WO2008078692A1 - 成形品用カチオン重合性樹脂組成物およびそれを用いた成形品 - Google Patents

成形品用カチオン重合性樹脂組成物およびそれを用いた成形品 Download PDF

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Publication number
WO2008078692A1
WO2008078692A1 PCT/JP2007/074690 JP2007074690W WO2008078692A1 WO 2008078692 A1 WO2008078692 A1 WO 2008078692A1 JP 2007074690 W JP2007074690 W JP 2007074690W WO 2008078692 A1 WO2008078692 A1 WO 2008078692A1
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WO
WIPO (PCT)
Prior art keywords
molding
resin composition
cationically polymerizable
polymerizable resin
molded article
Prior art date
Application number
PCT/JP2007/074690
Other languages
English (en)
French (fr)
Inventor
Ou Shibata
Yukiko Fujita
Original Assignee
Dh Material Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dh Material Inc. filed Critical Dh Material Inc.
Publication of WO2008078692A1 publication Critical patent/WO2008078692A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)

Abstract

　本発明は、エポキシ基を２～４個含有しかつ芳香族系骨格を有するエポキシ化合物（Ａ）７０～９９質量部と、ビニル基を１～２個有する芳香族系単量体（Ｂ）１～３０質量部と、カチオン系硬化剤（Ｃ）とを含有し、前記質量比における前記エポキシ化合物（Ａ）と前記芳香族系単量体（Ｂ）との混合物が常温（２５°C）で液状であることを特徴とする成形品用カチオン重合性樹脂組成物およびそれを硬化せしめて得られることを特徴とする成形品を提供する。
PCT/JP2007/074690 2006-12-27 2007-12-21 成形品用カチオン重合性樹脂組成物およびそれを用いた成形品 WO2008078692A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-351026 2006-12-27
JP2006351026A JP2008163068A (ja) 2006-12-27 2006-12-27 成形品用カチオン重合性樹脂組成物およびそれを用いた成形品

Publications (1)

Publication Number Publication Date
WO2008078692A1 true WO2008078692A1 (ja) 2008-07-03

Family

ID=39562481

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/074690 WO2008078692A1 (ja) 2006-12-27 2007-12-21 成形品用カチオン重合性樹脂組成物およびそれを用いた成形品

Country Status (2)

Country Link
JP (1) JP2008163068A (ja)
WO (1) WO2008078692A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6178797B2 (ja) * 2012-10-15 2017-08-09 株式会社ダイセル 硬化性樹脂組成物及びその硬化物
JP6131062B2 (ja) * 2013-02-05 2017-05-17 株式会社日本触媒 硬化性樹脂組成物、その硬化物及び光学材料
WO2018020941A1 (ja) * 2016-07-29 2018-02-01 名古屋ファインケミカル株式会社 エポキシ組成物、その硬化方法及びその保存方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62273221A (ja) * 1986-05-20 1987-11-27 Nippon Soda Co Ltd 無電解メツキ用光硬化型レジスト樹脂組成物
JPS63226096A (ja) * 1987-03-14 1988-09-20 ソニー株式会社 耐半田保護材料
JP2006127776A (ja) * 2004-10-26 2006-05-18 Hitachi Chem Co Ltd 回路接続材料並びに回路端子の接続構造体及び接続方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62273221A (ja) * 1986-05-20 1987-11-27 Nippon Soda Co Ltd 無電解メツキ用光硬化型レジスト樹脂組成物
JPS63226096A (ja) * 1987-03-14 1988-09-20 ソニー株式会社 耐半田保護材料
JP2006127776A (ja) * 2004-10-26 2006-05-18 Hitachi Chem Co Ltd 回路接続材料並びに回路端子の接続構造体及び接続方法

Also Published As

Publication number Publication date
JP2008163068A (ja) 2008-07-17

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