JP2014093484A - Laminate manufacturing method, laminate manufacturing apparatus, and laminate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminate manufacturing method capable of easily and accurately exposing electrodes of a first sheet from an adhesive layer of a second sheet.SOLUTION: The laminate manufacturing method comprises: a first curing step of at least partially irradiating those portions of an uncured part 32a of an adhesive layer 32 of a second sheet 30 which correspond to electrodes 23 and 24 of a first sheet 20 with light to form a first cured parts 32b; and bonding the first sheet 20 and the second sheet 30 together so that a functional layer 22 of the first sheet 20 is covered with the adhesive layer 32 of the second sheet 30.

Description

  The present invention relates to a laminate manufacturing method and a laminate manufacturing apparatus for manufacturing a laminate including a sealed semiconductor layer. The present invention also relates to a laminate including a sealed semiconductor layer.

  In recent years, research on an organic semiconductor device having an organic semiconductor layer containing an organic semiconductor material has been actively conducted. Organic semiconductor materials can generally be formed on a substrate at low temperatures. For this reason, the material which has a softness | flexibility can be used as a material which comprises a base material. This makes it possible to provide a lightweight semiconductor device that has stability against mechanical shock. Therefore, organic semiconductor devices are expected to be applied to drive circuits such as organic EL and electronic paper, or electronic tags.

  In addition, since a flexible substrate can be used, the organic semiconductor layer can be formed on the substrate by a roll-to-roll method. Here, the roll-to-roll method is a form in which a base material wound in a roll shape is unwound to form a laminate including an organic semiconductor layer, and then the laminate is wound into a roll shape to form a roll body. It is a method. In the roll-to-roll method, since the organic semiconductor layer can be continuously formed on the substrate, the production efficiency of the organic semiconductor layer can be improved.

  On the other hand, the organic semiconductor layer is known to be susceptible to moisture and oxygen. Therefore, in order to prevent deterioration of the quality of the organic semiconductor layer, the periphery of the organic semiconductor layer is generally surrounded by a sealing substrate that shields moisture and oxygen. In the roll-to-roll system, such sealing is realized by bonding an organic semiconductor base material provided with an organic semiconductor layer and a sealing base material provided with an adhesive layer.

  By the way, when using an organic semiconductor device, it is necessary to ensure electrical connection with the organic semiconductor layer through an electrode provided on the organic semiconductor substrate and connected to the organic semiconductor layer. Here, in the roll-to-roll method, not only the organic semiconductor layer but also the electrode is usually surrounded by a sealing substrate. Therefore, in order to ensure electrical connection with the electrode, it is necessary to expose the electrode to the outside, for example, by at least partially removing the sealing substrate provided on the electrode. On the other hand, in order to firmly seal the organic semiconductor layer from the external environment, it is preferable that the adhesion between the base material and the adhesive layer of the sealing base material is large. Therefore, usually, an adhesive material having a large adhesive force with the base material is selected as a material constituting the adhesive layer of the sealing base material. For this reason, the operation | work which removes the sealing base material provided on the electrode partially is not easy.

  As a method that eliminates the need for such removal work, an opening is formed in advance in the portion of the sealing substrate corresponding to the electrode of the organic semiconductor substrate, and the sealing substrate and the organic semiconductor substrate are bonded together. Thus, a method of manufacturing a laminate can be considered. However, when using the roll-to-roll method, it is conceivable that the organic semiconductor substrate or the sealing substrate expands and contracts according to changes in environmental conditions. It is also conceivable that the position of the sealing substrate with respect to the organic semiconductor substrate gradually shifts in the width direction due to a shift at the time of bonding. Therefore, it is not easy to bond the organic semiconductor substrate and the sealing substrate accurately so that the opening formed in advance overlaps the electrode.

  In consideration of such points, in Patent Document 1, the position of the electrode of the organic semiconductor substrate is detected before the bonding step, and an opening is formed in the sealing substrate based on the detected position information. A method has been proposed. In the method described in Patent Document 1, the position of the opening of the sealing substrate is determined according to the position of the actual electrode of the organic semiconductor substrate. It is intended to reduce the influence of displacement in the width direction.

JP 2012-22783 A

  However, in the method described in Patent Document 1, an adhesive layer is formed by applying an adhesive material to a region other than the region where the opening is formed in the substrate after forming the opening in the substrate. A sealing substrate is produced. That is, after the position of the electrode of the organic semiconductor substrate is detected and before the organic semiconductor substrate and the sealing substrate are bonded together, an opening forming step and an adhesive material applying step are performed. . In this case, during the process of forming the openings and the application process of the adhesive material, the base material expands and contracts and the displacement in the width direction occurs, and as a result, the positional deviation between the openings and the electrodes may occur. Conceivable. Therefore, in the method described in Patent Document 1, it is considered that there is a limit to the accuracy of alignment of the opening of the sealing substrate with respect to the electrode of the organic semiconductor substrate. In addition, since the opening is formed immediately before bonding, the apparatus configuration may be complicated.

  An object of this invention is to provide the laminated body manufacturing method, laminated body manufacturing apparatus, and laminated body which can solve the above-mentioned subject effectively.

  1st this invention is a laminated body manufacturing method which manufactures the laminated body containing the sealed semiconductor layer, Comprising: It was provided on the said 1st base material and the said 1st base material, and was comprised from the semiconductor material. A first sheet supply step of supplying a first sheet having a functional layer including a semiconductor layer and an electrode connected to the functional layer; a second base; and a second base, and photocuring A second sheet supply step of supplying a second sheet having an adhesive layer, and the first sheet and the functional sheet of the first sheet so that the functional layer of the first sheet is covered with the adhesive layer. A laminating step for laminating the second sheet, wherein the adhesive layer of the second sheet supplied in the second sheet supplying step includes an uncured portion, and the laminate manufacturing method includes the laminating step. Before the adhesive layer of the second sheet Further comprising a first curing step to form a first cured portion by irradiating the at least partially light to portions corresponding to the electrode of the first sheet of the uncured portions, a laminate manufacturing method.

  In the laminated body manufacturing method according to the first aspect of the present invention, the first curing treatment step is based on a detection step of acquiring position information of the electrode of the first sheet, and the position information obtained in the detection step. And a light irradiating step of irradiating light at least partially to a portion corresponding to the electrode of the first sheet in the uncured portion of the adhesive layer of the second sheet.

  The laminate manufacturing method according to the first aspect of the present invention is implemented after the laminating step, and cures a portion corresponding to the functional layer of the first sheet among the uncured portions of the adhesive layer of the second sheet. And a second curing treatment step for forming a second cured portion. In this case, the adhesive force between the first cured portion of the adhesive layer and the electrode is smaller than the adhesive force between the second cured portion of the adhesive layer and the electrode.

  The laminate manufacturing method according to the first aspect of the present invention further includes a removal step of removing at least part of the first cured portion of the adhesive layer overlapping the electrode as a removal portion after the lamination step, In the removing step, a portion of the second base material that overlaps the removed portion of the first cured portion may be removed together with the removed portion.

  In the laminate manufacturing method according to the first aspect of the present invention, in the removing step, a cut corresponding to a range including at least the removed portion of the first cured portion is formed in the second base material and the first cured portion. A step of forming an adhesive member on the second base material, and a portion of the second base material that overlaps the removal portion of the first cured portion together with the removal portion of the first sheet. And a peeling step of shifting from the electrode side to the adhesive member side.

