JP2007273400A - Method of manufacturing optical device, and optical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To seal a self-luminous part formed on a panel substrate, with high accuracy by a simple process, to prevent a connection failure and a display failure caused by formation of an adhesive layer on lead-out wiring and to carry out high accuracy sealing at a time to a plurality of self-luminous parts formed on the panel substrate in the case of performing multi-piece production, thereby shortening a manufacturing time and reducing a quality failure in a dividing process or an unnecessary part removing process. <P>SOLUTION: This method of manufacturing an optical device comprises a self-luminous part forming process for forming the plurality of self-luminous parts 101 on the panel substrate 2; a hardening process for carrying out hardening processing to a part of an adhesive layer 82 formed in sheet shape beforehand or the adhesive layer 82 formed in a film on a sealing substrate 81; a sealing process for sealing the self-luminous parts 101 with the panel substrate 2 and the sealing substrate 81 after the hardening process; and a dividing process for dividing the panel substrate 2 into a plurality of parts after the sealing process to form the optical device. The self-luminous parts 101 formed on the panel substrate 2 can thereby be sealed with accuracy by the simple process. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an optical device manufacturing method and an optical device.

  Optical devices are, for example, cell phones, in-vehicle monitors, home appliance monitors, information display devices that perform dot matrix display such as personal computer display devices and television receivers, and fixed displays such as clocks and advertising panels. It is used in various devices such as light sources for devices, scanners and printers, lighting devices such as lighting and liquid crystal backlights, and optical communication devices using photoelectric conversion functions. This optical device is generally formed by a plurality of pixels, and displays desired information by performing display driving or non-display driving for each pixel. A pixel that employs a self-luminous element is known as a pixel forming the optical device. The self-light-emitting element has the advantage of low power and no need for a backlight. A light panel in which a plurality of self-light-emitting elements are arranged in a dot matrix form, a display part in which an icon part (fixed display part) is formed, It is also used for optical devices such as flat and spherical lighting fixtures, and various types of optical devices are known, from small to large screens.

  As typical self-luminous elements, inorganic EL elements, organic EL (electroluminescence) elements, FED (Field Emission Display) elements, light emitting diodes, and the like are known. The organic EL element is also called, for example, an organic EL (OEL) device, an organic light emitting diode (OLED) device, a self-light emitting element, or an electroluminescent light source. In general, an organic EL element has a structure in which an organic layer (light emitting layer) is sandwiched between an anode (corresponding to an anode and a hole injection electrode) and a cathode (corresponding to a cathode and an electron injection layer). In general, the organic layer has a structure in which a plurality of functional layers are stacked, for example, a structure in which a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, an electron injection layer, and the like are sequentially stacked. Have. Each layer is composed of a single layer made of a single organic material, a mixed layer in which a plurality of materials are mixed, a functional material of an organic material or an inorganic material in a polymer binder (charge transport function, light emitting function, charge blocking function, A layer in which an optical function or the like is dispersed can be employed. Also known are layers that have a buffer function so that the organic layer is not damaged when the upper electrode is formed on each layer by sputtering, and organic EL elements that have a flattening function to prevent unevenness due to the film formation process. It has been.

  In the organic EL device having the above configuration, by applying a voltage to both electrodes, holes injected and transported from the anode into the organic layer and electrons injected and transported from the cathode into the organic layer are within the organic layer. The electronic state of the organic molecules in the organic layer changes from the ground state to the excited state, and light is emitted when the excited state changes to the ground state.

  By the way, it is known that the characteristics of the organic EL panel deteriorate when the organic layer is exposed to the outside air. This is because, for example, moisture enters the interface between the organic layer and the electrode to prevent the injection of carriers such as electrons and holes, thereby generating a non-light emitting region (dark spot) and corrosion of the electrode. For this reason, in order to improve the stability and durability of the organic EL element, a sealing technique for shielding the organic EL element from the outside air is indispensable. With respect to this sealing technique, a method of sealing by sealingly placing a sealing can on a substrate on which an electrode and an organic layer are formed, and an adhesive made of a resin material for a sealing member that covers the electrode and the organic layer So-called solid sealing is known (see Patent Document 1, for example). With this solid sealing, it is easy to make the self-luminous panel thin.

  In general, in order to improve the production efficiency by mass-producing organic EL panels, multi-cavity (multi-cavity) is performed in the manufacturing process. Multi-chamfering refers to the formation of a plurality of self-luminous parts (including a display surface in which a plurality of pixels are formed in a matrix) on a single large panel substrate, and then separating the panel substrate into a plurality of self-luminous components. It is to make a panel.

  As a sealing method at the time of multi-sided cutting, for example, a sealing substrate having approximately the same size as the self-luminous portion formed on the substrate, and an adhesive layer formed by cutting a sheet-like resin film with a cutter or the like Is prepared, an adhesive layer is disposed for each self-luminous portion, and a sealing substrate is individually bonded thereon.

JP 2002-216950 A (FIG. 1)

  However, when solid sealing is performed by arranging an adhesive layer and a sealing substrate on a plurality of self-luminous portions formed on the panel substrate, it is necessary to perform alignment with relatively high accuracy. For example, when the alignment accuracy is relatively low, the adhesive layer adheres to the lead wiring, and there is a possibility that an electrical connection failure may occur when a flexible substrate (wiring substrate) or a driving IC chip is mounted. Further, the display panel may cause a display failure due to this electrical connection failure. Further, in the above method, it takes a relatively long time to arrange the plurality of adhesive layers on the self-light-emitting portion.

  This invention makes it an example of a subject to cope with such a problem. In other words, the self-luminous part formed on the panel substrate is sealed with high accuracy by a simple process, the connection failure and the display failure due to the formation of the adhesive layer on the lead wiring, When performing, sealing a plurality of self-light-emitting portions formed on the panel substrate with high accuracy at a time to shorten the manufacturing time, and reducing quality defects in the dividing step or the unnecessary portion removing step. These are the objects of the present invention.

  In order to achieve such an object, the present invention comprises at least the configurations according to the following independent claims.

  The invention according to claim 1 is a method for manufacturing an optical device in which at least one self-light-emitting portion formed on a panel substrate is sealed, and the light-emitting device forms at least one self-light-emitting portion on the panel substrate. A part forming step, a curing step in which a part of the adhesive layer formed in advance in the form of a sheet or an adhesive layer formed on the sealing substrate is cured, and the panel substrate and the sealing substrate after the curing step. And a sealing step for sealing the light emitting portion.

  According to a fourth aspect of the present invention, there is provided a method of manufacturing an optical device in which at least one self-luminous part formed on a panel substrate is sealed, wherein the self-luminous part forms at least one self-luminous part on the panel substrate. Part forming step, a release sheet is disposed on one surface side of the adhesive layer, a curing step in which a cured part and a non-cured part are formed on the photo-curing or thermosetting adhesive layer, and the other of the adhesive layer Forming a sealing member in which the cured portion is peeled from the sealing substrate together with the release sheet to remove the cured portion and the adhesive layer is formed on the sealing substrate with the surface side attached to the sealing substrate. And a sealing step of sealing the self-luminous portion with the sealing substrate through the non-cured portion excluding the cured portion of the adhesive layer.

  The invention according to claim 5 is a method of manufacturing an optical device in which at least one self-light-emitting portion formed on the panel substrate is sealed, and the light-emitting device forms at least one self-light-emitting portion on the panel substrate. A non-cured portion and a photocuring or thermosetting adhesive layer in which a release sheet is disposed on one surface side of the adhesive layer and a sealing substrate is placed on the other surface side; A curing step of forming a cured portion on a part of the sealing substrate side, and removing the non-cured portion by peeling the non-cured portion other than the cured region together with the release sheet from the sealing substrate; A sealing member forming step of forming an adhesive layer on the sealing substrate; and a sealing step of sealing the self-light-emitting portion with the sealing substrate via the adhesive layer.

  The invention according to claim 6 is a method of manufacturing an optical device in which at least one self-light-emitting portion formed on the panel substrate is sealed, and the light-emitting device forms at least one self-light-emitting portion on the panel substrate. In the state where the release sheet is disposed on one surface side of the part forming step and the photocurable or thermosetting adhesive layer, and the other surface side of the adhesive layer is attached to the sealing substrate, The sealing substrate through the non-cured portion of the adhesive layer formed on the sealing substrate in a state in which the cured portion and the non-cured portion are formed in a predetermined shape, and a curing step for forming the cured portion and the non-cured portion A sealing step for sealing the self-light-emitting portion, and a dividing step for dividing the panel substrate into a plurality of parts after the sealing step or removing unnecessary portions, and removing the cured portion of the adhesive layer to form an optical device. And a removing step.

  A thirteenth aspect of the present invention is an optical device in which a self-luminous portion formed on a panel substrate is sealed with a sealing substrate via an adhesive layer, and is a sheet-like photocurable or thermosetting type The adhesive layer is cured to form the adhesive layer having a cured portion and a non-cured portion having a predetermined shape on the sealing substrate, the cured portion is removed, and the sealing substrate is bonded. The self-luminous portion is formed by being pasted on the self-luminous portion via the non-cured portion of the layer.

  The invention according to claim 14 is an optical device comprising a self-light-emitting portion including one or a plurality of self-light-emitting elements on a substrate, wherein the self-light-emitting portion is sealed with a sealing substrate. The self-light-emitting element formed on the barrier rib is formed around the self-luminous element, and the adhesive layer is formed between the barrier ribs.

