JP2007316244A - Manufacturing method for element substrate and manufacturing method for liquid crystal display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily and accurately correct a defect which is detected by electric inspection. <P>SOLUTION: A manufacturing method comprises: an electric inspection process S12 for detecting existence of the defect in a unit region by detecting electric charge held in a capacitance element after supplying the charge to a capacitance element of an element substrate which is mounted on a first stage; and a correction process S16 for correcting the defect on a second stage. The electric inspection process S12 includes a coordinate detection process S13 for detecting a position coordinate of the unit region including the defect, when the defect of the unit region is detected. In a correction process S16, a position of the unit region including the defect in the second stage by position coordinate, is specified and the defect of the unit region is corrected. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an element substrate and a method for manufacturing a liquid crystal display device.

  In recent years, demand for thin display devices such as liquid crystal display devices has been rapidly expanding, and needs for display quality and reliability are increasing day by day. For the thin display device, for example, a method of performing display by active matrix driving is suitably used. In this active matrix driving type thin display device, for example, a TFT substrate, which is an element substrate in which a plurality of thin film transistors (hereinafter abbreviated as TFTs) are arranged in a matrix, and the TFT substrate are arranged opposite to each other. It has a counter substrate and a display medium layer interposed between the TFT substrate and the counter substrate.

  A liquid crystal display device will be described as an example. In manufacturing the liquid crystal display device, after a TFT substrate and a counter substrate are formed, they are bonded to each other through a seal member and a liquid crystal layer. Various inspections are performed in the manufacturing process.

  For example, a cell lighting inspection is generally known in which after a TFT substrate and a counter substrate are bonded together to form a liquid crystal display panel, the panel is turned on for inspection. In the lighting inspection, in order to display a prepared image pattern, a pixel defect, color unevenness, contrast, or the like is visually inspected by applying a driving signal for inspection to the data line terminal and the scanning line terminal. .

  A TFT array inspection is also known in which a TFT substrate is inspected in advance before being bonded to a counter substrate. That is, in the TFT array inspection, first, a charge write voltage is applied to the data line and a voltage is applied to the scanning line, whereby the charge is written to the pixel capacitor to be inspected. Next, the charge is measured after a lapse of a certain time. Based on the measured value of the electric charge, it is possible to determine whether the signal line is short-circuited, disconnected, or defective.

  Further, optical inspection such as AOI for optically inspecting a TFT substrate is known. In this inspection, each predetermined region of the TFT substrate can be enlarged and recognized, and the shape of the pattern formed on the substrate is continuously inspected.

  The optical inspection can be performed in an arbitrary process, and the state of the substrate can be grasped without time difference. For example, if optical inspection is applied to photoresist development inspection, defects can be found in the stage before etching processing, and the reduction in substrate yield can be suppressed by simply redoing resist formation. Is possible.

  However, there is a case where the dust does not come into a pattern defect in actuality only by lightly riding on the pattern after the photo process. In this case, there is a problem that it is difficult to make a reliable determination by optical inspection, and the detection work is troublesome. Detection of a pinhole of about several μm is not economically practical because it requires a great deal of effort to distinguish it from overlying dust that increases exponentially with the miniaturization of the size.

  In Patent Document 1, as an inspection system for a liquid crystal display device, a lighting control unit that supplies a control signal to a gate line and a data line of a liquid crystal panel to be inspected, and respective pixel capacities of pixels for one frame in the liquid crystal panel The data line of the liquid crystal panel connected to the lighting control unit is connected to the charge measurement unit for one frame period in response to the input of the charge measurement unit for measuring the voltage and the test start signal instructing the start of the electrical test. Including an inspection switching unit. As a result, the electrical inspection and the lighting inspection of the liquid crystal display device can be performed simultaneously under the same conditions.