  2nd this invention is a laminated body manufacturing apparatus which manufactures the laminated body containing the sealed semiconductor layer, Comprising: It was provided on the 1st base material and the said 1st base material, and was comprised from the semiconductor material. A first supply device that supplies a first sheet having a functional layer including a semiconductor layer and an electrode connected to the functional layer, a second base material, and a second base material. A second supply device for supplying a second sheet having an adhesive layer containing a material; and the first sheet and the second sheet so that the functional layer of the first sheet is covered by the adhesive layer of the second sheet. A laminating device for laminating the sheet, wherein the adhesive layer of the second sheet supplied from the second feeding device includes an uncured portion, and the laminated body manufacturing device is located upstream of the laminating device. Of the uncured portion of the adhesive layer of the second sheet Serial, further comprising a first curing unit to form a first cured portion by irradiating the at least partially light to portions corresponding to the first sheet said electrodes, a laminate production apparatus.

  In the laminate manufacturing apparatus according to the second aspect of the present invention, the first curing processing device is based on a detection unit that acquires positional information of the electrodes of the first sheet and the positional information obtained by the detection unit. The light irradiation part which irradiates light at least partially to the part corresponding to the electrode of the 1st sheet among the uncured parts of the adhesion layer of the 2nd sheet may be provided.

  The laminated body manufacturing apparatus according to the second aspect of the present invention is disposed on the downstream side of the laminating apparatus, and includes a portion corresponding to the functional layer of the first sheet among the uncured portions of the adhesive layer of the second sheet. You may further provide the 2nd hardening processing apparatus which hardens | cures and forms a 2nd hardening part. In this case, the adhesive force between the first cured portion of the adhesive layer and the electrode is smaller than the adhesive force between the second cured portion of the adhesive layer and the electrode.

  The laminated body manufacturing apparatus according to a second aspect of the present invention is disposed on the downstream side of the laminating apparatus, and at least partially removes a region overlapping the electrode in the uncured portion of the adhesive layer of the second sheet. The removal apparatus may further include a removal device, and the removal device may be configured to remove a portion of the second base material that overlaps the removal portion of the first cured portion together with the removal portion.

  In the laminate manufacturing apparatus according to the second aspect of the present invention, the removing device forms a cut in the second base material and the first cured portion corresponding to a range including at least the removed portion of the first cured portion. An adhesive member is brought into contact with the second forming portion and the second base material, and a portion of the second base material that overlaps the removal portion of the first cured portion is combined with the removal portion of the first sheet. And a peeling portion that shifts from the electrode side to the adhesive member side.

According to a third aspect of the present invention, there is provided a first base material, a functional layer provided on the first base material and including a semiconductor layer made of a semiconductor material, an electrode connected to the functional layer, and the functional layer And an adhesive layer arranged to overlap the electrode;
A second substrate disposed on the adhesive layer, wherein the adhesive layer is disposed so as to cover the functional layer, a first cured portion disposed so as to at least partially overlap the electrode. The first cured portion and the second cured portion are made of the same material, and the adhesion between the first cured portion of the adhesive layer and the electrode is It is a laminated body which is smaller than the adhesive force between the second cured portion of the adhesive layer and the electrode.

  In the laminate according to the third aspect of the present invention, an opening that at least partially exposes the surface of the electrode on the second substrate side is formed, and the first cured portion is formed in the opening. You may touch.

  According to the present invention, the electrode of the first sheet can be easily and accurately exposed from the adhesive layer of the second sheet.

FIG. 1 is a longitudinal sectional view showing a laminated body in an embodiment of the present invention. FIG. 2 is a perspective view showing the laminated body manufacturing apparatus in the embodiment of the present invention. FIGS. 3A to 3E are views showing a laminate manufacturing method in the embodiment of the present invention. 4A to 4D are views for explaining an example of a method for exposing the electrode of the first sheet to the outside. FIG. 5 is a perspective view showing a laminate manufacturing apparatus according to a first comparative embodiment. FIG. 6 is a plan view showing a laminate obtained by using the laminate manufacturing apparatus shown in FIG. FIG. 7 is a perspective view showing a laminate manufacturing apparatus according to a second comparative embodiment. FIG. 8 is a plan view showing a laminate obtained by using the laminate manufacturing apparatus shown in FIG. FIGS. 9A and 9B are diagrams for explaining the advantages obtained by the present embodiment. FIG. 10 is a perspective view showing a laminated body manufacturing apparatus in a modification of the embodiment of the present invention. FIGS. 11A to 11C are views for explaining an example of a method for exposing the electrode of the first sheet from the adhesive layer of the second sheet. 12A to 12C are views for explaining an example of a method for exposing the electrode of the first sheet from the adhesive layer of the second sheet. FIGS. 13A and 13B are views for explaining a modification of the first curing process.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 4A to 4D. First, the laminated body 40 in this Embodiment is demonstrated with reference to FIG. As will be described later, the laminate 40 is produced by laminating the first sheet 20 and the second sheet 30 in a roll-to-roll manner.

Laminate FIG. 1 is a longitudinal sectional view showing a laminate 40. As shown in FIG. 1, the stacked body 40 is connected to the first base material 21, the functional layer 22 provided on the first base material 21 and including a semiconductor made of a semiconductor material, and the functional layer 22. Electrodes 23 and 24. Usually, the laminated body 40 includes a combination of a plurality of functional layers 22 and electrodes 23 and 24, and a semiconductor device having the functional layers 22 and the electrodes 23 and 24 is obtained by cutting each combination individually.

(First base material)
The material which comprises the 1st base material 21 is not specifically limited as long as it has the softness | flexibility of the grade which can be wound up in roll shape. Whether or not the first base material 21 is required to have translucency is appropriately determined according to the use of the semiconductor device. Examples of the material constituting the first base material 21 include polyethylene terephthalate and polyethylene naphthalate. Although the thickness of the 1st base material 21 is suitably set according to the material etc. which comprise the 1st base material 21, it exists in the range of 5 micrometers-250 micrometers, for example.

(Functional layer)
As long as the functional layer 22 has a semiconductor layer for realizing a semiconductor device having a desired function, the specific configuration of the functional layer 22 is not particularly limited. For example, FIG. 1 shows an example in which the semiconductor device is an organic EL device that emits light by recombination of electrons and holes in an organic compound. In the example shown in FIG. 1, the functional layer 22 includes a hole injection layer 22a, a hole transport layer 22b, a light emitting layer 22c, and an electron injection layer 22d arranged in this order from the first base material 21 side. In this case, the hole injection layer 22a, the hole transport layer 22b, the light emitting layer 22c, and the electron injection layer 22d are organic semiconductor layers containing an organic semiconductor material. Note that the structure of the functional layer 22 is not limited to the structure shown in FIG. 1, a structure composed of a light emitting layer alone, a structure composed of a hole injection layer and a light emitting layer, a structure composed of a light emitting layer and an electron injection layer, Furthermore, a structure in which a hole transport layer is interposed between the hole injection layer and the light emitting layer, a structure in which an electron transport layer is interposed between the light emitting layer and the electron injection layer, or the like may be employed. As the organic semiconductor layer and other components, known ones can be used, for example, those described in JP2011-9498A can be used.

