (enrdf_load_stackoverflow)
JP2009532894A5 (enrdf_load_stackoverflow)
JP2013225618A5 (enrdf_load_stackoverflow)
JP5795046B2 (ja) ソルダージョイントの検査方法
WO2009129105A3 (en) Methods and systems for determining a defect criticality index for defects on wafers
US10119866B2 (en) In-process monitoring, automated decision-making, and process control for composite manufacturing using part-referenced ply-by-ply infrared thermography and other non-contact non-destructive inspection
CN104460226B (zh) 一种光刻工艺热点的自动修复方法
TW200745765A (en) Coating and developing apparatus, coating and developing method, and recording medium
TW200622509A (en) A method for performing full-chip manufacturing reliability checking and correction
JP2005286161A5 (enrdf_load_stackoverflow)
JP2011513973A5 (enrdf_load_stackoverflow)
JP2008032702A5 (enrdf_load_stackoverflow)
JP5640943B2 (ja) 露光装置の設定方法、基板撮像装置及び記憶媒体
JP5842864B2 (ja) 鉄鋼材料の衝撃破壊試験中の変形挙動測定方法
JP2013130392A (ja) Ｘ線非破壊検査装置
CN101819161A (zh) 一种表面缺陷视觉检测的高效路径规划方法
JP2011018816A5 (enrdf_load_stackoverflow)
GB201111039D0 (en) Inspection of a component
CN105593636B (zh) 检查基板时的测定区域补偿方法
JP7030635B2 (ja) 付加製造方法及び付加製造システム
CN103182630A (zh) 金属屏蔽的制造方法及用于制造金属屏蔽的镭射开孔装置
CN108573110B (zh) 一种多层互连线结构的cmp仿真方法和仿真系统