JP2004247239A - Display device and process of manufacture therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To strip a protecting member in between an element substrate, an adhering layer and a sealing substrate from the element substrate, and to expose a terminal for electrical connection from outside in a simple procedure in a top surface light emitting type organic EL display device. <P>SOLUTION: The terminal 11 is covered by a masking tape (the protecting member 60) before the element side base substrate and the sealing side base substrate are adhered by the adhering layer 30. Next, the adhered element side base substrate and the sealing side base substrate are parted into the element substrate 10 and the sealing substrate 20. Then, each empty range (adhesive application part) of the element substrate 10 and the sealing substrate 20 is eliminated by bending them along a scribe groove. At the same time, the masking tape (the protecting member 60) is stripped from the element substrate 10 and, as the result, the terminal 11 is exposed. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a display device manufacturing method and a display device having a structure in which an element substrate having a light emitting element and a sealing substrate are bonded together via an adhesive layer, and particularly to an organic light emitting device using a top emitting organic light emitting device. The present invention relates to a method for manufacturing a display device suitable for a display and a display device.
[0002]
[Prior art]
In recent years, an organic light emitting display using an organic light emitting element has been receiving attention as a display device replacing the liquid crystal display. Organic light-emitting displays are self-luminous and have a wide viewing angle and low power consumption, and are considered to have sufficient responsiveness to high-definition high-speed video signals. It is being developed for practical use.
[0003]
In the production process of an organic light emitting display, for example, after an organic light emitting device is formed on an element substrate, the back side of the element substrate is sealed to shut off the organic light emitting device from the atmosphere. Organic light-emitting elements are extremely sensitive to moisture, and when exposed to the atmosphere, absorb moisture and create areas (dark spots) that do not emit light, which may cause a decrease in brightness or life. Therefore, sealing is an essential technology for organic light-emitting displays. is there.
[0004]
Conventionally, a method in which light generated by an organic light emitting element is taken out from the side of an element substrate, an adhesive such as an ultraviolet curable resin is applied to a peripheral portion of a back surface of the element substrate, and a cover for shielding the atmosphere is attached. Has been done. In this conventional method, the adhesive is applied only to the peripheral portion of the panel. Therefore, when the adhesive is applied, the terminal for electrical connection to the outside of the organic light emitting element is covered with the adhesive. It is relatively easy to prevent the contact from occurring, and there was no problem in taking out the terminal portion.
[0005]
Conventionally, in the liquid crystal display device, in order to prevent the width of the seal portion formed on the terminal portion from being partially thinned or thickened due to the shape of the wiring pattern of the terminal portion, There has been proposed a configuration in which a barrier pattern made of an insulating layer is provided along the side of the seal portion to make the width of the seal portion constant (for example, see Patent Document 1).
[0006]
[Patent Document 1]
JP 2002-244148 A
[Problems to be solved by the invention]
However, in the case of a top emission / perfect solid sealing structure in which the element substrate and the sealing substrate are bonded over the entire surface via an adhesive layer so that light generated by the organic light emitting element is extracted from the sealing substrate side. In order to protect the terminal portion from adhesion of the adhesive, it is necessary to protect the terminal portion with a protective member such as a protective tape before bonding with the adhesive layer. Therefore, after bonding, the protective member is sandwiched between the element substrate, the adhesive layer, and the sealing substrate. A method of peeling the protective member buried in the adhesive layer from the element substrate and taking out the terminal portion has not been developed so far.
[0008]
In particular, in order to realize a so-called multiple-panel manufacturing process in which a large substrate is divided into multiple display devices in consideration of mass productivity, it is absolutely inevitable to establish a method of extracting a terminal portion.
[0009]
The present invention has been made in view of such a problem, and an object of the present invention is to remove a protection member sandwiched between an element substrate, an adhesive layer, and a sealing substrate from the element substrate by a simple procedure, and to form a terminal portion. It is an object of the present invention to provide a display device manufacturing method and a display device that can take out the display device.
