JP4984815B2 - Manufacturing method of electro-optical device - Google Patents

Manufacturing method of electro-optical device Download PDF

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JP4984815B2
JP4984815B2 JP2006285119A JP2006285119A JP4984815B2 JP 4984815 B2 JP4984815 B2 JP 4984815B2 JP 2006285119 A JP2006285119 A JP 2006285119A JP 2006285119 A JP2006285119 A JP 2006285119A JP 4984815 B2 JP4984815 B2 JP 4984815B2
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inspection
plurality
step
active matrix
matrix substrate
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JP2008102335A (en
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幸行 北澤
武史 野澤
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セイコーエプソン株式会社
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The present invention relates to an organic EL device containing a self-light emitting elements such as electric optical device (electroluminescence set sense (EL) element, an inorganic EL device, and a liquid crystal device or the like having a built-in liquid crystal device is a non-self-luminous element A manufacturing method).

  Conventionally, in the inspection of an active matrix substrate using, for example, an organic EL as a light emitting element, the inspection is performed by contacting a probe needle with a mounting terminal formed on the active matrix substrate and connected to a flexible substrate or the like.

  However, since the number of mounting terminals is large and the pitch is small, it is indispensable to align the probe needles for accurate contact. Usually, a substrate to be inspected is arranged on a stage movable on a two-dimensional surface, and a mark provided on the substrate to be inspected is optically read by a camera, and the information is displayed on a monitor for alignment.

Patent Document 1 discloses a method for inspecting a liquid crystal display substrate in which a driving IC is mounted on a glass substrate by COG (Chip On Glass). In this method, it is assumed that terminal electrodes for inspection corresponding to the respective transparent electrodes formed on the two glass substrates are formed on the protruding portion for inspection of the glass substrate. The inspection is performed before the driving IC is COG-mounted. At the time of inspection, the inspection terminal electrode is energized for inspection, and a non-defective liquid crystal display device cuts the protruding portion for inspection and then COG-mounts the driving IC. This eliminates the waste of discarding the defective substrate together with the driving IC.
Japanese Patent Laid-Open No. 11-30785

  However, both when the inspection is performed using the mounting terminal and when the inspection is performed using the terminal electrode for inspection as in Patent Document 1, the area of the terminal to which the probe needle is contacted is small, and the terminal Since the pitch is narrow, the substrate to be inspected must be precisely positioned.

  For this reason, a camera and a monitor for positioning become indispensable, and the inspection apparatus becomes expensive. Also, this kind of alignment takes 2-4 days, so the throughput is poor.

  Moreover, in patent document 1, only the test | inspection in the state with which the liquid crystal was enclosed could be performed, and the active matrix substrate which is one of two glass substrates could not be made into a test object. Therefore, in the inspection of Patent Document 1, it is undeniable that a defective product has a lot of waste because liquid crystal is sealed in advance to be inspected.

  All of the above items ultimately affect the unit price of the product and increase the cost.

An object of the present invention, the alignment of the substrate to be inspected becomes easy to shorten the positioning time for the test, the minimum and Ru electricity can be a waste of defects and the product inspection An object of the present invention is to provide a method for manufacturing an optical device.

An electro-optical device manufacturing method according to an aspect of the present invention includes a first inspection step of inspecting an active matrix substrate connected to an inspection device;
A step of manufacturing an electro-optical device using the active matrix substrate determined to be non-defective in the first inspection step;
A second inspection step for inspecting lighting by connecting the electro-optical device to the inspection device;
A step of cutting a part of the electro-optical device that is regarded as a non-defective product in the second inspection step;
Have
The active matrix substrate is
On the board
A plurality of scan lines;
Multiple data lines,
A plurality of pixels each including a thin film transistor connected to each one of the plurality of scanning lines and each one of the plurality of data lines;
A plurality of mounting terminals respectively connected to the plurality of scanning lines and the plurality of data lines and arranged at a first pitch;
An inspection circuit;
A plurality of inspection wirings connected to the plurality of mounting terminals and the inspection circuit and formed in a first layer wiring layer that is the same layer as the gate of the thin film transistor;
A plurality of inspection terminals connected to the inspection circuit, arranged in a second pitch that is smaller than the plurality of mounting terminals and wider than the first pitch, and wider than the area of each of the plurality of mounting terminals. When,
With
In the first and second inspection steps, the inspection device is connected to the inspection circuit provided on the active matrix substrate for inspection,
The cutting step is characterized in that the substrate and the plurality of inspection wirings are cut at positions between the plurality of mounting terminals and the inspection circuit.