  The functional layer 22 may be configured such that an organic transistor device that controls a current flowing in the organic compound is obtained from the stacked body 40. In this case, the organic semiconductor layer included in the functional layer 22 is configured such that a current flows according to a voltage applied to the gate electrode. Known organic semiconductor layers and other components can be used, for example, those described in JP-A-2009-87996.

  The functional layer 22 may be configured such that an organic solar cell device that converts light into electric power by the photovoltaic effect is obtained from the stacked body 40. In this case, the organic semiconductor layer included in the functional layer 22 is configured as a photoelectric conversion layer that obtains a photovoltaic force using incident light. A well-known thing can be used as a photoelectric converting layer and another component, For example, the thing of Unexamined-Japanese-Patent No. 2011-151195 can be used.

  Further, the semiconductor layer included in the functional layer 22 is not limited to the organic semiconductor layer. The semiconductor layer of the functional layer 22 may be an inorganic semiconductor layer containing an inorganic semiconductor material as long as it can cope with a manufacturing process using a roll-to-roll method.

(electrode)
As shown in FIG. 1, the electrodes 23 and 24 are connected to the hole injection layer 22a of the functional layer 22, and are connected to the first electrode 23 functioning as an anode and the electron injection layer 22d of the functional layer 22, and as the cathode. And a functioning second electrode 24. In the present embodiment, the electrodes 23 and 24 at least partially have a region in which at least one of the first electrode 23 and the second electrode 24 does not overlap the other when viewed from the normal direction of the first base material 21. It is configured as such. In the example shown in FIG. 1, both the first electrode 23 and the second electrode 24 have a region that does not overlap the other when viewed from the normal direction of the first base material 21. Although not shown, an insulating layer that prevents the second electrode 24 from contacting the hole injection layer 22a, the hole transport layer 22b, and the semiconductor layer 22c may be provided.

  The material which comprises the electrodes 23 and 24 is not specifically limited as long as it has electroconductivity, A metal, an alloy, these mixtures, etc. can be used. When light generated from the functional layer 22 passes through either the first electrode 23 or the second electrode 24 and is extracted to the outside, a light-transmitting conductive material is used as the material of the electrode through which the light passes. Used. Examples of the light-transmitting conductive material include oxide conductive materials such as indium tin oxide (ITO), indium oxide, indium zinc oxide (IZO), zinc oxide, and stannic oxide, or thin film electrodes such as gold. Materials can be mentioned.

  As shown in FIG. 1, the laminate 40 further includes an adhesive layer 32 disposed so as to cover the functional layer 22, and a second base material 31 disposed on the adhesive layer 32.

(Second base material and adhesive layer)
The second base material 31 and the adhesive layer 32 are for suppressing moisture and oxygen from coming into contact with the functional layer 22, thereby suppressing the functional degradation of the functional layer 22. The material which comprises the 2nd base material 31 is not specifically limited as long as a water | moisture content and oxygen can be interrupted | blocked efficiently. For example, as the second base material 31, a base material including a flexible material and an inorganic oxide thin film that is provided on the flexible material and functions as a barrier layer can be used. The flexible material is not particularly limited as long as it has sufficient flexibility, and examples thereof include polyethylene terephthalate and polyethylene naphthalate. As the adhesive layer 32, an adhesive or the like that can favorably adhere the adhesive layer 32 and the functional layer 22 or the electrodes 23 and 24 around the functional layer 22 and thereby shield the functional layer 22 from the external environment. It is done. As the adhesive constituting the adhesive layer 32, for example, an epoxy resin thermosetting adhesive or an acrylic resin UV curing adhesive can be used. Depending on the type of adhesive, the adhesive also has a barrier property. When the adhesive also has barrier properties, the second base material 31 may not include the above-described barrier layer.

  As shown in FIG. 1, the adhesive layer 32 includes a first cured portion 32 b disposed so as to at least partially overlap the electrodes 23 and 24, a second cured portion 32 c disposed so as to cover the functional layer 22, have. These 1st hardening parts 32b and the 2nd hardening part 32c are comprised from the same adhesive agent containing a predetermined photocurable material. Further, the adhesion force between the first cured portion 32 b and the electrodes 23 and 24 is smaller than the adhesion force between the second cured portion 32 c and the electrodes 23 and 24. For example, there is almost no adhesion between the first cured portion 32b and the electrodes 23 and 24. Hereinafter, the purpose of configuring the adhesive layer 32 in this manner will be described.

  In order to operate a semiconductor device manufactured from the stacked body 40, it is necessary to ensure electrical connection between the electrodes 23 and 24. For example, it is necessary to expose the electrodes 23 and 24 to the outside and to connect wirings to the electrodes 23 and 24. On the other hand, in order to firmly seal the functional layer 22 including the semiconductor layer from the external environment, it is preferable that the adhesion between the electrodes 23 and 24 and the adhesive layer 32 is large. However, the greater the adhesion between the electrodes 23 and 24 and the adhesive layer 32, the more difficult it is to remove the adhesive layer 32 and the second base material 31 on the electrodes 23 and 24 and expose the electrodes 23 and 24. Become.

  Here, according to the present embodiment, the adhesive layer 32 is a second adhesive layer 32b having a large adhesion force between the electrodes 23 and 24 and the first cured portion 32b that does not exhibit the adhesion force between the electrodes 23 and 24. And a hardened portion 32c. Therefore, the second cured portion 32c can ensure the ease of the operation of exposing the electrodes 23 and 24 by the first cured portion 32b while ensuring the strong sealing performance of the functional layer 22 with respect to the external environment. .

  The method for specifying the adhesion between the two members is not particularly limited, and a known method is used. For example, the adhesion force can be specified based on the result of a tensile test using a tensile tester that applies tension to the sample using a pair of gripping means.

Specifically, first, a first sample in which a first electrode 23 or a second electrode 24 (hereinafter also simply referred to as an electrode) and a first cured portion 32b are stacked is prepared. Next, the end of the first sample on the electrode side is gripped by one of the pair of gripping means, and the end of the first sample on the first cured portion 32b side is gripped by the other of the pair of gripping means. . Thereafter, tension is applied to the first sample until the electrode of the first sample and the first cured portion 32b are peeled off. Here, let A be the tension when peeling occurs. Note that each of the pair of gripping means may directly grip the electrode and the first cured portion 32b, or may indirectly grip it via some layer or member.
In addition, a second sample in which the electrode and the second cured portion 32c are laminated is prepared, and the tension B when the electrode and the second cured portion 32c are peeled is obtained in the same manner as in the case of the first sample. taking measurement.
The adhesive layer 32 can be configured such that the tension A measured in this way is smaller than the tension B and the tension A is substantially zero.

  The photocurable material constituting the adhesive layer 32 is not particularly limited, and is appropriately selected according to the type of light irradiated on the adhesive layer 32. For example, when the wavelength of light applied to the adhesive layer 32 is in the ultraviolet light or visible light region, the material constituting the adhesive layer 32 is a functional material that cures in response to light used, such as imide, acrylic, acrylate, or the like. A photocurable material having a group can be used.