[0010]
[Means for Solving the Problems]
A method of manufacturing a display device according to the present invention includes an element substrate having a plurality of light-emitting elements and a terminal portion for electrical connection to the outside of the light-emitting element, and a sealing member arranged to face the light-emitting element of the element substrate. Manufacturing a display device including a substrate, a step of covering the terminal portion with a protective member, and a step of providing an adhesive layer between the element substrate and the sealing substrate so as to cover the light emitting element and the protective member; And removing a part of the element substrate and the sealing substrate bonded to each other via the adhesive layer, thereby removing the protection member together with the removed portion to expose the terminal portion.
[0011]
A display device according to the present invention includes an element substrate having a plurality of light-emitting elements and a terminal portion for electrical connection to the outside of the light-emitting element, and a sealing substrate facing the light-emitting element side of the element substrate. A light emitting element for extracting light generated by the light emitting element from the side of the sealing substrate, the terminal part being covered with a protective member, and an adhesive layer covering the light emitting element and the protective member between the element substrate and the sealing substrate. Then, by removing a part of the element substrate and the sealing substrate bonded together via the adhesive layer, the protection member is removed together with the removed part to expose the terminal part.
[0012]
In the display device manufacturing method and the display device according to the present invention, the terminal portion is covered with the protective member, and the adhesive layer is provided between the element substrate and the sealing substrate so as to cover the light emitting element and the protective member. By removing a part of the element substrate and the sealing substrate which are bonded together via the layer, the protection member is removed together with the removed portion, and the terminal portion is taken out.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0014]
FIG. 1 shows a schematic structure of a display device according to an embodiment of the present invention. The display device is an ultra-thin organic light-emitting display used for, for example, a PDA (Personal Digital Assistants) or a mobile phone. For example, the element substrate 10 and the sealing substrate 20 are arranged to face each other. The entire surface is bonded via an adhesive layer 30. On one side of the element substrate 10, a terminal portion 11 for electrical connection to the outside of the organic light emitting element is provided as a signal input and power supply port to the organic light emitting element described later. The terminal portion 11 is formed of, for example, titanium (Ti) -aluminum (Al), and its surface is not covered with the adhesive layer 30 and the sealing substrate 20, but is exposed.
[0015]
In this display device, as will be described later, the terminal portion 11 is covered with a protective member such as a masking tape, and an adhesive layer 30 is provided between the element substrate 10 and the sealing substrate 20, and then bonded by the adhesive layer 30. By removing a part of the element substrate 10 and the sealing substrate 20 that have been removed, the protection member is removed together with the part to be removed, so that the terminal portion 11 is exposed.
[0016]
FIG. 2 illustrates an example of a cross-sectional configuration of the display device. The element substrate 10 is made of, for example, an insulating material such as glass, and includes an organic light emitting element 10R that generates red light, an organic light emitting element 10G that generates green light, and an organic light emitting element 10B that generates blue light. Are sequentially provided in a matrix form as a whole.
[0017]
The organic light-emitting elements 10R, 10G, and 10B include, for example, a first electrode 12 as an anode, an organic layer 13 including a light-emitting layer, and a second electrode 14 as a cathode, which are stacked in this order from the element substrate 11 side. I have.
[0018]
The first electrode 12 also functions as a reflection layer, and is made of, for example, a metal or alloy such as platinum (Pt), gold (Au), chromium (Cr), or tungsten (W).
[0019]
The configuration of the organic layer 13 differs depending on the emission color of the organic light emitting device. The organic light emitting devices 10R and 10B have a structure in which a hole transport layer, a light emitting layer, and an electron transport layer are stacked in this order from the first electrode 12 side. It has a structure in which a light emitting layer is stacked in this order from the first electrode 12 side. The hole transport layer is for increasing the efficiency of hole injection into the light emitting layer. In the light emitting layer, recombination of electrons and holes occurs when an electric field is applied, and light is generated. The electron transport layer is for increasing the efficiency of injecting electrons into the light emitting layer.
[0020]
As a constituent material of the hole transport layer of the organic light emitting device 10R, for example, bis [(N-naphthyl) -N-phenyl] benzidine (α-NPD) can be cited, and as a constituent material of the light emitting layer of the organic light emitting device 10R. Is, for example, 2,5-bis [4- [N- (4-methoxyphenyl) -N-phenylamino]] styrylbenzene-1,4-dicarbonitrile (BSB). As a constituent material of the electron transport layer, for example, 8-quinolinol aluminum complex (Alq ₃ ) can be given.