  In Patent Document 2, in order to shorten the time required for inspection and repair, files including the contents of defects generated in each inspection machine are integrated, and after all inspection machines are executed, at the final stage of the manufacturing process. It is disclosed that a repair machine repairs at once by referring to an integrated file.

Specifically, the repair system includes a plurality of inspection machines and repair machines. The inspection machine optically or electrically inspects a substrate on which a predetermined pattern is formed in each processing step sequentially after each step, and stores the inspection result in a file in a certain format. The repair machine is connected to multiple inspection machines, acquires the files saved by the inspection machine, performs the file integration work on the files, then performs the repair work collectively with reference to the integrated files Yes.
Japanese Patent Laid-Open No. 11-38374 JP 2000-82729 A

  By the way, since the TFT array inspection is an electrical inspection, defects such as a minute pinhole of about several μm that cannot be identified by an optical inspection are not affected by the amount of overshooting dust. It can be detected reliably. However, generally, in order to optically visually recognize or correct a defect detected in the TFT array inspection, it is necessary to transfer the TFT substrate from the stage where the TFT array inspection is performed to another different stage. For this reason, there is a problem that in order to specify the position of the defect again on the transferred stage and align it with high accuracy, the defect can only be displayed and specified by turning on the panel.

  The present invention has been made in view of such various points, and a main object of the present invention is to easily and efficiently correct defects detected by electrical inspection.

  In order to achieve the above object, according to the present invention, an electrical inspection is performed on the first stage, a position coordinate of a region including a defect is detected, and a defect specified by the position coordinate is corrected on the second stage. I made it.

  Specifically, the element substrate manufacturing method according to the present invention includes a first mounting step of mounting an element substrate on which a plurality of unit regions having capacitive elements are arranged on a first stage, and mounting the element substrate on the first stage. In addition, after supplying electric charge to the capacitive element of the element substrate, an electric inspection step for detecting the presence or absence of a defect in the unit region by detecting the electric charge held in the capacitive element for a certain period of time; and A second mounting step of transporting the element substrate from the first stage and mounting it on the second stage when a defect is detected; and a correcting step of correcting the defect in the second stage. The electrical inspection step includes a coordinate detection step of detecting a position coordinate of the unit region including the defect when a defect of the unit region is detected. In the correction step, the position coordinate Therefore locates unit area including the defect in the second stage, to correct defects of the unit area.

  When a defect in the unit area is detected, it is preferable to have a correction area prediction step of predicting a correction area in which a defect has occurred in the unit area and needs to be corrected.

  In the correction region prediction step, a plurality of inspection pattern signals are input to the capacitive element of the unit region including the defect, and the correction region is selected according to a combination of output values from the capacitance element obtained for each inspection pattern signal. May be predicted.

  The correction area is preferably predicted based on a predetermined table.

  It is preferable that a drive circuit for driving each unit region is directly built in the element substrate.

  In the correction step, the unit region including the defect may be optically enlarged and analyzed.

  In the correction step, it is preferable to correct the defect by irradiating a laser along the optical axis at the time of the analysis.

  In the correction step, after the defect is corrected, the state of the unit region containing the defect may be analyzed again.

  The correction area data predicted in the correction area prediction step may be transmitted from the first stage to the second stage by data communication.

  In addition, a method for manufacturing a liquid crystal display device according to the present invention includes an element substrate on which a plurality of pixels each including a capacitive element are arranged, a counter substrate arranged to face the element substrate, the counter substrate, and the element substrate. A method of manufacturing a liquid crystal display device including a liquid crystal layer provided therebetween, the first mounting step of mounting the element substrate on a first stage, and the element mounted on the first stage An electrical inspection process for detecting the presence or absence of a defect in the pixel by detecting the charge held in the capacitive element after supplying the charge to the capacitive element on the substrate, and when a defect in the pixel is detected And a second mounting step of transporting the element substrate from the first stage and mounting the device substrate on the second stage, and a correction step of correcting the defect in the second stage. When a defect of the pixel is detected, a coordinate detection step of detecting a position coordinate of the pixel including the defect is included, and the correction step includes a pixel including the defect in the second stage based on the position coordinate. And the defect of the pixel is corrected.

