JP2007308570A5 - - Google Patents
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- Publication number
- JP2007308570A5 JP2007308570A5 JP2006138347A JP2006138347A JP2007308570A5 JP 2007308570 A5 JP2007308570 A5 JP 2007308570A5 JP 2006138347 A JP2006138347 A JP 2006138347A JP 2006138347 A JP2006138347 A JP 2006138347A JP 2007308570 A5 JP2007308570 A5 JP 2007308570A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- formula
- peak
- phenol
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 claims description 16
- 229920000647 polyepoxide Polymers 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 9
- 238000005227 gel permeation chromatography Methods 0.000 claims description 7
- 238000005259 measurement Methods 0.000 claims description 5
- 239000005011 phenolic resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Oc1ccccc1 Chemical compound Oc1ccccc1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 10
- UMSGIWAAMHRVQI-UHFFFAOYSA-N CCc(cc1)ccc1-c1ccc(CC)cc1 Chemical compound CCc(cc1)ccc1-c1ccc(CC)cc1 UMSGIWAAMHRVQI-UHFFFAOYSA-N 0.000 description 5
- 230000001588 bifunctional effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006138347A JP5142180B2 (ja) | 2006-05-17 | 2006-05-17 | エポキシ樹脂組成物、およびその硬化物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006138347A JP5142180B2 (ja) | 2006-05-17 | 2006-05-17 | エポキシ樹脂組成物、およびその硬化物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007308570A JP2007308570A (ja) | 2007-11-29 |
| JP2007308570A5 true JP2007308570A5 (enrdf_load_stackoverflow) | 2009-05-07 |
| JP5142180B2 JP5142180B2 (ja) | 2013-02-13 |
Family
ID=38841732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006138347A Active JP5142180B2 (ja) | 2006-05-17 | 2006-05-17 | エポキシ樹脂組成物、およびその硬化物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5142180B2 (enrdf_load_stackoverflow) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5472103B2 (ja) * | 2008-05-30 | 2014-04-16 | ダイソー株式会社 | エポキシ樹脂硬化物、及びエポキシ樹脂接着剤 |
| KR101326934B1 (ko) * | 2011-08-31 | 2013-11-11 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 방열회로기판 |
| KR101385005B1 (ko) * | 2012-04-25 | 2014-04-16 | 국도화학 주식회사 | 에폭시몰딩컴파운드용 자기소화성 에폭시 수지 및 그 제법, 에폭시몰딩컴파운드용 에폭시 수지 조성물 |
| JP2019104821A (ja) * | 2017-12-12 | 2019-06-27 | 日鉄ケミカル＆マテリアル株式会社 | エポキシ樹脂組成物及びその硬化物 |
| TWI877461B (zh) * | 2021-03-18 | 2025-03-21 | 日商日本化藥股份有限公司 | 環氧樹脂混合物及其製造方法、環氧樹脂組成物及其硬化物 |
| KR20240037177A (ko) * | 2021-07-30 | 2024-03-21 | 니폰 가야꾸 가부시끼가이샤 | 에폭시 수지, 경화성 수지 조성물 및 그 경화물 |
| JP2024159336A (ja) | 2023-04-28 | 2024-11-08 | Dic株式会社 | フェノール性水酸基含有樹脂、硬化性組成物、硬化物、プリプレグ、回路基板、ビルドアップフィルム、半導体封止材及び半導体装置 |
| JP2024159337A (ja) | 2023-04-28 | 2024-11-08 | Dic株式会社 | フェノール性水酸基含有樹脂、硬化性組成物、硬化物、プリプレグ、回路基板、ビルドアップフィルム、半導体封止材及び半導体装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003212962A (ja) * | 2002-01-21 | 2003-07-30 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2003213084A (ja) * | 2002-01-28 | 2003-07-30 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2003301031A (ja) * | 2002-04-10 | 2003-10-21 | Nippon Kayaku Co Ltd | フェノール樹脂、エポキシ樹脂及びその製法、樹脂組成物 |
| WO2005087833A1 (ja) * | 2004-03-16 | 2005-09-22 | Sumitomo Bakelite Co., Ltd. | エポキシ樹脂組成物および半導体装置 |
| CN101384638B (zh) * | 2006-03-07 | 2012-05-30 | 住友电木株式会社 | 密封半导体用环氧树脂组合物及半导体装置 |
| JP5366263B2 (ja) * | 2010-07-21 | 2013-12-11 | 日本化薬株式会社 | フェノールアラルキル樹脂、エポキシ樹脂組成物及びその硬化物 |
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2006
- 2006-05-17 JP JP2006138347A patent/JP5142180B2/ja active Active