[0021]
As a constituent material of the hole transport layer of the organic light emitting device 10B, for example, α-NPD can be mentioned. As a constituent material of the light emitting layer of the organic light emitting device 10B, for example, 4,4-bis (2,2-diphenyl) is used. Binin) biphenyl (DPVBi) and the like, as the material of the electron transport layer of the organic light emitting element 10B, for example, Alq _3.
[0022]
As a material of the hole transport layer of the organic light emitting element 10G, for example, it includes alpha-NPD, as the material of the light-emitting layer of the organic light emitting element 10G, for example, coumarin 6 to Alq _3; a (C6 Coumarin6) 1% by volume is exemplified.
[0023]
The second electrode 14 is formed of a semi-transparent electrode, and light generated in the light emitting layer is extracted from the second electrode 14 side. The second electrode 14 is made of, for example, a metal or alloy such as silver (Ag), aluminum (Al), magnesium (Mg), calcium (Ca), and sodium (Na).
[0024]
The sealing substrate 20 is located on the organic light emitting elements 10R, 10G, 10B side of the element substrate 10, and seals the organic light emitting elements 10R, 10G, 10B together with the adhesive layer 30. The sealing substrate 20 is made of a material such as glass that is transparent to light generated in the organic light emitting elements 10R, 10G, and 10B. The sealing substrate 20 is provided with, for example, a color filter 21 (21R, 21G, 21B) to take out the light generated in the organic light emitting devices 10R, 10G, 10B, as well as the organic light emitting devices 10R, 10G, 10B and The external light reflected by the wiring in the meantime is absorbed to improve the contrast.
[0025]
This display device can be manufactured, for example, as follows.
[0026]
3 to 11 show a method of manufacturing the display device in the order of steps. First, as shown in FIG. 3, for example, an element-side base substrate 40 including a plurality of the element substrates 10 described above is formed. On the element-side base substrate 40, as shown by the dotted line in FIG. 3, for example, a region in which four rows and three columns, that is, a total of twelve element substrates 10 is laid out. An element-side empty area 41 is provided between them. The element-side vacant area 41 serves as a margin for removing a protective member described later.
[0027]
The element-side base substrate 40 includes, for example, organic light-emitting elements 10R, 10G, and 10B (not shown in FIG. 3; see FIG. 2) and the organic light-emitting elements 10R, 10G, and 10B for each element substrate 10. Is formed with a terminal portion 11 for electrical connection with the outside. As a method for forming the organic light emitting elements 10R, 10G, and 10B, for example, a plurality of first electrodes 12 made of the above-described material are formed in parallel, and a hole injection made of the above-described material is formed on the anode 12. Layer, a hole transport layer, a light emitting layer, and an electron transport layer are sequentially formed to form an organic layer 13, and then a plurality of second electrodes 14 made of the above-described material are placed in a direction perpendicular to the first electrode 12. Are formed in parallel. In addition, the terminal portion 11 is formed by PVD (Physical Vapor Deposition) using, for example, Ti-Al.
[0028]
After forming the element-side base substrate 40, as shown in FIG. 4, for example, a sealing-side base substrate 50 including a plurality of the above-described sealing substrates 20 is formed. On the sealing-side base substrate 50, as shown by the dotted line in FIG. 4, for example, four rows and three columns, a total of 12 sealing substrates 20 are laid out. A sealing-side free space 51 is provided between the substrates 20. The sealing-side empty area 51 serves as a margin for removing a protection member described later.
[0029]
Further, on the sealing-side base substrate 50, for example, a color filter 21 (not shown in FIG. 4; see FIG. 2) is formed for each sealing substrate 20.
[0030]
After forming the element-side base substrate 40 and the sealing-side base substrate 50, as shown in FIG. 5, the terminal portions 11 of each element substrate 20 of the element-side base substrate 40 are covered with a protection member 60. As the protective member 60, it is preferable to use a masking tape having heat resistance, such as a Kapton tape commercially available from Sumitomo 3M Limited. This is because, when the adhesive layer 30 is cured, it is necessary to heat the adhesive layer 30 at a predetermined temperature for a predetermined time, for example, so that the protective member 60 needs to be able to withstand this heating.