  An optical device manufacturing method according to an embodiment of the present invention is an optical device manufacturing method in which at least one or a plurality of self-light-emitting portions formed on a panel substrate is sealed, and at least one on the panel substrate. Or a self-light-emitting portion forming step for forming a plurality of self-light-emitting portions, a curing step for subjecting a part of the adhesive layer formed in advance to a sheet shape or an adhesive layer formed on the sealing substrate, and a panel after the curing step It has the sealing process which seals a self-light-emitting part with a board | substrate and a sealing substrate, It is characterized by the above-mentioned. Preferably, the method includes a dividing step of dividing the panel substrate into a plurality of parts and forming an optical device after the sealing step.

  Also preferably, in the curing step, the sheet-like photo-curing type or thermo-curing type adhesive layer is subjected to a curing treatment to form an adhesive layer including a cured part and a non-cured part having a predetermined shape on the sealing substrate. To do. Also preferably, in the sealing step, the self-luminous portion is sealed with the sealing substrate through the non-cured portion excluding the cured portion of the adhesive layer.

  According to the method for manufacturing an optical device, after performing a curing process in which a part of the adhesive layer formed in advance in a sheet shape or the adhesive layer formed on the sealing substrate is subjected to a curing process, the panel substrate, the sealing substrate, Since the sealing process for sealing the self-light-emitting portion is performed, the self-light-emitting portion formed on the panel substrate can be sealed with high accuracy by a simple process.

  At this time, an adhesive layer is patterned on the sealing substrate in a predetermined shape so that the adhesive layer does not adhere to the lead-out wiring formed on the panel substrate, and sealed by the sealing substrate on which the adhesive layer of the predetermined shape is formed. By stopping, sealing can be performed with high accuracy without attaching an adhesive layer to the lead wiring formed on the panel substrate. Further, connection failure and display failure due to the formation of the adhesive layer on the lead-out wiring can be prevented.

  Moreover, when performing multi-chamfering, it is possible to perform high-precision sealing at once with respect to a plurality of self-light-emitting portions formed on the panel substrate. For this reason, compared with the case where the several self-light-emitting part is individually solid-sealed in order, for example, in the manufacturing method of the optical device which concerns on this invention, manufacturing time can be shortened.

  More specifically, the adhesive layer can be easily formed into a predetermined shape by applying a predetermined curing process such as heating or light irradiation using, for example, a thermosetting or photocurable adhesive layer.

  An optical device according to an embodiment of the present invention is an optical device including a self-light-emitting unit including one or a plurality of self-light-emitting elements on a substrate and sealing the self-light-emitting unit with a sealing substrate. The barrier ribs are formed around the self-luminous elements formed on the substrate, the barrier ribs function as a support member for the sealing substrate, and the adhesive layer is formed between the barrier ribs.

  In the optical device having the above configuration, the partition wall functions as a support member for the sealing substrate. Therefore, the sealing substrate can be supported with high strength. For example, a thin and high-strength optical device can be manufactured. Further, by forming an adhesive layer between the partition walls, a higher-strength optical device can be manufactured.

  Hereinafter, an optical device manufacturing method and an optical device according to an embodiment of the present invention will be described with reference to the drawings.

[First Embodiment]
In the method of manufacturing an optical device according to the first embodiment of the present invention, first, a plurality of self-luminous portions are formed on a large panel substrate. In accordance with this, a plurality of sheet-like thermosetting or photo-curing adhesive members are patterned to form an adhesive layer having a predetermined shape of a hardened portion and a non-hardened portion on the sealing substrate. The non-cured portion of the adhesive layer is formed in a shape corresponding to the self-light emitting portion formed on the panel substrate. That is, a plurality of adhesive layers formed in a predetermined shape are formed on the sealing substrate at positions corresponding to the formation positions of the self-light-emitting portions formed on the panel substrate while maintaining the positional relationship. Yes. By aligning the large sealing substrate and the panel substrate and attaching them through an adhesive layer, sealing is performed with high accuracy at a time. By the said manufacturing method, it can seal with high precision. Further, it can be easily sealed with high accuracy.

  Moreover, on the sealing substrate, since these adhesive layers are arranged in a state in which the relative positional relationship of the plurality of adhesive layers is maintained, compared to the case where each adhesive layer is individually aligned, Positioning can be easily performed with high accuracy at a time.

  FIG. 1 is a diagram for explaining an optical device according to the first embodiment of the present invention. Fig.1 (a) is a front view from the element formation surface side of an optical device. FIG. 1B is a cross-sectional view of the optical device shown in FIG. FIG. 2A is a diagram for explaining the optical device shown in FIG. 1A in detail. FIG. 2B is a cross-sectional view for explaining in detail the optical device shown in FIG.

  The optical device 1 according to the first embodiment of the present invention can perform various types of information display when the self-luminous element emits light and does not emit light. The optical device 1 can be applied to, for example, an information display device, illumination, and the like. The optical device 1 has one pixel or a plurality of pixels. In the present embodiment, a plurality of pixels are formed in a lattice shape. As the self-emitting element, for example, an organic EL (electroluminescence) element, an inorganic EL element, an FED (Field Emission Display), a light emitting diode, or the like can be adopted, and an organic EL is adopted as the self-emitting element according to the present invention. . Hereinafter, the components of the optical device 1 will be described in detail.

  The optical device 1 according to the present invention includes a panel substrate (substrate) 2, a self-luminous element 100, and a flexible substrate (wiring substrate) 90. On the substrate 2, a self-luminous element 100 and a lead wiring 7 are formed. For example, one or a plurality of self light emitting elements 100 are formed in a matrix in the self light emitting portion 101. The sealing member 80 includes a sealing substrate 81 and an adhesive layer 82. Here, the “panel substrate 2” is used in a production method in which a plurality of optical devices are formed on one substrate (also referred to as a mother substrate or mother glass) and then divided to manufacture a plurality of optical devices. Define things. Alternatively, a production method may be employed in which one self-light-emitting portion 101 is formed on the panel substrate 2 and a removal step of removing unnecessary portions after the sealing step is performed.

For example, in a bottom emission type optical device, the substrate 2 is preferably formed of a light-transmitting material so that the light emitted from the self-light-emitting element 100 is transmitted through the substrate. The substrate 2 has a function of blocking moisture and oxygen, which are one of the deterioration factors of the organic EL element. As a material of the substrate 2, it is preferable to employ, for example, plastic, an inorganic material, particularly glass. The substrate 2 may be a flexible substrate in which a sealing film is coated on the transparent polymer with various materials such as SiO ₂ .

  In the organic EL element as the self-luminous element 100, a film formation layer is formed between the hole injection electrode and the electron injection electrode, and holes from the hole injection electrode and electrons from the electron injection electrode are formed into the film formation layer. , And then emits light upon energy transition to the ground state after the electronic state is excited by recombination of electrons and holes. As shown in FIGS. 2A and 2B, the self-light emitting device 100 according to the present embodiment includes, for example, a first electrode (lower electrode) 3, an insulating film 4, a film formation layer 5, and a second electrode (upper part). Electrode) 6.

  The lower electrode 3 is formed on the substrate 2. The lower electrode 3 is formed, for example, by forming a film on the substrate 2 and patterning it into a predetermined shape. When the passive matrix optical device is employed, the lower electrode 3 is formed by patterning a plurality of line-shaped electrodes as shown in FIG. When an active matrix optical device is employed, a lower electrode 3 is formed for each pixel on a so-called active substrate on which a transistor (TFT: Thin Film Transistor) and an interlayer insulating layer are formed. When the bottom emission type optical device is adopted, the lower electrode 3 emits light from the substrate 2 side, and is therefore formed of a transparent material. As a material for forming the lower electrode 3, for example, ITO (Indium Tin Oxide) is used, and various other conductive materials such as IZO (Indium Zinc Oxide), metal electrodes, and conductive oxides can be used.

  For example, when the optical device forms an organic EL element in the form of a dot matrix for the purpose of displaying information, the insulating film 4 partitions the pixels 10. For example, the insulating film 4 is formed in a shape that opens a part of the upper portion of the previously patterned lower electrode 3 and covers from the periphery of the opening 11 to the adjacent opening 11. Examples of the material for forming the insulating film 4 include various materials such as polyimide, epoxy, and light receiving resin. Further, if necessary, an inverted trapezoidal partition wall 41 is formed on the insulating film 4 along the direction orthogonal to the lower electrode 3 so that the stripe-shaped film formation layer 5 or the upper electrode 6 can be formed without using a mask pattern. Can be formed.

  The film formation layer 5 is formed on the lower electrode 3, and various functional layers such as a hole injection layer, a hole transport layer, an organic EL light emitting layer, an electron transport layer, and an electron injection layer are formed into a thin film. Is formed. The film formation process of the film formation layer 5 may be, for example, vapor deposition of a low molecular organic material, or thin film formation of a polymer organic material by various film formation methods such as printing, chemical vapor deposition, and laser transfer. . Each layer of the film formation layer 5 may be formed of a single organic material, a mixture of a plurality of materials (mixed layer), a functional material of an organic material or an inorganic material (for example, a charge) in a polymer binder A material having a transport function, a light emitting function, a charge blocking function, an optical function, and the like may be dispersed.

  The second electrode 6 is formed on the film formation layer 5. For example, when a passive organic EL element is employed, the second electrode 6 is formed by patterning a plurality of stripe electrodes along a direction orthogonal to the lower electrode 3. When the active drive type organic EL element is employed, the second electrode 6 is formed in common on a plurality of pixel portions, for example. When the lower electrode 3 is a hole injection electrode, the second electrode 6 employs a material having an electron injection function. As the material having an electronic function, for example, aluminum, a magnesium silver (MgAg) alloy, or the like can be used. For example, when aluminum is used as the material for forming the second electrode 6, a layer or region containing an alkali metal compound such as lithium (Li) is formed between the film formation layer 5 and the second electrode 6. Is preferred.

