JP2007005107A - Light-emitting panel and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a sealing member from peeling off after panel formation. <P>SOLUTION: An adhesive layer 5 is formed between a substrate 2L or a sealing member 6L and a resin layer 4 to stick the sealing member 6L on to the substrate 2L, when a plurality of light-emitting elements 3 are formed on the substrate 2L to stick the sealing member 6L on to the substrate 2L via the resin layer 4 for covering the light-emitting elements 3. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a self-luminous panel and a self-luminous panel.

  A self-luminous panel typified by an organic EL (Electroluminescence) panel is not only a display of a mobile phone, a flat-screen TV, an information terminal, but also an in-vehicle function display, such as an instrument panel such as a speedometer, or a function display unit of an electrical appliance, It is expected to be applied to film displays, outdoor guidance displays, or lighting, and is actively developed and researched.

  Such a self-light-emitting panel is formed by arranging a plurality of or a single self-light-emitting element on a substrate. As the self-light-emitting element, in addition to an organic EL element, an LED (Light Emitting Diode), FED (Field And a light emitting element such as Emission Display).

  The structure of the self-luminous element is, for example, an organic EL element, an organic layer (including a light-emitting layer, low molecular weight or polymer) between an anode (anode, hole injection electrode) and a cathode (cathode, electron injection electrode). A layer made of an organic material) is sandwiched between the anode and cathode, and by applying a voltage between the anode and cathode, holes injected and transported from the anode into the organic layer and from the cathode into the organic layer The injected and transported electrons are recombined, and desired light emission is obtained by recombination in the organic layer (light emitting layer).

  In such a self-luminous panel, in order to maintain the light emission characteristics of the self-luminous element, a sealing structure that blocks the self-luminous element from the outside air is generally employed. In particular, in an organic EL panel, when the organic layer and the electrode are exposed to moisture and oxygen in the atmosphere, the light emission characteristics of the organic EL element deteriorate. Therefore, a sealing means for blocking the organic EL element from the outside air is provided. It is indispensable at the development stage.

  As a sealing structure of the organic EL panel, a metal or glass sealing member and a substrate on which the organic EL element is formed are bonded together to form a sealing space in which a desiccant can be disposed around the organic EL element. In general, however, the use of a top emission method in which light is extracted from the opposite side of the substrate with respect to the organic EL element on the substrate has been studied. A structure in which an organic EL element is directly covered with a resin layer has been studied.

  In the prior art disclosed in Patent Document 1 below, a sealing resin film is pasted on a sealing member, and the substrate on which the light-emitting element part is formed is pressed and sealed through the sealing resin film. is doing.

  FIG. 1 is an explanatory view for explaining a case where this conventional technique is expanded to a large-sized self-luminous element part capable of taking multiple faces. As shown in FIG. 1A, the self-luminous panel J1 has a self-luminous element portion J11 formed on a substrate J10, and a resin layer J12 is provided so as to cover the self-luminous element portion J11. The substrate J10 and the sealing member J13 are pasted together.

JP 2004-139777 A

  According to such a conventional technique, it is necessary to pressurize the self-luminous panel J1 at the time of attachment in order to firmly adhere the substrate J10 on which the self-luminous element portion J11 is formed and the sealing member J13. . A plurality of self-luminous element portions J11 are formed on a large plate-like substrate J10, a large plate-like sealing member J13 is pasted thereon, and after bonding and curing, the individual light-emitting panels J1 are cut and divided. When performing multiple chamfering to obtain, since the degree of pressure applied is different between the portion where the resin layer J12 covering the self-light emitting element portion J11 is present and the portion where it does not exist with respect to the large plate-shaped sealing member J13, for example, FIG. As shown in FIG. 1B, when the pressure is applied from the sealing member J13 side, the sealing member J13 is likely to be deformed, and the substrate J10 is likely to be deformed relative to the pressure from the substrate J10 side. In the self-luminous panel J1 after processing, peeling (S) is likely to occur between the end of the sealing member J13 and the end of the substrate J10 and the resin layer J12 as shown in FIG. There was a problem.