[0031]
Further, it is more preferable that the protection member 60 has conductivity. This is because it is possible to prevent an adverse effect due to static electricity from exerting on a TFT (Thin Film Transistor; not shown) provided to the organic light emitting elements 10R, 10G, and 10B.
[0032]
The thickness of the protection member 60 is preferably, for example, not less than 10 μm and not more than 60 μm. It is practically difficult to use the protective member 60 having a thickness of less than 10 μm, and if the thickness of the protective member 60 is larger than 60 μm, the thickness of the adhesive layer 30 is increased accordingly, so that the viewing angle is reduced. This is because it is difficult to make use of the characteristic of the organic light emitting display such as a wide viewing angle.
[0033]
After covering the terminal portion 11 with the protective member 60, as shown in FIG. 6, an adhesive layer 30 is provided over the entire surface between the element-side base substrate 40 and the sealing-side base substrate 50, and the element-side base substrate 40 The sealing-side base substrate 50 is bonded via the adhesive layer 30. Thereby, an adhesive layer 30 is provided between each element substrate 10 and the corresponding sealing substrate 20 so as to cover the organic light emitting elements 10R, 10G, 10B (see FIG. 2) and the protective member 60. The substrate 10 and the corresponding sealing substrate 20 are bonded via the adhesive layer 30.
[0034]
After bonding the element-side base substrate 40 and the sealing-side base substrate 50, the terminal portion 11 is taken out in parallel with the separation of the element-side base substrate 40 and the sealing-side base substrate 50 as follows. Do.
[0035]
First, as shown in FIG. 7, the sealing side base substrate 50 is set on a glass scriber table with the sealing side base substrate 50 facing upward, and the sealing side base substrate 50 is placed on the sealing side along the four sides of the sealing substrate 20. The scribe grooves 52A, 52B, 52C, 52D, 52E, 52F, 52G, 52H, 521, 52J, and 52K are provided.
[0036]
Next, the sealing side scribe grooves 52A to 52K shown in FIG. 7 are set on a glass breaker, and an impact is applied along the sealing side scribe grooves 52A to 52K to grow the sealing side scribe grooves 52A to 52K in a crack shape. Break the base substrate 50 side.
[0037]
Subsequently, as shown in FIG. 8, the element-side base substrate 40 is turned upside down and set on a glass scriber table, and the element-side base substrate 40 is placed along the four sides of the element substrate 10. Element-side scribe grooves 42A, 42B, 42C, 42D, 42E, 42F, 42G, 42H, 42I, 42J, and 42K are provided.
[0038]
Next, the device-side base substrate 40 is set in a glass breaker and subjected to an impact along the device-side scribe grooves 42A to 42K shown in FIG. 8 to grow the device-side scribe grooves 42A to 42K in a crack shape. Break the side. The scribing and breaking may be performed first on the element-side base substrate 40 side.
[0039]
Next, as shown in FIG. 9, the element side scribe grooves 42A, 42B, 42C, 42D, 42E, 42F, 42H, 42J and the sealing side scribe grooves 52A, 52B, 52C, 52D, 52E, 52F, 52H, The element-side base substrate 40 and the sealing-side base substrate 50 are divided along 52I. This division can be performed manually, for example. At this time, the element-side scribe grooves 42G, 42I, and 42K and the sealing-side scribe grooves 52G, 52I, and 52K are not divided.
[0040]
Thereby, as shown in FIG. 10, a display device in which the element substrate 10 and the sealing substrate 20 are bonded via the adhesive layer 30 is obtained. In this display device, the protective member 60 is sandwiched between the element substrate 10, the sealing substrate 20, and the adhesive layer 30, and is buried in the adhesive layer 30. In addition, the display device is provided with an element-side empty area 41 and a sealing-side empty area 51 via the undivided element-side scribe grooves 42G, 42I, and 42K and sealing-side scribe grooves 52G, 52I, and 52K. It is in the state of having done.
