JP2006085957A - Method of manufacturing self-luminous panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a self-luminous panel using a sealing structure directly covering a self-luminous element on a substrate with sealing material, in which productivity of the panel is not made worse. <P>SOLUTION: A self-luminous element region forming process A and a luminous element region forming process B are independently performed. A substrate having a self-luminous element region formed thereon in the self-luminous element region forming process A and a seal substrate having a layer of sealing material formed thereon in the seal member forming process B are laminated to each other in a sealing process C. In the display region forming process A, the self-luminous element forming process is performed (S2) after a pretreatment process (S1). In the luminous element region forming process B, the sealing members are formed into the sizes of the sealing substrates respectively (S3) and then the sealing material is adhered on the sealing member (S4). <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a self-luminous panel.

  A self-luminous panel typified by an organic EL (Electroluminescence) panel is not only a display of a mobile phone, a flat-screen TV, an information terminal, but also an in-vehicle function display, such as an instrument panel such as a speedometer, or a function display unit of an electrical appliance, It is expected to be applied to film displays, outdoor guidance displays, or lighting, and is actively developed and researched.

  Such a self-light-emitting panel is formed by arranging a plurality of or a single self-light-emitting element on a substrate. As the self-light-emitting element, in addition to an organic EL element, an LED (Light Emitting Diode), FED (Field And a light emitting element such as Emission Display).

  The structure of the self-luminous element is, for example, an organic EL element, an organic layer (including a light-emitting layer, low molecular weight or polymer) between an anode (anode, hole injection electrode) and a cathode (cathode, electron injection electrode). A layer made of an organic material) is sandwiched between the anode and cathode, and by applying a voltage between the anode and cathode, holes injected and transported from the anode into the organic layer and from the cathode into the organic layer The injected and transported electrons are recombined, and desired light emission is obtained by recombination in the organic layer (light emitting layer).

  In such a self-luminous panel, in order to maintain the light emission characteristics of the self-luminous element, a sealing structure that blocks the self-luminous element from the outside air is generally employed. In particular, in an organic EL panel, when the organic layer and the electrode are exposed to moisture and oxygen in the atmosphere, the light emission characteristics of the organic EL element deteriorate. Therefore, a sealing means for blocking the organic EL element from the outside air is provided. It is indispensable at the development stage.

  As a sealing structure of an organic EL panel, a structure that forms a sealing space in which a desiccant can be disposed around the organic EL element has been generally adopted. On the other hand, the adoption of a top emission method in which light is extracted from the side opposite to the substrate has been studied, and a structure in which the organic EL element on the substrate is directly covered with a sealing material has been developed.

  FIG. 1 and FIG. 2 are explanatory views for explaining a conventional example employing such a sealing structure, and a multi-sided substrate in which a plurality of regions (self-emitting element regions) where self-emitting elements are formed are formed on the substrate. It is explanatory drawing which shows the manufacturing method of the organic electroluminescence display which aimed at the improvement of productivity.

  FIG. 1 is a diagram for explaining a method of manufacturing an organic EL display device disclosed in Patent Documents 1 and 2 below, and represents a plan view of a panel substrate J1. A light emitting element is formed in the display area J2 on the panel substrate J1, an external electrode (not shown) is formed in the external electrode area J3 on the panel substrate J1, and then a covering portion J5 (mask in Patent Document 1 is used in the external electrode area J3). Pattern, a protective film in Patent Document 2), a sealing resin J4 is applied on the display region J2 of the panel substrate J1, and the panel substrate J1 and the sealing substrate (not shown) are interposed via the sealing resin J4. Are pasted together.

  FIGS. 2A and 2B show a method for manufacturing the organic EL display device disclosed in Patent Documents 3 and 4, and show plan views of the panel substrate J11 and the sealing substrate J14, respectively. After the light emitting element is formed in the display region J12 on the panel substrate J11 and the external electrode J13 is formed in the external electrode region J13A on the panel substrate J11, the sealing substrate J14 is sealed as shown in FIG. A suppression portion J16 (a convex protective wall in Patent Document 3 and a concave relief portion in Patent Document 4) that suppresses the spread of the resin is formed, and a sealing resin J5 is applied on the display region J12 of the panel substrate J11. The panel substrate J11 and the sealing substrate J14 are bonded together through a sealing resin J15.