  This invention makes it an example of a subject to cope with such a problem. That is, in a self light emitting panel in which a self light emitting element portion is formed on a substrate and a sealing member is attached via a resin layer covering the self light emitting element portion, the sealing member is peeled off or floated after the attaching process. It is an object of the present invention to prevent, and thereby obtain a self-luminous panel with high sealing performance.

  In order to achieve such an object, the present invention comprises at least the configurations according to the following independent claims.

  [Claim 1] A method of manufacturing a self-luminous panel in which a self-luminous element is formed on a substrate and a sealing member is attached to the substrate via a resin layer covering the self-luminous element. A method for producing a self-luminous panel, wherein a liquid adhesive layer is formed between the sealing member and the resin layer.

  [Claim 2] A step of forming a self-luminous element portion on the substrate, a step of forming a resin layer on the substrate so as to cover the self-luminous element portion, and a liquid adhesive layer on the resin layer The manufacturing method of the self-light-emitting panel characterized by having the process to form and the process of sticking a sealing member on the said resin layer through this adhesive bond layer.

  [Claim 3] A step of forming a self-luminous element portion on the substrate, a step of forming a resin layer on the substrate so as to cover the self-luminous element portion, and a liquid adhesive layer on the sealing member The manufacturing method of the self-luminous panel characterized by having the process of forming a sealing member on the said resin layer through this adhesive bond layer.

  [Claim 4] A step of forming a self-luminous element on a substrate, a step of forming a resin layer on a sealing member, a step of forming a liquid adhesive layer on the substrate, and the adhesive layer And a step of attaching a sealing member on the self-light-emitting element part through a method.

  [Claim 5] A step of forming a self-luminous element portion on a substrate, a step of forming a resin layer on a sealing member, a step of forming a liquid adhesive layer on the resin layer, and the adhesive And a step of affixing a sealing member on the self-luminous element portion through a layer.

  [Claim 9] A self-luminous panel in which a self-luminous element portion is formed on a substrate and a sealing member is attached to the substrate via a resin layer covering the self-luminous element portion, the resin layer being a film material A self-luminous panel comprising: an adhesive layer for bonding the resin layer and the sealing member as a hardened layer of a liquid adhesive.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 2 is an explanatory view showing a method for manufacturing a self-luminous panel according to an embodiment of the present invention. In the method for manufacturing the self light emitting panel 1 according to the embodiment of the present invention, the self light emitting element portion 3 is formed on the substrate 2L, and the sealing member 6L is provided on the substrate 2L through the resin layer 4 covering the self light emitting element portion 3. In this manufacturing method, the liquid adhesive layer 5 is formed between the substrate 2L or the sealing member 6L and the resin layer 4. That is, in order to improve the adhesion between the substrate 2L or the sealing member 6L and the resin layer 4, the liquid is provided between the substrate 2L and the resin layer 4, between the sealing member 6L and the resin layer 4, or both. The adhesive layer 5 is formed and the sealing member 6L is attached to the substrate 2L.

  An example of the process will be described with reference to FIG. 2. First, as shown in FIG. 2A, a plurality of self light emitting element portions 3 are formed on a substrate 2L (self light emitting element portion forming step). The self-light emitting element part 3 is formed based on a known process. For example, when the self-light emitting element part 3 made of an organic EL element is formed, the substrate 2L is washed, and the lower electrode and the extraction electrode are formed and patterned. The organic EL functional layer is formed / patterned and the upper electrode is formed / patterned.

  Next, as shown in FIG. 2B, the resin layer 4 is patterned according to the arrangement position of the self-light-emitting element portions 3 so as to cover the self-light-emitting element portions 3 (resin layer forming step). In this step, the resin layer 4 that covers the self-luminous element portion 3 is formed by application such as dipping, spin coating, printing, film lamination, or the like. Various pattern forming methods such as use of a mask, screen printing, or transfer of a film pattern may be employed. As the resin layer 4, ultraviolet light or thermosetting resin having low moisture permeability is used.