[0041]
Subsequently, as shown in FIG. 11, the element-side vacant regions 41 and the sealing-side vacant regions 51 of the element substrate 10 and the sealing substrate 20 are divided into the element-side scribe grooves 42G, 42I, 42K and the sealing-side scribe grooves 52G. , 52I, and 52K by bending. Thereby, the protection member 60 is peeled off from the element substrate 10 and removed together with the removed element-side vacant area 41 and the sealing-side vacant area 51, so that the terminal portion 11 can be exposed.
[0042]
In the bending / removing operation, for example, it is preferable to use a bending jig 70 as shown in FIG. 12 in order to uniformly apply a force to the element-side empty region 41 and the sealing-side empty region 51. . The bending jig 70 is provided with, for example, a holding portion 71 that sandwiches the element-side empty region 41 and the sealing-side empty region 51 with a hinge portion 70a therebetween, and a grip portion 72 that is gripped by an operator. As shown in FIG. 13, the operator holds the bending jig 70 with one hand, sandwiches the element-side empty region 41 and the sealing-side empty region 51 with the bending jig 70, and The ends can be pinched with one hand to bend the element-side free area 41 and the sealing-side free area 51. The folding jig 70 is made of aluminum or the like for weight reduction. However, only the holding portion 71 sandwiching the element-side empty region 41 and the sealing-side empty region 51 prevents the display device from being damaged. For this reason, it is preferable to use a resin or the like. Although the bending jig 70 is used for performing the bending operation manually, it is needless to say that the bending operation can be automated.
[0043]
The width of the element-side free area 41 is preferably, for example, 1 mm or more. This is because the width needs to be 1 mm or more as a realistic value that can be sandwiched by using the bending jig 70 or the like. Although the upper limit of the width varies depending on the size of the display device, for example, it is preferably 35 mm or less, and more preferably 30 mm or less. This is because if it exceeds 35 mm, wasteful portions increase, and the manufacturing efficiency decreases. Also, if the thickness is 30 mm or less, almost even a display device for a large screen can be used.
[0044]
The width of the sealing-side free area 51 is a value obtained by adding the width of the protection member 60 to the width of the element-side free area 41 described above.
[0045]
Thus, the display device shown in FIGS. 1 and 2 is completed.
[0046]
In this display device, for example, when a predetermined voltage is applied between the first electrode 12 and the second electrode 14, a current is injected into the light emitting layer of the organic layer 13, and holes and electrons are recombined. This causes light emission. This light is extracted from the sealing substrate 20 side. Here, after the terminal portion 11 is covered with the protective member 60, in a process of removing a part of the element substrate 10 and the sealing substrate 20 bonded by the adhesive layer 30, the protective member 60 is removed together with the removed portion. Is removed to expose the surface. Therefore, the electrical connection of the terminal portion 11 can be easily performed, and the characteristics of the organic light emitting device having the top emission and complete solid sealing structure are improved.
[0047]
As described above, in the present embodiment, the terminal portion 11 provided on the element substrate 10 is covered with the protective member 60 such as a masking tape, and the element substrate 10 and the sealing substrate 20 are attached to each other with the adhesive layer 30. Since the protection member 60 is also removed at the same time when the part 10 and the sealing substrate 20 are removed, the surface of the terminal part 11 can be easily exposed.
[0048]
As described above, the present invention has been described with reference to the embodiment. However, the present invention is not limited to the above embodiment, and various modifications are possible. For example, in the above-described embodiment, the present invention is applied to a so-called multiple-panning process, and the element-side base substrate 40 including a plurality of element substrates 10 and the sealing-side base substrate 50 including a plurality of sealing substrates 20 are formed. After forming and bonding these via the adhesive layer 30, the case where the terminal portion 11 is taken out in parallel with the separation of the element-side base substrate 40 and the sealing-side base substrate 50 has been described. Is not necessarily limited to only a multiple manufacturing process. For example, when the sizes of the element substrate 10 and the sealing substrate 20 are large, the dividing scribe grooves 42A, 42B, 42C, 42D, 42E, 42F, 42H, 42J, 52A, 52B, 52C, 52D, 52E, 52F. , 52H, 52I, only the scribe grooves 42G, 42I, 42K, 52G, 52I, 52K for removing the protection member 60 are provided, and the portions of the element substrate 10 and the sealing substrate 20 outside the protection member 60. May be bent and removed along the scribe grooves 42G to 42K and 52G to 52K for removing the protection member 60.