JP 2003-187969 A JP 2004-111175 A JP 2003-178866 A JP 2004-11119 A

  As in the above-described prior art, the self-luminous element (organic EL element) formed on the substrate is directly covered with a sealing material (encapsulating resin). Since a process of applying a sealing material is added to the substrate), an increase in the number of processes for the element side substrate causes a problem that the productivity of the panel deteriorates.

  In addition, since the sealing material layer is formed on the self-luminous element formed on the substrate, it becomes difficult to perform a process such as defoaming on the sealing material before bonding the sealing substrate. There is also a problem that a sealing effect on the light emitting element cannot be obtained sufficiently.

  Furthermore, it is difficult to accurately control the application range of the sealing resin before curing. In the method of manufacturing the organic EL display device disclosed in Patent Documents 1 and 2, as shown in FIG. However, it expands on the covering portion J5 and uses the sealing resin J4 more than necessary, resulting in increased waste and a case where the display region J2 cannot be completely covered with the sealing resin J4. In addition, since a process for forming and removing the covering portion J5 is required separately, there is a problem that the number of processes for the element side substrate is further increased and the productivity of the panel is deteriorated.

  Moreover, in the manufacturing method of the organic EL display device described in Patent Documents 3 and 4, it is difficult to determine an appropriate amount of the sealing resin J15 to be applied on the substrate J11, and when the amount of the sealing resin J15 is small, When a gap is generated between the sealing substrate and sufficient sealing cannot be performed and the amount of the sealing resin J15 becomes large, the sealing resin J15 exceeds the suppressing portion J16 and is placed on the external electrode. There is a problem that the sealing resin expands to the extent that the function of the suppressing portion J16 cannot be sufficiently achieved.

  This invention makes it an example of a subject to cope with such a problem. That is, in a manufacturing method of a self-luminous panel that employs a sealing structure that directly covers a self-luminous element on a substrate with a sealing material, providing a manufacturing method that does not deteriorate the productivity of the panel, sealing before the bonding step Processes such as defoaming are performed on the material to obtain reliable sealing performance, and the sealing material can be attached with high accuracy by suppressing the protrusion from the individual light emitting element regions, and the sealing material is wasted. It is an object of the present invention that the self-luminous element region can be reliably covered with a sealing material without being used.

  In order to achieve such an object, a method for manufacturing a self-luminous panel according to the present invention comprises at least the configuration according to the following independent claims.

  [Claim 1] A step of forming a self light emitting element region comprising a self light emitting element including a light emitting layer sandwiched between a pair of electrodes on a substrate, and a sealing substrate for sealing the self light emitting element. A step of forming a size corresponding to a light emitting element region, attaching a sealing material on the sealing substrate, and bonding the substrate and the sealing substrate together to form the self light emitting element region as the sealing material And a step of sealing the self-light-emitting element by covering with a self-light-emitting panel.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 3 is an explanatory diagram (flow diagram) illustrating a method for manufacturing a self-luminous panel according to an embodiment of the present invention. This manufacturing method includes a self-luminous element region forming step A, a sealing member forming step B, and a bonding sealing step C.

  The self-light emitting element region forming step A is a pre-processing step S1 (substrate preparation, lower electrode and lead wiring pattern formation, insulating film pattern formation, cathode partition wall formation) for the substrate (element side substrate) on which the self-light emitting element is formed. And a step of forming a self-luminous element including an organic layer including a light emitting layer and an upper electrode and including a light emitting layer sandwiched between a pair of electrodes. A light emitting element forming step) S2 is performed.

  For this process, a conventionally known process for forming a self-luminous element can be employed. In the case of an organic EL device, a method of forming a low molecular weight organic material by vacuum deposition, a method of forming a high molecular weight organic material by a printing method, and transferring a pre-formed organic EL film to the substrate side with a laser. A laser thermal transfer method or the like can be employed.

  In the sealing member forming step B, a sealing substrate forming step S3 is formed, in which a sealing substrate that is bonded to the element side substrate and seals the self light emitting element is formed in a size corresponding to the self light emitting element region. A sealing material attaching step S4 for attaching the sealing material onto the sealing substrate is performed.

  Thereafter, a step (bonding sealing step C) for sealing the self-luminous element is performed by bonding the element-side substrate and the sealing substrate and covering the self-luminous element region with a sealing material. In the case where a plurality of self-luminous element regions are formed on the substrate, a process of cutting and dividing the substrate into each self-luminous element area is performed, and a panel inspection process or the like is performed on the finally formed panel. Will be given.