  In one embodiment of the present invention, the inspection circuit provided on the active matrix substrate can be used for both the active matrix substrate and an electro-optical device manufactured therefrom, and the same inspection apparatus can be used for both inspections.

  Further, the portion to be contacted at the time of inspection is not a mounting terminal, and it is sufficient to contact an inspection terminal having a smaller number and a wider pitch and a larger contact area. Therefore, the alignment at the time of inspection does not have to be strict in either the substrate or the electro-optical device.

  Furthermore, since the inspection circuit and the inspection terminal formed on the active matrix substrate for inspection are cut after the non-defective product of the electro-optical device is confirmed, the electro-optical device can be kept downsized in actual use.

  In one embodiment of the present invention, in the first inspection step, the same potential is collectively supplied to the plurality of data lines via the inspection circuit, and at least one of the plurality of scanning lines is selected. Then, a step of inspecting the active matrix substrate can be included.

  As a result, only one inspection terminal needs to be provided for all data lines, and the number of inspection terminals is reduced, so that it is possible to increase the pitch and area of the inspection terminals.

  Here, in the first inspection step, the active matrix substrate can be inspected by supplying the same potential collectively to the plurality of scanning lines. This greatly reduces the inspection time.

  In one aspect of the present invention, the second inspection step supplies the same potential to the plurality of scanning lines collectively via the inspection circuit and selects at least one of the plurality of data lines. In addition, a step of lighting and inspecting the pixels of the electro-optical device may be included.

  In this way, in the inspection of the electro-optical device, it is sufficient to provide one inspection terminal for all the data lines as in the active matrix substrate, and an inspection device common to both inspections can be used.

  In one aspect of the present invention, in the second inspection step, the same potential may be collectively supplied to the plurality of scanning lines, and all pixels of the electro-optical device may be turned on for inspection. This further reduces the inspection time.

In one aspect of the present invention, the first and second inspection steps include a step of positioning the active matrix substrate on a stage,
In the positioning step, the two corners of the rectangular active matrix substrate are brought into contact with a positioning member provided on the stage.

  Since the number of inspection terminals is reduced and the inspection terminals are increased in pitch and area, strict alignment is not necessary.

Another aspect of the present invention is:
On the board
A plurality of scan lines;
Multiple data lines,
A plurality of pixels each including a thin film transistor connected to each one of the plurality of scanning lines and each one of the plurality of data lines;
A plurality of mounting terminals respectively connected to the plurality of scanning lines and the plurality of data lines and arranged at a first pitch;
An inspection circuit;
A plurality of inspection wirings connecting the plurality of mounting terminals and the inspection circuit;
A plurality of inspection terminals connected to the inspection circuit, arranged in a second pitch that is smaller than the plurality of mounting terminals and wider than the first pitch, and wider than the area of each of the plurality of mounting terminals. When,
A method for inspecting an active matrix substrate on which is formed,
Positioning the active matrix substrate on a stage;
Contacting probe needles with the plurality of inspection terminals on the active matrix substrate positioned on the stage;
Inspecting the active matrix substrate by supplying the same potential to the plurality of data lines collectively through the inspection circuit, and selecting at least one of the plurality of data lines;
It is characterized by providing.

  Even in this case, the alignment of the active matrix substrate is remarkably facilitated.

  Also in this inspection process, if the same potential is collectively supplied to the plurality of scanning lines and the active matrix substrate is inspected, the inspection time can be greatly shortened.

  Yet another aspect of the invention defines an active matrix substrate and an electro-optical device suitable for the method described above.

  Here, the plurality of inspection wirings can be formed of a first wiring layer which is the same layer as the gate of the thin film transistor. In this way, even if the active matrix substrate is cut after the inspection, the inspection wiring does not turn up.

  Further, one of the plurality of inspection terminals may be an inspection data terminal that supplies the same potential to the plurality of data lines. Since only one inspection terminal needs to be provided for an enormous number of data lines, a wider pitch and a larger area are achieved as the number of inspection terminals decreases.

  Hereinafter, preferred embodiments of the present invention will be described in detail. The present embodiment described below does not unduly limit the contents of the present invention described in the claims, and all the configurations described in the present embodiment are indispensable as means for solving the present invention. Not always.

(First embodiment)
FIG. 1 shows a method of manufacturing an electro-optical device, for example, an organic EL display device according to this embodiment.

  First, steps 1 and 2 in FIG. 1, that is, alignment on the stage of the active matrix substrate and subsequent inspection will be described.