[0049]
【The invention's effect】
As described above, according to the display device manufacturing method or the display device of the present invention, the terminal portion provided on the element substrate is covered with a protective member such as a masking tape, and the element substrate and the sealing substrate are bonded with an adhesive layer. After that, when removing a part of the element substrate and the sealing substrate, the protective member is also peeled off at the same time, so that the surface of the terminal portion can be easily exposed by a simple procedure. Therefore, it can be suitably used particularly for manufacturing an organic light emitting display using a top emission type organic light emitting element.
[Brief description of the drawings]
FIG. 1 is a perspective view illustrating a schematic configuration of a display device according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view for explaining an element structure of the display device shown in FIG.
3 is a configuration diagram of an element-side base substrate used in a manufacturing process of the display device shown in FIG.
FIG. 4 is a structural view of a sealing-side base substrate.
FIG. 5 is a plan view for explaining a manufacturing process of the display device shown in FIG.
FIG. 6 is a view for explaining a manufacturing step following the step in FIG. 5;
FIG. 7 is a view for explaining a manufacturing step following the step in FIG. 6;
FIG. 8 is a view for explaining a manufacturing step following the step in FIG. 7;
FIG. 9 is a view for explaining a manufacturing step following the step in FIG. 8;
FIG. 10 is a view for explaining a manufacturing step following the step in FIG. 9;
FIG. 11 is a view for explaining a manufacturing step following the step in FIG. 10;
FIG. 12 is a perspective view of a jig used in the process of FIG.
FIG. 13 is a view for explaining how to use the jig shown in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Element board, 11 ... Terminal part, 20 ... Sealing board, 30 ... Adhesive layer, 40 ... Element side base board, 50 ... Sealing side base board

Claims (6)

Manufacture of a display device comprising: an element substrate having a plurality of light emitting elements and a terminal portion for electrical connection to the outside of the light emitting element; and a sealing substrate facing the light emitting element side of the element substrate. The method,
A step of covering the terminal portion with a protective member;
Providing an adhesive layer between the element substrate and the sealing substrate so as to cover the light emitting element and the protection member;
Removing a part of the element substrate and the sealing substrate bonded via the adhesive layer, thereby removing the protection member together with the part to be removed to expose the terminal portion. A method for manufacturing a display device, comprising: 2. The method according to claim 1, wherein the width of the removed portion of the element substrate is 1 mm or more. Before the step of covering the terminal portion with a protective member, the method includes a step of forming an element-side base substrate including a plurality of the element substrates and a sealing-side base substrate including a plurality of the sealing substrates.
In the step of providing the adhesive layer, providing the adhesive layer over the entire surface between the element-side base substrate and the sealing-side base substrate,
2. The display device according to claim 1, wherein the step of exposing the terminal portion is performed in parallel with the separation of the element-side base substrate and the sealing-side base substrate bonded by the adhesive layer. 3. Method. The light emitting element has a configuration in which an organic layer including a light emitting layer is sequentially stacked from a side of the element substrate on the element substrate, between a first electrode and a second electrode, and light generated in the light emitting layer is emitted. The method according to claim 1, further comprising providing an organic light emitting element that is extracted from the side of the second electrode. An element substrate having a plurality of light-emitting elements and a terminal portion for electrical connection to the outside of the light-emitting element, and a sealing substrate disposed to face the light-emitting element side of the element substrate, A display device for taking out generated light from the side of the sealing substrate,
After covering the terminal portion with a protective member, providing an adhesive layer between the element substrate and the sealing substrate so as to cover the light emitting element and the protective member, and then bonding the adhesive layer via the adhesive layer. A display device, wherein by removing a part of the element substrate and the sealing substrate, the protection member is removed together with the part to be removed to expose the terminal portion. The light-emitting element has a configuration in which an organic layer including a light-emitting layer is sequentially laminated from a side of the element substrate on the element substrate, between a first electrode and a second electrode, and light generated in the light-emitting layer is The display device according to claim 5, wherein the display device is an organic light-emitting element extracted from the side of the second electrode.

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