JP2007508157A - 計算された放射線スポット長さによって平坦なセラミック加工物を分離するための方法 - Google Patents
計算された放射線スポット長さによって平坦なセラミック加工物を分離するための方法 Download PDFInfo
- Publication number
- JP2007508157A JP2007508157A JP2006517958A JP2006517958A JP2007508157A JP 2007508157 A JP2007508157 A JP 2007508157A JP 2006517958 A JP2006517958 A JP 2006517958A JP 2006517958 A JP2006517958 A JP 2006517958A JP 2007508157 A JP2007508157 A JP 2007508157A
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- JP
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- Prior art keywords
- workpiece
- beam spot
- ceramic
- stress
- length
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/60—Production of ceramic materials or ceramic elements, e.g. substitution of clay or shale by alternative raw materials, e.g. ashes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Mining & Mineral Resources (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
・レーザ放射出力
・ビームスポットの出力密度
・ビームスポットの形状および表面積
・ビームスポットと加工物との間の相対速度
・加工物の材料特性
・冷却剤の熱物理的特性
・冷却断面の形状と表面積およびビーム断面からの距離
によって決定される。
Claims (5)
- 所望の分割線に沿ったレーザによる熱の一時的かつ局所的な適用と、これに続いて、冷却剤による熱の一時的かつ局所的な除去の結果として生じる応力に起因する分離亀裂の誘発によって平坦なセラミック加工物を分割するための方法であって、
レーザ放射線が前記加工物上にビームスポットを形成し、前記分割線の方向における前記ビームスポットの長さが、前記分割線に直交する前記ビームスポットの幅より大きく、前記ビームスポット長が、前記加工物の熱伝導率および前記加工物の材料厚さに基づいて調整されて、熱伝導にかかわらず分割亀裂を発生するために必要な温度勾配を実現するために必要なほど小さいけれども、熱の可能な限り最速の導入、したがって高い工程速度を実現するために可能な限り大きく、
前記ビームスポット長が、
l=8×d×24/WLF
の式から計算され、式中、lは前記ビームスポットの長さであり、WLFは分割されるべき前記セラミックの熱伝導率であり、dは分割されるべき前記セラミックの厚さである、方法。 - 前記分割工程を開始するのに初期亀裂が形成されていないことを特徴とする請求項1に記載の方法。
- 前記所望の分割線に沿った加工物の前記内部応力が、前記分割工程の開始前に決定され、前記内部応力を考慮しながら前記出力または前記速度が前記分割工程中に空間的に指向された態様で制御され、要するに、前記分割線に沿った前記熱応力および前記内部応力が亀裂形成のために必要な破壊応力を実現することを特徴とする請求項1または2に記載の方法。
- 前記加工物は、前記プロセス応力を補強する更なる応力を発生するために、プレテンショニングを伴って加工物支持体上に保持されることを特徴とする請求項1〜3のいずれか一項に記載の方法。
- 前記加工物が前記加工物支持体に固定され、当該加工物支持体上で前記加工物はまた、前記内部応力を測定するために、前記分割工程中、同じ態様で保持されることを特徴とする請求項3に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10330179A DE10330179A1 (de) | 2003-07-02 | 2003-07-02 | Verfahren zum Trennen flacher Werkstücke aus Keramik |
PCT/DE2004/001490 WO2005002779A1 (de) | 2003-07-02 | 2004-07-02 | Verfahren zum trennen flacher werkstücke aus keramik mit einer berechneten strahlflecklänge |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2007508157A true JP2007508157A (ja) | 2007-04-05 |
Family
ID=33521328
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006517958A Pending JP2007508157A (ja) | 2003-07-02 | 2004-07-02 | 計算された放射線スポット長さによって平坦なセラミック加工物を分離するための方法 |
Country Status (9)
Country | Link |
---|---|
US (1) | US20060145399A1 (ja) |
EP (1) | EP1641591B1 (ja) |
JP (1) | JP2007508157A (ja) |
KR (1) | KR20060036077A (ja) |
CN (1) | CN100589915C (ja) |
AT (1) | ATE419949T1 (ja) |
DE (3) | DE10330179A1 (ja) |
TW (1) | TWI314488B (ja) |
WO (1) | WO2005002779A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010527141A (ja) * | 2007-04-25 | 2010-08-05 | セラムテック アクチエンゲゼルシャフト | チップ抵抗器基板 |