(Inspection of active matrix substrate)
FIG. 2 shows the active matrix substrate 20 positioned on the inspection stage 10. The active matrix substrate 20 has an active matrix region 24 on a substrate 22. The active matrix region 24 is connected to mounting terminals 26 arranged in a large number at a narrow pitch. The mounting terminal 26 is connected to an inspection circuit 30 formed on the substrate 22 via an inspection wiring 28. In the case of the present embodiment, the mounting terminal 26 is connected to a flexible substrate on which a driving IC is COF (Chip On Film) when the organic EL device is assembled. The inspection circuits 30 are connected to inspection terminals 32 that are wider in pitch and smaller in number than the mounting terminals 26 and wider than the terminal area of the mounting terminals 26.

  The inspection wiring 28, the inspection circuit 30, and the inspection terminal 32 are used at the time of inspection, and are not necessary at the time of actual use as an organic EL device. Reference numeral 34 indicates a position for later cutting the inspection wiring 28, the inspection circuit 30 and the inspection terminal 32 from the substrate 22. The substrate 22 itself may be processed at the cutting position 34 so that the substrate 22 can be easily cut. However, the substrate 22 itself may be marked only at the cutting position, or may be fixed by a machine. As long as the substrate 22 can be cut, the substrate 22 itself may not be processed at the cutting position 34 at all.

  The inspection apparatus 100 for inspecting the active matrix substrate 20 inputs and outputs signals between the probe card 104 provided with a plurality of probe needles 102 and the active matrix substrate 20 via the probe card 104, and the active matrix substrate And a tester 106 for evaluating 20 electrical characteristics.

  Prior to the inspection of the active matrix substrate 20, the active matrix substrate 20 is positioned on the stage 10. In the present embodiment, in this positioning step, the two corners of the rectangular active matrix substrate 20 are simply brought into contact with a positioning member provided on the stage 10, for example, the pin 12. The reason why inaccurate positioning is sufficient is as follows.

  The probe needles 102 of the inspection apparatus 100 are not contacted with a large number of mounting terminals 26 with a small pitch and a small area on the active matrix substrate 20, and have a larger area with a wider pitch than the mounting terminals 26 and more than the mounting terminals 26. It connects to the inspection terminal 32 with few numbers. For this reason, the probe needles 102 may be a small number with a wide pitch, and since the inspection terminals 32 to be contacted have a large area, precise alignment of the active matrix substrate 20 on the stage 10 is not necessary.

  For this reason, 2-4 days are not required for alignment for inspection. In addition, the inspection apparatus 100 does not require a camera or monitor for alignment, and the inspection apparatus 100 itself is also inexpensive.

  In the inspection of the active matrix substrate 20, as shown in FIG. 2, the probe needle 102 is brought into contact with the inspection terminal 32, and necessary signals are sent from the tester 106 side to drive the active matrix substrate 20. A signal obtained from the active matrix substrate 20 obtained by driving is supplied to the tester 106 to judge whether the active matrix substrate 20 is good or bad.

  Here, the active matrix substrate 20 will be described with reference to FIG. FIG. 3 is a circuit diagram showing a specific circuit configuration of one pixel 24A in the active matrix region 24 shown in FIG. As illustrated, the pixel 24A includes a pixel selection transistor M1, a drive TFT (drive thin film transistor) M2, a light emission control transistor M3, and a storage capacitor Ch. In addition, since the organic EL layer is not connected to the active matrix substrate 20, the organic EL element (OLED) and the common line (VCT) are indicated by dotted lines in the drawing.

  In FIG. 3, GWRT is a driving signal for the pixel selection transistor M1, and DATA is data written through the data line DL. GEL is a drive transistor of the pixel light emission control transistor M3. In the figure, reference numeral 110 denotes a pixel power source provided in the inspection apparatus 100 (see FIG. 1), and is connected to each pixel 24A via the inspection terminal 32. The pixel power supply voltage (VEL: second power supply voltage) is set to 12 V, for example. Reference numeral 112 is an ammeter used for detecting a basic failure. The ammeter 112 indicated by a dotted line indicates that this ammeter is not necessarily required.

(Configuration of inspection circuit and inspection device)
FIG. 4 is a circuit diagram showing an internal circuit configuration of the inspection circuit 30 or the inspection apparatus 100 of FIG. As shown in the figure, the scanning line driver 200 built in the inspection circuit 30 is arranged at a low level (non-driving level) for all the scanning lines WL at once by a shift circuit 210 (including a shift register) and, for example, an enable signal. Or a scanning line drive control circuit 230, a level shift circuit 240, and an output buffer circuit 250 that can set all the scanning lines to a high level (driving level) at once. The shift circuit 210 is used to sequentially select the scanning lines, but can be omitted because it is not always necessary for the inspection described later.

  The level shift circuit 240 boosts the voltage level in the low voltage system circuit to a voltage level suitable for the high voltage system circuit. The output buffer circuit 250 drives each scanning line WL.