  The lead wiring 7 is a wiring for inputting, for example, a control signal for controlling light emission and non-light emission of the organic EL element from an external circuit such as a drive circuit or a control circuit, and is made of a conductive material. The lead wiring 7 includes, for example, a first electrode lead wiring 3 a electrically connected to the lower electrode 3 and a second electrode lead wiring 76 electrically connected to the second electrode 6. The lead wiring 7 may be laminated on the first lower electrode 3 or the second electrode 6. The lead wiring 7 may be formed of the same material as the first lower electrode 3 and the second electrode 6, for example, or may be formed of a metal material having a lower resistance than these. Specifically, examples of the material for forming the lead wiring 7 include low resistance metals such as silver, aluminum, and chromium, and any two or more alloys thereof. As shown in FIGS. 1A and 1B, the lead-out wiring 7 has a conductive material such as an anisotropic conductive film (ACF) or a nonconductive material such as NCF, for example, as shown in FIGS. A flexible substrate (wiring substrate) 90 is crimped and connected. An external circuit such as a drive circuit is connected to the wiring board 90. Further, the connection between the optical device 1 and the external circuit is not limited to the above embodiment. For example, various mounting techniques such as COG (Chip on glass) in which the drive circuit is formed on the substrate 2 and COF (Chip on film) in which the drive circuit is formed on the flexible substrate may be employed for mounting the external circuit. Good.

  The sealing substrate 81 seals the self-light emitting unit 101 via the adhesive layer 82. The sealing substrate 81 is made of a material for sealing the self-light-emitting portion 101, such as a low moisture-permeable material that can block outside air, and is made of ceramic such as glass, or metal material such as aluminum or stainless steel (SUS: Stainless Used Steel). In addition, various materials such as plastic can be employed. In addition, the sealing substrate 81 may be formed in substantially the same shape as the self-light-emitting portion 101, and may be specifically formed in a substantially rectangular shape, but is not limited thereto. Further, when the self-luminous panel is manufactured, the sealing substrate 81 is sealed by bonding the sealing substrate through an adhesive layer, and then the connecting portion and the panel manufacturing substrate are separated by cutting or the like as necessary. Although a self-luminous panel is obtained, it is preferable that the sealing substrate is formed in a substantially rectangular shape because there is an unnecessary part in the sealing substrate in the operation of separating the panel so that it is necessary to separate it from the panel manufacturing substrate. .

  The adhesive layer 82 is formed between the self light emitting unit 101 and the sealing substrate 81. The adhesive layer 82 includes, for example, a thermosetting adhesive layer that is cured by heating or heat ray irradiation, a photocurable adhesive layer that is cured by irradiation with light (electromagnetic waves) such as ultraviolet rays or visible light, and the like. As a material for forming the thermosetting adhesive layer, for example, various adhesive materials such as an epoxy resin can be employed. In addition, as a material for forming the ultraviolet (UV) curable adhesive layer, various materials such as an acrylic resin can be employed. The adhesive layer 82 undergoes irreversible phase transition from an adhesive state (non-cured state) to a cured state or a solidified state when subjected to the curing treatment by heating or light irradiation.

  The adhesive layer 82 according to the present embodiment is formed in a sheet shape, and can be patterned into a cured portion 821 that has undergone a phase transition to a cured state by light irradiation or heating, and a non-cured portion 822 having other adhesive properties. It is.

  In the adhesive layer 82, the cured portion 821 formed by heating, light irradiation, or the like has a high adhesive force with respect to what is in contact before curing, and has an adhesive force with respect to what is in contact after curing. descend.

[Optical device manufacturing method]
FIG. 3 is a flowchart for explaining the manufacturing method of the optical device according to the first embodiment of the present invention.

  In the present embodiment, a plurality of optical devices are manufactured by so-called multiple chamfering. In detail, as shown in FIG. 3, the manufacturing method of the optical device includes a self-luminous portion forming step (S1), a sealing member forming step (S2), a sealing step (S3), and a dividing / removing step (S4). Have Hereafter, each process is demonstrated in detail, referring drawings.

[Self-light emitting part forming step (S1)]
FIG. 4A is a diagram for explaining a large panel substrate on which a plurality of self-light-emitting portions are formed. FIG. 4B is a cross-sectional view of the panel substrate and the self-light emitting unit shown in FIG. As shown in FIGS. 4A and 4B, a plurality of self-light-emitting portions 101 and lead-out wirings 7 are formed on the panel substrate 2 in a matrix. A specific example of the method for manufacturing the self-luminous portion 101 and the lead-out wiring 7 will be briefly described.

  As shown in FIGS. 2A and 2B, a transparent electrode forming material such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide) is first sputtered on a panel substrate 2 such as glass. The lower electrode 3 (3a) is formed in a striped pattern by various film forming methods such as the above. An opening 11 partitioned by the insulating film 4 is formed on the lower electrode 3, and the opening 11 functions as one pixel. A partition wall 41 may be formed on the insulating film 4. The partition wall 41 is preferably formed in, for example, a reverse taper shape or a shape having an overhang portion. By forming the partition wall 41, the film formation layer 5 and the upper electrode 6 can be patterned without using a film formation mask. Next, a film formation layer 5 is formed in the opening 11 on the lower electrode 3 by depositing an organic material by various manufacturing methods such as resistance heating vapor deposition. As a specific example of the film forming method, a five-layer structure in which a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are sequentially stacked may be formed. Next, the upper electrode 6 (6a) is formed and patterned on the film forming layer 5 along the direction orthogonal to the lower electrode 3. An end portion 76 of the upper electrode 6 and an end portion 3 a of the lower electrode 3 correspond to the lead wiring 7. By the above manufacturing method, the self-light-emitting portion 101 in which the plurality of self-light-emitting elements 100 are formed in a matrix on the substrate 2 can be manufactured.

[Sealing member forming step (S2)]
FIG. 5 is a perspective view for explaining an optical device manufacturing method according to the first embodiment of the present invention. Next, in order to seal the plurality of self-light emitting portions 101 formed on one surface side of the substrate 2, an adhesive layer 82 is formed on a large sealing substrate 81 as shown in FIG. At this time, an adhesive layer 82 having a predetermined shape is formed on the sealing substrate 81 at a position corresponding to the position and shape of the self-light-emitting portion 101 formed on the substrate 2. Further, when the self-light-emitting portion 101 is sealed with the sealing substrate 81 via the adhesive layer 82, it is preferable that the adhesive layer 82 is not attached onto the lead-out wiring 7. The sealing formation step according to the present embodiment includes an adhesive layer patterning step (S21), an adhesive layer curing step (S22), a step of attaching the sealing substrate and the adhesive layer (S23), and a removing step (S24). Hereinafter, each process will be described in detail.

[Adhesive layer patterning step (S21)]
FIG. 6 is a view for explaining a sealing member forming step of the method for manufacturing an optical device according to the first embodiment of the present invention. FIG. 6A is a diagram for explaining an adhesive layer in which a release sheet is attached to one surface side, and FIG. 6B is a diagram for explaining a process of performing a curing process on the adhesive layer. is there. First, as shown in FIG. 6A, a sheet-like adhesive layer 82 is placed (placed) on a placing table (base) 201 via a release sheet (separator) 83. For example, when a sheet-like adhesive member in which a sheet-like release sheet 83 is formed on both sides is prepared, one of the release sheets 83 is peeled off, and as shown in FIG. Each is disposed so that the release sheet 83 is positioned between the two. The adhesive layer 82 according to this embodiment is made of a thermosetting adhesive.

[Adhesive layer curing step (S22)]
Next, a part of the sheet-like adhesive layer 82 is cured to form a cured part 821 and a non-cured part 822 having a predetermined shape in the adhesive layer 82. Specifically, the hardened part 821 and the non-hardened part 822 are formed in a predetermined shape according to the self-light emitting part 101 to be sealed formed on the panel substrate 2. Specifically, as shown in FIG. 6B, the adhesive layer 82 is irradiated from the surface opposite to the surface on which the release sheet 83 of the adhesive layer 82 is attached by heat ray irradiation by a light irradiation device 84 such as a laser device. The predetermined region is heated to cure or solidify the thermosetting adhesive. The cured portion 821 formed by this heat ray irradiation has a lower adhesive strength than the non-cured portion 822. Further, the adhesive force of the non-cured portion 822 is not changed because the heat ray is not irradiated.

[Step of Affixing Sealing Substrate and Adhesive Layer (S23)]
6C and 6D are views for explaining a process of attaching the sealing substrate and the adhesive layer. Next, as shown in FIGS. 6C and 6D, the sealing substrate 81 is attached to the adhesive layer 82. At this time, in order to perform alignment with high accuracy, an alignment mark (AL) is previously formed on any or all of the adhesive layer 82, the release sheet 83, the base 201, and the sealing substrate 81, Based on the alignment mark (AL), the adhesive layer 82 and the sealing substrate 81 are aligned, and the adhesive layer 82 and the sealing substrate 81 are attached as shown in FIG.