  According to such a method for manufacturing a self-luminous panel, a sealing material and a substrate on which the self-luminous element region is formed after sealing material is attached to the sealing substrate side formed in a size corresponding to the self-luminous element region and the sealing Since the self-luminous element is sealed by bonding the substrates, the self-luminous element can be directly covered with the sealing material without affecting the formation process for the element-side substrate. This makes it possible to form a panel with high productivity.

  In addition, by attaching the sealing material to the sealing substrate before the bonding step, the sealing material can be subjected to processing such as defoaming regardless of the self-luminous element formed on the element side substrate. Thereafter, since the element-side substrate and the sealing substrate are simply bonded together, reliable sealing performance can be ensured by the sealing material.

  Furthermore, since the amount of the sealing material attached can be defined by the size of the sealing substrate, the element side substrate and the sealing substrate can be simply connected without any special work on the element side substrate or the sealing substrate. The sealing material can be attached with high accuracy by simply bonding together, and the sealing material can be attached without waste. In addition, by forming a uniform sealing material layer on the sealing substrate, the self-luminous element region can be reliably covered with the sealing material.

  Hereinafter, the manufacturing method according to the embodiment of the present invention will be described in more detail with reference to FIGS. 4 to 6 by taking an organic EL panel made of organic EL elements as an example.

  4A and 4B are a perspective view and a cross-sectional view showing an example of the substrate 1 formed by the above-described self-light emitting element region forming step A (FIG. 4B is an X- X sectional view). In the pretreatment step S 1, the lower electrode 2 and the extraction electrode 3 are formed and patterned on the substrate 1, and then the insulating film 4 is formed and patterned so as to partition the opening of the light emitting region on the lower electrode 2. .

  Specifically, a transparent substrate (for example, ITO) was formed as the lower electrode 2 to a thickness of about 150 nm by sputtering or the like, and a polishing process or a chemical etching process was performed as necessary to smooth the surface irregularities. Thereafter, a resist corresponding to the pattern of the lower electrode 2 and the pattern of the extraction electrode 3 for connection to an external driving circuit is exposed and developed, and patterned using a ferric chloride solution or the like as an etchant. Extraction electrodes 3 are formed respectively. As the extraction electrode 3, it is preferable to laminate a low-resistance metal such as silver, chromium, or aluminum on ITO.

  Next, the substrate 1 is washed, and a polyimide precursor as the insulating film 4 is applied, exposed and developed. After the development, a baking process is performed at 200 ° C. for 2 hours to form a pattern of the insulating film 4 having a light emitting region opened on the lower electrode 2. Further, a reverse-tapered cathode barrier rib is formed on the insulating film 4 as necessary. Before the support substrate 1 is carried into the film forming step S2, the surface of the substrate 1 is cleaned by UV irradiation. In the example shown in the figure, an example is shown in which a plurality of self-luminous element regions 5 are formed on a single multi-sided (large format) substrate.

Next, as a film forming process (self-luminous element forming process: S2), the substrate 1 is carried into the vapor deposition chamber, and a hole injection layer such as CuPc is formed at the opening position where the insulating film 4 on the lower electrode 2 is patterned. Then, a hole transport layer such as NPB, a blue light emitting material DPVBi, a green light emitting material Alq ₃ , a red light emitting material such as tBu-PTC is separately formed, and an electron transport such as Alq _{3 is formed.} An organic layer 7 is formed by sequentially forming a layer, an electron injection layer such as LiO ₂ , and an upper electrode 6 such as Al. In some cases, a base layer for the purpose of planarization or the like is formed between the substrate 1 and the lower electrode 2. In particular, when the lower electrode 2 is driven by a driving element such as a TFT formed on the substrate 1, the lower electrode 2 is formed on the substrate 1 via a planarizing film. Through this film forming process, a plurality of self-light emitting element regions 5 and lead wirings 3 are formed on the substrate 1.

  Next, FIG. 5 is a figure explaining an example of the sealing member formation process B shown in FIG. The sealing substrate 11 divided and formed for each self-light emitting element region 5 on the positioning tray (positioning member) 10 is supported so as to be arranged at the same position as the self-light emitting element region 5 shown in FIG. . And the sealing member 13 is uniformly apply | coated to the whole on these several sealing substrates 11 using the application member (dispenser etc.) 12. As the sealing member 13, a thermosetting or photo-curing resin material, an elastomer, or the like is used. After the application is completed, a necessary process such as a defoaming process for removing bubbles in the sealing material 13 is performed on the sealing member 13. Here, an example in which the sealing material 13 is applied has been described. However, the present invention is not limited thereto, and the sealing material 13 may be adhered onto the sealing substrate 11 by laminating a film-shaped sealing material. Good.

