JP2007331095A5 - - Google Patents
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- Publication number
- JP2007331095A5 JP2007331095A5 JP2007131665A JP2007131665A JP2007331095A5 JP 2007331095 A5 JP2007331095 A5 JP 2007331095A5 JP 2007131665 A JP2007131665 A JP 2007131665A JP 2007131665 A JP2007131665 A JP 2007131665A JP 2007331095 A5 JP2007331095 A5 JP 2007331095A5
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- JP
- Japan
- Prior art keywords
- layer
- forming
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- substrate
- release
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims 47
- 125000006850 spacer group Chemical group 0.000 claims 25
- 238000004519 manufacturing process Methods 0.000 claims 9
- 238000000034 method Methods 0.000 claims 7
- 239000004065 semiconductor Substances 0.000 claims 6
- 239000000853 adhesive Substances 0.000 claims 3
- 230000001070 adhesive effect Effects 0.000 claims 3
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007131665A JP2007331095A (ja) | 2006-05-18 | 2007-05-17 | 微小構造体、マイクロマシンおよび半導体装置、ならびに微小構造体およびマイクロマシンの作製方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006138835 | 2006-05-18 | ||
| JP2007131665A JP2007331095A (ja) | 2006-05-18 | 2007-05-17 | 微小構造体、マイクロマシンおよび半導体装置、ならびに微小構造体およびマイクロマシンの作製方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007331095A JP2007331095A (ja) | 2007-12-27 |
| JP2007331095A5 true JP2007331095A5 (enrdf_load_stackoverflow) | 2010-06-24 |
Family
ID=38931057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007131665A Withdrawn JP2007331095A (ja) | 2006-05-18 | 2007-05-17 | 微小構造体、マイクロマシンおよび半導体装置、ならびに微小構造体およびマイクロマシンの作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007331095A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5203794B2 (ja) * | 2008-05-08 | 2013-06-05 | 日本電信電話株式会社 | 微細構造 |
| US8760413B2 (en) * | 2009-01-08 | 2014-06-24 | Synaptics Incorporated | Tactile surface |
| JP5761293B2 (ja) * | 2013-10-02 | 2015-08-12 | セイコーエプソン株式会社 | 電気光学装置及び電子機器 |
| JP6854517B2 (ja) * | 2017-07-27 | 2021-04-07 | 株式会社ジェイテックコーポレーション | 形状可変ミラー |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10270718A (ja) * | 1997-03-26 | 1998-10-09 | Mitsubishi Materials Corp | 半導体慣性センサの製造方法 |
| JP4061846B2 (ja) * | 2001-01-23 | 2008-03-19 | セイコーエプソン株式会社 | 積層体の製造方法及び半導体装置の製造方法 |
| US6663820B2 (en) * | 2001-03-14 | 2003-12-16 | The Procter & Gamble Company | Method of manufacturing microneedle structures using soft lithography and photolithography |
| JP2003326500A (ja) * | 2002-05-07 | 2003-11-18 | Masaki Esashi | ウエーハプロセス用薄板基板構造とこの薄板基板を用いたｍｅｍｓ素子の製造方法 |
| KR100486716B1 (ko) * | 2002-10-18 | 2005-05-03 | 삼성전자주식회사 | 2-ｄ 액튜에이터 및 그 제조방법 |
| JP4059203B2 (ja) * | 2004-01-27 | 2008-03-12 | 松下電工株式会社 | マイクロリレー |
| KR100624436B1 (ko) * | 2004-10-19 | 2006-09-15 | 삼성전자주식회사 | 2축 액츄에이터 및 그 제조방법 |
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2007
- 2007-05-17 JP JP2007131665A patent/JP2007331095A/ja not_active Withdrawn