  Next, as shown in FIG. 3C, a liquid adhesive layer 5 is formed on the resin layer 4 (adhesive layer forming step). The liquid adhesive layer 5 is for adhering the resin layer 4 and the sealing member 6L without performing a pressurizing step. For example, the liquid adhesive layer 5 is a two-component curable adhesive, etc. An adhesive that can be bonded only by its own weight is used. This layer is formed, for example, by applying the adhesive 5 </ b> A to the upper surface of the resin layer 4 by arranging the dropping device 50 sequentially or at once.

  Next, as shown in FIG. 4D, a large-sized sealing member 6L is pasted on the resin layer 4 via the adhesive layer 5 (sealing member pasting step). At this time, without applying pressure, the sealing member 6L is brought into close contact with the resin layer 4 only by its own weight. The sealing member 6L is not particularly limited as long as a moisture-proof effect can be obtained, such as a glass substrate, a metal substrate, and a metal foil.

  Thereafter, the liquid adhesive layer 5 and the resin layer 4 are cured to obtain the self light emitting panel 1 in which the self light emitting element portion 3 is sealed. In the self-luminous panel 1, for example, the resin layer 4 is made of a film material, and an adhesive layer 5S that bonds the resin layer 4 and the sealing member 6L is formed as a hardened layer of a liquid adhesive.

  Thereafter, as shown in FIG. 5E, after the adhesive layer 5S is formed, cutting and dividing processes are performed at the cutting points C, and individual self-luminous panels 1 can be obtained. In the self-luminous panel 1, for example, the resin layer 4 is made of a film material, and an adhesive layer 5S that bonds the resin layer 4 and the sealing member 6L is formed as a hardened layer of a liquid adhesive.

  According to such an embodiment, at the time of attaching shown in FIG. 4D, the attaching portion of the sealing member 6L is only the portion where the resin layer 4 exists, and the portion where the resin layer 4 does not exist is the sealing member. Although a space is formed between 6L and the substrate 2L, since it is not necessary to pressurize the sealing member 6L by providing the adhesive layer 5, the sealing member 6L does not bend. . Further, when a film-like resin is used for the resin layer, it is necessary to heat the sealing member 6L in addition to pressurization in order to improve the adhesion with the sealing member. The member 6L is not contracted by heating.

  Accordingly, when the resin layer 4 and the sealing member 6L have different heat shrinkage rates, or after the resin layer 4 and the sealing member 6L are bonded and cured, the sealing member 6L and the substrate 2L are cut. -Even after the division, the sealing member 6 </ b> L is not peeled off from the resin layer 4.

  Further, the presence of the adhesive layer 5 makes it possible to firmly and firmly fix the sealing member 6L to the substrate 2L. Thereby, high adhesion can be ensured with a wide area at the interface between the resin layer 4 and the sealing member 6L, and the barrier property (moisture blocking property) to the self-light emitting element portion 3 can be further enhanced. .

  In addition, since the substrate 2L and the sealing member 6L are attached via the liquid adhesive layer 5, the state in which the substrate 2L and the sealing member 6L are attached until the adhesive layer 5 is cured. Thus, the alignment can be adjusted, and the workability of the attaching process can be improved. Furthermore, since an appropriate amount of the liquid adhesive 5A is dropped on the patterned resin layer 4, the adhesive does not spread beyond the pattern of the resin layer 4, and the substrate 2L and the sealing member 6L are disposed at unnecessary portions. Can be avoided. In the embodiment described above, the adhesive layer 5 may be formed on the entire surface of the resin layer 4.

  The adhesive layer 5 may be formed on the resin layer 4 as described above, or may be formed on the adhesive region on the sealing member 6L side, and then the resin layer 4 via the adhesive layer 5. You may make it affix the sealing member 6L on it.

  Further, the resin layer 4 may be formed on the self-luminous element portion 3 on the substrate 2L side as described above, or the resin layer 4 is formed on the sealing member 6L, and the adhesive layer is formed on the substrate 2L. 5 may be formed, and the resin layer 4 and the sealing member 6 </ b> L may be attached to the self-light emitting element portion 3 via the adhesive layer 5.