  Then, as shown in FIG. 6, the sealing material 13 adhered on the sealing substrate 11 and the self-luminous element region 5 formed on the substrate 1 are faced to each other, and the substrate 1 and the sealing substrate 11 are bonded. Align.

  A specific example of the bonding step C will be described with reference to FIGS. 7A is arranged so that the self-luminous element region 5 of the substrate 1 formed in FIG. 3 and the sealing member 13 on the positioning tray 10 of the sealing substrate formed in FIG. 4 face each other. It shows the state that was done. Then, for example, the self-light emitting element region 5 and the sealing substrate 11 which are sealed by aligning the alignment mark provided on the positioning tray 10 and the alignment mark provided on the substrate 1 are positioned, and then, The substrate 1 and the sealing substrate 11 are brought close to each other.

  Then, as shown in FIG. 7B, the sealing member 13 on the sealing substrate 11 is brought into close contact with the self-luminous element region 5 of the substrate 1 so that the sealing member 13 covers the entire self-luminous element region 5. The substrate 1 and the positioning tray 10 are brought into pressure contact with each other with a predetermined pressure P. The pressure P at this time is controlled so that the sealing member 13 does not cover the extraction wiring 3 in consideration of the expansion of the sealing member 13.

  Thereafter, when a thermosetting resin is used as the sealing material 13, the sealing material 13 is cured by heating from behind the sealing substrate 11 (positioning tray 10). Then, the positioning tray 10 is detached from the sealing substrate 11 as shown in FIG.

  In the example shown in the figure, the sealing substrate 11 is positioned on the positioning tray 10 and bonded together. However, the present invention is not limited to this. On the other hand, the sealing substrate 11 may be bonded one by one or plural (for example, every horizontal row).

  FIG. 8 is an example of a self-luminous panel (organic EL panel) manufactured by the manufacturing method of the present invention.

  Here, an example of the bottom emission method in which the display surface 100a formed by the organic EL element is formed on the substrate 101 side is shown, but not limited to this, a top emission method in which light is extracted from the sealing substrate 121 side is shown. You can also In the case of the top emission method, the organic EL element is formed so as to extract light to the sealing substrate 121 side, and the sealing substrate 121 and the sealing material 123 are formed of a transparent material. In particular, in the case of the top emission method, it is possible to make the refractive index of the light emission path uniform by adjusting the refractive index of the sealing material 13, and the emission opening on the sealing substrate 11 side and each organic EL. It is possible to solve the problem of an optical shift from the opening on the light emitting surface of the element or a color shift in the case of colorization.

  As described above, the self-light emitting element region 5 is obtained by forming a plurality of organic EL elements on the substrate 101 by sandwiching the organic layer 33 including the light emitting layer between the lower electrode 31 and the upper electrode 32. In the illustrated example, the organic EL element has a silicon oxide coating layer 101 </ b> A formed on a support substrate 101, and a lower electrode 31 formed thereon is set as an anode made of a transparent electrode such as ITO. An insulating film 34 is formed so as to open the light emitting regions 30R, 30G, and 30B, and a hole transport layer 33a, a light emitting layer 33b, and an electron transport layer 33c are formed on the lower electrode 31 in the light emitting regions 30R, 30G, and 30B. The upper electrode 32 made of a metal material such as Al is formed thereon, and this is set as the cathode.

Regarding the setting of the anode and the cathode, the anode side is made of a material having a higher work function than the cathode side, and a metal film such as chromium (Cr), molybdenum (Mo), nickel (Ni), platinum (Pt), ITO, IZO A transparent conductive film such as a metal oxide film is used. Conversely, the cathode side is made of a material having a lower work function than the anode side, such as alkali metals (Li, Na, K, Rb, Cs), alkaline earth metals (Be, Mg, Ca, Sr, Ba), rare earth metals, etc. , Metal having a low work function, a compound thereof, or an alloy containing them, amorphous semiconductors such as doped polyaniline and doped polyphenylene vinylene, and oxides such as Cr ₂ O ₃ , NiO, and Mn ₂ O ₅ are used. it can. Therefore, it is naturally possible to set the lower electrode 31 as the cathode and the upper electrode 32 as the anode by selecting the material, and in this case, the stacking order of the organic layers is reversed from the above-described example. Thus, the electron transport layer, the light emitting layer, and the hole transport layer are stacked from the lower electrode 31 side. Whether the bottom emission method or the top emission method is used is determined by whether or not the light extraction side electrode is a transparent electrode. When both the lower electrode 31 and the upper electrode 32 are made of a transparent material, Further, a configuration in which a reflective film is provided on the electrode side opposite to the light emission side may be employed.