[Removal step (S24)]
FIG. 6E is a view for explaining a removal process of the hardened portion 821 of the adhesive layer 82. Next, as shown in FIG. 6 (e), the release sheet 83 is peeled from the sealing substrate 81 to remove the hardened portion 821, which is an unnecessary part of the adhesive layer 82, and adhere to the sealing substrate 81 in a predetermined shape. The uncured portion 822 of the layer 82 is formed. Specifically, as shown in FIG. 6 (e), the non-cured portion 822 having a relatively strong adhesive force in the adhesive layer 82 is disposed on the sealing substrate 81, and the cured portion 821 is combined with the release sheet 83. Removed.

  At this time, the adhesive force of the cured portion 821 of the adhesive layer 82 to the sealing substrate 81 attached after the curing process of the adhesive layer 82 is smaller than the adhesive force of the non-cured portion 822 of the adhesive layer 82 to the sealing substrate 81. . Further, the adhesive force of the non-cured portion 822 of the adhesive layer 82 to the release sheet 83 is smaller than the adhesive force of the non-cured portion 822 of the adhesive layer 82 to the sealing substrate 81.

  That is, since the sealing substrate 81 is contacted after the resin of the adhesive layer 82 is cured, the cured portion 821 (the portion to be removed) can be removed with a decrease in the adhesive force with the sealing substrate 81.

[Lamination process (sealing process) (S3)]
FIG. 6F is a diagram for explaining the sealing process. Next, as shown in FIG. 5 and FIG. 6 (f), a sealing substrate 81 is attached to the panel substrate 2 having the self-light-emitting portion 101 and the lead-out wiring 7 formed on one surface via an adhesive layer 82. . Specifically, the sealing substrate 81 is attached to the self-light-emitting portion 101 via the non-cured portion 822 of the adhesive layer 82 to perform sealing. At this time, an alignment mark (AL) is formed in advance on the panel substrate 2 and the sealing substrate 81, the substrate 2 and the sealing substrate 81 are positioned based on the alignment mark (AL), and the two are bonded together. Is preferred. At this time, the adhesive layer 82 does not adhere to the lead wiring 7.

  FIG. 6G is a diagram for explaining the curing process. As shown in FIG. 6G, the adhesive layer 82 is cured by subjecting the adhesive layer 82 (non-cured portion 822) to a predetermined curing process such as a heat treatment. The self-luminous part 101 is sealed by the sealing substrate 81 through the adhesive layer 82 by the above process.

[Division / Removal Step (S4)]
FIGS. 7A and 7B are diagrams for explaining the dividing / removing step of the optical device manufacturing method according to the present invention. Next, as shown in FIGS. 7A and 7B, the self-light-emitting portion 101 formed on the substrate 2 is sealed with the adhesive layer 82 cured by the sealing substrate 81 being sealed. The stop substrate 81 and the substrate 2 are cut and divided for each optical device 1 (self-luminous panel) by a cutting device such as a cutter. At this time, the sealing substrate 81 is cut into the same shape as the non-cured portion 822 of the adhesive layer 82, and the unnecessary portion 81A is removed to produce the optical device 1 as shown in FIGS. The method for manufacturing an optical device according to this embodiment is also applied to a substrate in which one self-light emitting unit 101 is formed on the substrate 2. In this case, the optical device 1 is manufactured by a removing step of removing the unnecessary portion 81A without performing the dividing step after the sealing step S3.

  Next, as shown in FIGS. 7C, 1A, and 1B, after the sealing process, for example, an anisotropic conductive film (ACF) or the like is formed on the lead-out wiring 7 formed on the substrate 2. An external circuit such as a flexible substrate (wiring substrate) 90 or a driving IC chip is crimped and electrically connected through a conductive material. In the method for manufacturing an optical device according to the present invention, since the sealing is performed with high precision by the adhesive layer 82 patterned with high precision, the adhesion of the adhesive layer on the lead wiring 7 is reduced, and the wiring to the lead wiring 7 is reduced. External circuits such as the substrate 90 and the driving IC chip can be reliably mounted and electrically connected.

  By performing the method for manufacturing an optical device, it is possible to reduce quality defects during the dividing step.

  In the method for manufacturing the optical device 1 according to the above-described embodiment, the self-light-emitting portion forming step S1, the sealing member forming step S2, the sealing step S3, and the dividing / removing step S4 are sequentially performed. Is not limited to the form described above. For example, the self-luminous part forming step S1 may be performed after the sealing member forming step S2, or may be performed simultaneously.

  As described above, in the method for manufacturing an optical device according to the present embodiment, the sheet-like photo-curing type or thermo-curing type adhesive layer 82 is cured, so that the cured part 821 and the non-cured part 822 having a predetermined shape are formed. The sealing member forming step (S2) for forming the adhesive layer 82 on the sealing substrate 81, the cured portion 821 is removed, and the sealing substrate 81 is passed through the non-cured portion 822 of the adhesive layer 82. And a sealing step (S3) for sealing the self-light-emitting portion 101, which is attached to the self-light-emitting portion 101, so that the self-light-emitting portion 101 formed on the panel substrate 2 is sealed with high accuracy by a simple process. Can be stopped. In addition, when performing multi-chamfering, the adhesive layer 82 is patterned on the sealing substrate 81 with high accuracy, and the plurality of self-light-emitting portions 101 formed on the panel substrate 2 are sealed with high accuracy at a time. It can be carried out. In addition, the manufacturing time can be shortened in the optical device manufacturing method according to the present invention as compared with the conventional manufacturing method in which the individual light-emitting portions 101 are individually sealed. Further, since the sealing can be performed with high accuracy, it is possible to prevent the adhesion layer from adhering to the lead-out wiring 7, and it is possible to prevent connection failure and display failure.

  Further, the adhesive layer 82 having the release sheet 83 disposed on one surface side is cured to form a cured portion 821 and a non-cured portion 822, and the sealing substrate 81 is disposed on the other surface side of the adhesive layer 82. In the attached state, the cured portion 821 is peeled from the sealing substrate 81 together with the release sheet 83 to remove the cured portion 821, so that the adhesive layer 82 can be patterned on the sealing substrate 81 easily and with high accuracy. it can.

[Second Embodiment]
FIG. 8 is a diagram for explaining a method of manufacturing the optical device 1 according to the second embodiment of the present invention. The description of the same configuration, function, operation, etc. as in the first embodiment is omitted. In the method for manufacturing the optical device 1 according to the present embodiment, an ultraviolet (UV) curable adhesive member is employed as the adhesive layer 82. When the adhesive layer 82 is cured, as shown in FIGS. 8A and 8B, a sheet-like adhesive layer 82 is placed on a placing table (base) 201 as a separator (release sheet 83). And a photomask (mask) 87 is disposed on the adhesive layer 82. In the mask 87, for example, an opening 871 and a shielding part 872 having a predetermined shape are formed. The adhesive layer 82 is irradiated with electromagnetic waves such as ultraviolet rays through the mask 87 from the light irradiation device 84A. Specifically, the light transmitted through the opening 871 of the mask 87 is irradiated to the adhesive layer 82, the irradiated portion is cured, and the adhesive force of the cured portion 821 is reduced. The adhesive force of the non-cured portion 822 is not changed because it is shielded from light by the mask 87.

  Further, as shown in FIG. 8G, the adhesive layer 82 is cured by subjecting the adhesive layer 82 (non-cured portion 822) to a predetermined curing process, for example, light irradiation such as ultraviolet (UV) irradiation. The self-luminous portion 101 is sealed by the sealing substrate 81 through the film formation layer 5 by the above process. Thereafter, as in the first embodiment, as shown in FIGS. 7A and 7B, the sealing substrate 81 and the substrate 2 are cut for each optical device (self-luminous panel) by a cutting device such as a cutter. A plurality of the optical devices 1 are manufactured by dividing them. In the present embodiment, the method for manufacturing an optical device is also applied to one in which one self-luminous portion 101 is formed on the substrate 2. In this case, the optical device 1 is manufactured by a removing step of removing unnecessary portions without performing a dividing step after the sealing step.

  In the optical device manufacturing method according to the present embodiment, since the photo-curing type adhesive layer 82 is adopted, the adhesive layer 82 is cured by irradiating the adhesive layer 82 with light through the mask 87 from the light irradiation device 84A. Since the treatment is performed, the adhesive layer 82 can be patterned into a predetermined shape easily with high accuracy.

[Third Embodiment]
FIG. 9 is a view for explaining the method for manufacturing an optical device according to the third embodiment of the present invention. FIG. 9A is a view for explaining an adhesive layer 82 in which a release sheet 83 is attached to one surface side and a sealing substrate 81 is disposed on the other surface side. FIG. 9B is a diagram for explaining a process of performing a curing process on the adhesive layer 82. Descriptions of configurations, functions, operations, and the like similar to those in the first and second embodiments are omitted. In the method for manufacturing the optical device 1 according to the present embodiment, the adhesive layer 82 and the release sheet 83 are disposed in advance on the sealing substrate 81, and in this state, the curing process is performed to pattern the adhesive layer 82 into a predetermined shape.

  Specifically, first, as shown in FIG. 9A, a release sheet 83 is attached to one surface side of the adhesive layer 82, and a sealing substrate 81 is disposed on the other surface side. For example, when a sheet-like adhesive member having a sheet-like release sheet 83 formed on both sides is prepared, one release sheet 83 is peeled off and the other surface side is sealed as shown in FIG. Affixed to the substrate 81.