  In FIG. 4, the power supply 120 on the inspection apparatus 100 side is connected to the shift circuit 210 and the scanning line drive control circuit 230 via the probe needle 102, and the low voltage system circuit (before the level shift circuit 240 is connected to the previous stage). Circuit) is supplied with a low-level power supply voltage VDD (for example, 5 V). Further, the level shift circuit 240 and the buffer circuit 250 are connected to the power supply 122 on the inspection apparatus 100 side via the probe needle 102, whereby the high voltage system circuit (the circuit after the level shift circuit 240) is connected to the level shift circuit 240 and the buffer circuit 250. A high power supply voltage (VHH: a first power supply voltage, for example, set to 15 V) is supplied.

  Further, the ammeter 124 provided on the inspection apparatus 100 side is used to detect that a basic defect such as a scanning line short-circuit has occurred during the inspection.

  The test circuit 30 shown in FIG. 2 is provided with a data line driver 300 shown in FIG. The data line driver 300 includes a plurality of switches, such as switching transistors Tr, that collectively short-circuit each data line DL. A high level H can be supplied to the gates of all the switching transistors Tr via the inspection terminal 32. The drains of all the switching transistors Tr are connected to a short line 310, and this short line 310 is connected to one inspection terminal 32 (not shown in FIG. 4). Therefore, only one inspection terminal 32 for supplying a signal to all the data lines DL of the active matrix substrate 20 is required. For this reason, the number of inspection terminals 32 is significantly reduced as compared with the number of mounting terminals 26.

  The short line 310 is connected to the power supply 130 provided on the inspection apparatus 100 side via one inspection terminal 32 and the probe needle 102, and 7 V is supplied to all the data lines DL as VDATA at the time of inspection. Note that the ammeter 132 provided on the inspection apparatus 100 side is used to detect that a basic defect such as a data line short-circuit has occurred during the inspection.

(Details of inspection of active matrix substrate)
FIGS. 5A to 5C each illustrate the principle of detecting basic defects (scanning line short-circuit defect, data line short-circuit defect, retention capacitor short-circuit / essential defect) in the operation of the active matrix substrate 20. It is a figure for doing.

  FIG. 5A shows a change in current of a non-defective product (when there is no defect). Assume that all the scanning lines and all the data lines are set to the high level, and the current supplied to the scanning line driver 200 and the current flowing through the data line driver 300 are observed.

  In this case, after charging of the parasitic capacitance of the scanning line WL, the parasitic capacitance of the data line DL, or the holding capacitance of each pixel 24A (after time t1), only a leakage current less than the allowable value should flow. That is, as shown in FIG. 5A, a predetermined charging current flows in the initial stage, and after time t1, there is no leakage current other than very little leakage current.

  However, when a scanning line short circuit, a data line short circuit, a storage capacitor short circuit, or an essential defect occurs, as shown in FIG. 5B, a current exceeding the allowable value is applied in a predetermined direction after time t1. It flows continuously. FIG. 5C shows a case where a current that is opposite to the direction of the current in FIG. 5B flows continuously. In this case as well, any defect occurs as in FIG. Can be determined.

  Hereinafter, basic inspection contents and procedure of the active matrix substrate 20 will be specifically described.

(1) Scanning line short-circuit defect inspection (FIGS. 4 to 7)
FIG. 6 shows an inspection flowchart, and FIGS. 4 and 7 are diagrams showing examples of currents that flow during the inspection of a scanning line WL short circuit. FIG. 4 shows the current flow in a non-defective product, and FIG. The flow of current in non-defective products is shown.

  First, the flow of current when there is no defect will be described with reference to FIG. The first power supply voltage (VHH: 15V) is supplied to the high voltage system circuit (level shift circuit 240 and buffer circuit 250) in the scanning line driver 200. At this time, the ammeter 124 can detect a temporal change in the current supplied to the high voltage system circuit of the scanning line driver 200. Further, the third power supply voltage (VDATA: 7V) is supplied to the drain of the switching transistor Tr and held in the on state.

  Note that the ammeter 132 does not necessarily need to be connected when only the short-circuit defect of the scanning line WL is inspected. However, the current flowing through the switching transistor Tr may be detected by the ammeter 132.

  First, the output level of the scanning line drive control circuit 230 in the scanning line driver 200 is forcibly fixed to a high level. As a result, all the scanning lines (WL) are simultaneously set to the high level (driving state). Further, VDATA (7 V) is supplied to all data lines (DL) (step 1 in FIG. 6). In this case, initially, charging currents (I1a, I1b, I1c) for charging the parasitic capacitances (Cga, Cgb, Cgc in FIG. 4) of each scanning line (WL) flow. No longer flows (see FIG. 5A). Such a temporal change of the current becomes clear by observing the current IY1 with the ammeter 124 (step 2 in FIG. 6).