  Further, the resin layer 4 is formed on the sealing member 6L, the adhesive layer 5 is formed on the resin layer 4, and the resin layer 4 and the self-light emitting element portion 3 are sealed with the adhesive layer 5 interposed therebetween. The stop member 6L may be pasted.

  Hereinafter, as a more specific embodiment of the present invention, a manufacturing method and a structure of a self-luminous panel (organic EL panel) provided with a self-luminous element portion 3 made of an organic EL element will be described with reference to FIGS.

  The substrate preparation step S1 includes steps of performing cleaning, surface treatment, and surface coating on the substrate 2L as necessary. When forming the self-light-emitting panel 1 for active driving, a driving element is formed on the substrate 2L. 21 (TFT or the like), and a step of forming the planarizing film 22 on the substrate 2L on which the driving element 21 is formed.

  In the lower electrode formation step S2, a pattern of the lower electrode 30 is formed on the substrate 2L that has undergone the substrate preparation step S1. In the case of active driving, the lower electrode 30 is formed in a pattern partitioned as a pixel electrode, and is connected to the driving element 21 through the connection hole 22A of the planarizing film 22. In the case of passive driving, the lower electrode 30 is formed as a stripe pattern, and at the same time, an extraction electrode portion is formed (FIG. 4 shows an example of active driving).

In the insulating film pattern forming step S <b> 3, the pattern of the insulating film 31 is formed so as to partition the light emitting region on the lower electrode 30 and insulate between the adjacent lower electrodes 30.
A step of forming a partition for dividing the upper electrode may be included as necessary, such as in the case of passive driving.

  In the organic layer forming step S4, for example, an organic layer 32 composed of a hole transport layer 32A, a light emitting layer 32B, an electron transport layer 32C, and the like is formed in a light emitting region on the lower electrode 30 partitioned by the insulating film 31. The

  In the upper electrode formation step S5, the upper electrode 33 is formed on the formed organic layer 32. (FIG. 4 shows an example of active driving).

  In the resin layer forming step S <b> 6, for example, a film material for forming the resin layer 4 is attached on the substrate 2 </ b> L so as to cover the self-light emitting element 3. Affixing is performed using an affixing device that continuously performs linear contact in a direction orthogonal to the contact line, so that bubbles do not enter between the resin layer 4 and the substrate 2L.

  Further, a step of forming a protective layer made of an inorganic material such as silicon nitride or silicon oxide may be inserted between the upper electrode forming step S5 and the resin layer forming step S6. Conversely, the resin layer 4 may be attached to the sealing substrate 6 side (not shown).

  In the adhesive layer forming step S <b> 7, for example, a two-component curable liquid adhesive is dropped on the resin layer 4, and the adhesive layer 5 is formed only on the resin layer 4. On the contrary, the adhesive layer 5 may be formed on the substrate side. In this case, the adhesive layer 5 may be formed on the entire surface of the bonding region with the resin layer 4 on the substrate (not shown).

  In the sealing member attaching step S8, the sealing member 6L made of a glass substrate or the like is placed on the adhesive layer 5 and alignment is performed as necessary until the adhesive layer 5 is cured. Thereafter, heat treatment is performed as necessary to cure the adhesive layer 5.

  A known material such as a photosensitive material can be used as the material used for the insulating film 31 and is not particularly limited.

  The organic EL element constituting the self-light emitting element portion will be further described. The organic EL element includes an anode (anode, hole injection electrode; lower electrode 30 or upper electrode 33) and a cathode (cathode, electron injection electrode; upper electrode 33 or It has a structure in which an organic layer 32 having an organic EL function is sandwiched between the lower electrode 30) and holes injected and transported from the anode into the organic layer 30 by applying a voltage to both electrodes. The electrons injected and transported from the cathode into the organic layer are recombined at the light emitting portion (light emitting layer 32B) in the layer to obtain light emission.