  It is preferable that when a defect of the pixel is detected, there is a correction region prediction step of predicting a correction region in which the defect is generated and needs to be corrected.

  In the correction region prediction step, a plurality of inspection pattern signals are input to the capacitor element of the pixel including the defect, and the correction region is determined according to a combination of output values from the capacitor element obtained for each inspection pattern signal. It may be predicted.

  The correction area is preferably predicted based on a predetermined table.

  It is preferable that a drive circuit for driving each pixel is directly built in the element substrate.

  In the correction step, the pixel including the defect may be optically enlarged and analyzed.

  In the correction step, it is preferable to correct the defect by irradiating a laser along the optical axis at the time of the analysis.

  In the correction step, after correcting the defect, the state of the pixel including the defect may be analyzed again.

  The correction area data predicted in the correction area prediction step may be transmitted from the first stage to the second stage by data communication.

  The correction mark formed by the defect correction may be protected and flattened by a flattening film, and then the pixel electrode may be formed.

-Action-
Next, the operation of the present invention will be described.

  A plurality of unit regions (corresponding to pixels when the element substrate constitutes a liquid crystal display device) having a capacitive element are arranged on the element substrate. When manufacturing an element substrate, a 1st mounting process and an electrical inspection process are performed. When a defect is detected in the unit region of the element substrate, a coordinate detection process, a second mounting process, and a correction process are performed.

  In the first mounting step, the element substrate is mounted on the first stage. Thereafter, in the electrical inspection process, after charge is supplied to the capacitor element of the element substrate mounted on the first stage, the charge held in the capacitor element is detected. Then, the presence / absence of a defect in the unit region is detected based on the detected charge amount.

  The electrical inspection process includes a coordinate detection process. In the coordinate detection step, when a defect in the unit area is detected, the position coordinates of the unit area including the defect are detected. Thereafter, a second mounting step is performed, and the element substrate is transported from the first stage and mounted on the second stage. Next, a correction process is performed, and the defect is corrected in the second stage. At this time, the position of the unit region including the defect is specified by the position coordinates, and the defect of the unit region is corrected. Thus, the presence or absence of defects is inspected and the defects are corrected, and the element substrate is manufactured.

  Furthermore, when a defect in the unit area is detected, it is preferable to perform a correction area prediction step of predicting a correction area in which the defect has occurred in the unit area and needs to be corrected. That is, in the correction region prediction step, first, a plurality of inspection pattern signals are input to the capacitive element for a unit region including a defect whose position coordinates are specified. As a result, the correction region is predicted according to the combination of output values from the capacitive elements obtained for each inspection pattern. The correction area can be predicted based on a predetermined table.

  In the correction process, the unit region including the defect can be optically enlarged and analyzed. At that time, it is preferable to correct the defect by irradiating a laser along the optical axis at the time of analysis. As a result, correction by a laser can be easily and efficiently performed using an optical axis aligned for analysis.

  The correction work may be performed without human intervention.

  By the way, removal scraps such as cutting off are generated at the time of defect correction by the laser, and there is a possibility that the removal scraps may cause new defects in other portions of the unit region. Therefore, it is preferable to analyze again the state of the unit region after the defect correction in the correction step. As a result, even if a new defect occurs along with the correction, the correction can be easily performed again, so that the process can be shortened and the yield of the substrate can be improved.

  After correction, the flattening film is flattened by filling the correction marks, and by forming pixel electrodes with good flatness, the uniformity of the alignment force that affects the display uniformity can be maintained, and the display quality can be maintained. A high liquid crystal display device can be provided.

