JP2007294944A5 - - Google Patents
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- JP2007294944A5 JP2007294944A5 JP2007095157A JP2007095157A JP2007294944A5 JP 2007294944 A5 JP2007294944 A5 JP 2007294944A5 JP 2007095157 A JP2007095157 A JP 2007095157A JP 2007095157 A JP2007095157 A JP 2007095157A JP 2007294944 A5 JP2007294944 A5 JP 2007294944A5
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- JP
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- Prior art keywords
- emitting device
- light emitting
- light
- substrate
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (11)
前記複数の領域の各領域に、薄膜トランジスタ回路を形成する第２工程と、
前記各領域に、少なくとも前記薄膜トランジスタ回路を覆うように接着剤を供給する第３工程と、
前記各領域にそれぞれ所定の封止部材を接着する第４工程と、
切断線が前記接着剤に当接するように前記基板母材を切断することにより、前記基板母材を、おのおのが前記発光素子および前記薄膜トランジスタ回路を含む複数の基板に分割する第５工程と、
を含む発光装置の製造方法。 A first step of forming light emitting elements in a plurality of regions on the substrate base material;
A second step of forming a thin film transistor circuit in each of the plurality of regions;
A third step of supplying an adhesive to each region so as to cover at least the thin film transistor circuit ;
A fourth step of bonding a predetermined sealing member to each of the regions;
A fifth step of dividing the substrate base material into a plurality of substrates each including the light emitting element and the thin film transistor circuit by cutting the substrate base material so that a cutting line contacts the adhesive ;
A method for manufacturing a light-emitting device including:
前記第４工程において、前記封止部材の外縁が前記接着剤の供給された領域の外縁に一致するように前記封止部材を接着するようにした発光装置の製造方法。 A method of manufacturing a light emitting device according to claim 1 ,
The method of manufacturing a light emitting device , wherein in the fourth step, the sealing member is bonded so that an outer edge of the sealing member coincides with an outer edge of a region supplied with the adhesive.
少なくとも前記第３工程より前に、前記基板母材に前記切断用の溝部を形成する第６工程を含む発光装置の製造方法。 The method for manufacturing a light emitting device according to claim 1 or 2,
A method for manufacturing a light-emitting device , comprising a sixth step of forming the cutting groove in the substrate base material at least before the third step .
前記第３工程は、前記溝部に沿って前記接着剤を供給する工程であって、前記溝部に接するように前記接着剤を供給し、
前記第５工程は、前記切断線が前記溝部に当接するように前記基板母材を切断する工程である発光装置の製造方法。 A method for manufacturing a light emitting device according to claim 3 ,
The third step is a step of supplying the adhesive along the groove portion, and supplying the adhesive so as to be in contact with the groove portion,
The fifth step is a method for manufacturing a light-emitting device, which is a step of cutting the substrate base material so that the cutting line comes into contact with the groove .
前記発光素子を有機エレクトロルミネセンス素子とした発光装置の製造方法。 A method for manufacturing a light-emitting device according to any one of claims 1 to 4 ,
A method for manufacturing a light emitting device, wherein the light emitting element is an organic electroluminescent element.
前記接着剤として熱硬化樹脂を用いるようにした発光装置の製造方法。 A method for manufacturing a light emitting device according to claim 5 ,
A method for manufacturing a light emitting device, wherein a thermosetting resin is used as the adhesive.
前記基板上に配置された発光素子と、
前記基板上の前記長方形形状の外端に沿って配置される薄膜トランジスタ回路と、
前記基板の上方に設けられた封止部材と、
前記基板上の前記薄膜トランジスタ回路を少なくとも覆って、前記封止部材と前記基板とを固着する接着剤と、を具備し、
前記薄膜トランジスタ回路を覆っている前記接着剤は、
更に、前記基板上の前記長方形形状の外端と、前記薄膜トランジスタ回路との間の領域に亘って前記封止部材と前記基板とを固着する発光装置。 A rectangular substrate;
A light emitting device disposed on the substrate;
A thin film transistor circuit disposed along an outer edge of the rectangular shape on the substrate;
A sealing member provided above the substrate;
An adhesive that covers at least the thin film transistor circuit on the substrate and fixes the sealing member and the substrate ;
The adhesive covering the thin film transistor circuit is:
Furthermore, the light emitting device for fixing the sealing member and the substrate across a region between the rectangular outer end on the substrate and the thin film transistor circuit .
前記発光装置は、更に、前記基板上に、前記発光素子から出力される光を検出する光検出素子を含み、The light-emitting device further includes a light detection element that detects light output from the light-emitting element on the substrate,
前記薄膜トランジスタ回路は、前記光検出素子の出力を処理するものである発光装置。The light emitting device, wherein the thin film transistor circuit processes an output of the light detection element.
前記発光素子は、有機エレクトロルミネッセンス素子である発光装置。The light emitting device is a light emitting device which is an organic electroluminescence element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007095157A JP2007294944A (en) | 2006-03-31 | 2007-03-30 | Method of manufacturing sealing body, method of manufacturing light emitting device using the same, sealing body, light emitting device, exposure device and image forming device using the exposure device |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006100415 | 2006-03-31 | ||
| JP2006100413 | 2006-03-31 | ||
| JP2007095157A JP2007294944A (en) | 2006-03-31 | 2007-03-30 | Method of manufacturing sealing body, method of manufacturing light emitting device using the same, sealing body, light emitting device, exposure device and image forming device using the exposure device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007294944A JP2007294944A (en) | 2007-11-08 |
| JP2007294944A5 true JP2007294944A5 (en) | 2009-12-24 |
Family
ID=38765191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007095157A Pending JP2007294944A (en) | 2006-03-31 | 2007-03-30 | Method of manufacturing sealing body, method of manufacturing light emitting device using the same, sealing body, light emitting device, exposure device and image forming device using the exposure device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007294944A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101900362B1 (en) | 2012-01-16 | 2018-11-09 | 삼성디스플레이 주식회사 | Organic light emitting display apparatus and method of manufacturing organic light emitting display apparatus |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000068050A (en) * | 1998-08-24 | 2000-03-03 | Casio Comput Co Ltd | Electroluminescent element and its manufacture |
| JP2003187969A (en) * | 2001-12-18 | 2003-07-04 | Sony Corp | Manufacturing method of display device |
| JP2003197366A (en) * | 2001-12-25 | 2003-07-11 | Sanyo Electric Co Ltd | Display and manufacturing method for it |
| JP2004303425A (en) * | 2003-03-28 | 2004-10-28 | Tohoku Pioneer Corp | Organic el panel and its forming method |
| JP4066953B2 (en) * | 2004-01-13 | 2008-03-26 | セイコーエプソン株式会社 | Electro-optical device and electronic apparatus |
| JP4590932B2 (en) * | 2004-05-18 | 2010-12-01 | セイコーエプソン株式会社 | Method for manufacturing electroluminescence device |
| JP2006085957A (en) * | 2004-09-15 | 2006-03-30 | Tohoku Pioneer Corp | Method of manufacturing self-luminous panel |
-
2007
- 2007-03-30 JP JP2007095157A patent/JP2007294944A/en active Pending
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