  Next, the sheet-like adhesive layer 82 is subjected to a curing process to form the cured portion 821 and the non-cured portion 822 having a predetermined shape in the adhesive layer 82. For example, as shown in FIG. 9B, the curing process according to the present embodiment is performed by curing a heat ray or the like from the transparent sealing substrate 81 side to the adhesive layer 82 by a light irradiation device 84 such as a laser device. Process. For example, the cured portion 821a is formed on a part of the adhesive layer 82 on the sealing substrate side. Specifically, only the surface of the adhesive layer 82 facing the sealing substrate 81 is cured. More specifically, the vicinity of the surface of the adhesive layer 82 facing the sealing substrate 81 is cured to form a cured portion 821a. A portion other than the cured portion 821 of the adhesive layer 82 corresponds to the non-cured portion 822.

  Since the adhesive layer 82 is in contact with the sealing substrate 81 before curing, the adhesive force of the cured portion 821a to the sealing substrate 81 is greater than the adhesive force of the non-cured portion 822 to the sealing substrate 81. That is, the adhesive force between the cured portion 821a and the sealing substrate 81 becomes relatively high, and the non-cured portion 822 other than the region where the cured portion 821a is formed can be removed.

  FIG. 9C is a view for explaining a step of removing the non-cured portion of the adhesive layer 82. Next, as shown in FIG. 9C, the release sheet 83 is released from the adhesive layer 82. At this time, together with the release sheet 83, the non-cured portion 822a other than the region where the cured portion 821a is formed is peeled from the sealing substrate 81 to remove the non-cured portion 822a. On the sealing substrate 81, a non-cured portion 822 of the adhesive layer 82 having a predetermined shape is formed.

  Next, as in the first embodiment, as shown in FIGS. 9D to 9G, the self-luminous portion 101 on the panel substrate 2 is sealed with the sealing substrate 81 via the adhesive layer 82. Then, the entire adhesive layer 82 is cured (sealing step S3), and the division / removal step (S4) is performed for each optical device 1 to produce a plurality of optical devices 1. The method for manufacturing an optical device according to this embodiment is also applied to a substrate in which one self-light emitting unit 101 is formed on the substrate 2. In this case, the optical device 1 is manufactured by a removing step of removing the unnecessary portion 81A without performing the dividing step after the sealing step S3.

  As described above, in the optical device 1 according to the present embodiment, the adhesive layer 82 and the release sheet 83 are arranged on the sealing substrate 81 in advance, and a curing process is performed in this state, so that the covering is performed on the sealing substrate 81. Since the adhesive layer 82 having a predetermined shape corresponding to the self-luminous portion 101 to be sealed is formed, the step of attaching the sealing substrate and the adhesive layer (S23) is omitted as compared with the first and second embodiments. can do. For this reason, the manufacturing time of an optical device can be shortened. In addition, since the adhesive layer 82 and the release sheet 83 are disposed on the sealing substrate 81 in advance and subjected to the curing process, the adhesive layer having a predetermined shape is formed on the sealing substrate 81 with higher accuracy than in the first and second embodiments. 82 uncured portions 822 can be formed. For this reason, the self-luminous part 101 can be sealed with high accuracy by the sealing substrate 81 and the adhesive layer 82.

[Fourth Embodiment]
FIG. 10 is a diagram for explaining the manufacturing method of the optical device according to the fourth embodiment of the present invention. Fig.10 (a) is a figure for demonstrating the contact bonding layer by which the peeling sheet was affixed on the one surface side, and the sealing substrate was arrange | positioned on the other surface side. FIG.10 (b) is a figure for demonstrating the process of performing a hardening process to a contact bonding layer. The description of the same configuration, function, operation and the like as in the third embodiment is omitted. In the method of manufacturing an optical device according to the present embodiment, first, as shown in FIGS. 10A and 10B, an adhesive layer 82 and a release sheet 83 are arranged on a sealing substrate 81, and light irradiation such as a laser device is performed. A curing process such as heat ray irradiation is performed on the adhesive layer 82 via the release sheet 83 by the device 84 to form a cured part 821 and a non-cured part 822 having a predetermined shape on the sealing substrate 81.

  FIG. 10C is a diagram for explaining a process of peeling the release sheet 83 from the adhesive layer 82. Next, in this embodiment, as shown in FIG. 10C, only the release sheet 83 is peeled from the adhesive layer 82. In the present embodiment, an adhesive layer 82 including a cured portion 821 and a non-cured portion 822 is formed on the sealing substrate 81.

  FIG. 10D is a diagram for explaining the sealing process. Next, as illustrated in FIG. 10D, a sealing substrate 81 is attached to the panel substrate 2 on which the self-light-emitting portion 101 and the lead-out wiring 7 are formed via an adhesive layer 82. At this time, an alignment mark (AL) is formed in advance on the panel substrate 2, the sealing substrate 81, the adhesive layer 82, etc., and the substrate 2 and the sealing substrate 81 are positioned based on the alignment mark (AL). It is preferable to bond them together. At this time, even when the hardened portion 821 comes into contact with the lead wiring 7, the adhesive force of the hardened portion 821 to the sealing substrate 82 and the lead wiring 7 is relatively low because the hardened portion 821 is hardened. The adhesive material does not adhere to the lead wiring 7.

  FIG. 10E is a diagram for explaining the curing process, FIG. 10F is a diagram for explaining the dividing process, and FIG. 10G is a sectional view of the optical device 1 after the dividing. is there. Next, as shown in FIG. 10E, the adhesive layer 82 is cured by subjecting the adhesive layer 82 to a predetermined curing process, for example, a heat treatment.

  Next, as shown in FIG. 10 (f), the self-luminous portion 101 formed on the substrate 2 is sealed through the adhesive layer 82 cured by the sealing substrate 81, and the sealing substrate 81 and The board | substrate 2 is cut | disconnected and divided | segmented for every optical device 1 (self-light-emitting panel), for example with cutting devices, such as a cutter. At this time, the sealing substrate 81 is cut into the same shape as the non-cured portion 822 of the adhesive layer 82 to remove the unnecessary portion 81A and the non-cured portion 822, as shown in FIGS. 1, 2, and 10 (g). Such an optical device 1 is produced. The optical device manufacturing method of the present embodiment is also applied to a substrate in which one self-luminous portion 101 is formed on the substrate 2. In this case, the optical device 1 is manufactured by a removing step of removing the unnecessary portion 81A without performing the dividing step after the sealing step S3.

  As described above, in the present embodiment, the cured portion 821 and the non-cured portion 822 having a predetermined shape are formed in the adhesive layer 82 on the sealing substrate 81, and the cured portion 821 and the non-cured portion 822 are formed on the sealing substrate 81. In this state, the self-light-emitting portion 101 formed on the substrate 2 is bonded and then divided for each optical device 1 (self-light-emitting panel). Therefore, the release sheet 83 is formed as compared with the third embodiment. The process of peeling and removing the non-cured portion 822 can be omitted, and the manufacturing process is simplified. Further, the manufacturing time can be shortened.

[Fifth Embodiment]
FIG. 11 is a view for explaining the method for manufacturing the optical device according to the fifth embodiment of the invention. FIG. 11A is a view for explaining a cured portion 821 and a non-cured portion 822 of the adhesive layer 82 according to the first specific example, and FIG. 11B is a diagram of the cured adhesive layer 82b according to the second specific example. It is a figure for demonstrating the part 821b and the non-hardened part 822b. The description of the same configurations, functions, effects, and the like as in the first to fourth embodiments is omitted.

  For example, the sheet-like adhesive layer 82 is subjected to a curing process, and as illustrated in FIG. 11A, the sheet-like adhesive layer 82 is individually separated corresponding to the self-luminous portion 101 to be sealed formed on the panel substrate 2. An uncured portion 822 may be formed. Further, as shown in FIG. 11 (b), when the release sheet 83 is peeled off, a shape that is easy to peel off the hardened portion 821b, for example, a portion between a plurality of non-hardened portions corresponding to the self-light emitting portion to be sealed You may form the non-hardened part 822b of the shape connected by.

  Moreover, the shape of the hardening part 821 and the non-hardening part 822 of the contact bonding layer 82 is not restricted to the said form. For example, the hardened portion 821 and the non-hardened portion 822 may be formed in a shape that allows the hardened portion 821 to be peeled favorably in accordance with the physical properties of the adhesive layer such as the strength, elongation, and adhesive strength of the adhesive layer.

  At this time, by forming a peeling region so that unnecessary parts can be easily removed, it is possible to prevent the end surface of the peeled adhesive layer from having, for example, a jagged shape and peeling of the adhesive layer. Become.

  In addition, there is also an advantage that a region to be peeled can be easily and easily formed in order to peel well according to the strength, elongation, and adhesive strength of the adhesive layer.

[Sixth Embodiment]
FIG. 12 is a view for explaining an optical device 1e according to the sixth embodiment of the present invention. FIG. 12A is a diagram for explaining the optical device 1e before sealing, and FIG. 12B is a diagram for explaining the optical device 1e after sealing. Descriptions of configurations, functions, effects, and the like similar to those in the first to fifth embodiments are omitted.

  The optical device 1e according to the present embodiment is, for example, a passive matrix organic EL panel, and includes one or more organic EL elements (self-emitting elements) 100 on the panel substrate 2 as illustrated in FIG. A self-light-emitting unit 101 is provided, and an inverted trapezoidal partition wall 41 is formed around the self-light-emitting unit 101. On one surface side of the sealing substrate 81, an adhesive layer 82e is patterned in a predetermined shape. The adhesive layer 82e according to the present embodiment is formed in a shape in which an adhesive layer is disposed between the partition walls 41 formed on the substrate 2, for example. The adhesive layer 82e is formed by subjecting a sheet-like thermosetting or photo-curing type adhesive layer to a predetermined curing process and removing unnecessary cured portions, as in the first to third and fifth embodiments. Make it. However, in the present embodiment, the adhesive layer 82e is formed in a shape corresponding to the shape of the partition wall 41.