  As shown in FIG. 1, the laminated body 40 may be formed with an opening 33 for at least partially exposing the surface on the second base material 31 side of the surfaces of the electrodes 23 and 24 to the outside. . In the following description and drawings, the stacked body 40 in which the electrodes 23 and 24 are exposed to the outside or can be exposed may be represented by reference numeral 40A.

  As will be described later, the opening 33 is formed by removing at least part of the first cured portion 32b overlapping with the electrodes 23 and 24 together with the second base material 31 present thereon. Is done. Therefore, as shown in FIG. 1, there is a first cured portion 32 b in contact with the opening 33 between the opening 33 and the functional layer 22 in a direction parallel to the surface direction of the first base material 21. doing. In the following description, the portion removed from the electrodes 23 and 24 in the first cured portion 32b may be referred to as a removed portion.

Laminate Manufacturing Apparatus Next, a laminate manufacturing apparatus 10 for manufacturing a laminate 40 including a sealed semiconductor layer will be described with reference to FIG. FIG. 2 is a perspective view showing the laminate manufacturing apparatus 10.

The laminate manufacturing apparatus 10 is configured to stack the first sheet 20 and the second sheet 30 in a roll-to-roll manner, thereby manufacturing the above-described laminate 40. As shown in FIG. 2, the laminate manufacturing apparatus 10 includes a first supply device 11 that supplies the first sheet 20, a second supply device 12 that supplies the second sheet 30, and the first sheet 20 and the second sheet. 30 and a laminating apparatus 14 for producing a laminated body 40 and a winding apparatus 18 for winding up the obtained laminated body 40. Moreover, the laminated body manufacturing apparatus 10 is disposed on the upstream side of the laminating apparatus 14 and first irradiates the light to the adhesive layer 32 of the second sheet 30 to form the first cured portion 32b described above. 13 is further provided. 2, the conveying direction of the first sheet 20 is represented by arrow T _1, the transport direction of the second sheet 30 is represented by arrow T _2.

  The first sheet 20 includes a band-shaped first base material 21, a functional layer 22 provided on the first base material 21 and including a semiconductor layer made of a semiconductor material, and an electrode 23 connected to the functional layer 22, 24. The first sheet 20 may be provided with detection marks 26 for indicating the positions of the electrodes 23 and 24 on the first base material 21 and the position of the functional layer 22. The second sheet 30 includes a band-shaped second base material 31 and an adhesive layer 32 provided on the second base material 31. Here, the second sheet 30 is disposed so as to face the functional layer 22 and the electrodes 23 and 24 of the first sheet 20. In addition, the adhesive layer 32 of the second sheet 30 is provided on the side of the second base material 31 that faces the first sheet 20.

  In the example shown in FIG. 2, the width of the first sheet 20 and the width of the second sheet 30 are substantially the same. Here, the “width” is a dimension in a direction orthogonal to the transport direction T. 2 shows an example in which the electrodes 23 and 24 are arranged so as to be adjacent to the functional layer 22 along the transport direction T, but the present invention is not limited to this. For example, the electrodes 23 and 24 may be disposed adjacent to the functional layer 22 along the width direction of the first sheet 20. Further, the first sheet 20 has both the electrodes 23 and 24 adjacent to the functional layer 22 along the transport direction T and the electrodes 23 and 24 adjacent to the functional layer 22 along the width direction of the first sheet 20. You may do it.

(First supply device)
The 1st supply apparatus 11 contains the unwinding shaft 11a around which the 1st sheet | seat 20 was wound in roll shape, and the unwinding shaft 11a is rotationally driven by the drive mechanism which is not shown in figure. In addition, what is wound around the unwinding shaft 11a may be only the first base material 21, or the first base on which only a part of the functional layer 22 and part of the electrodes 23 and 24 are formed. The material 21 may be used. In this case, the first supply device 11 further includes a forming device for forming part or all of the functional layer 22 and the electrodes 23 and 24 on the first base material 21.

(Second supply device)
The 2nd supply apparatus 12 has the unwinding axis | shaft 12a around which the 2nd base material 31 in which the contact bonding layer 32 was provided was wound in roll shape. Alternatively, when the adhesive layer 32 is formed after the second base material 31 is unwound from the unwinding shaft 12a, the second supply device 12 is placed on the second base material 31 unwound from the unwinding shaft 12a. It further has an application part 12b for forming the adhesive layer 32. The application unit 12b applies a coating solution containing a photocurable material and a solvent onto the second base material 31, and thereby forms an adhesive layer 32 including an uncured portion 32a on the second base material 31. It is configured. The “uncured portion” is a portion of the photocurable material that undergoes a irreversible curing reaction when irradiated with light, where such a curing reaction has not been completed.

(First curing processing device)
The first curing processing unit 13 irradiates at least part of the uncured portion 32a of the adhesive layer 32 of the second sheet 30 with the light corresponding to the electrodes 23 and 24 of the first sheet 20 to form a first cured portion. 32b is formed. The “part corresponding to the electrodes 23 and 24 of the first sheet 20 in the uncured portion 32 a” refers to the electrode 23 when the first sheet 20 and the second sheet 30 are bonded to each other in the uncured portion 32 a. , 24 and the overlapping part. As shown in FIG. 2, the first curing processing device 13 detects a detection mark 26 provided on the first sheet 20, thereby acquiring position information of the electrodes 23 and 24, and a detection unit 13 a. Based on the positional information obtained in step 2, a light irradiation unit that at least partially irradiates light to a portion corresponding to the electrodes 23 and 24 of the first sheet 20 in the uncured portion 32a of the adhesive layer 32 of the second sheet 30 13b.

(Lamination equipment)
The laminating apparatus 14 is for bonding the first sheet 20 and the second sheet 30 so that the functional layer 22 of the first sheet 20 is covered with the adhesive layer 32 of the second sheet 30. Although the specific configuration of the laminating device 14 is not particularly limited, for example, the laminating device 14 includes a laminating roller 14 a provided so as to be in contact with the second sheet 30. The laminating roller 14a presses the second sheet 30 toward the first sheet 20, whereby the second sheet 30 and the first sheet 20 are bonded together. Although not shown in the figure, a platen roller that is disposed so as to face the laminating roller 14a and clamps the first sheet 20 and the second sheet 30 between the laminating roller 14a may be provided. Thereby, the 1st sheet | seat 20 and the 2nd sheet | seat 30 can be bonded together more firmly.

  As shown in FIG. 2, the laminate manufacturing apparatus 10 is disposed on the downstream side of the lamination apparatus 14 and corresponds to the functional layer 22 of the first sheet 20 in the uncured portion 32 a of the adhesive layer 32 of the second sheet 30. You may further provide the 2nd hardening processing apparatus 15 which hardens a part and forms the 2nd hardening part 32c. The 2nd hardening processing apparatus 15 has the light irradiation part 15a which irradiates light to the part corresponding to the functional layer 22 of the 1st sheet | seat 20 at least among the unhardened parts 32a, for example.

  Next, the operation and effect of the present embodiment having such a configuration will be described. Here, first, an example of a method for manufacturing the laminate 40 using the laminate manufacturing apparatus 10 will be described. Next, an example of a method for exposing the electrodes 23 and 24 of the obtained laminate 40 to the outside will be described.

The manufacturing method Introduction laminate, a method of manufacturing the laminate 40, will be described with reference to FIG. 3 (a) ~ (e) .