  A lead wire 41 is formed on the substrate 101, and an end 32 a of the upper electrode 32 is connected to the lead wire 41. The lead-out wiring 41 is patterned in a state in which the first electrode layer 41 a formed by the same material and in the same process as the lower electrode 31 is insulated from the first electrode 31 by the insulating layer 34. On the layer 41a, a second electrode layer 41b for forming a low resistance wiring portion is formed.

  Here, the self-light-emitting element region 5 on the premise of the passive drive method is shown, but the self-light-emitting device region 5 can also be configured by the active drive method without being limited to this.

  A layer of the sealing material 123 is formed so as to directly cover the self-light emitting element region 5, and the substrate 101 and the sealing substrate 121 are bonded to each other through the sealing material 123.

  As described above, the organic layer 33 is generally a combination of the hole transport layer 33a, the light emitting layer 33b, and the electron transport layer 33c, but each of the hole transport layer 33a, the light emitting layer 33b, and the electron transport layer 33c is 1 in number. A plurality of layers may be provided in addition to the layers, and either one or both of the hole transport layer 33a and the electron transport layer 33b may be omitted. It is also possible to insert organic material layers such as a hole injection layer, an electron injection layer, and a hole blocking layer depending on the application. For the hole transport layer 33a, the light emitting layer 33b, and the electron transport layer 33c, a conventionally used material (regardless of a polymer material or a low molecular material) can be appropriately selected.

  The light emitting material forming the light emitting layer 33b exhibits light emission (fluorescence) when returning from the singlet excited state to the ground state, and light emission (phosphorescence) when returning from the triplet excited state to the ground state. Any one of them can be used.

  Further, in this embodiment, the self-light emitting element portion made of the organic EL element can display a plurality of colors (for example, light emission of red (R), green (G), and blue (B) as shown in the figure) even in a single color display. In order to realize a multi-color display, not only a separate coating method is included, but also a single color light emitting functional layer such as white or blue is provided with a color filter or a fluorescent material. A method that combines conversion layers (CF method, CCM method), a method that realizes multiple light emission by irradiating electromagnetic waves to the light emitting area of a monochromatic light emitting functional layer (photo bleaching method), a unit display area of two or more colors It is possible to adopt a method (SOLED (Transparent Stacked OLED) method) or the like in which a single unit display area is formed by vertically stacking layers.

  In the current material development and manufacturing process development status, full-color display panels that use low molecular weight materials for the organic layer 33 have been commercialized. As the structure of the organic layer at this time, a layer structure of lower electrode (anode) / hole injection layer / hole transport layer / light emitting layer / electron transport layer / electron injection layer / upper electrode (anode) is employed. . Each layer can be made of a single organic material, a mixture of multiple materials (mixed layer), or a functional material of organic or inorganic materials in a polymer binder (charge transport function, light emitting function) , Charge blocking function, optical function, etc.) can be dispersed. In addition, each layer can be provided with a layer having a buffer function so that an organic layer formed in a lower layer is not damaged when an upper layer such as an upper electrode is formed by sputtering. In addition, a planarization function can be provided in order to prevent unevenness due to the film formation process.

  As the structure of the organic EL element, a structure in which a plurality of organic EL elements are stacked (SOLED element), a structure in which a charge generation layer is interposed between an anode and a cathode (multiphoton element), and an element structure having only one organic layer (The functional layer is formed continuously and the layer boundary is eliminated) or the like.

  Hereinafter, although the specific example of the manufacturing method of such a self-light-emitting panel is shown, this invention is not specifically limited to this.

Pretreatment process:
An indium tin oxide film (ITO), which is a transparent conductive film, is formed on a glass substrate 101 by a sputtering method, and patterned by a photolithography method, whereby a lower electrode 31 serving as an anode and an extraction wiring 41 (first wiring) The pattern of the electrode layer 41a) is formed. Further, the insulating film 34 made of polyimide is patterned so that the light emitting region is opened on the lower electrode 31. Thereafter, UV ozone cleaning is performed on the substrate 101 with ITO.