  When manufacturing a liquid crystal display device, the counter substrate is bonded to the element substrate manufactured as described above, and the liquid crystal layer is provided between the counter substrate and the element substrate. . Thereby, a liquid crystal display device in which the element substrate is inspected and corrected is manufactured.

  According to the present invention, the electrical inspection is performed on the first stage, the position coordinates of the region including the defect are detected, and the defect specified by the position coordinates on the second stage is corrected. The detected defect can be easily and accurately corrected.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiment.

Embodiment 1 of the Invention
1 to 7 show Embodiment 1 of the present invention. In the first embodiment, when manufacturing a TFT substrate which is a liquid crystal display device or an element substrate constituting the liquid crystal display device, defects of the TFT substrate are inspected and corrected.

  Although not shown, the liquid crystal display device includes a TFT substrate, a counter substrate disposed to face the TFT substrate, and a liquid crystal layer provided between the counter substrate and the TFT substrate. On the counter substrate, a color filter, a common electrode, a black matrix, and the like are formed.

  On the other hand, the TFT substrate is configured as a so-called active matrix substrate. On the TFT substrate, as shown in an enlarged view in FIG. 4 which is a plan view, a plurality of pixels 12 as unit regions are arranged in a matrix. A plurality of gate wirings 13 are formed on the TFT substrate 10 so as to extend in parallel with each other. In addition, a plurality of source lines 14 are formed on the TFT substrate 10 in parallel with each other, and are arranged so as to be orthogonal to the gate lines 13. As a result, the TFT substrate 10 is formed with a pattern in which the wiring composed of the gate wiring 13 and the source wiring 14 is regularly arranged.

  Each pixel 12 is formed by a rectangular region partitioned by the gate wiring 13 and the source wiring 14. Each pixel 12 is formed with a pixel electrode 15 for driving the liquid crystal layer. The pixel electrode 15 is disposed between the pixels 12 and has a rectangular shape. As shown in FIG. 4, a predetermined interval is provided between the pixel electrode 15 and the surrounding wiring (gate wiring 13 and source wiring 14) in plan view.

  Each pixel 12 is provided with a TFT (thin film transistor) 16 which is a switching element for driving the pixel electrode 15 in an active matrix. The TFT 16 includes a gate electrode 17 connected to the gate wiring 13, a source electrode 18 connected to the source wiring 14, and a drain electrode 19 connected to the pixel electrode 15. Thus, the signal voltage is supplied from the source wiring 14 to the pixel electrode 15 via the source electrode 18 and the drain electrode 19 in a state where the scanning voltage is applied to the gate electrode 17 via the gate wiring 13. ing.

  In addition, a plurality of capacitor wirings 20 are formed on the TFT substrate 10 in parallel with each other so as to pass between the pixels. An insulating film is interposed between the capacitor wiring 20 and the pixel electrode 15, and a capacitor element 21, also called an auxiliary capacitor, is formed by these. The capacitive element 21 is formed in each pixel 12 and has a function of reducing display voltage fluctuation in each pixel 12 that occurs at the moment when the gate 16 switches from the on state to the off state. In FIG. 4, the pixel electrode 15 and the capacitor 21 are described as being formed on the same surface, but may be formed with different layers. Further, a driving circuit (not shown) for driving each pixel 12 is directly built in the TFT substrate 10.

  Incidentally, each pixel 12 may be defective in the manufacturing stage. Here, for example, a state in which the pixel electrode 15 and the gate wiring 13 or the source wiring 14 are erroneously electrically connected corresponds to a defect. In addition, for example, a state where the gate wiring 13 and the drain electrode 19 of the TFT 16 are erroneously electrically connected also corresponds to the defect. For example, a state in which the pixel electrode 15 and the capacitor wiring 20 are erroneously electrically connected corresponds to a defect. When such a defect occurs, the pixel 12 cannot hold an appropriate charge, causing a display defect.