  On the other hand, as shown in FIG. 7, when a short circuit (defect A) occurs between the scanning line (WL) and the data line (DL), a short circuit (defect B) occurs between the scanning line (WL) and the pixel power supply line. Or when the scanning line (WL) is grounded (defect C), a current exceeding the allowable value constantly flows even after the completion of charging in FIG. 4 (FIG. 5 ( b)).

  That is, as shown in FIG. 7, abnormal currents (I10, I11, I12) flow continuously. This abnormal current is detected by the ammeter 124. That is, the current IY2 flows through the ammeter 124 continuously (YES in step 3 in FIG. 6). Therefore, it is possible to efficiently detect that a short defect has occurred in any of the scanning lines (steps 4 and 5 in FIG. 6).

  When the current supplied from the pixel power supply 110 (the power supply that supplies the second power supply voltage VEL (12 V)) is observed by the ammeter 112 (see FIG. 7), the scanning line WL and the pixel wire source (holding capacitor Ch) are observed. It is possible to specify that a short circuit failure has occurred with the power supply line connected to one end of the power source. That is, it is possible to narrow down the types of defects, although it is not possible to identify defective portions.

(2) Data line short circuit inspection (FIGS. 8 to 10)
FIG. 8 shows an inspection flowchart, and FIGS. 9 to 11 are diagrams showing examples of currents that flow during the inspection of a data line short circuit defect. FIG. 9 shows a current flow in a non-defective product, and FIG. 10 shows a defective product. The current flow in is shown.

  First, the flow of current when there is no defect will be described with reference to FIG. Step 10 of FIG. 8 shows substantially the same operation as Step 1 of FIG.

  First, the output level of the scanning line drive control circuit 230 in the scanning line driver 200 is forcibly fixed to a high level. As a result, all the scanning lines (WL) are simultaneously set to the high level (driving state). Further, VDATA (7 V) is supplied to all data lines (DL) (step 10 in FIG. 8). In this case, initially, charging currents (I3a, I3b, I3c, I3d) for charging the parasitic capacitances (Cda, Cdb, Cdc, Cdd in FIG. 9) of each data line (DL) flow, but charging is completed. Then, almost no current flows (see FIG. 5A). This becomes clear by observing the current IX1 with the ammeter 132 (step 11 in FIG. 8).

  On the other hand, as shown in FIG. 10, when a short circuit (defect A) occurs between the data line (DL) and the scanning line (WL), a short circuit (defect B) occurs between the data line (DL) and the pixel power supply line. Is generated, a current exceeding the allowable value constantly flows even after the completion of charging in FIG. 9 (see FIG. 5B).

  That is, as shown in FIG. 10, abnormal currents (I20, I21) flow continuously (YES in step 12 in FIG. 8). This abnormal current is detected by an ammeter 132 connected to the switching transistor Tr. That is, when it is observed by the ammeter 902 that the current IX2 continuously flows, it can be determined that a short circuit failure has occurred in any of the data lines (WL) (step 13 in FIG. 8). , 14). Therefore, it is possible to efficiently detect a data line short circuit defect.

  When the current supplied from the pixel power supply 110 (the power supply that supplies the second power supply voltage VEL (12V)) is observed by an ammeter 112 (not shown in FIGS. 9 to 10), the data line (WL) It is possible to specify that a short circuit failure has occurred with the pixel wire source (a power supply line connected to one end of the holding capacitor Ch). That is, it is possible to narrow down the types of defects, although it is not possible to identify defective portions.

(3) Storage capacity short circuit / essential defect inspection (FIGS. 11-13)
FIG. 11 shows an inspection flowchart, and FIGS. 12 and 13 are diagrams showing examples of currents that flow when a storage capacitor is short-circuited and essential defects are inspected. FIG. 12 shows the current flow in a non-defective product. Reference numeral 13 denotes a current flow in a defective product.

  First, the flow of current when there is no defect will be described with reference to FIG. Step 20 in FIG. 11 shows substantially the same operation as steps 1 and 10 in FIGS.

  First, the output level of the scanning line drive control circuit 230 in the scanning line driver 200 is forcibly fixed to a high level. As a result, all the scanning lines (WL) are simultaneously set to the high level (driving state). Further, VDATA (7 V) is supplied to all data lines (DL) (step 20 in FIG. 11). In this case, initially, a charging current of parasitic capacitances (Cda, Cdb, Cdc, Cdd in FIG. 9) of each data line (DL) flows, and further, a charging current I40 of the holding capacitor Ch in each pixel 24A flows. However, when charging is completed, almost no current flows (see FIG. 5A). This can be determined by observing the current IX4 with the ammeter 132 (step 21 in FIG. 11).