JPWO2016151776A1 (ja) * | 2015-03-24 | 2017-04-27 | 三菱電機株式会社 | レーザ加工方法、レーザ加工機、加工プログラム生成装置およびレーザ加工システム |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005144487A (ja) * | 2003-11-13 | 2005-06-09 | Seiko Epson Corp | レーザ加工装置及びレーザ加工方法 |
FR2970666B1 (fr) * | 2011-01-24 | 2013-01-18 | Snecma | Procede de perforation d'au moins une paroi d'une chambre de combustion |
EP2965853B2 (en) | 2014-07-09 | 2020-03-25 | High Q Laser GmbH | Processing of material using elongated laser beams |
CN113139300B (zh) * | 2021-05-14 | 2023-09-12 | 南京工程学院 | 陶瓷微孔致裂强度定量预测方法、装置、计算机设备及存储介质 |
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-
2003
- 2003-07-02 DE DE10330179A patent/DE10330179A1/de not_active Withdrawn
-
2004
- 2004-07-02 DE DE112004001646T patent/DE112004001646D2/de not_active Expired - Fee Related
- 2004-07-02 EP EP04738906A patent/EP1641591B1/de not_active Not-in-force
- 2004-07-02 US US10/563,411 patent/US20060145399A1/en not_active Abandoned
- 2004-07-02 TW TW093119985A patent/TWI314488B/zh not_active IP Right Cessation
- 2004-07-02 WO PCT/DE2004/001490 patent/WO2005002779A1/de active Application Filing
- 2004-07-02 AT AT04738906T patent/ATE419949T1/de not_active IP Right Cessation
- 2004-07-02 DE DE502004008826T patent/DE502004008826D1/de active Active
- 2004-07-02 JP JP2006517958A patent/JP2007508157A/ja active Pending
- 2004-07-02 CN CN200480014965A patent/CN100589915C/zh not_active Expired - Fee Related
- 2004-07-02 KR KR1020067000011A patent/KR20060036077A/ko active IP Right Grant
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JPH08509947A (ja) * | 1992-04-02 | 1996-10-22 | フォノン テクノロジー リミテッド | 非金属材料の分割 |
JPH0899186A (ja) * | 1994-09-30 | 1996-04-16 | A G Technol Kk | レーザ加工装置 |
JPH0919782A (ja) * | 1995-07-04 | 1997-01-21 | Hitachi Cable Ltd | 基板の加工方法及びその加工装置 |
JPH09141764A (ja) * | 1995-11-21 | 1997-06-03 | Koatetsuku Kk | 中空紐状物の製造装置 |
WO2002048059A1 (de) * | 2000-12-15 | 2002-06-20 | Lzh Laserzentrum Hannover E.V. | Verfahren zum durchtrennen von bauteilen aus glas, keramik, glaskeramik oder dergleichen durch erzeugung eines thermischen spannungsrisses an dem bauteil entlang einer trennzone |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010527141A (ja) * | 2007-04-25 | 2010-08-05 | セラムテック アクチエンゲゼルシャフト | チップ抵抗器基板 |
JPWO2016151776A1 (ja) * | 2015-03-24 | 2017-04-27 | 三菱電機株式会社 | レーザ加工方法、レーザ加工機、加工プログラム生成装置およびレーザ加工システム |
Also Published As
Publication number | Publication date |
---|---|
DE112004001646D2 (de) | 2006-05-18 |
EP1641591B1 (de) | 2009-01-07 |
CN100589915C (zh) | 2010-02-17 |
CN1798631A (zh) | 2006-07-05 |
WO2005002779A1 (de) | 2005-01-13 |
ATE419949T1 (de) | 2009-01-15 |
TW200524695A (en) | 2005-08-01 |
TWI314488B (en) | 2009-09-11 |
DE10330179A1 (de) | 2005-01-20 |
DE502004008826D1 (de) | 2009-02-26 |
EP1641591A1 (de) | 2006-04-05 |
US20060145399A1 (en) | 2006-07-06 |
KR20060036077A (ko) | 2006-04-27 |
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