  As for the substrate 2L, in the case of adopting a bottom emission structure in which light is extracted from the substrate 2L side, a transparent flat plate or film is used, and glass or plastic can be used as the material. When employing a top emission structure in which light is extracted from the sealing member 6L side, the transparency of the substrate 2L is not particularly required.

  One of the lower electrode 30 and the upper electrode 33 is set as a cathode and the other is set as an anode. In this case, the anode is preferably made of a material having a high work function, such as a metal film such as chromium (Cr), molybdenum (Mo), nickel (Ni), platinum (Pt), or a metal oxide such as ITO or IZO. A transparent conductive film such as a film is used. The cathode is preferably composed of a material having a low work function, in particular, metals such as aluminum and silver, alloys of magnesium and silver, alkali metals (Li, Na, K, Rb, Cs), and alkaline earth metals. A metal having a low work function such as (Be, Mg, Ca, Sr, Ba) or a rare earth metal, a compound thereof, or an alloy containing them can be used. Further, when both the lower electrode 30 and the upper electrode 33 are made of a transparent material, a configuration in which a reflective film is provided on the electrode side opposite to the light emission side can also be adopted.

  In addition, the extraction electrode extracted from the lower electrode 30 or the upper electrode 33 is a wiring electrode provided to connect the self-luminous display panel 1 and driving means such as an IC and a driver for driving the display panel, and preferably Ag. It is preferable to use low resistance metal materials such as Cr, Al, and alloys thereof.

  In general, the lower electrode 30 and the extraction electrode are formed by depositing an electrode material such as ITO or IZO by a method such as vapor deposition or sputtering, and forming a pattern by a photolithography method or the like. The lower electrode 30 and the extraction electrode (particularly the extraction electrode that requires low resistance) have a two-layer structure in which a low-resistance metal such as Ag, Ag alloy, Al, or Cr is laminated on the base such as ITO or IZO described above. Alternatively, a three-layer structure in which a material having high oxidation resistance such as Cu, Cr, Ta or the like is further laminated can be adopted as a protective layer such as Ag.

  As the organic layer 32 formed between the lower electrode 30 and the upper electrode 33, when the lower electrode 30 is an anode and the upper electrode 33 is a cathode, as described above, the hole transport layer 32A / light emitting layer The stack structure of 32B / electron transport layer 32C is general (when the lower electrode 30 is used as a cathode and the upper electrode 33 is used as an anode, the stacking order is reversed), but the light emitting layer 32B, the hole transport layer 32A, The electron transport layer 32C may be provided by laminating not only one layer but also a plurality of layers, and either one of the hole transport layer 32A and the electron transport layer 32C may be omitted, or both layers may be omitted. Only the light emitting layer 32B may be used. In addition, as the organic layer 32, an organic functional layer such as a hole injection layer, an electron injection layer, a hole barrier layer, or an electron barrier layer can be inserted depending on the application.

  The material of the organic layer can be appropriately selected according to the use of the organic EL element. Examples are shown below, but are not limited thereto.

  The hole transport layer 32A only needs to have a function of high hole mobility, and any material can be selected and used from conventionally known compounds. Specific examples include porphyrin compounds such as copper phthalocyanine, aromatic tertiary amines such as 4,4′-bis [N- (1-naphthyl) -N-phenylamino] -biphenyl (NPB), 4- (di- Organic materials such as stilbene compounds such as p-tolylamino) -4 ′-[4- (di-p-tolylamino) styryl] stilbenzene, triazole derivatives and styrylamine compounds are used. In addition, a polymer-dispersed material in which a low-molecular organic material for hole transport is dispersed in a polymer such as polycarbonate can also be used. Preferably, a material whose glass transition temperature is higher than the temperature at which the sealing resin is heated and cured is preferable, for example, 4,4′-bis [N- (1-naphthyl) -N-phenylamino] -biphenyl (NPB). It is done.