  As shown in FIG. 3 which is a plan view, a plurality of TFT substrates 10 are arranged in a matrix on the mother substrate 11 in the manufacturing stage. That is, a plurality of TFT substrates 10 are simultaneously formed on one mother substrate 11 at the same time.

-Manufacturing method-
Next, a method for manufacturing the liquid crystal display device and the TFT substrate 10 will be described.

  As shown in the flowchart of FIG. 2, the liquid crystal display manufacturing method includes a TFT substrate forming step (step S1), a panel forming step (step S2), a modularization step (step S3), and a final product. Process (step S4).

  In the TFT substrate forming step (step S1), a thin film such as a metal film or an insulating film is formed on the mother substrate 11 made of, for example, a glass substrate, and a resist process, an exposure process, an etching process, and the like are repeatedly performed. The pixel electrode 15, the TFT 16, the gate wiring 13, the source wiring 14, and the like are formed in a pattern. Thereafter, an array inspection correction process (step S10), which will be described in detail later, is performed. Thus, a plurality of TFT substrates are formed while being included in the mother substrate. When the formed TFT substrate has no defect and when the defect is corrected, the process proceeds to the next step.

  Although omitted in FIG. 2, a counter substrate forming step is performed separately from the TFT substrate forming step (step S1). In the counter substrate forming step, for example, a color filter and a black matrix are formed by photolithography on a mother substrate made of a glass substrate, and a common electrode is formed by ITO or the like. Thereby, a plurality of counter substrates are formed in a state of being included in the mother substrate.

  The color filter may be formed in the lower layer of the TFT substrate. Since the correction is performed from the substrate film surface side, the focus of the laser beam is narrowed down and only the surface layer is cut off, so that the color filter is not damaged and the color loss due to the correction does not occur.

  In the paneling step (step S2), an alignment film is formed on the bonding surface of the TFT substrate 10 and the counter substrate to perform an alignment process. Thereafter, the TFT substrate 10 and the counter substrate are bonded together via a seal member. The seal member is formed in a substantially rectangular frame shape, and has an opening for injecting liquid crystal in a part thereof. Then, liquid crystal is injected from the opening of the seal member between the TFT substrate 10 and the counter substrate bonded to each other.

  The liquid crystal may be sealed at the same time when the TFT substrate 10 and the counter substrate are bonded together.

  Subsequently, the pair of mother substrates bonded to each other is divided to form each cell constituting the liquid crystal display device. Thereafter, a lighting inspection is performed for each cell.

  Next, in the modularization process (step S3), for example, a connection film, a control board, a backlight unit, a bezel, an optical film, etc. are assembled to the divided cells as a module constituting a liquid crystal display device. Form. Thereafter, in the final product manufacturing step (step S4), for example, the modularized liquid crystal display device is assembled and completed with respect to the final product such as a mobile phone.

  Next, the array inspection correction step (step S10) will be described in detail with reference to FIG. The array inspection correction step (step S10) includes a first mounting step (step S11), an electrical inspection step (step S12), a correction region prediction step (step S14), a second mounting step (step S15), and a correction step ( Step S16) is included.

  In the first mounting step (step S11), the TFT substrate 10 is mounted on the first stage (not shown) in the state of the mother substrate 11. That is, as shown in FIG. 1, first, the TFT substrate 10 is transferred from a transfer cassette or the like to the first stage, and is mounted on the first stage. A plurality of suction ports are formed on the mounting surface of the first stage, and the TFT substrate 10 is sucked and held by a vacuum force.

  Next, in the electrical inspection process (step S12), the presence or absence of a defect in each pixel 12 of the TFT substrate 10 is detected. That is, charges are supplied to the capacitive elements 21 of the respective pixels 12 by inputting the inspection signal by bringing the probe pins into contact with the terminals on the TFT substrate 10 mounted on the first stage. Thereafter, the charge held in the capacitor 21 is detected. When the pixel 12 has no defect, a charge amount that is comparable to the charge amount read by the peripheral pixels is detected, but when there is a defect, a charge amount different from those is detected. Therefore, the presence and nature of the defect can be identified by the detected charge value.