Self-luminous element formation process (film formation process):
After the pretreatment step, the substrate 101 is carried into a vacuum film forming apparatus evacuated to 10 ⁻⁴ Pa, CuPc is deposited as a hole injection layer by 50 nm, and then NPD is deposited as a hole transport layer by 50 nm. An organic EL layer in which a blue light emitting layer and an orange light emitting layer are laminated is used. First, as a blue EL light emitting layer, 50 nm of BCzVBi as a 1 wt% dopant is co-evaporated on a DPVBi host material, and 50 nm of DCM is co-evaporated as a 1 wt% dopant on an Alq ₃ host material. On top of this, 20 nm of Alq ₃ is deposited as an electron transport layer, and 150 nm of Al is deposited as a cathode.

After such a film formation step, a light emission inspection step is performed on the substrate 101 side, and then the substrate 101 is carried into a sealing chamber that is changed from a vacuum atmosphere to an inert gas atmosphere of N ₂ .

Sealing member forming step:
Each sealing substrate 121 is formed by cutting and dividing a plate material made of glass or the like into a desired shape (rectangular, square, etc.) having a size corresponding to the self-light emitting element region 5. Then, a layer of the sealing material 123 is formed on one surface of the sealing substrate 121 by the above-described method such as coating.

Bonding sealing process:
After that, the substrate 101 on which the organic EL element is formed and the sealing substrate 121 covered with the layer of the sealing material 123 are opposed to each other, and the organic EL element is directly covered with the sealing material 123. The sealing substrate 121 is attached. Then, the sealing material 123 is cured while the substrate 101 is heated (about 70 ° C.) and pressed to complete the sealing of the organic EL element and the bonding between the substrate 101 and the sealing substrate 123. In order to improve the sealing performance of the sealing material 123, a sealing seal may be separately provided around the layer of the sealing material 123.

  According to such an embodiment of the present invention, in a method for manufacturing a self-luminous panel that employs a sealing structure that directly covers a self-luminous element on a substrate with a sealing material, a manufacturing method that does not deteriorate the productivity of the panel is provided. Can do. Moreover, reliable sealing performance can be obtained by performing a process such as defoaming on the sealing material before the bonding step. Furthermore, the sealing material can be attached to each self-light-emitting element with high accuracy, and the self-light-emitting element region can be reliably covered with the sealing material without wasteful use of the sealing material.

It is explanatory drawing of a prior art. It is explanatory drawing of a prior art. FIG. 3 is an explanatory diagram (flow diagram) illustrating a method for manufacturing a self-luminous panel according to an embodiment of the present invention. It is explanatory drawing explaining the manufacturing method of the self-light-emitting panel which concerns on embodiment of this invention. It is explanatory drawing explaining the manufacturing method of the self-light-emitting panel which concerns on embodiment of this invention. It is explanatory drawing explaining the manufacturing method of the self-light-emitting panel which concerns on embodiment of this invention. It is explanatory drawing explaining the manufacturing method of the self-light-emitting panel which concerns on embodiment of this invention. It is explanatory drawing which shows the self-light-emitting panel (organic EL panel) manufactured by the manufacturing apparatus which concerns on embodiment of this invention.

DESCRIPTION OF SYMBOLS 1 Substrate 2 Lower electrode 3 Lead electrode 4 Insulating film 5 Self-luminous element area 6 Upper electrode 7 Organic layer 11 Sealing substrate 13 Sealing material

Claims (5)

Forming a self light emitting element region comprising a self light emitting element including a light emitting layer sandwiched between a pair of electrodes on a substrate;
Forming a sealing substrate for sealing the self-light-emitting element in a size corresponding to the self-light-emitting element region, and attaching a sealing material on the sealing substrate;
A step of sealing the self-light-emitting element by bonding the substrate and the sealing substrate together and covering the self-light-emitting element region with the sealing material. Method.   2. The self light emitting element region is formed in plural on the substrate, and the substrate and the sealing substrate are bonded together, and then the substrate is divided and cut for each self light emitting element region. The manufacturing method of the self-light-emitting panel described in 2.   3. The method for manufacturing a self-luminous panel according to claim 2, wherein a plurality of the sealing substrates are supported on a positioning member and then bonded to the substrates at a time.   The self-luminous element is formed so as to extract light to the sealing substrate side, and the sealing substrate and the sealing material are formed of a transparent material. A method for manufacturing a self-luminous panel.   The method for manufacturing a self-luminous panel according to claim 1, wherein the self-luminous element is an organic EL element.

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