A known light emitting material can be used for the light emitting layer 32B. Specific examples thereof include aromatic dimethylidin compounds such as 4,4′-bis (2,2′-diphenylvinyl) -biphenyl (DPVBi), 1,4 -Styrylbenzene compounds such as bis (2-methylstyryl) benzene, triazole derivatives such as 3- (4-biphenyl) -4-phenyl-5-t-butylphenyl-1,2,4-triazole (TAZ), anthraquinones Derivatives, fluorescent organic materials such as fluorenone derivatives, fluorescent organometallic compounds such as (8-hydroxyquinolinato) aluminum complex (Alq ₃ ), polyparaphenylene vinylene (PPV), polyfluorene, polyvinylcarbazole (PVK) Of phosphorescence from triplet excitons such as platinum and iridium complexes Usable organic materials (Special Tables 2001-520450) can be used. It may be composed only of the light emitting material as described above, or may contain a hole transport material, an electron transport material, an additive (donor, acceptor, etc.) or a light emitting dopant. These may be dispersed in a polymer material or an inorganic material.

  The electron transport layer 32C only needs to have a function of transmitting electrons injected from the cathode to the light emitting layer, and any material can be selected and used from conventionally known compounds. Specific examples include organic materials such as nitro-substituted fluorenone derivatives and anthraquinodimethane derivatives, metal complexes of 8-quinolinol derivatives, metal phthalocyanines, and the like.

  The hole transport layer 32A, the light emitting layer 32B, and the electron transport layer 32C are formed by a wet process such as a spin coating method, a coating method such as a dipping method, a printing method such as an ink jet method or a screen printing method, or a vapor deposition method, which will be described later. It can be formed by a dry process such as a laser transfer method.

  And the self-light-emitting element part 3 may form a single organic EL element, or may have a desired pattern structure and constitute a plurality of pixels. In the latter case, the display method may be single-color light emission or multi-color light emission of two or more colors, and in particular, in order to realize a multi-color light emission organic EL panel, three types of light emitting function layers corresponding to RGB are provided. A method of forming a light emitting functional layer of two or more colors including a forming method (coloring method), a method of combining a color conversion layer made of a color filter or a fluorescent material with a single color light emitting functional layer such as white or blue (CF method, CCM method), a method that realizes multiple light emission by irradiating electromagnetic waves to the light emitting area of the monochromatic light emitting functional layer (photo bleaching method), and low molecular organic materials with different light emitting colors are formed on different films in advance. For example, a laser transfer method in which the image is transferred onto one substrate by thermal transfer using a laser can be used.

Examples of the present invention will be described below.
[Example 1] An ITO film of 110 nm was formed on a glass substrate by a sputtering method. Next, ITO electrodes (lower electrodes) were formed in a stripe pattern by photolithography using photoresist AZ6112 (manufactured by Tokyo Ohka Kogyo Co., Ltd.).

A positive resist material (polyimide, etc.) with high electrical insulation is applied on the substrate on which this ITO electrode (lower electrode) is formed, and the film is formed by spin coating, and then the substrate is heated at 100 ° C. for 80 seconds. The solvent is volatilized, and exposure is performed with an exposure apparatus through a photomask under irradiation conditions of 50 mJ / cm ² , followed by development with an alkaline aqueous solution, heat treatment at 300 ° C. in a treatment tank, and patterned insulation. A film was formed.

Then, the substrate was put into a vacuum chamber, and CuPc was 20 nm as a hole injection layer, α-NPD was 50 nm as a hole transport layer, Alq ₃ was 60 nm as a light emitting layer, and LiF was 0 as an electron injection layer by resistance heating vapor deposition. Each film was formed by resistance heating vacuum with a thickness of 0.5 nm.

  Then, a shadow mask for the cathode is applied in vacuum, and the Al electrode (upper electrode) is heated by resistance heating to a thickness of 100 nm at a rate of 1 nm per second so as to be orthogonal to the stripe pattern of the ITO electrode (lower electrode). A film was formed.

