EP1747704A4 - Carte imprimee, procede de fabrication et dispositif electronique correspondants - Google Patents

Carte imprimee, procede de fabrication et dispositif electronique correspondants

Info

Publication number
EP1747704A4
EP1747704A4 EP05740730A EP05740730A EP1747704A4 EP 1747704 A4 EP1747704 A4 EP 1747704A4 EP 05740730 A EP05740730 A EP 05740730A EP 05740730 A EP05740730 A EP 05740730A EP 1747704 A4 EP1747704 A4 EP 1747704A4
Authority
EP
European Patent Office
Prior art keywords
manufacturing
electronic device
wiring board
printed wiring
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05740730A
Other languages
German (de)
English (en)
Other versions
EP1747704A1 (fr
Inventor
Pauliina Mansikkamaeki
Tero Peltola
Juulia Loisa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MEADVILLE ENTERPRISES (HK) LIMITED
Original Assignee
MEADVILLE ENTERPRISES (HK) Ltd
MEADVILLE ENTPR HK Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MEADVILLE ENTERPRISES (HK) Ltd, MEADVILLE ENTPR HK Ltd filed Critical MEADVILLE ENTERPRISES (HK) Ltd
Publication of EP1747704A1 publication Critical patent/EP1747704A1/fr
Publication of EP1747704A4 publication Critical patent/EP1747704A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
EP05740730A 2004-05-17 2005-05-16 Carte imprimee, procede de fabrication et dispositif electronique correspondants Withdrawn EP1747704A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20045179A FI117234B (fi) 2004-05-17 2004-05-17 Piirilevy, valmistusmenetelmä ja elektroninen laite
PCT/FI2005/050160 WO2005112526A1 (fr) 2004-05-17 2005-05-16 Carte imprimee, procede de fabrication et dispositif electronique correspondants

Publications (2)

Publication Number Publication Date
EP1747704A1 EP1747704A1 (fr) 2007-01-31
EP1747704A4 true EP1747704A4 (fr) 2011-10-12

Family

ID=32338458

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05740730A Withdrawn EP1747704A4 (fr) 2004-05-17 2005-05-16 Carte imprimee, procede de fabrication et dispositif electronique correspondants

Country Status (4)

Country Link
EP (1) EP1747704A4 (fr)
JP (1) JP2007538394A (fr)
FI (1) FI117234B (fr)
WO (1) WO2005112526A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5539800B2 (ja) * 2010-07-07 2014-07-02 日本特殊陶業株式会社 配線基板の中間製品及び配線基板の製造方法
US20150257278A1 (en) * 2014-03-06 2015-09-10 Tactotek Oy Method for manufacturing electronic products, related arrangement and product
CN106794698B (zh) 2014-08-28 2019-02-26 惠普发展公司，有限责任合伙企业 打印头组件
US10136512B2 (en) 2014-12-09 2018-11-20 Microsoft Technology Licensing, Llc Avoiding reflections in PCB signal trace

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61270887A (ja) * 1985-05-24 1986-12-01 松下電器産業株式会社 フレキシブルプリント配線基板
US5095407A (en) * 1987-02-27 1992-03-10 Hitachi, Ltd. Double-sided memory board
US5278727A (en) * 1990-05-29 1994-01-11 Digital Equipment Corporation High density electrical interconnection device and method therefor
US5300899A (en) * 1993-02-02 1994-04-05 Ast Research, Inc. Thin, flexible, stripline flex cable having two shielding ground planes formed as grids having mutually offset grid patterns
US5715140A (en) * 1996-05-03 1998-02-03 Ford Motor Company Overlay substrate for securing electronic devices in a vehicle
US5818315A (en) * 1996-12-31 1998-10-06 Lucent Technologies Inc. Signal trace impedance control using a grid-like ground plane
US20020043400A1 (en) * 2000-08-31 2002-04-18 Hitachi, Ltd. Semiconductor device
JP2002171030A (ja) * 2000-11-30 2002-06-14 Kyocera Corp 配線基板およびその製造方法
US6407345B1 (en) * 1998-05-19 2002-06-18 Ibiden Co., Ltd. Printed circuit board and method of production thereof
US20040065473A1 (en) * 2002-10-08 2004-04-08 Siliconware Precision Industries, Ltd., Taiwan Warpage preventing substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05299786A (ja) * 1992-04-20 1993-11-12 Ibiden Co Ltd プリント配線板
JP2001326429A (ja) * 2000-05-17 2001-11-22 Sony Corp プリント配線基板
JP2002111142A (ja) * 2000-09-29 2002-04-12 Hitachi Kokusai Electric Inc プリント基板の構造
JP2002190657A (ja) * 2000-12-21 2002-07-05 Sony Chem Corp フレキシブル配線板及びその製造方法
JP2003124637A (ja) * 2001-10-11 2003-04-25 Toppan Printing Co Ltd 多層配線板

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61270887A (ja) * 1985-05-24 1986-12-01 松下電器産業株式会社 フレキシブルプリント配線基板
US5095407A (en) * 1987-02-27 1992-03-10 Hitachi, Ltd. Double-sided memory board
US5278727A (en) * 1990-05-29 1994-01-11 Digital Equipment Corporation High density electrical interconnection device and method therefor
US5300899A (en) * 1993-02-02 1994-04-05 Ast Research, Inc. Thin, flexible, stripline flex cable having two shielding ground planes formed as grids having mutually offset grid patterns
US5715140A (en) * 1996-05-03 1998-02-03 Ford Motor Company Overlay substrate for securing electronic devices in a vehicle
US5818315A (en) * 1996-12-31 1998-10-06 Lucent Technologies Inc. Signal trace impedance control using a grid-like ground plane
US6407345B1 (en) * 1998-05-19 2002-06-18 Ibiden Co., Ltd. Printed circuit board and method of production thereof
US20020043400A1 (en) * 2000-08-31 2002-04-18 Hitachi, Ltd. Semiconductor device
JP2002171030A (ja) * 2000-11-30 2002-06-14 Kyocera Corp 配線基板およびその製造方法
US20040065473A1 (en) * 2002-10-08 2004-04-08 Siliconware Precision Industries, Ltd., Taiwan Warpage preventing substrate

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 198702, Derwent World Patents Index; AN 1987-011969, XP002570962 *
See also references of WO2005112526A1 *

Also Published As

Publication number Publication date
FI117234B (fi) 2006-07-31
WO2005112526A8 (fr) 2006-02-16
FI20045179A0 (fi) 2004-05-17
EP1747704A1 (fr) 2007-01-31
FI20045179A (fi) 2005-11-18
WO2005112526A1 (fr) 2005-11-24
JP2007538394A (ja) 2007-12-27

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20061109

AK Designated contracting states

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Designated state(s): AT CH DE FR GB LI SE

DAX Request for extension of the european patent (deleted)
RBV Designated contracting states (corrected)

Designated state(s): AT CH DE FR GB LI SE

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: MEADVILLE ENTERPRISES (HK) LIMITED

A4 Supplementary search report drawn up and despatched

Effective date: 20100519

17Q First examination report despatched

Effective date: 20121109

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20130422