  First, as shown in FIG. 2 and FIG. 3A, the unwinding shaft 12a of the second supply device 12 unwinds the second base material 31 toward the coating part 12b. Next, the coating unit 12 b of the second supply device 12 applies a coating liquid containing a photocurable material and a solvent onto the second base material 31. As a result, as shown in FIG. 3B, the second sheet 30 having the second base material 31 and the adhesive layer 32 including the uncured portion 32a can be obtained. The obtained second sheet 30 is conveyed toward the first curing processing device 13. Further, the first supply device 11 supplies the first sheet 20 toward the laminating device 14.

  Next, the 1st hardening process apparatus 13 implements the 1st hardening process process which irradiates light to the uncured part 32a, and forms the above-mentioned 1st hardening part 32b. Specifically, first, the detection unit 13 a of the first curing processing device 13 detects the detection mark 26 provided on the first base material 21 of the first sheet 20. Thereby, the position information of the electrodes 23 and 24 on the first base material 21 is acquired. Next, based on the obtained position information, the light irradiation unit 13 b of the first curing processing device 13 corresponds to the electrodes 23 and 24 of the first sheet 20 in the uncured portion 32 a of the adhesive layer 32 of the second sheet 30. A part of the light is irradiated with light. As a result, the curing reaction proceeds in a portion of the uncured portion 32a that has been irradiated with light. As a result, as shown in FIG. 3C, part of the uncured portion 32a corresponding to the electrodes 23 and 24 of the first sheet 20 changes to the first cured portion 32b, and the first cured portion 32b. The adhesive strength at is lost. At this time, the second substrate 31 and the first cured portion 32b are firmly bonded.

  Thereafter, as shown in FIG. 3 (d), the laminating apparatus 14 includes the first sheet 20 and the second sheet 20 so that the functional layer 22 of the first sheet 20 is covered with the uncured portion 32 a of the adhesive layer 32 of the second sheet 30. A laminating process for bonding the sheet 30 is performed. Thereby, the laminated body 40 in which the first sheet 20 and the second sheet 30 are laminated can be obtained.

  Thereafter, if necessary, the curing processing device 15 irradiates light to a portion corresponding to the functional layer 22 of the first sheet 20 in the uncured portion 32a of the adhesive layer 32 to form the second cured portion 32c. 2 Carry out the curing process. Thereby, as shown in FIG.3 (e), the part corresponding to the functional layer 22 in the uncured part 32a changes to the 2nd cured part 32c. Thereby, the periphery of the functional layer 22 of the first sheet 20 can be quickly sealed by the second cured portion 32 c and the second base material 31. In the second curing process, light may be irradiated from the second base material 31 over the entire surface of the second base material 31.

  The laminated body 40 thus obtained is wound up by a winding device 18 including a winding shaft 18a that is rotationally driven by a driving mechanism (not shown). Thus, the roll body of the laminated body 40 obtained is conveyed to the place for implementing the process mentioned later which exposes the electrodes 23 and 24. FIG.

How to expose the electrode Next, an example of a method for exposing the electrodes 23, 24 of the resulting laminate 40 to the outside will be described. Here, a method of forming the opening 33 shown in FIG. 1 in the stacked body 40 and exposing the electrodes 23 and 24 will be described with reference to FIGS.

  First, as shown in FIG. 4A, cuts 34 and 35 are formed in regions of the first cured portion 32 b of the adhesive layer 32 that overlap the electrodes 23 and 24. The cuts 34 and 35 have a shape corresponding to the outline of the opening 33 described above. In other words, the notches 34 and 35 have a shape corresponding to the contour of the first cured portion 32b that is removed from the electrodes 23 and 24, that is, the so-called contour of the removed portion. As shown in FIG. 4 (a), when viewed along the direction in which the functional layer 22 and the electrodes 23 and 24 are arranged, the incision that is close to the functional layer 22 is referred to as a proximal incision 34. What is more distal to the functional layer 22 than the position notch 34 is also referred to as a distal notch 35.

  As shown in FIG. 4A, each of the cuts 34 and 35 passes from the second base material 31 side toward the electrodes 23 and 24 so as to penetrate at least the second base material 31 and reach the first cured portion 32b. It is formed. Preferably, each of the cuts 34 and 35 is formed so as to penetrate the first cured portion 32b and reach the inside of the electrodes 23 and 24 as short as possible. As a result, it is possible to prevent the characteristics and reliability of the electrodes 23 and 24 from deteriorating while ensuring the ease of work when removing the removed portion of the first cured portion 32b later.

  In the example shown in FIG. 4A, the cuts 34 and 35 are formed so as to have a shape corresponding to the contour of the above-described removal portion, but the present invention is not limited to this. The cut may be formed so as to have a shape corresponding to a range including at least the above-described removal portion. For example, not only the above-described removed portion of the first cured portion 32b but also the second cured portion 32c and the uncured portion 32a may be included within the range surrounded by the cuts. Specifically, an example in which the cut is formed so that the removed portion of the first cured portion 32b formed in two regions separated from each other is removed by one continuous cut.

  Next, as shown in FIG. 4B, the adhesive member 50 is brought into close contact with the laminate 40 from the second base material 31 side. As the adhesive member 50, a member having sufficient adhesion to the second base material 31 is used. Specifically, a member that can make the adhesion between the adhesive member 50 and the second base material 31 greater than the adhesion between the first cured portion 32b and the electrodes 23 and 24 is used. . For example, a rubber blanket can be used as the adhesive member 50.

  Thereafter, the adhesive member 50 is pulled away from the laminate 40 as shown in FIG. Here, as described above, the second base material 31 and the first cured portion 32b are firmly adhered during the first curing process. Accordingly, the adhesion force between the second base material 31 and the first cured portion 32 b is larger than the adhesion force between the first cured portion 32 b and the electrodes 23 and 24. For this reason, when the adhesive member 50 is pulled away from the laminate 40, the removed portion 32 b ′ of the first cured portion 32 b is peeled off from the electrodes 23 and 24 at the same time. Accordingly, the portion of the second base material 31 that overlaps with the removed portion 32b ′ is transferred from the electrode 23, 24 side to the adhesive member 50 side along with the removed portions 32b ′ along the cuts 34, 35. . As a result, an opening 33 is formed on a part of the electrodes 23 and 24 as shown in FIG. In this way, a stacked body 40A in which the electrodes 23 and 24 are exposed to the outside can be obtained.

  Then, you may cut out the laminated body 40 for every functional layer 22. FIG. As a result, as shown in FIG. 4D, a semiconductor device 45 configured as a stacked body 40A including one functional layer 22 can be obtained.

  According to the present embodiment, before the laminating step, at least part of the uncured portion 32a of the adhesive layer 32 of the second sheet 30 is irradiated with light corresponding to the electrodes 23 and 24 of the first sheet 20. Then, the first curing process step for forming the first cured portion 32b is performed. For this reason, the adhesive force of the part which contact | connects the electrodes 23 and 24 of the 1st sheet | seat 20 among the contact bonding layers 32 can be lost at least partially before a lamination process. Thereby, in the obtained laminated body 40, the adhesion between the electrodes 23 and 24 is smaller than that of the second cured portion 32c formed at least partially on the electrodes 23 and 24 after the lamination step. One cured portion 32b can be provided. For this reason, the operation | work which removes the 2nd base material 31 and the 1st hardening part 32b on the electrodes 23 and 24 along the notches 34 and 35 and exposes the electrodes 23 and 24 can be implemented easily. Moreover, since the operation | work which removes the 2nd base material 31 and the 1st hardening part 32b can be implemented after a lamination process, a removal operation | work can be implemented, confirming the actual position of the electrodes 23 and 24. FIG. Therefore, the second base material 31 and the first cured portion 32b on the electrodes 23 and 24 can be accurately removed.