  This electrical inspection process (step S12) includes a coordinate detection process (step S13). In the coordinate detection step (step S13), when a defect of the pixel 12 is detected, the position coordinate X in the substrate 11 is obtained from the pixel coordinates of the pixel 12 including the defect. The position coordinate X of the pixel 12 is, for example, the lower left position of the pixel 12 in FIG. 4 and the center position of the region where the gate wiring 13 and the source wiring 14 intersect.

  Subsequently, when a defect of the pixel 12 is detected in the electrical inspection process (step S12), a correction area prediction process (step S14) is performed. In the correction area prediction step (step S14), a correction area that is an area where a defect has occurred in the pixel 12 and needs to be corrected is predicted. That is, first, a plurality of inspection pattern signals are input to the capacitive element 21 of the pixel 12 including a defect. Thus, a correction region is predicted according to a combination of output values from the capacitive element 21 obtained for each inspection pattern signal.

  The correction area can be predicted based on a predetermined table. For example, as shown in FIG. 5, four inspection pattern signals are defined. In FIG. 5, Terms 1 to 3 are signals corresponding to red display, green display, and blue display, respectively. Black corresponds to an operating environment for displaying black in actual driving, and White corresponds to an operating environment for displaying white.

  The first pattern is an inspection pattern signal in which all of Terms 1 to 3 are Black. The second pattern is an inspection pattern signal in which Term1 is Black and Term2 and 3 are White. The third pattern is an inspection pattern signal in which Term2 is Black and Term1 and 3 are White. The fourth pattern is an inspection pattern signal in which Term 3 is Black and Terms 1 and 2 are White.

  When each inspection pattern signal (first to fourth patterns) is input to the pixel 12 including the defect, the value of the charge amount held in the capacitive element 21 obtained as an output is a predetermined normal value (denoted as OK). Or an abnormal value (For example, it describes as NG1-4: These NG1-4 are mutually different values) can be taken. The inventor has found that the correction area can be predicted by a combination of output values obtained by inputting the four inspection pattern signals.

  That is, for example, as shown in FIG. 6, when the combination of output values when the first to fourth patterns are input is (NG2, NG1, OK, OK), the region A shown in FIG. Predict that it is a correction area. When the combination of output values when the first to fourth patterns are input is (NG2, NG1, NG4, OK), it is predicted that the area B shown in FIG. 4 is a correction area. When the combination of output values when the first to fourth patterns are input is (NG1, NG1, OK, OK), it is predicted that the region C shown in FIG. 4 is a correction region. When the combination of output values when the first to fourth patterns are input is (NG3, NG3, NG3, NG3), it is predicted that the region D shown in FIG. 4 is a correction region. The predicted correction area data is transmitted from the first stage to the second stage by data communication.

  After performing the data processing in this way, the probe head is detached from the TFT substrate 10 and the second mounting step (step S15) is performed as shown in FIG. In the second mounting step (step S15), when a defect of the pixel 12 is detected as described above, the TFT substrate 10 is transported from the first stage and mounted on the second stage (not shown). The second stage is provided with an optical system such as a magnifying lens for optical inspection, a laser device for correcting defects, and a drive system thereof.

  Next, in the correction step (step S16), the defect is corrected in the second stage. At this time, the position of the pixel 12 including the defect in the second stage is specified by the position coordinate X. That is, the optical system such as the magnifying lens is made to face the pixel 12 specified by moving the second stage. Then, the pixel 12 including the defect is optically enlarged and analyzed. As described above, since the position coordinate X of the desired pixel 12 is acquired in advance, it is possible to easily specify a region to be enlarged and analyzed.

