JP2007538394A5 - - Google Patents

Download PDF

Info

Publication number
JP2007538394A5
JP2007538394A5 JP2007517318A JP2007517318A JP2007538394A5 JP 2007538394 A5 JP2007538394 A5 JP 2007538394A5 JP 2007517318 A JP2007517318 A JP 2007517318A JP 2007517318 A JP2007517318 A JP 2007517318A JP 2007538394 A5 JP2007538394 A5 JP 2007538394A5
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
support pattern
insulating layer
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007517318A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007538394A (ja
Filing date
Publication date
Priority claimed from FI20045179A external-priority patent/FI117234B/fi
Application filed filed Critical
Publication of JP2007538394A publication Critical patent/JP2007538394A/ja
Publication of JP2007538394A5 publication Critical patent/JP2007538394A5/ja
Pending legal-status Critical Current

Links

JP2007517318A 2004-05-17 2005-05-16 プリント基板、製造方法および電子デバイス Pending JP2007538394A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20045179A FI117234B (fi) 2004-05-17 2004-05-17 Piirilevy, valmistusmenetelmä ja elektroninen laite
PCT/FI2005/050160 WO2005112526A1 (en) 2004-05-17 2005-05-16 Printed wiring board, manufacturing method and electronic device

Publications (2)

Publication Number Publication Date
JP2007538394A JP2007538394A (ja) 2007-12-27
JP2007538394A5 true JP2007538394A5 (https=) 2008-07-03

Family

ID=32338458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007517318A Pending JP2007538394A (ja) 2004-05-17 2005-05-16 プリント基板、製造方法および電子デバイス

Country Status (4)

Country Link
EP (1) EP1747704A4 (https=)
JP (1) JP2007538394A (https=)
FI (1) FI117234B (https=)
WO (1) WO2005112526A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5539800B2 (ja) * 2010-07-07 2014-07-02 日本特殊陶業株式会社 配線基板の中間製品及び配線基板の製造方法
US20150257278A1 (en) * 2014-03-06 2015-09-10 Tactotek Oy Method for manufacturing electronic products, related arrangement and product
CN106794698B (zh) 2014-08-28 2019-02-26 惠普发展公司，有限责任合伙企业 打印头组件
US10136512B2 (en) 2014-12-09 2018-11-20 Microsoft Technology Licensing, Llc Avoiding reflections in PCB signal trace
CN115702490A (zh) * 2020-06-03 2023-02-14 住友电木株式会社 电路基板
EP4554347A1 (en) * 2023-11-10 2025-05-14 Rolls-Royce Deutschland Ltd & Co KG Printed circuit board assembly

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61270887A (ja) * 1985-05-24 1986-12-01 松下電器産業株式会社 フレキシブルプリント配線基板
JPS63211692A (ja) * 1987-02-27 1988-09-02 株式会社日立製作所 両面配線基板
US5278727A (en) * 1990-05-29 1994-01-11 Digital Equipment Corporation High density electrical interconnection device and method therefor
JPH05299786A (ja) * 1992-04-20 1993-11-12 Ibiden Co Ltd プリント配線板
US5300899A (en) * 1993-02-02 1994-04-05 Ast Research, Inc. Thin, flexible, stripline flex cable having two shielding ground planes formed as grids having mutually offset grid patterns
US5715140A (en) * 1996-05-03 1998-02-03 Ford Motor Company Overlay substrate for securing electronic devices in a vehicle
US5818315A (en) * 1996-12-31 1998-10-06 Lucent Technologies Inc. Signal trace impedance control using a grid-like ground plane
US6407345B1 (en) * 1998-05-19 2002-06-18 Ibiden Co., Ltd. Printed circuit board and method of production thereof
JP2001326429A (ja) * 2000-05-17 2001-11-22 Sony Corp プリント配線基板
JP2002076263A (ja) * 2000-08-31 2002-03-15 Hitachi Ltd 半導体装置
JP2002111142A (ja) * 2000-09-29 2002-04-12 Hitachi Kokusai Electric Inc プリント基板の構造
JP4646386B2 (ja) * 2000-11-30 2011-03-09 京セラ株式会社 配線基板の製造方法
JP2002190657A (ja) * 2000-12-21 2002-07-05 Sony Chem Corp フレキシブル配線板及びその製造方法
JP2003124637A (ja) * 2001-10-11 2003-04-25 Toppan Printing Co Ltd 多層配線板
TW564533B (en) * 2002-10-08 2003-12-01 Siliconware Precision Industries Co Ltd Warpage-preventing substrate

Similar Documents

Publication Publication Date Title
US4912288A (en) Moulded electric circuit package
JPH02109389A (ja) 三次元のプリント配線板
JP6178877B2 (ja) 非平面印刷回路基板アセンブリを製造するための方法
US11310915B2 (en) Thermoforming an electronic device with surface curvature
US8033014B2 (en) Method of making a molded interconnect device
KR101753225B1 (ko) Ｌｄｓ 공법을 이용한 적층 회로 제작 방법
US10070517B2 (en) Three-dimensional circuit structure
JP2012124460A5 (https=)
JP2010267607A (ja) 静電容量センサ及びその製造方法
JP2009004584A5 (https=)
JP2016092259A5 (https=)
JP2007538394A5 (https=)
CA2168285A1 (en) Thermoformed three dimensional wiring module
JP2007150180A5 (https=)
US7676918B2 (en) Method for forming a molded circuit board
JP2007208200A5 (https=)
TW200714142A (en) Method of continuous producing flexible printed circuit board
JPH03147388A (ja) 射出成形印刷回路
CN112074086A (zh) 一种新型立体3d电路板的制作方法
JP2007538394A (ja) プリント基板、製造方法および電子デバイス
US20050206047A1 (en) Contoured circuit boards
CN101646305A (zh) 在非导体基材上制作导线的方法
TWI384919B (zh) 一種在非導體基材上製作導線的方法
KR102453382B1 (ko) 전자 기기를 위한 플렉서블 쉴드 캔
JP2007330044A5 (https=)