  Further, according to the present embodiment, the effect that the electrodes 23 and 24 of the first sheet 20 can be easily and accurately exposed is partly applied to the adhesive layer 32 of the second sheet 30 before the lamination process. Can be obtained only by irradiation. Therefore, the position information of the electrodes 23 and 24 is acquired before the stacking step, and then an opening is formed in the second base 31, and then the adhesive material is formed in a region other than the opening in the second base 31. Compared with the prior art of applying the coating, the process to be performed immediately before the lamination process can be completed in a short time with a simpler apparatus configuration. For this reason, according to this Embodiment, the time lag after acquiring the positional information on the electrodes 23 and 24 until it implements a lamination process can be made small. Therefore, even if the first sheet 20 and the second sheet 30 are stretched, the uncured portion 32a of the adhesive layer 32 is removed from the first sheet 20 before the positional shift caused by the stretch occurs. The electrodes 23 and 24 can be accurately superimposed. Further, the apparatus cost can be reduced.

The comparative embodiment Next, the effect of this embodiment will be described in comparison with a comparative embodiment. FIG. 5 is a perspective view showing the laminate manufacturing apparatus 70 in the first comparative embodiment, and FIG. 6 is a plan view showing the laminate obtained by using the laminate manufacturing apparatus 70 shown in FIG. is there.

First Comparative Form In the display device 70 according to the first comparative form, as the second sheet 60 having the base material 61 and the adhesive layer 62 for sealing the functional layer 22 of the first sheet 20, A second sheet 60 is used in which openings 63 are formed in advance in portions corresponding to the electrodes 23 and 24 of the sheet 20. Other configurations are substantially the same as those of the above-described embodiment of the present invention shown in FIGS. In the first comparative embodiment shown in FIGS. 5 and 6, the same parts as those in the embodiment of the present invention shown in FIGS.

  When using the roll-to-roll method, it is conceivable that the first sheet 20 and the second sheet 60 expand and contract according to changes in environmental conditions. When the expansion and contraction occurs, in the comparative form, as shown in FIG. 6, the position of the opening 63 formed in advance in the transport direction T is displaced from the position of the first electrode 23 or the second electrode 24. Can be considered. As a result, the functional layer 22 cannot be properly sealed with the second sheet 60, or the electrodes 23 and 24 cannot be exposed.

  On the other hand, according to this Embodiment, the 1st hardening part 32b corresponding to the electrodes 23 and 24 can be formed based on the positional information on the electrodes 23 and 24 acquired immediately before the lamination process. For this reason, even when the first sheet 20 and the second sheet 30 expand and contract, the functional layer 22 is reliably covered with the uncured portion 32a, that is, the second cured portion 32c, and the first and the second layers 30 and 24 are covered with the first layer. The cured portion 32b can be positioned reliably.

Second Comparison Mode Next, the effect of the present embodiment will be described in comparison with the second comparison mode. FIG. 7 is a perspective view showing the laminate manufacturing apparatus 70 in the second comparative embodiment, and FIG. 8 is a plan view showing the laminate obtained by using the laminate manufacturing apparatus 70 shown in FIG. is there. In the display device 70 according to the second comparative embodiment, the electrodes 23 and 24 are disposed adjacent to the functional layer 22 along the width direction of the first sheet 20. Other configurations are substantially the same as those of the above-described embodiment of the present invention shown in FIGS. In the second comparative embodiment shown in FIGS. 7 and 8, the same parts as those in the embodiment of the present invention shown in FIGS.

  When the roll-to-roll method is used, it is conceivable that the position of the second sheet 60 with respect to the first sheet 20 is gradually displaced in the width direction due to a shift at the time of bonding. When the shift in the width direction occurs, it is considered that the position of the opening 63 formed in advance in the width direction is shifted from the position of the first electrode 23 or the second electrode 24 as shown in FIG. As a result, the functional layer 22 cannot be properly sealed with the second sheet 60, or the electrodes 23 and 24 cannot be exposed.

  On the other hand, according to this Embodiment, the 1st hardening part 32b corresponding to the electrodes 23 and 24 can be formed based on the positional information on the electrodes 23 and 24 acquired immediately before the lamination process. For this reason, even if the position of the second sheet 30 relative to the first sheet 20 is gradually displaced in the width direction, the functional layer 22 is reliably covered with the uncured portion 32a, that is, the second cured portion 32c, and on the electrodes 23 and 24. The 1st hardening part 32b can be positioned reliably.

For example, in this embodiment, as shown in FIG. 9 (a) (b), the conveying direction T ₂ of the second sheet 30, it is assumed that deviates slightly to the conveying direction T ₁ of the first sheet 20 . Even in such a case, in the present embodiment, the light irradiation unit 13b irradiates the uncured portion 32a with light based on the positional information of the electrodes 23 and 24 acquired by the detection unit 13a. For this reason, as shown in FIG. 9B, the first cured portions 32 b arranged along the direction T ₃ parallel to the transport direction T ₁ of the first sheet 20 can be formed in the adhesive layer 32. . Thereby, the 1st hardening part 32b can be accurately positioned on the electrodes 23 and 24.

  Note that various modifications can be made to the above-described embodiment. Hereinafter, an example of modification will be described with reference to the drawings. In the following description and the drawings used in the following description, the same reference numerals as those used for the corresponding parts in the above embodiment are used for the parts that can be configured in the same manner as in the above embodiment. A duplicate description is omitted.

Modified Embodiment of Laminate Manufacturing Apparatus In the above-described embodiment, the step of exposing the electrodes 23 and 24 of the laminate 40 to the outside is performed at a place or apparatus different from the place or apparatus where the roll body of the laminate 40 is manufactured. An example of implementation is shown. However, the step of exposing the electrodes 23 and 24 to the outside may be performed in the same place or apparatus as the place or apparatus for manufacturing the roll body of the laminate 40. For example, the laminated body manufacturing apparatus 10 may further include a removing device 16 for exposing the electrodes 23 and 24 to the outside as described below.

  FIG. 10 is a perspective view showing the laminate manufacturing apparatus 10 in this modification. The laminated body manufacturing apparatus 10 is arranged on the downstream side of the laminating apparatus 14 and is configured to remove at least partially the area overlapping the electrodes 23 and 24 of the first cured part 32b as a removed part 32b ′. Is further provided. As shown in FIG. 10, the removing device 16 forms notches 34 and 35 in the second base material 31 and the first cured portion 32b corresponding to the contour of the removed portion 32b ′ of the first cured portion 32b. The adhesive member 16d is brought into contact with the portion 16a and the second base material 31, and the portion of the second base material 31 that overlaps the removal portion 32b ′ of the first cured portion 32b is removed together with the removal portion 32b ′ in the first sheet. And a peeling portion 16b that moves from the 20 electrodes 23 and 24 to the adhesive member 16d side.