  Defect correction is performed on the region predicted in the correction region prediction step (step S14). For example, as shown in FIG. 7, when the correction area is the area A, the area A is corrected by irradiating the laser. Similarly, when the correction area is the area B, the area B is corrected, and when the correction area is the area C, the area C is corrected. This defect is corrected by irradiating a laser along the optical axis at the time of analysis. On the other hand, if the correction area is the area D, it is difficult to correct the area, and the TFT substrate 10 is abandoned without correction.

  Furthermore, in this correction process, it is preferable to analyze again the state of the pixel 12 containing the defect after the defect correction. This makes it possible to confirm whether a new defect has occurred after the defect correction by the laser. If a new defect has occurred, it is possible to easily correct the defect while analyzing the pixel 12.

  Subsequently, the TFT substrate 10 is detached from the second stage and moved to the transport cassette. Thereafter, the above paneling process (step S2) is performed.

-Effect of Embodiment 1-
Therefore, according to the first embodiment, since the defect is determined by performing the electrical inspection at the first stage, it is caused by a minute pinhole of about several μm that cannot be detected by the optical inspection such as AOI. Even a defect or the like can be detected with high accuracy. In addition, by performing numerical management and numerical determination of detected abnormal pixels, not only the presence or absence of defects but also property classification can be performed.

  Furthermore, since the electrical inspection process (step S12) is performed in the first stage and the position coordinate X of the pixel 12 including the defect is detected, the defect specified by the position coordinate X in the second stage is efficiently processed. It can be analyzed optically well and can be easily and efficiently corrected.

  Furthermore, in the correction step (step S16), since the laser is irradiated along the optical axis at the time of analysis, it is not necessary to separately align the laser, and defect correction by the laser can be easily and accurately performed. Can do.

  Further, removal scraps such as cutting off are generated at the time of defect correction by the laser, and the removal scraps may cause new defects in other parts of the pixel. On the other hand, according to the present embodiment, since the laser is irradiated along the optical axis at the time of analysis, the corrected pixel state can be analyzed again. Therefore, even if a new defect occurs, it can be easily corrected again, so that the process can be shortened and the yield of the substrate can be improved.

  In particular, in the present embodiment, the correction region in the pixel 12 including the defect can be easily predicted by inputting the inspection pattern signal in the correction region prediction step (step S14). Therefore, defect correction can be performed appropriately and easily.

<< Other Embodiments >>
In Embodiment 1 described above, the TFT substrate of the liquid crystal display device has been described as an example of the element substrate. However, the present invention is not limited to this, and for example, a capacitance for each unit region such as an element substrate constituting the organic EL display device. It can be applied to an element substrate having elements.

  The correction can be basically performed without human intervention, but may be used as an aid for human operation.

  As described above, the present invention is useful for a method for manufacturing an element substrate and a method for manufacturing a liquid crystal display device, and is particularly suitable for correcting defects detected by electrical inspection easily and accurately.

3 is a flowchart illustrating an array inspection correction process according to the first embodiment. It is a flowchart which shows the manufacturing process of a liquid crystal display device. It is a top view which shows a mother board | substrate. It is a top view which expands and shows the pixel of a TFT substrate. It is a table | surface which shows the content of a test | inspection pattern signal. It is a table | surface which shows the relationship between a test | inspection pattern signal and a correction area | region. It is a table | surface which shows the relationship between a correction area | region and a correction location.

Explanation of symbols

A to D Correction area X Position coordinate 10 TFT substrate (element substrate)
12 pixels (unit area)
13 Gate wiring 14 Source wiring 15 Pixel electrode 16 TFT
17 Gate electrode 18 Source electrode 19 Drain electrode 20 Capacitive wiring 21 Capacitance element (overlapping region of 15 and 20)

Claims (18)

