JP2008007590A5 - - Google Patents

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Publication number
JP2008007590A5
JP2008007590A5 JP2006177937A JP2006177937A JP2008007590A5 JP 2008007590 A5 JP2008007590 A5 JP 2008007590A5 JP 2006177937 A JP2006177937 A JP 2006177937A JP 2006177937 A JP2006177937 A JP 2006177937A JP 2008007590 A5 JP2008007590 A5 JP 2008007590A5
Authority
JP
Japan
Prior art keywords
hardening
curing agent
range
sufficiently
desirable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006177937A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008007590A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006177937A priority Critical patent/JP2008007590A/ja
Priority claimed from JP2006177937A external-priority patent/JP2008007590A/ja
Publication of JP2008007590A publication Critical patent/JP2008007590A/ja
Publication of JP2008007590A5 publication Critical patent/JP2008007590A5/ja
Pending legal-status Critical Current

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JP2006177937A 2006-06-28 2006-06-28 熱伝導性樹脂組成物およびその用途 Pending JP2008007590A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006177937A JP2008007590A (ja) 2006-06-28 2006-06-28 熱伝導性樹脂組成物およびその用途

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006177937A JP2008007590A (ja) 2006-06-28 2006-06-28 熱伝導性樹脂組成物およびその用途

Publications (2)

Publication Number Publication Date
JP2008007590A JP2008007590A (ja) 2008-01-17
JP2008007590A5 true JP2008007590A5 (ru) 2008-08-21

Family

ID=39066085

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006177937A Pending JP2008007590A (ja) 2006-06-28 2006-06-28 熱伝導性樹脂組成物およびその用途

Country Status (1)

Country Link
JP (1) JP2008007590A (ru)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5407163B2 (ja) * 2008-04-02 2014-02-05 東レ株式会社 ペースト組成物およびそれを用いた高熱伝導率樹脂組成物
JP5688204B2 (ja) * 2008-10-16 2015-03-25 日東シンコー株式会社 絶縁シートの製造方法
JP6088731B2 (ja) * 2011-10-14 2017-03-01 日東シンコー株式会社 放熱用部材、及び半導体モジュールの製造方法
JP6428121B2 (ja) * 2014-10-03 2018-11-28 富士電機株式会社 溶射用複合粉体材料及び溶射絶縁基板
US10563095B2 (en) 2015-03-27 2020-02-18 Toray Industries, Inc. Adhesive composition sheet, method of producing same, and semiconductor device
JP6879690B2 (ja) 2016-08-05 2021-06-02 スリーエム イノベイティブ プロパティズ カンパニー 放熱用樹脂組成物、その硬化物、及びこれらの使用方法
JP7358883B2 (ja) * 2019-09-26 2023-10-11 日本ゼオン株式会社 熱伝導シート
CN113960108B (zh) * 2021-09-24 2024-05-28 株洲国创轨道科技有限公司 一种碳纤维复合材料导热系数和比热容同时测量方法及测量系统
WO2024053347A1 (ja) * 2022-09-06 2024-03-14 東レ株式会社 芳香族ポリアミドおよび／または芳香族ポリアミドイミドを含む組成物、溶液、成形体、フィルム、回折光学素子、画像表示装置、回路基板、磁気記録媒体、製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0726032B2 (ja) * 1987-04-06 1995-03-22 触媒化成工業株式会社 異方導電性膜及びその製造方法
JP2002363410A (ja) * 2001-06-08 2002-12-18 Ge Toshiba Silicones Co Ltd エネルギー高伝導性シリコーンゴム組成物
JP3794996B2 (ja) * 2002-08-13 2006-07-12 電気化学工業株式会社 熱伝導性樹脂組成物及びフェーズチェンジ型放熱部材

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