  As long as the cuts 34 and 35 as shown in FIG. 4A can be formed in the second base material 31 and the first cured portion 32b, the specific configuration of the cut forming portion 16a is particularly limited. Never happen. For example, the cut forming portion 16a has a shape corresponding to the shapes of the cuts 34 and 35, and is configured as a blade that can be inserted into the second base material 31 and the first hardened portion 32b. Although not shown, the cut forming portion 16a may include a detection portion that detects the detection mark 26 provided on the first sheet 20. Thereby, the notch formation part 16a can pinpoint the place where the notches 34 and 35 should be formed among the laminated bodies 40. FIG.

  For example, as illustrated in FIG. 10, the peeling unit 16 b includes an unwinding unit 16 e that supplies the adhesive member 16 d, a roller 16 c that presses the adhesive member 16 d supplied from the adhesive member 16 d against the second sheet 30, The winding part 16f which winds up the adhesive member 16d which passed between the 2 sheet | seat 30 and the roller 16c is included. As in the case of the above-described adhesive member 50, the adhesive member 16 d has an adhesive force between the adhesive member 16 d and the second base material 31 between the first cured portion 32 b and the electrodes 23 and 24. It is comprised so that it may become larger than adhesive force. For example, a rubber blanket is used as the adhesive member 16d.

  Hereinafter, a method for manufacturing the stacked body 40A in which the electrodes 23 and 24 are exposed will be described using the stacked body manufacturing apparatus 10 in the present modification.

(Laminate manufacturing process)
First, using the first supply device 11, the second supply device 12, the first curing processing device 13, the stacking device 14, and the second curing processing device 15, the first sheet 20 and the second sheet 30 are stacked. The body 40 is manufactured. Since the method for manufacturing the laminated body 40 is the same as the method of the present embodiment shown in FIGS. 3A to 3E, detailed description thereof is omitted.

(Incision forming process)
Next, the notch forming part 16a of the removing device 16 is inserted into the second base material 31 and the first cured portion 32b of the second sheet 30 from the second sheet 30 side. As a result, cuts 34 and 35 are formed in portions of the first cured portion 32 b that overlap the electrodes 23 and 24. The cuts 34 and 35 are the same as those in the above-described embodiment shown in FIG.

(Peeling process)
Next, the roller 16c of the peeling part 16b adheres the adhesive member 16d to the laminate 40 from the second base material 31 side. As a result, the portion of the second base material 31 that overlaps the removed portion 32b ′ of the first cured portion 32b along the cuts 34 and 35 together with the removed portion 32b ′ from the electrodes 23 and 24 side to the adhesive member 50 side. It is moved to. In this way, a stacked body 40A in which the electrodes 23 and 24 are exposed to the outside can be obtained. In addition, since a mode that the removal part 32b 'and the 2nd base material 31 are partially peeled is the same as the case of the above-mentioned this Embodiment shown to FIG.4 (b) (c), detailed description is given. Omitted.

  In this way, the removal step of removing the first cured portion 32b at least partially as the removal portion 32b 'is performed in the laminate manufacturing apparatus 10.

  According to this modification, the laminate manufacturing apparatus 10 not only functions to manufacture the laminate 40 by bonding the first sheet 20 and the second sheet 30, but also at least partially removes the first cured portion 32b. It also has a function. For this reason, by using the laminate manufacturing apparatus 10, the laminate 40A in which the electrodes 23 and 24 are exposed to the outside can be efficiently manufactured. Thus, higher efficiency and space saving can be achieved as compared with the case where the step of manufacturing the laminate 40 and the step of exposing the electrodes 23 and 24 to the outside are performed in different places and apparatuses.

Variation of Method for Exposing Electrodes In the present embodiment described above, in the step for exposing electrodes 23 and 24 to the outside, both notches 34 and 35 penetrate through second base material 31 and are first cured. An example of reaching the portion 32b is shown. However, it is sufficient that at least the proximal cut 34 penetrates the second base material 31 to reach the first hardened portion 32b, and the distal cut 35 does not have to pass through the first hardened portion 32b. For example, as shown in FIG. 11A, the distal cut 35 may be formed in a region that does not overlap the first cured portion 32b when viewed from the normal direction of the first base material 21. Even in this case, depending on the conditions, as shown in FIGS. 10B and 10C, the second base material 31 and the first cured portion 32b in the region surrounded by the notches 34 and 35 may be connected to the electrodes 23, It can be shifted from the 24 side to the adhesive member 50 side. For example, when the contact area between the second cured portion 32c and the electrodes 23, 24 and the first sheet 20 is sufficiently smaller than the contact area between the first cured portion 32b and the electrodes 23, 24, etc. 11 (b) and (c) can be transferred.

  Moreover, in this Embodiment mentioned above, the example which ensures the electrical connection with respect to the electrodes 23 and 24 by forming the opening part 33 on the electrodes 23 and 24 was shown. However, as described below with reference to FIGS. 12A to 12C, electrical connection to the electrodes 23 and 24 can be ensured without forming the opening 33.

  First, as shown in FIG. 12A, a laminated body in which the first sheet 20 and the second sheet 30 are laminated in the same manner as in the case of the present embodiment shown in FIGS. 3A to 3E. Get 40. Next, as illustrated in FIG. 12B, the stacked body 40 is cut into a plurality of sections each including one functional layer 22. For example, the stacked body 40 is cut out along the cutting line indicated by XX in FIG. At this time, the cutting line XX is set to pass through at least the electrodes 23 and 24 and the first cured portion 32b.

  Thereafter, as shown in FIG. 12 (c), at the end of the semiconductor device 45, the second base material 31 and the first cured portion 32b are slightly separated from the electrodes 23 and 24, whereby the first cured portion 32b and A slight gap is formed between the electrodes 23 and 24. Here, as described above, the adhesive force of the first cured portion 32 b is lost before the first cured portion 32 b contacts the electrodes 23 and 24. For this reason, the 1st hardening part 32b can be pulled apart from the electrodes 23 and 24 easily. That is, the gap between the first cured portion 32b and the electrodes 23 and 24 can be easily formed.

  Thereafter, the wiring 47 is inserted into the formed gap. In this way, electrical connection to the electrodes 23 and 24 can be ensured without forming the opening 33.

In the modified example of the first cured portion and the above-described embodiment and each modified example, the example in which the first cured portion 32b is formed over the entire region in the thickness direction of the adhesive layer 32 is shown. However, the present invention is not limited to this, and it is sufficient that the first cured portion 32b is formed in at least a portion of the adhesive layer 32 that contacts the electrodes 23 and 24. That is, it is only necessary that the adhesive force in at least a portion of the adhesive layer 32 that contacts the electrodes 23 and 24 is lost before the laminating process. As a result, the work of exposing the electrodes 23 and 24 can be facilitated.

In the modified example of the first curing process and the present embodiment and the modified examples described above, light is irradiated to the part corresponding to the electrodes 23 and 24 of the first sheet 20 in the uncured part 32a of the adhesive layer 32. An example is shown. However, the present invention is not limited to this, and the portion of the uncured portion 32a corresponding to the first substrate 21 of the first sheet 20 may be further irradiated with light. For example, as shown in FIGS. 13A and 13B, each of the plurality of electrodes 23 and 24 arranged along the conveyance direction T ₁ of the first sheet 20 is arranged in the conveyance direction T ₁ of the first sheet 20. as the first cured portion 32b extending continuously along the direction parallel to T ₃ are in contact may be irradiated with light in uncured portion 32a. Thereby, control of the light irradiation part 13b which irradiates light to the uncured part 32a can be simplified.

