JP2007538394A5 - - Google Patents
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- Publication number
- JP2007538394A5 JP2007538394A5 JP2007517318A JP2007517318A JP2007538394A5 JP 2007538394 A5 JP2007538394 A5 JP 2007538394A5 JP 2007517318 A JP2007517318 A JP 2007517318A JP 2007517318 A JP2007517318 A JP 2007517318A JP 2007538394 A5 JP2007538394 A5 JP 2007538394A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- support pattern
- insulating layer
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20045179A FI117234B (fi) | 2004-05-17 | 2004-05-17 | Piirilevy, valmistusmenetelmä ja elektroninen laite |
PCT/FI2005/050160 WO2005112526A1 (fr) | 2004-05-17 | 2005-05-16 | Carte imprimee, procede de fabrication et dispositif electronique correspondants |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007538394A JP2007538394A (ja) | 2007-12-27 |
JP2007538394A5 true JP2007538394A5 (fr) | 2008-07-03 |
Family
ID=32338458
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007517318A Pending JP2007538394A (ja) | 2004-05-17 | 2005-05-16 | プリント基板、製造方法および電子デバイス |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1747704A4 (fr) |
JP (1) | JP2007538394A (fr) |
FI (1) | FI117234B (fr) |
WO (1) | WO2005112526A1 (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5539800B2 (ja) * | 2010-07-07 | 2014-07-02 | 日本特殊陶業株式会社 | 配線基板の中間製品及び配線基板の製造方法 |
US20150257278A1 (en) * | 2014-03-06 | 2015-09-10 | Tactotek Oy | Method for manufacturing electronic products, related arrangement and product |
WO2016032497A1 (fr) | 2014-08-28 | 2016-03-03 | Hewlett-Packard Development Company, L.P. | Ensemble tête d'impression |
US10136512B2 (en) | 2014-12-09 | 2018-11-20 | Microsoft Technology Licensing, Llc | Avoiding reflections in PCB signal trace |
EP4163961A4 (fr) * | 2020-06-03 | 2024-06-26 | Sumitomo Bakelite Co., Ltd. | Carte de circuit imprimé |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61270887A (ja) * | 1985-05-24 | 1986-12-01 | 松下電器産業株式会社 | フレキシブルプリント配線基板 |
JPS63211692A (ja) * | 1987-02-27 | 1988-09-02 | 株式会社日立製作所 | 両面配線基板 |
US5278727A (en) * | 1990-05-29 | 1994-01-11 | Digital Equipment Corporation | High density electrical interconnection device and method therefor |
JPH05299786A (ja) * | 1992-04-20 | 1993-11-12 | Ibiden Co Ltd | プリント配線板 |
US5300899A (en) * | 1993-02-02 | 1994-04-05 | Ast Research, Inc. | Thin, flexible, stripline flex cable having two shielding ground planes formed as grids having mutually offset grid patterns |
US5715140A (en) * | 1996-05-03 | 1998-02-03 | Ford Motor Company | Overlay substrate for securing electronic devices in a vehicle |
US5818315A (en) * | 1996-12-31 | 1998-10-06 | Lucent Technologies Inc. | Signal trace impedance control using a grid-like ground plane |
KR100791281B1 (ko) * | 1998-05-19 | 2008-01-04 | 이비덴 가부시키가이샤 | 프린트배선판 및 프린트배선판의 제조방법 |
JP2001326429A (ja) * | 2000-05-17 | 2001-11-22 | Sony Corp | プリント配線基板 |
JP2002076263A (ja) * | 2000-08-31 | 2002-03-15 | Hitachi Ltd | 半導体装置 |
JP2002111142A (ja) * | 2000-09-29 | 2002-04-12 | Hitachi Kokusai Electric Inc | プリント基板の構造 |
JP4646386B2 (ja) * | 2000-11-30 | 2011-03-09 | 京セラ株式会社 | 配線基板の製造方法 |
JP2002190657A (ja) * | 2000-12-21 | 2002-07-05 | Sony Chem Corp | フレキシブル配線板及びその製造方法 |
JP2003124637A (ja) * | 2001-10-11 | 2003-04-25 | Toppan Printing Co Ltd | 多層配線板 |
TW564533B (en) * | 2002-10-08 | 2003-12-01 | Siliconware Precision Industries Co Ltd | Warpage-preventing substrate |
-
2004
- 2004-05-17 FI FI20045179A patent/FI117234B/fi not_active IP Right Cessation
-
2005
- 2005-05-16 JP JP2007517318A patent/JP2007538394A/ja active Pending
- 2005-05-16 WO PCT/FI2005/050160 patent/WO2005112526A1/fr not_active Application Discontinuation
- 2005-05-16 EP EP05740730A patent/EP1747704A4/fr not_active Withdrawn
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