  Next, as shown in FIG. 12B, the sealing substrate 81 and the substrate 2 are pasted so that the adhesive layer 82 e is positioned between the partition walls 41 and the adhesive layer 82 e is disposed on the self-luminous element 100. Sealing. At this time, for example, as shown in FIG. 12B, an alignment mark (AL) is formed in advance on the substrate 2, the sealing substrate 81, the adhesive layer 82, etc., and the sealing substrate 81 and the sealing substrate 81 are formed on the basis of the alignment mark. The substrate 2 is aligned, and the sealing substrate 81 and the substrate 2 are attached.

  In the optical device 1e, as shown in FIG. 12B, the partition wall 41 functions as a support member for the sealing substrate 81, and an adhesive layer 82e is formed between the partition walls 41. Further, the adhesive layer 82 e is in contact with the self-light-emitting portion 101 and the sealing substrate 81. The upper part of the partition wall 41 is in contact with the sealing substrate 81.

  That is, in the optical device 1e having the above configuration, the partition wall 41 functions as a support member for the sealing substrate 81. Therefore, even when the optical device 1e is thinned, the sealing substrate 81 and the substrate 2 have relatively large strength. Can have. Further, in the optical device 1e having the above configuration, since the adhesive layer 82e is formed between the partition walls 41, the thickness can be reduced and the sealing can be performed with higher accuracy.

  In addition, the thickness and shape of the adhesive layer 82 according to the present embodiment are preferably set as appropriate according to the shape and size of the partition wall 41, the shape and size of the self-luminous element 100, and the like.

As shown in FIG. 12B, a sealing space 800 is formed between the adhesive layer 82e and the partition wall 41 functioning as a support member. That is, the adhesive layer 82 e is disposed so as not to cover the partition wall 41 and to cover the self-light emitting element 100. A hygroscopic material 801 may be formed in the sealed space 800. Examples of the hygroscopic material include metal oxides, metal inorganic acid salts and organic acid salts, and it is particularly preferable to employ at least one of alkaline earth metal oxides and sulfates. Examples of the alkaline earth metal oxide include calcium oxide (CaO), barium oxide (BaO), magnesium oxide (MgO), and the like. Examples of the sulfate include lithium sulfate (Li ₂ SO ₄ ), sodium sulfate (NaSO ₄ ), calcium sulfate (CaSO ₄ ), magnesium sulfate (MgSO ₄ ), cobalt sulfate (CoSO ₄ ), and gallium sulfate (Ga ₂ (SO ₂ ). ₄ ) ₃ ), titanium sulfate (Ti (SO ₄ ) ₂ ), nickel sulfate (NiSO ₄ ) and the like. In addition, a hygroscopic organic material can be employed as a hygroscopic agent.

  In the above configuration, when the partition wall 41 is not completely covered, when a gas such as water vapor as a deterioration factor is generated from the partition wall 41, the sealed space 800 becomes a discharge path for the gas, and the moisture absorbing material 801. By adsorbing the gas, the degradation of the self-luminous element can be prevented.

[Seventh Embodiment]
FIG. 13 is a diagram for explaining an optical device 1f according to a seventh embodiment of the present invention. FIG. 13A is a diagram for explaining the optical device 1f before sealing, and FIG. 13B is a diagram for explaining the optical device 1f after sealing. Descriptions of configurations, functions, effects, and the like similar to those in the first to sixth embodiments are omitted.

  In the manufacturing method of the optical device 1f according to the present embodiment, first, as shown in FIGS. 13A and 13B, the self-luminous element 100 and the partition wall 41 are formed on the substrate 2, and the hygroscopic material 801 is formed thereon. A film is formed, and then sealed with a sealing substrate 81 on which an adhesive layer 82e is formed. In addition, the thickness and shape of the adhesive layer 82 according to the present embodiment may be set as appropriate according to the film thickness and shape of the hygroscopic material 801, the shape and size of the partition wall 41, the shape and size of the self-luminous element 100, and the like. preferable.

  In the optical device 1f having the above configuration, the hygroscopic material 801 can be formed in a large amount as compared with the sixth embodiment, so that the sealing effect is improved.

  The present invention is not limited to the embodiment described above. You may combine embodiment and the specific example which were mentioned above.

  In the embodiment described above, the organic EL panel in which the inversely tapered (inverted trapezoidal) partition wall 41 is formed as shown in FIG. 12 has been described. However, the present invention is not limited to this embodiment. For example, as shown in FIG. 14A, the present invention may be applied to an organic EL panel 1g in which trapezoidal partition walls 41a are formed in a tapered shape.

  In the above-described embodiment, the passive matrix organic EL panel is described as the optical device, but the present invention is not limited to this form. For example, as shown in FIG. 14B, the optical device and the manufacturing method thereof according to the present invention may be applied to an active matrix organic EL panel 1h. In a general active matrix organic EL panel 1h, a driving transistor (TFT: Thin Film Transistor) 21 of a self-luminous element 100 and wirings 22 such as a power supply line, a data line, and a scanning line are formed on a substrate 2, A planarizing film 23, an insulating layer 24, and the like are formed thereon, and self-emitting elements are formed in a matrix thereon.

  Moreover, if the optical device 1 which concerns on this invention can be implement | achieved, it will not be limited to the said embodiment.

  Moreover, although the bottom emission type optical device 1 has been described in the above embodiment, the present invention is not limited to this embodiment. For example, the optical device according to the present invention may be applied to a top emission type optical device that extracts light from the side opposite to the substrate 2. Furthermore, the present invention may be applied to an optical device that extracts light from both the substrate side and the opposite side of the substrate. This top emission type passive matrix optical device has, for example, a structure in which the layers according to the respective embodiments are stacked in reverse.

  In addition, as described above, details of the optical device 1 formed by the method of manufacturing the optical device 1 according to the embodiment of the present invention will be described below without limiting the present invention.

  First, an organic EL element will be described. Generally, an organic EL element has a structure in which an organic EL functional layer is sandwiched between an anode (anode, hole injection electrode) and a cathode (cathode, electron injection electrode). Yes. By applying a voltage to both electrodes, the holes injected and transported from the anode into the organic EL functional layer and the electrons injected and transported from the cathode into the organic EL functional layer are regenerated in this layer (light emitting layer). Light emission is obtained by bonding. A specific configuration and material example of an organic EL element in which a lower electrode, a film-forming layer composed of an organic EL functional layer, and an upper electrode are stacked on a substrate are shown as follows.

  The substrate is preferably a flat plate or film having transparency, and glass or plastic can be used as the material.

  As for the lower or upper electrode, one is set as a cathode and the other is set as an anode. In this case, the anode is preferably composed of a material having a high work function, such as a metal film such as chromium (Cr), molybdenum (Mo), nickel (Ni), platinum (Pt), or a metal oxide such as ITO or IZO. A transparent conductive film such as a film is used. The cathode is preferably composed of a metal having a low work function, and in particular, alkali metals (Li, Na, K, Rb, Cs), alkaline earth metals (Be, Mg, Ca, Sr, Ba), rare earths. Such a metal having a low work function, a compound thereof, or an alloy containing them can be used. In the case where both the lower electrode and the upper electrode are made of a transparent material, a reflection film may be provided on the electrode side opposite to the light emission side.

  In addition, the extraction electrode that is led out from the lower electrode or the upper electrode to the sealing region is a wiring electrode provided to connect the organic EL panel and driving means such as an IC (integrated circuit) and a driver for driving the organic EL panel. Thus, it is preferable to use a low-resistance metal material such as Ag, Cr, Al, or an alloy thereof.

  In general, the lower electrode and the extraction electrode are formed by forming a thin film for the lower electrode and the extraction electrode by ITO, IZO or the like by a method such as vapor deposition or sputtering, and forming a pattern by a photolithography method or the like. The lower electrode and the extraction electrode (particularly the extraction electrode that needs to be reduced in resistance) have a two-layer structure in which a low-resistance metal such as Ag, Al, Cr, or an alloy thereof is laminated on the above-described underlayer such as ITO or IZO. As a protective layer such as Ag, a layer having a three-layer structure in which materials having high oxidation resistance such as Cu, Cr and Ta are further laminated can be employed.

  As the organic EL functional layer formed between the lower electrode and the upper electrode, when the lower electrode is an anode and the upper electrode is a cathode, a stacked structure of a hole transport layer / a light emitting layer / an electron transport layer is formed. Although it is common (when the lower electrode is the cathode and the upper electrode is the anode, the reverse stacking order is used), but one of the light emitting layer, hole transport layer, and electron transport layer is omitted. Alternatively, both layers may be omitted and only the light emitting layer may be used. As the organic EL functional layer, organic functional layers such as a hole injection layer, an electron injection layer, a hole barrier layer, and an electron barrier layer can be inserted depending on the application.

  The material of the organic EL functional layer can be appropriately selected according to the use of the organic EL element. Examples are shown below, but are not limited thereto.

  The hole transport layer only needs to have a function of high hole mobility, and any material can be selected and used from conventionally known compounds. Specific examples include porphyrin compounds such as copper phthalocyanine, aromatic tertiary amines such as 4,4′-bis [N- (1-naphthyl) -N-phenylamino] -biphenyl (NPB), 4- (di- Organic materials such as stilbene compounds such as p-tolylamino) -4 ′-[4- (di-p-tolylamino) styryl] stilbenzene, triazole derivatives and styrylamine compounds are used. Further, a polymer dispersion material in which a low-molecular organic material for hole transport is dispersed in a polymer such as polycarbonate can also be used. Preferably, a material having a glass transition temperature (Tg) higher than the temperature at which the sealing resin is heated and cured is preferable, for example, 4,4′-bis [N- (1-naphthyl) -N-fermiamino] -biphenyl (NPB). ).