  In this case, in the laminating step, the first cured portion 32b that has lost adhesiveness straddles the step between the electrodes 23, 24 and the first base member 21 existing at the ends of the electrodes 23, 24, It is conceivable that the electrodes 23 and 24 and the first base material 21 are brought into contact with each other. For this reason, it is conceivable that a gap is generated between the first cured portion 32 b and the first base material 21 in the vicinity of the ends of the electrodes 23 and 24. Even in this case, the functional layer 22 is covered with the second cured portion 32 c and the second base material 31, and therefore, it is possible to prevent moisture and oxygen from coming into contact with the functional layer 22. That is, even if there is a gap between the first cured portion 32b and the first base material 21 in the vicinity of the ends of the electrodes 23 and 24, there is no effect on the sealing characteristics of the functional layer 22, It can be said that it is a slight one.

  In addition, although some modified examples with respect to the above-described embodiment have been described, naturally, a plurality of modified examples can be applied in combination as appropriate.

DESCRIPTION OF SYMBOLS 10 Laminate manufacturing apparatus 11 1st supply apparatus 12 2nd supply apparatus 13 1st hardening processing apparatus 14 Lamination apparatus 20 1st sheet | seat 21 1st base material 22 Functional layer 23 1st electrode 24 2nd electrode 30 2nd sheet | seat 31 1st 2 base materials 32 adhesive layer 32a uncured portion 32b first cured portion 40 laminate

Claims (12)

A laminate manufacturing method for manufacturing a laminate including a sealed semiconductor layer,
A first sheet is provided that includes a first substrate, a functional layer that is provided on the first substrate and includes a semiconductor layer made of a semiconductor material, and an electrode connected to the functional layer. Sheet feeding process;
A second sheet supply step of supplying a second sheet having a second substrate and an adhesive layer provided on the second substrate and including a photocurable material;
And laminating the first sheet and the second sheet so that the functional layer of the first sheet is covered by the adhesive layer of the second sheet,
The adhesive layer of the second sheet supplied in the second sheet supply step includes an uncured portion,
The laminate manufacturing method is performed before the laminating step, and at least partially irradiates light to a portion corresponding to the electrode of the first sheet among the uncured portions of the adhesive layer of the second sheet. And the laminated body manufacturing method further provided with the 1st hardening process process of forming a 1st hardening part.   The first curing treatment step includes a detection step of acquiring position information of the electrode of the first sheet, and the position of the adhesive layer of the second sheet based on the position information obtained in the detection step. The laminated body manufacturing method of Claim 1 which has a light irradiation process which irradiates light at least partially to the part corresponding to the said electrode of a said 1st sheet | seat among hardened | cured parts. A second curing process that is performed after the laminating step and cures a portion corresponding to the functional layer of the first sheet in the uncured portion of the adhesive layer of the second sheet to form a second cured portion. Further comprising a process,
The adhesion between the first cured portion of the adhesive layer and the electrode is smaller than the adhesion between the second cured portion of the adhesive layer and the electrode. The laminated body manufacturing method as described in 1 .. After the laminating step, the method further comprises a removing step of removing at least part of the first cured portion of the adhesive layer overlapping the electrode as a removed portion,
The laminate manufacturing according to any one of claims 1 to 3, wherein in the removing step, a portion of the second base material that overlaps the removed portion of the first cured portion is removed together with the removed portion. Method. The removal step includes
A notch forming step of forming a cut corresponding to a range including at least the removed portion of the first cured portion in the second base material and the first cured portion;
The adhesive member is brought into contact with the second base material, and the portion of the second base material that overlaps the removed portion of the first cured portion is together with the removed portion from the electrode side of the first sheet. The laminate manufacturing method according to claim 4, further comprising a peeling step of shifting to the adhesive member side. A laminate manufacturing apparatus for manufacturing a laminate including a sealed semiconductor layer,
A first sheet is provided that includes a first substrate, a functional layer that is provided on the first substrate and includes a semiconductor layer made of a semiconductor material, and an electrode connected to the functional layer. A feeding device;
A second supply device that supplies a second sheet having a second substrate and an adhesive layer that is provided on the second substrate and includes a photocurable material;
A laminating apparatus that bonds the first sheet and the second sheet so that the functional layer of the first sheet is covered by the adhesive layer of the second sheet;
The adhesive layer of the second sheet supplied from the second supply device includes an uncured portion,
The laminated body manufacturing apparatus is disposed upstream of the laminating apparatus, and at least partially emits light to a portion corresponding to the electrode of the first sheet among the uncured portions of the adhesive layer of the second sheet. The laminated body manufacturing apparatus further provided with the 1st hardening processing apparatus which irradiates and forms a 1st hardening part.   The first curing processing device is configured to detect a position of the electrode of the first sheet based on the position information obtained by the detection unit and the position information obtained by the detection unit. The laminated body manufacturing apparatus according to claim 6, further comprising: a light irradiation unit that at least partially irradiates light to a portion of the cured portion corresponding to the electrode of the first sheet. 2nd which arrange | positions in the downstream of the said lamination | stacking apparatus, hardens the part corresponding to the said functional layer of the said 1st sheet | seat among the said uncured part of the said contact bonding layer of the said 2nd sheet | seat, and forms the 2nd hardening part. Further comprising a curing device;
The adhesion between the first cured portion of the adhesive layer and the electrode is smaller than the adhesion between the second cured portion of the adhesive layer and the electrode. The laminated body manufacturing apparatus described in 1. A removing device that is disposed on the downstream side of the laminating device and removes at least part of the uncured portion of the adhesive layer of the second sheet overlapping the electrode as a removed portion;
The said removal apparatus is comprised so that the part which overlaps with the said removal part of the said 1st hardening part among the said 2nd base materials may be removed with the said removal part. Laminate manufacturing equipment. The removal device comprises:
A notch forming portion for forming a notch corresponding to a range including at least the removed portion of the first cured portion in the second base material and the first cured portion;
The adhesive member is brought into contact with the second base material, and the portion of the second base material that overlaps the removed portion of the first cured portion is together with the removed portion from the electrode side of the first sheet. The laminate manufacturing apparatus according to any one of claims 6 to 9, further comprising a peeling portion that is moved to the adhesive member side. A first substrate;
A functional layer including a semiconductor layer provided on the first base material and made of a semiconductor material;
An electrode connected to the functional layer;
An adhesive layer arranged to overlap the functional layer and the electrode;
A second substrate disposed on the adhesive layer,
The adhesive layer includes a first cured portion disposed so as to at least partially overlap the electrode, and a second cured portion disposed so as to cover the functional layer, and the first cured portion and the first cured portion 2 cured parts are composed of the same material,
The laminated body in which the adhesive force between the first cured portion of the adhesive layer and the electrode is smaller than the adhesive force between the second cured portion of the adhesive layer and the electrode. An opening is formed to at least partially expose the surface on the second substrate side of the surface of the electrode,
The laminate according to claim 11, wherein the first cured portion is in contact with the opening.

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