JP2007509320A - 放射感知装置の集積されたパッケージ設計および方法 - Google Patents

放射感知装置の集積されたパッケージ設計および方法 Download PDF

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Publication number
JP2007509320A
JP2007509320A JP2006535397A JP2006535397A JP2007509320A JP 2007509320 A JP2007509320 A JP 2007509320A JP 2006535397 A JP2006535397 A JP 2006535397A JP 2006535397 A JP2006535397 A JP 2006535397A JP 2007509320 A JP2007509320 A JP 2007509320A
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JP
Japan
Prior art keywords
processing chamber
window
vacuum chamber
solder
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006535397A
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English (en)
Japanese (ja)
Other versions
JP2007509320A5 (enExample
Inventor
ケネディー、アダム・エム．
バイレイ、マイケル・シー．
メイスナー、エドワード
ドッズ、ロバート・ケー．
バンルー、デイビッド
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of JP2007509320A publication Critical patent/JP2007509320A/ja
Publication of JP2007509320A5 publication Critical patent/JP2007509320A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G01J5/041—Mountings in enclosures or in a particular environment
    • G01J5/045—Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G01J5/046—Materials; Selection of thermal materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0875—Windows; Arrangements for fastening thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Light Receiving Elements (AREA)
JP2006535397A 2003-10-17 2004-10-16 放射感知装置の集積されたパッケージ設計および方法 Pending JP2007509320A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/688,708 US7084010B1 (en) 2003-10-17 2003-10-17 Integrated package design and method for a radiation sensing device
PCT/US2004/034302 WO2005038909A2 (en) 2003-10-17 2004-10-16 Integrated package design for a radiation sensing device and manufacturing method

Publications (2)

Publication Number Publication Date
JP2007509320A true JP2007509320A (ja) 2007-04-12
JP2007509320A5 JP2007509320A5 (enExample) 2007-09-27

Family

ID=34465604

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006535397A Pending JP2007509320A (ja) 2003-10-17 2004-10-16 放射感知装置の集積されたパッケージ設計および方法

Country Status (4)

Country Link
US (1) US7084010B1 (enExample)
EP (1) EP1673814B1 (enExample)
JP (1) JP2007509320A (enExample)
WO (1) WO2005038909A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014146755A (ja) * 2013-01-30 2014-08-14 Kyocera Corp 電子装置製造用ジグおよび電子装置の製造方法
JP2015114325A (ja) * 2013-12-09 2015-06-22 オックスフォード インストゥルメンツ アナリティカル オーワイＯｘｆｏｒｄ Ｉｎｓｔｒｕｍｅｎｔｓ Ａｎａｌｙｔｉｃａｌ Ｏｙ 大きな作用面積を有する半導体放射線検出器およびその製造方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI302036B (en) * 2005-04-01 2008-10-11 Unimems Mfg Co Ltd Infrared imaging sensor and vacuum packaging method thereof
US7790484B2 (en) * 2005-06-08 2010-09-07 Sharp Kabushiki Kaisha Method for manufacturing laser devices
US7301227B1 (en) * 2005-08-19 2007-11-27 Sun Microsystems, Inc. Package lid or heat spreader for microprocessor packages
US8743207B2 (en) 2010-07-27 2014-06-03 Flir Systems Inc. Infrared camera architecture systems and methods
JP6017906B2 (ja) * 2011-10-19 2016-11-02 株式会社Kelk 温調装置
US20160380014A1 (en) * 2014-01-27 2016-12-29 INVIS Technologies Corporation Thermal Imaging Device
CN105161485B (zh) * 2015-07-28 2017-12-26 昆明物理研究所 一体化封装管壳和半导体恒温器及其制备方法
CN108766898B (zh) * 2018-06-23 2020-04-17 芜湖迅创信息科技有限公司 一种防掉落的电子元器件封装用料饼上料装置
CN113363275B (zh) * 2021-08-10 2021-11-16 西安中科立德红外科技有限公司 混合成像结构
CN119635106B (zh) * 2025-01-03 2025-07-22 成都市汉桐集成技术股份有限公司 一种真空平行缝焊设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09229765A (ja) * 1996-02-28 1997-09-05 Mitsubishi Electric Corp 赤外線検出器

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0566156B1 (en) * 1992-04-17 1997-08-27 Terumo Kabushiki Kaisha Infrared sensor and method for production thereof
US5433639A (en) 1993-08-18 1995-07-18 Santa Barbara Research Center Processing of vacuum-sealed dewar assembly
US5399897A (en) 1993-11-29 1995-03-21 Raytheon Company Microstructure and method of making such structure
CA2179052C (en) 1993-12-13 2001-02-13 Robert E. Higashi Integrated silicon vacuum micropackage for infrared devices
US5641713A (en) * 1995-03-23 1997-06-24 Texas Instruments Incorporated Process for forming a room temperature seal between a base cavity and a lid using an organic sealant and a metal seal ring
US5708269A (en) 1995-08-15 1998-01-13 Raytheon Ti Systems, Inc. Thermal detector and method
US5688699A (en) 1996-01-16 1997-11-18 Raytheon Company Microbolometer
US5808350A (en) 1997-01-03 1998-09-15 Raytheon Company Integrated IR, visible and NIR sensor and methods of fabricating same
US5921461A (en) 1997-06-11 1999-07-13 Raytheon Company Vacuum package having vacuum-deposited local getter and its preparation
US6077046A (en) 1998-01-20 2000-06-20 Raytheon Company Getter assembly having porous metallic support and its use in a vacuum apparatus
US6043982A (en) 1998-04-01 2000-03-28 Raytheon Company Integrated circuit package having a thermoelectric cooling element therein
US6122919A (en) 1999-06-22 2000-09-26 Raytheon Company Sensor/cooling system with cold finger having recessed end
US6326611B1 (en) 1999-09-28 2001-12-04 Raytheon Company Integrated multiple sensor package
US6479320B1 (en) 2000-02-02 2002-11-12 Raytheon Company Vacuum package fabrication of microelectromechanical system devices with integrated circuit components
FR2816447B1 (fr) 2000-11-07 2003-01-31 Commissariat Energie Atomique Dispositif de detection de rayonnements electromagnetiques tridimensionnel et procede de realisation de ce dispositif
FR2822541B1 (fr) 2001-03-21 2003-10-03 Commissariat Energie Atomique Procedes et dispositifs de fabrication de detecteurs de rayonnement

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09229765A (ja) * 1996-02-28 1997-09-05 Mitsubishi Electric Corp 赤外線検出器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014146755A (ja) * 2013-01-30 2014-08-14 Kyocera Corp 電子装置製造用ジグおよび電子装置の製造方法
JP2015114325A (ja) * 2013-12-09 2015-06-22 オックスフォード インストゥルメンツ アナリティカル オーワイＯｘｆｏｒｄ Ｉｎｓｔｒｕｍｅｎｔｓ Ａｎａｌｙｔｉｃａｌ Ｏｙ 大きな作用面積を有する半導体放射線検出器およびその製造方法

Also Published As

Publication number Publication date
EP1673814A2 (en) 2006-06-28
WO2005038909A2 (en) 2005-04-28
EP1673814B1 (en) 2014-12-17
WO2005038909A3 (en) 2005-11-24
US7084010B1 (en) 2006-08-01

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