A known light emitting material can be used for the light emitting layer. Specific examples include aromatic dimethylidin compounds such as 4,4′-bis (2,2′-diphenylvinyl) -biphenyl (DPVBi), 1,4- Styrylbenzene compounds such as bis (2-methylstyryl) benzene, triazole derivatives such as 3- (4-biphenyl) -4-phenyl-5-t-butylphenyl-1,2,4-triazole (TAZ), anthraquinone derivatives Fluorescent organic materials such as fluorenone derivatives, fluorescent organometallic compounds such as (8-hydroxyquinolinato) aluminum complex (Alq ₃ ), polyparaphenylene vinylene (PPV), polyfluorene, polyvinylcarbazole (PVK) The phosphorescence from triplet excitons such as platinum complexes and iridium complexes can be used for light emission. The organic material can be used. It may be composed only of the light emitting material as described above, or may contain a hole transport material, an electron transport material, an additive (donor, acceptor, etc.) or a light emitting dopant. These may be dispersed in a polymer material or an inorganic material.

  The electron transport layer only needs to have a function of transmitting electrons injected from the cathode to the light emitting layer, and any material can be selected from conventionally known compounds. Specific examples include organic materials such as nitro-substituted fluorenone derivatives and anthraquinodimethane derivatives, metal complexes of 8-quinolinol derivatives, metal phthalocyanines, and the like.

  The hole transport layer, the light-emitting layer, and the electron transport layer are spin coating methods, coating methods such as a dipping method, ink jet methods, etc., except for the layer for performing the film forming step and the heating step according to the present invention simultaneously or alternately. It can be formed by a wet process such as a screen printing method or a dry process such as a vapor deposition method or a laser transfer method.

  The sealing member is not particularly limited as long as it is a material that can ensure hermeticity, but for the convenience of heat-curing the adhesive, it is preferable to use a material that has little thermal expansion or change over time. For example, glass materials such as alkali glass and non-alkali glass, metal materials such as stainless steel and aluminum, plastics, and the like can be used. In addition, as a sealing member, a glass sealing substrate formed with a sealing recess (regardless of one-stage digging or two-stage digging) by processing such as press molding, etching, blasting, or flat glass is used. It is also possible to employ a glass (which may be plastic) spacer in which the substrate and the sealing region are formed, and a gas-tight space between the sealing member and the substrate filled with a resin or the like.

  Further, as the sealing material (adhesive), a thermosetting type, a chemical curing type (two-component mixing), a light (ultraviolet) curing type, or the like can be used. As the material, acrylic resin, epoxy resin, polyester, polyolefin, etc. can be used. Use. In particular, use of an ultraviolet curable or thermosetting epoxy resin is preferable.

  Drying materials include zeolite, silica gel, carbon, carbon nanotubes and other physical desiccants, alkali metal oxides, metal halides, chlorine peroxide and other chemical desiccants, organometallic complexes in toluene, xylene, aliphatic organic solvents It can be formed with a desiccant dissolved in a petroleum solvent such as a desiccant dispersed in a binder such as polyethylene, polyisoprene, and polyvinyl cinnaate having transparency.

  Moreover, although the organic EL panel which has an organic EL element as an optical device was demonstrated in the said embodiment, it is not restricted to this form. For example, the optical device according to the present invention may be applied to an optical device including a self-luminous element such as a light emitting diode. In addition, the optical device according to the present invention may be an information display device that performs dot matrix display, such as a mobile phone, an on-vehicle monitor, a monitor for home appliances, a display device for a personal computer or a television receiver, a clock or an advertising panel. The present invention may also be applied to various display devices such as fixed display devices such as light sources of scanners and printers, illumination devices such as lighting and liquid crystal backlights, and optical communication devices using photoelectric conversion functions.

  As described above, the method for manufacturing the optical device 1 according to the present invention includes the self-light-emitting portion forming step (S1) for forming the plurality of self-light-emitting portions 101 on the panel substrate 2, and the adhesive layer previously formed in a sheet shape. 82 or a curing process (S2, S22) in which a part of the adhesive layer 82 formed on the sealing substrate 81 is cured, and the panel substrate 2 and the sealing substrate 81 seal the light-emitting portion 101 after the curing process. Therefore, the self-luminous part 101 formed on the panel substrate 2 can be sealed with high accuracy by a simple process.

  Further, after the sealing step, the panel substrate 2 is divided into a plurality of parts, and a dividing / removing step (S4) for forming an optical device is performed, so that a plurality of optical devices can be manufactured.

  Specifically, the sheet-like photo-curing type or thermo-curing type adhesive layer 82 is cured to form an adhesive layer 82 including a cured portion 821 and a non-cured portion 822 having a predetermined shape on the sealing substrate 81. Sealing member forming step (S2) to be performed, the cured portion 821 is removed, and the sealing substrate 81 is attached to the self-light-emitting portion 101 via the non-cured portion 822 of the adhesive layer 82. Therefore, the self-light-emitting portion 101 formed on the panel substrate 2 can be sealed with high accuracy by a simple process.

  In addition, when performing multi-chamfering, the adhesive layer 82 is patterned on the sealing substrate 81 with high accuracy, and the plurality of self-light-emitting portions 101 formed on the panel substrate 2 are sealed with high accuracy at a time. It can be carried out. In addition, the manufacturing time can be shortened in the optical device manufacturing method according to the present invention as compared with the conventional manufacturing method in which the individual light-emitting portions 101 are individually sealed. Further, since the sealing can be performed with high accuracy, it is possible to prevent the adhesion layer from adhering to the lead-out wiring 7, and it is possible to prevent connection failure and display failure. Moreover, the quality defect in a division | segmentation process can be reduced.

  Further, the adhesive layer 82 having the release sheet 83 disposed on one surface side is cured to form a cured portion 821 and a non-cured portion 822, and the sealing substrate 81 is disposed on the other surface side of the adhesive layer 82. In the attached state, the cured portion 821 is peeled from the sealing substrate 81 together with the release sheet 83 to remove the cured portion 821, so that the adhesive layer 82 can be patterned on the sealing substrate 81 easily and with high accuracy. it can.

  The optical device includes a self-light-emitting unit 101 including one or more self-light-emitting elements 100 on the substrate 2, and is formed on the substrate 2 by sealing the self-light-emitting unit 101 with a sealing substrate 81. Since the partition wall 41 is formed around the self-luminous element 100, the partition wall 41 functions as a support member for the sealing substrate 81, and the adhesive layer 82 is formed between the partition walls 41, the optical device 1 is thin. Even in such a case, the optical device 1 having a relatively high strength can be manufactured. Further, since the self-luminous element 100 is sealed through the adhesive layer 82 and an extra sealing space is removed, the light emitting element 100 can be made thinner than the conventional optical device 1.

  That is, 1. Solid sealing can be achieved with high accuracy. Specifically, as described above, a self-luminous panel sealed without forming an adhesive layer on the support member can be obtained, and gas generated from the support member can be discharged.

  As another effect, since the pattern can be formed with high accuracy, it is not necessary to form an adhesive layer on the lead wiring 7, and it is possible to prevent the lead electrode from being oxidized, thereby preventing an increase in wiring resistance or disconnection. .

  In addition, when mass production in which the large-sized substrate 2 is used for multi-chamfering of the optical device 1 is taken into account, unnecessary portions of the substrate can be eliminated as much as possible by the above-described manufacturing method. In addition, an area used for manufacturing a self-luminous panel can be narrowed. Further, the frame portion and the sealing region can be made as narrow as possible. Quality defects due to poor patterning of the resin layer during the dividing step can be prevented.

  In addition, 2. It is easy to form an adhesive layer pattern. Specifically, after disposing the adhesive layer on the sealing substrate and reducing the adhesion to the sealing substrate by light irradiation, heating, etc., the unnecessary portion of the adhesive layer is removed while peeling the release sheet from the adhesive layer. Can be removed.