  On the other hand, as shown in FIG. 13, when both poles of the storage capacitor Ch are short-circuited, or when a large leak current flows due to an essential defect, as shown in FIG. Thus, an abnormal current I50 flows (see FIG. 5B).

  This abnormal current is detected by an ammeter 132 connected to the switching transistor Tr. That is, when it is observed by the ammeter 902 that the current IX5 continuously flows (step 22 in FIG. 11 is YES), it can be determined that the storage capacity is defective (step 24 in FIG. 11). Otherwise, it can be determined as normal (step 23 in FIG. 11). Therefore, it is possible to efficiently detect a defective storage capacitor.

  Note that observing the current supplied from the pixel power supply 110 (the power supply that supplies the second power supply voltage VEL (12V)) with the ammeter 112 specifies that a defect has occurred in the storage capacitor Ch. To help.

(Simultaneous inspection)
FIG. 14 is a flowchart showing an outline of a procedure for simultaneous inspection of scanning lines, data lines, and storage capacitors. First, all scanning lines are set to H (VHH), the precharge transistors are turned on, VDATA is supplied to all data lines, and the pixel power supply voltage (VEL) is supplied to the pixels 24A (step S30). ). Next, after a predetermined time has elapsed, the amount of current is checked with an ammeter on the scanning line driver side and an ammeter on the data line driver side, and the amount of current supplied to the pixel power supply line is checked as necessary (step S31). ). Then, it is determined whether or not the current that deviates from the permissible value continues (step S32). When the current that deviates from the permissible value is not detected, it is determined as normal (non-defective product) (step S33). When the current continues, abnormality determination is performed (step S34).

  Note that the scanning line driver 200 shown in FIG. 4 and the like can selectively drive the scanning lines WL one by one by a signal from the shift circuit 210. Therefore, the inspection described above is not necessarily performed by selecting all the scanning lines WL simultaneously. That is, various inspections may be performed by selecting one scanning line WL at a time. In any case, since the same potential is supplied to all the data lines DL at the same time, only one inspection terminal 32 is required to supply the potential to the data lines DL.

(Manufacture of display panels)
The pass / fail judgment of the active matrix substrate 20 was made by performing steps 1 and 2 in FIG. The active matrix substrate 20 determined to be defective is discarded, and an organic EL layer is formed on the non-defective active matrix substrate 20 to complete the display panel (step 3 in FIG. 1). Thereby, in the active matrix region 24 shown in FIG. 2, the organic EL element OLED and the common line VCT are connected to each pixel 24A shown in FIG.

(Inspection of display panel)
First, the display panel is placed on the stage 10 in FIG. 2 and positioned by the positioning member 12 (step 4 in FIG. 1). Similar to the active matrix substrate 20, this positioning can be performed in a very short time.

  Next, the probe needle 102 is contacted to the inspection terminal 32 of the display panel on the stage 10, and the display panel is inspected for lighting (step 5 in FIG. 1). This lighting inspection is performed in the same manner as in Step 1 of FIG. 6, Step 10 of FIG. 8, and Step 20 of FIG. 11, and the predetermined potentials are supplied to all the scanning lines WL and all the data lines DL. What is necessary is just to observe the lighting state in the pixel 24A visually or optically.

  The lighting inspection of the display panel can be performed by using the inspection apparatus 100 for the active matrix substrate 20 shown in FIG. 2, and it is not necessary to separately prepare the inspection apparatus for the active matrix substrate and the inspection apparatus for the display panel. .

  Note that the scanning line driver 200 shown in FIG. 4 and the like can selectively drive the scanning lines WL one by one in accordance with a signal from the shift circuit 210, so that the lighting inspection selects the scanning lines WL one by one and moves up one line. It is also possible to perform a lighting inspection for each of the pixels 24A.

(Cut off inspection circuit and inspection terminal)
As described above, when the display panel is completed and the lighting inspection is completed, not only the inspection circuit 30 and the inspection terminal 32 are no longer necessary, but also the downsizing of the display panel is hindered. Therefore, in the present embodiment, the active matrix substrate 20 is cut at the cutting position 34 shown in FIG. 2 (step 6 in FIG. 1).

  Here, the inspection wiring 28 exists on the cutting position 34. If the inspection wiring 28 is turned from the substrate 22 at the time of cutting, the commercial value of the display panel is remarkably lowered.

