JP2008009661A5 - - Google Patents

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Publication number
JP2008009661A5
JP2008009661A5 JP2006178823A JP2006178823A JP2008009661A5 JP 2008009661 A5 JP2008009661 A5 JP 2008009661A5 JP 2006178823 A JP2006178823 A JP 2006178823A JP 2006178823 A JP2006178823 A JP 2006178823A JP 2008009661 A5 JP2008009661 A5 JP 2008009661A5
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JP
Japan
Prior art keywords
processing
machining
laser
target surface
pattern
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Application number
JP2006178823A
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English (en)
Japanese (ja)
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JP4662482B2 (ja
JP2008009661A (ja
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Priority to JP2006178823A priority Critical patent/JP4662482B2/ja
Priority claimed from JP2006178823A external-priority patent/JP4662482B2/ja
Publication of JP2008009661A publication Critical patent/JP2008009661A/ja
Publication of JP2008009661A5 publication Critical patent/JP2008009661A5/ja
Application granted granted Critical
Publication of JP4662482B2 publication Critical patent/JP4662482B2/ja
Active legal-status Critical Current
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JP2006178823A 2006-06-28 2006-06-28 レーザ加工条件設定装置、レーザ加工装置、レーザ加工条件設定方法、レーザ加工条件設定プログラム Active JP4662482B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006178823A JP4662482B2 (ja) 2006-06-28 2006-06-28 レーザ加工条件設定装置、レーザ加工装置、レーザ加工条件設定方法、レーザ加工条件設定プログラム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006178823A JP4662482B2 (ja) 2006-06-28 2006-06-28 レーザ加工条件設定装置、レーザ加工装置、レーザ加工条件設定方法、レーザ加工条件設定プログラム

Publications (3)

Publication Number Publication Date
JP2008009661A JP2008009661A (ja) 2008-01-17
JP2008009661A5 true JP2008009661A5 (zh) 2009-05-28
JP4662482B2 JP4662482B2 (ja) 2011-03-30

Family

ID=39067829

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006178823A Active JP4662482B2 (ja) 2006-06-28 2006-06-28 レーザ加工条件設定装置、レーザ加工装置、レーザ加工条件設定方法、レーザ加工条件設定プログラム

Country Status (1)

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JP (1) JP4662482B2 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI264532B (en) * 2001-11-05 2006-10-21 Olympus Corp Substrate inspection device
KR101385095B1 (ko) 2012-09-10 2014-04-24 이철희 레이저 마킹방법
CN107876988B (zh) * 2016-09-29 2019-02-12 广州创乐激光设备有限公司 一种利用激光检测快速生成球形或圆柱形打标物模型的方法
CN109465539B (zh) * 2018-12-29 2024-02-13 广州新可激光设备有限公司 一种具有3d自建模的自动对焦激光打标机
CN109465553B (zh) * 2018-12-29 2024-02-13 广州新可激光设备有限公司 一种具有3d自建模的激光打标机
JP7450350B2 (ja) * 2019-08-13 2024-03-15 株式会社ディスコ 切削装置
JP7186944B2 (ja) * 2020-03-27 2022-12-12 株式会社日立ハイテクソリューションズ 加工装置および加工方法
JP2022139478A (ja) * 2021-03-12 2022-09-26 オムロン株式会社 レーザ印字データ生成器およびレーザマーカシステム

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6436817U (zh) * 1987-08-28 1989-03-06
JPH0384129U (zh) * 1989-12-19 1991-08-27
JPH07204753A (ja) * 1993-12-27 1995-08-08 Otto Borries Kg 回転対称体の円錐又は疑似円錐面に刻印するための装置
JP4281292B2 (ja) * 2002-04-23 2009-06-17 パナソニック電工株式会社 ３次元レーザ加工データ作成方法と同データ作成プログラム及び同データ作成プログラムを記録した媒体並びに同加工方法及び装置
JP2004122188A (ja) * 2002-10-03 2004-04-22 Y E Data Inc レーザーマーキング装置
JP2005014089A (ja) * 2003-05-30 2005-01-20 Central Glass Co Ltd レーザマーキング方法

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