A resin layer pattern was affixed on the self-luminous element portion thus formed on the substrate. As the resin layer 4, an epoxy resin film having low moisture permeability is used and pasted in a vacuum atmosphere of 10 ⁻² Pa or less using the above-described pasting apparatus so that no bubbles are mixed with the substrate. It was.

  Then, a two-component curable epoxy resin was used as an adhesive and dropped so as to cover the resin layer, and then a sealing member made of a glass plate was attached to the substrate via the adhesive layer. After pasting the sealing member and the substrate, the resin layer and the adhesive layer were completely cured by moving to a heating oven and applying heat. Thereafter, the completed self-luminous panel was taken out and it was confirmed whether or not the resin layer was peeled off from the substrate or the sealing member. In particular, such a portion was not found.

[Comparative Example 1]
When Example 1 was performed in the same manner as Example 1 except that the sealing member was bonded to the substrate without using the adhesive layer, there was a portion where the resin layer floated from the substrate or the sealing member. .

  According to the self light emitting panel and the manufacturing method thereof according to the embodiment of the present invention, the self light emitting element portion is formed on the substrate, and the sealing member is attached via the resin layer covering the self light emitting element portion. In the self-luminous panel, it is possible to prevent the sealing member from being peeled off or lifted after the pasting process. Moreover, a self-luminous panel with high sealing performance can be obtained thereby. Moreover, the manufacturing method of the self-light-emitting panel which does not require the process of heating and pressurizing a sealing member can be provided.

It is explanatory drawing of a prior art. It is explanatory drawing explaining the manufacturing method of the self-light-emitting panel which concerns on embodiment of this invention. It is explanatory drawing (process flow) explaining the manufacturing method of the self-light emission panel (organic EL panel) which concerns on embodiment of this invention. It is explanatory drawing explaining the self-light emission panel (organic EL panel) which concerns on embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Self-light-emitting panel 2,2L board | substrate 3 Self-light-emitting element part 4 Resin layer 5 Adhesive layer 5A Adhesive 50 Dripping apparatus 6,6L Sealing member

Claims (9)

A method for manufacturing a self-luminous panel, wherein a self-luminous element is formed on a substrate, and a sealing member is attached to the substrate via a resin layer covering the self-luminous element.
A method for producing a self-luminous panel, wherein a liquid adhesive layer is formed between the substrate or the sealing member and the resin layer. Forming a self-luminous element on the substrate;
Forming a resin layer on the substrate so as to cover the self-luminous element portion;
Forming a liquid adhesive layer on the resin layer;
And a step of affixing a sealing member on the resin layer through the adhesive layer. Forming a self-luminous element on the substrate;
Forming a resin layer on the substrate so as to cover the self-luminous element portion;
Forming a liquid adhesive layer on the sealing member;
And a step of affixing a sealing member on the resin layer through the adhesive layer. Forming a self-luminous element on the substrate;
Forming a resin layer on the sealing member;
Forming a liquid adhesive layer on the substrate;
And a step of attaching a sealing member on the self-light-emitting element portion through the adhesive layer. Forming a self-luminous element on the substrate;
Forming a resin layer on the sealing member;
Forming a liquid adhesive layer on the resin layer;
And a step of attaching a sealing member on the self-light-emitting element portion through the adhesive layer. A plurality of self-luminous element parts are arranged on the substrate,
The method for manufacturing a self-luminous panel according to claim 1, wherein the resin layer is patterned in accordance with an arrangement of the plurality of self-luminous element portions.   The said adhesive bond layer is formed by apply | coating an adhesive agent to a to-be-formed surface, The manufacturing method of the self-light-emitting panel described in any one of Claims 1-6 characterized by the above-mentioned.   The method for manufacturing a self-luminous panel according to claim 1, wherein the resin layer is formed by attaching a film material to the substrate or the sealing member. A self-luminous panel that forms a self-luminous element part on a substrate and attaches a sealing member to the substrate via a resin layer covering the self-luminous element part,
The self-luminous panel, wherein the resin layer is made of a film material, and an adhesive layer that bonds the resin layer and the sealing member is formed as a hardened layer of a liquid adhesive.

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