  In the present embodiment, when the pixel selection transistor M1 and the like are formed on the active matrix substrate 20, the inspection wiring 28 is formed. That is, the inspection wiring 28 is formed in the same first layer wiring layer as the gate layer of the pixel selection transistor M1. Usually, since the gate of the pixel selection transistor M1 is formed of a polysilicon layer, the inspection wiring 28 is also formed of a polysilicon layer. In other words, the inspection wiring 28 is not formed of a metal layer normally used for a wiring layer higher than the second layer wiring layer.

  If the inspection wiring layer 28 is formed of a metal layer, the metal layer is deposited by CVD or the like. This is because the deposited metal layer is easily turned over by mechanical pressure, unlike the polysilicon layer.

(Second Embodiment)
In the above-described embodiment, the inspection of the active matrix substrate for the organic EL element has been described, but the present invention can also be applied to the inspection of the substrate for other electro-optical elements. In the present embodiment, an inspection of an active matrix substrate for a liquid crystal element and a liquid crystal display panel will be described.

  The basic configuration of the active matrix substrate for the liquid crystal element according to this embodiment is the same as that of the active matrix substrate 20 shown in FIG.

  FIG. 15 is a diagram for explaining the configuration of the active matrix region of the active matrix substrate for the liquid crystal element and the outline of the inspection.

  The active matrix substrate 400 for a liquid crystal element includes a scanning line (WL), a data line (DL), and a pixel 412 provided at an intersection of the scanning line and the data line. The pixel 412 includes a pixel selection transistor M30 and a storage capacitor C30. Note that the liquid crystal element (MC) is indicated by a dotted line because the liquid crystal is not yet sealed at the stage of the active matrix substrate. Note that the pixel 412 is provided at the intersection of each of the plurality of scanning lines and each of the data lines, but FIG. 15 shows only one pixel.

  Inspection circuits provided on the active matrix substrate 400 are shown as a scanning line driver 500 and a data line driver 600 in FIG. The scanning line driver 400 and the data line driver 600 have the same circuit configuration as the scanning line driver 200 and the data line driver 300 shown in FIG.

  The inspection procedure is the same as in the first embodiment. That is, as shown in FIG. 15, a power source 140 is connected to the scanning line driver 400, and the total amount of current supplied to the scanning line driver 400 can be detected by the ammeter 142. The power supply 150 (the generated voltage VD is set lower than the generated voltage VS of the power supply 140) is connected to the drain of the switching transistor Tr in the data line driver 600. Further, the ammeter 152 can detect the current flowing through the switching transistor Tr. For example, by simultaneously driving all the scanning lines (WL), applying a predetermined voltage to all the data lines, and determining whether or not a current that deviates from the allowable value flows continuously after the charging period ends. In addition, a short inspection of each of the scanning line (WL) and the data line (DL), and a short circuit and a defect of the storage capacitor (C30) can be simultaneously performed.

  In the liquid crystal display panel manufactured after the inspection of the active matrix substrate 400, liquid crystal is injected between the active matrix substrate 400 and the counter substrate on which the common electrode is formed, and the liquid crystal cell MC shown in FIG. 15 is connected. do it. This display panel lighting inspection can also be performed by supplying the same potential to all the data lines at once and selecting one scanning line at a time or all at the same time.

(Electro-optical device)
An electro-optical device in which electro-optical elements are arranged in a matrix is also used as a display device for various electronic devices. Examples of the electronic device to which the present invention is applied include a portable personal computer, a mobile phone, a personal digital assistant (PDA), a digital still camera, a television, a video camera, a car navigation device, a pager, and an electronic notebook. , Electronic paper, calculators, word processors, workstations, videophones, POS terminals, printers, scanners, copiers, video players, devices with touch panels, and the like.

  In addition, for example, an image forming apparatus using an organic light emitting diode element as a light source (exposure means) can be configured. This image forming apparatus is not limited to the exposure of the image carrier. For example, it is employed in an image reading apparatus as an illuminating device that irradiates a reading target such as a document with light. As this type of image reading apparatus, there is a scanner, a copying machine or a reading part of a facsimile, a barcode reader, or a two-dimensional image code reader for reading a two-dimensional image code such as a QR code (registered trademark).