It is a figure for demonstrating the optical device which concerns on 1st Embodiment of this invention. (A) is a front view from the element formation surface side of an optical device, (b) is sectional drawing of the optical device shown to (a). (A) is a figure for demonstrating in detail the optical device shown to Fig.1 (a), (b) is sectional drawing for demonstrating in detail the optical device shown in FIG.1 (b). . It is a flowchart for demonstrating the manufacturing method of the optical device which concerns on 1st Embodiment of this invention. (A) is a figure for demonstrating the large sized panel board | substrate with which the several self-light-emitting part was formed, (b) is sectional drawing of the panel board | substrate and self-light-emitting part which were shown to (a). It is a perspective view for demonstrating the manufacturing method of the optical device which concerns on 1st Embodiment of this invention. It is a figure for demonstrating the sealing member formation process of the manufacturing method of the optical device which concerns on 1st Embodiment of this invention. (A) is a figure for demonstrating the contact bonding layer by which the peeling sheet was affixed on the one surface side, (b) is a figure for demonstrating the process of performing a hardening process to an contact bonding layer, (c) ) Is a diagram showing a state before the sealing substrate and the adhesive layer are pasted, (d) is a diagram showing a state where the sealing substrate and the adhesive layer are pasted, and (e) is a cured portion of the adhesive layer. It is a figure for demonstrating the removal process, (f) is a figure for demonstrating a sealing process, (g) is a figure for demonstrating a hardening process. It is a figure for demonstrating the division | segmentation process of the manufacturing method of the optical device which concerns on this invention. (A) is sectional drawing before the division | segmentation of an optical device, (b) is sectional drawing after the division | segmentation of an optical device, (c) demonstrates the process of crimping | bonding a flexible substrate (wiring board) to the lead-out wiring 7. FIG. It is a figure for doing. It is a figure for demonstrating the manufacturing method of the optical device 1 which concerns on 2nd Embodiment of this invention. (A) is a figure for demonstrating the contact bonding layer by which the peeling sheet was affixed on the one surface side, (b) is a figure for demonstrating the process of performing a hardening process to an contact bonding layer, (c) ) Is a diagram showing a state before the sealing substrate and the adhesive layer are pasted, (d) is a diagram showing a state where the sealing substrate and the adhesive layer are pasted, and (e) is a cured portion of the adhesive layer. It is a figure for demonstrating the removal process, (f) is a figure for demonstrating a sealing process, (g) is a figure for demonstrating a hardening process. It is a figure for demonstrating the manufacturing method of the optical device which concerns on 3rd Embodiment of this invention. (A) is a figure for demonstrating the contact bonding layer by which the peeling sheet was affixed on the one surface side, and the sealing substrate was arrange | positioned at the other surface side, (b) is the process of performing a hardening process to an contact bonding layer. (C) is a figure for demonstrating the removal process of the non-hardened part of an adhesive layer, (d) is a figure for demonstrating a sealing process, (e) (F) is sectional drawing before the division | segmentation of an optical device, (g) is sectional drawing of the optical device after a division | segmentation. It is a figure for demonstrating the manufacturing method of the optical device which concerns on 4th Embodiment of this invention. (A) is a figure for demonstrating the contact bonding layer by which the peeling sheet was affixed on the one surface side, and the sealing substrate was arrange | positioned at the other surface side, (b) is the process of performing a hardening process to an contact bonding layer. (C) is a figure for demonstrating the process of peeling a peeling sheet from an adhesive layer, (d) is a figure for demonstrating a sealing process, (e) (F) is a figure for demonstrating the division | segmentation process divided | segmented for every optical device, (g) is sectional drawing of the optical device after a division | segmentation. It is a figure for demonstrating the manufacturing method of the optical device which concerns on 5th Embodiment of this invention. (A) is a figure for demonstrating the hardening part 821 and the non-hardening part 822 of the contact bonding layer 82 which concern on a 1st specific example, (b) is the hardening part 821b and the non-hardening of the contact bonding layer 82b which concerns on a 2nd specific example. It is a figure for demonstrating the hardening part 822b. It is a figure for demonstrating the optical device 1e which concerns on 6th Embodiment of this invention. (A) is a figure for demonstrating the optical device 1e before sealing, (b) is a figure for demonstrating the optical device 1e after sealing. It is a figure for demonstrating the optical device 1f which concerns on 7th Embodiment of this invention. (A) is a figure for demonstrating the optical device 1f before sealing, (b) is a figure for demonstrating the optical device 1f after sealing. (A) It is a figure for demonstrating the optical device 1g which concerns on other embodiment of this invention, (b) is a figure for demonstrating the optical device 1h which concerns on other embodiment of this invention.

Explanation of symbols

1 Optical device (organic EL panel)
2 Substrate 3 First electrode (lower electrode)
3a Lead wire for first electrode 4 Insulating film (partition layer)
5 Film formation layer (light emitting layer)
6 Second electrode (upper electrode)
7 Drawer wiring 10 Pixel 11 Opening 41 Partition 80 Sealing member 81 Sealing substrate 82 Adhesive layer 83 Release sheet 90 Wiring substrate (flexible substrate)
100 Self-luminous element (organic EL element)
101 Self-luminous part 821 Curing part 822 Non-hardening part

Claims (16)

A method of manufacturing an optical device in which at least one self-light-emitting portion formed on a panel substrate is sealed,
A self-light-emitting part forming step of forming at least one self-light-emitting part on the panel substrate;
A curing step of performing a curing process on a part of the adhesive layer formed in advance in the form of a sheet or the adhesive layer formed on the sealing substrate;
And a sealing step of sealing the self-luminous portion with the panel substrate and the sealing substrate after the curing step.   The curing step is a step of performing a curing process on a sheet-like photo-curing type or thermo-curing type adhesive layer to form the adhesive layer including a cured part and a non-cured part having a predetermined shape on the sealing substrate. The method of manufacturing an optical device according to claim 1, wherein:   The said sealing process is a process of sealing the said self-light-emitting part with the said sealing substrate through the non-hardening part except the hardening part of the said contact bonding layer, The said Claim 1 or 2 characterized by the above-mentioned. Manufacturing method of optical device. A method of manufacturing an optical device in which at least one self-light-emitting portion formed on a panel substrate is sealed,
A self-light-emitting part forming step of forming at least one self-light-emitting part on the panel substrate;
A curing step in which a release sheet is disposed on one surface side of the adhesive layer, and a cured part and a non-cured part are formed in the adhesive layer of photo-curing type or thermosetting type;
With the other surface side of the adhesive layer attached to a sealing substrate, the cured portion is peeled from the sealing substrate together with the release sheet to remove the cured portion, and the adhesive layer is placed on the sealing substrate. A sealing member forming step to be formed;
A sealing step of sealing the self-luminous portion by the sealing substrate through the non-cured portion excluding the cured portion of the adhesive layer;
An optical device manufacturing method comprising: A method of manufacturing an optical device in which at least one self-light-emitting portion formed on a panel substrate is sealed,
A self-light-emitting portion forming step of forming a plurality of self-light-emitting portions on the panel substrate;
A release sheet is disposed on one side of the adhesive layer, and a sealing substrate is placed on the other side of the photo-curing or thermosetting adhesive layer. A curing step for forming a cured portion in part;
A sealing member forming step of peeling the non-cured portion other than the formation region of the cured portion together with the release sheet from the sealing substrate to remove the non-cured portion, and forming an adhesive layer on the sealing substrate. ,
A sealing step of sealing the self-luminous part with the sealing substrate through the adhesive layer;
An optical device manufacturing method comprising: A method of manufacturing an optical device in which at least one self-light-emitting portion formed on a panel substrate is sealed,
A self-light-emitting part forming step of forming at least one self-light-emitting part on the panel substrate;
A release sheet is disposed on one side of the photo-curing type or thermosetting type adhesive layer, and the other part of the adhesive layer is attached to the sealing substrate. A curing step to form a part;
A sealing step of sealing the self-luminous portion with the sealing substrate through the non-curing portion of the adhesive layer formed on the sealing substrate in a state where the cured portion and the non-curing portion are formed in a predetermined shape; ,
A division / removal step of forming the optical device by dividing the panel substrate into a plurality of parts after the sealing step or removing unnecessary portions, and removing the cured portion of the adhesive layer;
An optical device manufacturing method comprising:   The self-sealing target formed on the panel substrate is subjected to the curing treatment on a sheet-like adhesive layer in which a release sheet is disposed on one side of the photo-curing or thermosetting adhesive layer. The method for manufacturing an optical device according to claim 1, wherein an adhesive layer including the uncured portion and the cured portion having a predetermined shape corresponding to a light emitting portion is formed.   Sealing in which the adhesive layer is arranged based on an alignment mark formed on one or both of the sealing substrate and the adhesive layer and an alignment mark formed on the panel substrate at the time of sealing. The method for manufacturing an optical device according to claim 1, wherein alignment between the substrate and the panel substrate is performed. On the panel substrate, the self-luminous part and the lead wiring are formed,
The method for manufacturing an optical device according to claim 1, wherein the non-cured portion of the adhesive layer is not pasted on the lead-out wiring at the time of sealing.   10. The adhesive layer according to claim 1, wherein the adhesive layer is made of a photo-curing or thermosetting adhesive material that undergoes a phase transition from an adhesive state to a solidified or cured state by light irradiation or heating. The manufacturing method of the optical device of description.   The adhesive force of the cured portion of the adhesive layer to the sealing substrate attached after the curing treatment of the adhesive layer is smaller than the adhesive force of the non-cured portion of the adhesive layer to the sealing substrate. The method for manufacturing an optical device according to any one of claims 1 to 4 and claims 6 to 10.   The adhesive force of the non-hardened part of the adhesive layer to the release sheet is smaller than the adhesive force of the non-hardened part of the adhesive layer to the sealing substrate. The manufacturing method of the optical device as described in any one of Claim 6 to 11. An optical device in which a self-luminous part formed on a panel substrate is sealed with a sealing substrate via an adhesive layer,
The sheet-like photo-curing type or thermo-curing type adhesive layer is cured to form the adhesive layer including a cured part and a non-cured part having a predetermined shape on the sealing substrate, and the cured part is removed. And the sealing substrate is formed on the self-luminous portion by pasting the sealing substrate through the non-cured portion of the adhesive layer, and sealing the self-luminous portion. . An optical device comprising a self-luminous part comprising one or more self-luminous elements on a substrate, wherein the self-luminous part is sealed with a sealing substrate,
Having a partition wall formed around a self-luminous element formed on the substrate;
An optical device, wherein the adhesive layer is formed between the partition walls.   The optical device according to claim 14, wherein the adhesive layer is in contact with the self-light-emitting portion and the sealing substrate.   The optical device according to claim 14, wherein a hygroscopic material is formed in the sealed space.

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