A first mounting step of mounting an element substrate on which a plurality of unit regions having capacitive elements are arranged on a first stage;
An electrical inspection step of detecting the presence or absence of a defect in the unit region by detecting the charge held in the capacitive element after supplying the charge to the capacitive element of the element substrate mounted on the first stage When,
A second mounting step of transporting the element substrate from the first stage and mounting it on a second stage when a defect in the unit area is detected;
A correction step of correcting the defect in the second stage,
The electrical inspection step includes a coordinate detection step of detecting a position coordinate of the unit region including the defect when a defect of the unit region is detected,
In the correction step, the position of the unit region including the defect in the second stage is specified by the position coordinates, and the defect in the unit region is corrected. In claim 1,
A method of manufacturing an element substrate, comprising: a correction region prediction step of predicting a correction region in which a defect has occurred in the unit region and needs to be corrected when a defect in the unit region is detected. In claim 2,
In the correction region prediction step, a plurality of inspection pattern signals are input to the capacitive element of the unit region including the defect, and the correction region is selected according to a combination of output values from the capacitance element obtained for each inspection pattern signal. A method for manufacturing an element substrate, wherein: In claim 3,
The method of manufacturing an element substrate, wherein the correction region is predicted based on a predetermined table. In claim 1,
A method for manufacturing an element substrate, wherein a drive circuit for driving each unit region is directly built in the element substrate. In claim 1,
In the correcting step, the unit region including the defect is optically enlarged and analyzed, and the element substrate manufacturing method is characterized. In claim 6,
In the correction step, the defect is corrected by irradiating a laser along the optical axis at the time of the analysis, and the element substrate manufacturing method is characterized in that: In claim 7,
In the correcting step, after the defect is corrected, the state of the unit region containing the defect is analyzed again. In claim 2,
The method of manufacturing an element substrate, wherein data of the correction region predicted in the correction region prediction step is transmitted from the first stage to the second stage by data communication. A liquid crystal display device comprising: an element substrate on which a plurality of pixels having capacitive elements are arranged; a counter substrate arranged to face the element substrate; and a liquid crystal layer provided between the counter substrate and the element substrate A method of manufacturing
A first mounting step of mounting the element substrate on a first stage;
An electrical inspection step of detecting the presence or absence of a defect in the pixel by supplying charge to the capacitive element of the element substrate mounted on the first stage and then detecting the charge held in the capacitive element; ,
A second mounting step of transporting the element substrate from the first stage and mounting it on the second stage when a defect of the pixel is detected;
A correction step of correcting the defect in the second stage,
The electrical inspection step includes a coordinate detection step of detecting a position coordinate of the pixel including the defect when a defect of the pixel is detected,
In the correction step, the position of the pixel including the defect in the second stage is specified by the position coordinate, and the defect of the pixel is corrected. In claim 10,
A method of manufacturing a liquid crystal display device, comprising: a correction region prediction step of predicting a correction region that needs to be corrected when a defect is detected in the pixel when a defect of the pixel is detected. In claim 11,
In the correction region prediction step, a plurality of inspection pattern signals are input to the capacitor element of the pixel including the defect, and the correction region is determined according to a combination of output values from the capacitor element obtained for each inspection pattern signal. A method of manufacturing a liquid crystal display device characterized by predicting. In claim 12,
The method of manufacturing a liquid crystal display device, wherein the correction area is predicted based on a predetermined table. In claim 10,
A manufacturing method of a liquid crystal display device, wherein a drive circuit for driving each pixel is directly formed on the element substrate. In claim 10,
In the correction step, the pixel including the defect is optically enlarged and analyzed, and the method for manufacturing a liquid crystal display device is characterized. In claim 15,
In the correcting step, the defect is corrected by irradiating a laser along the optical axis at the time of the analysis, and a manufacturing method of a liquid crystal display device, characterized in that: In claim 16,
In the correcting step, after correcting the defect, the state of the pixel including the defect is analyzed again. In claim 11,
A method of manufacturing a liquid crystal display device, wherein data of a correction area predicted in the correction area prediction step is transmitted from the first stage to the second stage by data communication.

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