6 is a flowchart illustrating a method for manufacturing an electro-optical device according to the invention. It is a schematic explanatory drawing for demonstrating the inspection method of the active matrix substrate which concerns on this invention. FIG. 3 is a circuit diagram showing a specific circuit configuration of a pixel formed on the substrate shown in FIG. 2. FIG. 3 is a diagram showing the inspection circuit and the inspection apparatus shown in FIG. 2 and the current that flows when a scanning line short circuit defect is inspected (current that flows in a good product). 5 (a) to 5 (c) each show the principle of detecting basic defects (scan line short circuit defect, data line short circuit defect, retention capacitor short circuit / essential defect) in the operation of the active matrix substrate. It is a figure for demonstrating. It is a flowchart which shows the outline | summary of the procedure of a scanning line short test | inspection. It is a figure which shows the electric current which flows at the time of the test | inspection of the short circuit defect of a scanning line (electric current which flows into a defective product). It is a flowchart which shows the outline | summary of the procedure of a data line short test | inspection. It is a figure which shows the electric current (current which flows into a non-defective product) which flows at the time of the test | inspection of the short defect of a data line. It is a figure which shows the electric current (current which flows into a defective article) at the time of the test | inspection of the short defect of a data line. It is a flowchart which shows the outline | summary of the procedure of the defect of a retention capacity, and a short test. It is a figure which shows the example of the electric current (electric current which flows into a non-defective product) which flows at the time of inspection of a short of a storage capacitor and an essential defect. It is a figure which shows the example of the electric current (current which flows into a defective article) at the time of the test | inspection of short of a storage capacitor and an essential defect. It is a flowchart which shows the outline | summary of the procedure of the simultaneous test | inspection of a scanning line, a data line, and storage capacity. It is a figure for demonstrating the basic composition of the active matrix substrate for liquid crystal elements, and the outline | summary of the test | inspection.

Explanation of symbols

10 stages, 12 positioning members, 20 active matrix substrates,
22 substrates, 24 active matrix regions, 24A pixels, 26 mounting terminals,
28 inspection wiring, 30 inspection circuit, 32 inspection terminal, 34 cutting position,
100 inspection device, 102 probe needle, 104 probe card, 106 tester,
110, 120, 130, 140, 150 power supply,
112, 122, 132, 142, 152 ammeter,
200,400 scan line driver, 210 shift circuit,
230 scanning line drive control circuit, 240 level shift circuit, 250 buffer circuit,
300,600 Data line driver, WL scan line, DL data line

Claims (6)

  1. A first inspection step of inspecting an active matrix substrate connected to an inspection apparatus;
    A step of manufacturing an electro-optical device using the active matrix substrate determined to be non-defective in the first inspection step;
    A second inspection step for inspecting lighting by connecting the electro-optical device to the inspection device;
    A step of cutting a part of the electro-optical device that is regarded as a non-defective product in the second inspection step;
    Have
    The active matrix substrate is
    On the board
    A plurality of scan lines;
    Multiple data lines,
    A plurality of pixels each including a thin film transistor connected to each one of the plurality of scanning lines and each one of the plurality of data lines;
    A plurality of mounting terminals respectively connected to the plurality of scanning lines and the plurality of data lines and arranged at a first pitch;
    An inspection circuit;
    A plurality of inspection wirings connected to the plurality of mounting terminals and the inspection circuit and formed in a first layer wiring layer that is the same layer as the gate of the thin film transistor;
    A plurality of inspection terminals connected to the inspection circuit, arranged in a second pitch that is smaller than the plurality of mounting terminals and wider than the first pitch, and wider than the area of each of the plurality of mounting terminals. When,
    With
    In the first and second inspection steps, the inspection device is connected to the inspection circuit provided on the active matrix substrate for inspection,
    The method of manufacturing an electro-optical device, wherein in the cutting step, the substrate and the plurality of inspection wirings are cut at positions between the plurality of mounting terminals and the inspection circuit.
  2. In claim 1,
    In the first inspection step, the same potential is collectively supplied to the plurality of data lines via the inspection circuit, and at least one of the plurality of scanning lines is selected, and the active matrix substrate is selected. A method for manufacturing an electro-optical device, comprising:
  3. In claim 2,
    In the first inspection step, the same potential is collectively supplied to the plurality of scanning lines, and the active matrix substrate is inspected.
  4. In any one of Claims 1 thru | or 3,
    In the second inspection step, the same potential is collectively supplied to the plurality of scanning lines via the inspection circuit, and at least one of the plurality of data lines is selected, and the electro-optical device A method for manufacturing an electro-optical device, comprising the step of lighting and inspecting the pixels.
  5. In claim 4,
    In the second inspection step, the same potential is collectively supplied to the plurality of scanning lines, and all pixels of the electro-optical device are turned on for inspection.
  6. In any one of Claims 1 thru | or 5,
    The first and second inspection steps include a step of positioning the active matrix substrate on a stage,
    In the positioning step, the two corners of the rectangular active matrix substrate are brought into contact with a positioning member provided on the stage.
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